Mechanism for identifying chip defects

Abstract

The utility model provides a mechanism for chip defect identification, which comprises an ink dispensing device and is characterized in that the ink dispensing device is mounted on an ink dispensing connecting plate, the ink dispensing connecting plate is fixedly connected to the top end of a piston of an air cylinder, the upper part of the air cylinder is fixedly connected with an air cylinder connecting plate, the air cylinder connecting plate is fixedly connected to the lower part of a precise multi-dimensional adjusting table, and the precise multi-dimensional adjusting table is fixedly connected with the upper part of the air cylinder. The upper portion of the precise multi-dimensional adjusting table is fixedly connected with a rotary connecting plate, the rotary connecting plate is fixedly connected to the bottom face of an upper connecting plate through a nut, and the upper connecting plate is fixedly connected to a camera lens support. The ink dispensing device has the advantages that the ink dispensing device can freely rotate around the upper connecting plate in the space Z-axis direction so as to adapt to various angles, the accurate position of the ink dispensing device can be precisely adjusted in the X, Y and Z (TxTy) directions through the precise multi-dimensional adjusting table, the ink dispensing device can be used for blue films, Gel packs and the like, and after chip defects are recognized, ink is dispensed at the positions of corresponding chips so as to identify colors which are different from those of normal chips.

Description

Technical Field

[0001] This invention relates to the field of optics and can be used for color marking of chip defects. Background Technology

[0002] Currently, after chip defect detection using existing carriers such as blue film or gel packs, the defective chip needs to be manually remarked after comparing the corresponding defect location with the computer system. This method is not only inefficient, but also prone to mismarking and omission. Omission of defective chips can lead to the loss of finished or semi-finished products, while mismarking can result in cost losses. This device can automatically or manually mark defective chips, allowing subsequent processes to quickly and accurately identify and remove defective chips, thereby improving efficiency and reducing costs. Summary of the Invention

[0003] The purpose of this utility model is to overcome the aforementioned problems existing in the prior art and provide a device system for chip defect identification. To achieve the above objective, the technical solution of this utility model is: a mechanism for chip defect identification, including an ink dotting device, characterized in that the ink dotting device is mounted on an ink dotting connecting plate, the ink dotting connecting plate is fixedly connected to the piston top of a cylinder, a cylinder connecting plate is fixedly connected to the upper part of the cylinder, the cylinder connecting plate is fixedly connected to the lower part of a precision multi-dimensional adjustment platform, a rotating connecting plate is fixedly connected to the upper part of the precision multi-dimensional adjustment platform, the rotating connecting plate is fixedly connected to the bottom surface of the upper connecting plate by a nut, and the upper connecting plate is fixedly connected to a camera lens bracket. The multi-dimensional precision adjustment platform consists of three (or more) precision adjustment platforms, arranged sequentially from top to bottom as X, Y, and Z (expandable to TxTy). The bottom of the cylinder connecting plate is inclined, and the cylinder's axial direction is inclined downwards. The ink dots of the ink dotting device are colored. Compared with existing technologies, this utility model patent replaces manual offline chip marking and sorting with automatic online marking of defective chips, which not only improves marking efficiency, but also avoids the reduction in yield and increase in cost caused by missed or incorrect markings that may occur with manual marking. Attached Figure Description

[0004] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0005] Figure label:

[0006] 1 Nut, 2 Upper connecting plate, 3 Rotary connecting plate, 4 Precision multi-dimensional adjustment stage X, Y, Z (expandable to TxTy), 5 Cylinder connecting plate, 6 Cylinder, 7 Ink dotting connecting plate, 8 Ink dotting device, 9 Camera lens bracket. Detailed Implementation

[0007] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0008] This utility model discloses a device and mechanism for identifying chip defects, including an ink dotting device. The ink dotting device is mounted on an ink dotting connecting plate, which is fixedly connected to the piston top of a cylinder. A cylinder connecting plate is fixedly connected to the upper part of the cylinder, and the cylinder connecting plate is fixedly connected below a precision multi-dimensional adjustment platform. A rotating connecting plate is fixedly connected to the upper part of the precision multi-dimensional adjustment platform, and the rotating connecting plate is fixedly connected to the bottom surface of the upper connecting plate by a nut. The upper connecting plate is fixedly connected to a camera lens bracket. The multi-dimensional precision adjustment platform consists of three (or more) precision adjustment platforms, arranged vertically from top to bottom as X, Y, and Z (expandable to TxTy). The bottom of the cylinder connecting plate is inclined, and the cylinder's axial direction is tilted downwards. The ink dots of the ink dotting device are colored.

[0009] In use, assemble the chip defect marking device and fix the connecting plate to the camera lens bracket. Adjust the angle of the rotating connecting plate. With the cylinder extended, first adjust the X, Y, and Z (expandable to TxTy) of the precision multi-dimensional adjustment stage so that the ink dispensing device needle is close to the stage above the chip. Loosen the rotating connecting plate nut so that the ink dispensing device needle is within the camera's field of view. Fine-tune the X, Y, and Z (expandable to TxTy) of the precision multi-dimensional adjustment stage so that the ink dispensing device needle is in the slightly centered area of ​​the lens's field of view. Tighten the rotating connecting plate nut and simultaneously tighten the locking knob of the X, Y, and Z (expandable to TxTy) of the precision multi-dimensional adjustment stage. Then retract the cylinder and extend it again. Observe whether the position of the ink dispensing device needle changes. If it changes, repeat the adjustment. If it does not change, you can start chip defect detection on the stage with the chip and mark the detected defective chip.

[0010] The precision multi-dimensional adjustment stages X, Y, Z (expandable to TxTy), cylinders, and ink dispensing devices used in the system are all existing components on the market, and the housing structure is an existing machined part, so they will not be described in detail again.

[0011] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A mechanism for identifying chip defects, comprising an ink dispensing device, characterized in that, The ink dispensing device is mounted on the ink dispensing connecting plate, which is fixedly connected to the top of the piston of the cylinder. A cylinder connecting plate is fixedly connected to the upper part of the cylinder, and the cylinder connecting plate is fixedly connected to the bottom of the precision multi-dimensional adjustment platform. A rotating connecting plate is fixedly connected to the upper part of the precision multi-dimensional adjustment platform, and the rotating connecting plate is fixedly connected to the bottom surface of the upper connecting plate by a nut. The upper connecting plate is fixedly connected to the camera lens bracket.

2. The mechanism for chip defect identification according to claim 1, characterized in that, The precision multidimensional adjustment stage consists of three precision adjustment stages, which are X, Y, and Z from top to bottom.

3. The mechanism for chip defect identification according to claim 1, characterized in that, The bottom of the cylinder connecting plate is sloped, and the cylinder axis is inclined downward.

4. The mechanism for chip defect identification according to claim 1, characterized in that, The ink dots of the ink dispensing device are colored.

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