Film pasting device for silicon wafer processing
The film feeding mechanism driven by dual linear displacement components and automated film layer processing solve the problem of frequent film roll replacement in silicon wafer lamination equipment, achieving efficient film layer lamination and cutting, and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG HUALING ELECTRONICS
- Filing Date
- 2025-05-26
- Publication Date
- 2026-05-15
AI Technical Summary
Existing silicon wafer lamination equipment requires repeated replacement of film rolls, resulting in long operation times and affecting production efficiency.
The film feeding mechanism, driven by dual linear displacement components, combined with a suction rod, a rolling roller, and a cutting knife, enables automated film application and cutting, reducing the number of film roll changes.
It significantly shortens the time for silicon wafer lamination and casting, improves work efficiency, and reduces film loss.
Smart Images
Figure CN224241367U_ABST
Abstract
Description
Technical fields:
[0001] This utility model relates to the field of integrated circuit processing equipment manufacturing technology, specifically a silicon wafer processing film application device that is easy to operate, has a reasonable structure, and can reduce the complexity of silicon wafer film application and improve work efficiency. Background technology:
[0002] The dicing process in semiconductor processing is a crucial step in integrated circuit manufacturing. On each finished wafer, hundreds to hundreds of thousands of chips are connected together, with a certain gap between each chip, called a dicing block. The process of separating each chip, which has independent electrical properties, is called dicing. To prevent the chips from scattering after dicing, the silicon wafer needs to be adhered to a thin film (often called a white film) with a metal ring (acting as a support) before being sent to the dicing machine. Because debris is generated during dicing, a film transfer process is required after dicing. During this process, a blue film is attached to the diced silicon wafer. After flipping the wafer, the original white film is peeled off to remove the debris generated during dicing. Then, the white film is reattached, and the wafer is flipped again to remove the blue film.
[0003] Because the process of repeatedly applying, replacing, reapplying, and peeling the film is cumbersome, and both blue and white films are high-cost consumables, failure to apply the film will result in waste of the film layer. Therefore, how to effectively shorten the film application and re-filming process and reduce film layer loss is an urgent problem to be solved.
[0004] Currently, commonly used film-applying equipment includes a film-applying worktable and a film supply assembly that can move relative to the worktable. The film supply assembly includes a film roll holder for holding the film roll, an adsorption rod at the front end for unfolding the film layer on the roll, and an adsorption rod drive component for pressing the adsorption rod against the starting position of the silicon wafer to be coated. During operation, the film-applying worktable and the film supply assembly move relative to each other. Under the pressing action of the adsorption rod, the film layer can be smoothly adhered to the silicon wafer. To improve the coating effect, a roller that can press down or lift away from the silicon wafer surface can be included in the film supply assembly. This roller can be located behind the adsorption rod for applying the film... During the process, air bubbles between the film layer and the silicon wafer are removed. The worktable is also equipped with a film layer cutting assembly, which is used to remove the excess film layer on the outside of the silicon wafer after film application. The film layer cutting assembly includes a cutting annular groove set on the worktable surface and a cutter corresponding to the cutting annular groove. The cutting annular groove is arranged around the outside of the silicon wafer placement area to be film applied. The cutter is connected to a support mechanism, which is hinged to the side of the worktable via a damping hinge. When cutting the film, the support mechanism is brought close to the worktable so that the tip of the cutter passes through the film layer and is embedded in the cutting annular groove. The cutter slides along the annular guide rail on the support mechanism and the cutting annular groove to complete the removal of the excess film layer on the outside of the silicon wafer.
[0005] When using existing equipment, the film supply assembly needs to be changed repeatedly according to the operation requirements. After each film roll is changed, the free end of the film roll needs to be pulled back to the adsorption rod, which makes the film application operation of a single silicon wafer very time-consuming and is not conducive to industrial production applications. Summary of the Invention:
[0006] This invention addresses the shortcomings and deficiencies of existing technologies by proposing a silicon wafer lamination device with a reasonable structure, reliable operation, and the ability to significantly shorten the time required for dicing silicon wafers to lamination and casting, thereby improving work efficiency.
[0007] This utility model achieves its purpose through the following measures:
[0008] A film-applying device for silicon wafer processing includes a base plate with a film-applying working area, a film-applying worktable, and a film-supplying mechanism that can move relative to the worktable. The film-applying worktable is mounted on the base plate via a first linear displacement component and moves into / out of the film-applying working area under the drive of the first linear displacement component. The film-supplying mechanism includes two sets of film-supplying assemblies arranged side-by-side. The film-supplying mechanism is mounted on the base plate via a second linear displacement component, and under the drive of the second linear displacement component, any one set of film-supplying assemblies in the film-supplying mechanism moves above the film-applying working area.
[0009] The first linear displacement component and the second linear displacement component of this invention are each provided with a linear guide rail, a slider, and a driving component. The driving component can be an electric cylinder or an electric push rod. The guide rails of the first linear displacement component and the second linear displacement component are located on different sides of the film application work area, and the guide rails of the first linear displacement component and the second linear displacement component are perpendicular to each other. Furthermore, position sensors are provided on the sides of the guide rails of the first linear displacement component and the second linear displacement component, respectively, for detecting the translational positioning information of the film application worktable or the film supply assembly.
[0010] The film supply mechanism of this utility model includes a wall panel for supporting two sets of film supply components. A set of film supply components is located on each side of the wall panel. The bottom of the wall panel is fixedly connected to a slider in the second linear displacement component. Each film supply component includes a suction rod, a suction rod lifting component, a film roller, a film roller lifting component, a film roll roller, and a release film recovery roller. The suction rod is installed at one end of the wall panel near the film application area. The suction rod is connected to the wall panel via the suction rod lifting component, and the film roller is connected to the wall panel via the film roller lifting component. The film roller is parallel to the suction rod and located behind it. The film suction rod lifting component includes a vertical guide rail mounted on the wall panel, a slider cooperating with the guide rail, and a lifting cylinder. One end of the film suction rod is fixedly connected to the slider, one end of the lifting cylinder is connected to the wall panel, and the other end is connected to the film suction rod. The lifting cylinder pushes the film suction rod to rise and fall along the vertical guide rail. The film roller lifting component includes a vertical guide rail set on the wall panel, a slider cooperating with the vertical guide rail, and a film roller lifting cylinder. One end of the film roller lifting cylinder is mounted on the wall panel, and the other end is connected to the film roller. The film roller lifting cylinder drives the film roller to rise and fall along the vertical guide rail.
[0011] The film roll roller of this invention is located behind the film roller and is higher than the suction rod and the film roller. It is used to set up new film rolls. The release film recovery roller is located behind the film roll roller and is used to recover the release paper from the film roll roller. The film roll roller / release film recovery roller is also equipped with a corresponding roller shaft drive component. The roller shaft drive component can be a bearing, drive motor, or other component connected to the corresponding roller shaft. By adjusting the rotation speed of the roller shaft, the film layer extension tension can be adjusted, which is conducive to the unwinding and rewinding of the film roll. This is prior art and will not be described in detail. The roller shaft drive component and the corresponding film roll roller or release film recovery roller are respectively installed on both sides of the wall plate. Furthermore, in order to arrange the roller shaft drive component reasonably, each group of film supply components in the film supply mechanism is provided with a corresponding wall plate. The installation space of the roller shaft drive component is formed between the two wall plates, which facilitates equipment installation and subsequent debugging.
[0012] The film supply assembly of this utility model also includes a film cutter. The film cutter is installed on the front side of the suction rod, that is, on the side of the suction rod close to the film application area, via a film cutter guide component. The film cutter guide component includes a film cutter guide rail arranged along the length of the suction rod and a slider that cooperates with the film cutter guide rail. The film cutter is fixed on the slider. The length of the film cutter guide rail is greater than the length of the suction rod, so that when the operator pushes the upper end of the film cutter, the side edge of the film cutter can cut along one side of the suction rod to the other side, completing the complete cutting of the film layer.
[0013] The film-applying worktable of this utility model has a placement area for placing silicon wafers on its surface. An annular groove is provided on the outer side of the placement area, and a circumferential blade holder corresponding to the annular groove is provided above the film-applying worktable. The circumferential blade holder is positioned above the film-applying worktable via a blade holder lifting component. A circumferential blade is mounted on the circumferential blade holder, and a circumferential guide rail corresponding to the annular groove on the outer side of the placement area is also provided. The circumferential blade is mounted on the circumferential guide rail via a slider and slides along the circumferential guide rail. When the circumferential blade holder is engaged with the film-applying worktable surface, the tip of the circumferential blade is embedded in the annular groove on the outer side of the placement area. Pushing the upper end of the circumferential blade causes it to slide along the circumferential guide rail, and the tip of the circumferential blade cuts off the excess film layer on the outer side of the silicon wafer along the annular groove. Furthermore, since the wafer is to be... The silicon wafers used for film coating are disc-shaped. During film coating, an annular metal support is often placed on the outer side of the silicon wafer. In some processes, it is necessary to separate the coated silicon wafer from the annular metal support. At this time, two concentric circumferential guide rails are set on the circumferential blade holder. A circumferential blade is set on each circumferential guide rail via a slider. Correspondingly, two concentric annular grooves are set on the surface of the film coating worktable to accommodate the blade tip of the circumferential blade during cutting. The two circumferential blades can be referred to as the inner circumferential blade and the outer circumferential blade. In use, the circumferential blade holder is fastened to the surface of the film coating worktable, and the inner circumferential blade and the outer circumferential blade are pushed to complete the cutting of the adjacent film layer or the removal of excess film layer.
[0014] The circumferential blade holder described in this utility model is supported above the film-applying worktable by a hydraulic cylinder. The hydraulic cylinder can pull the circumferential blade holder closer to and fasten it to the surface of the film-applying worktable, or push it away from the surface of the film-applying worktable.
[0015] The present invention describes a first transmission gear at one end of a film roll, which meshes with a brake gear. The brake gear then meshes with a second transmission gear. The second transmission gear is coaxially arranged with a circular pulley. The circular pulley is connected to a driven pulley via a transmission belt. The driven pulley is coaxially installed with a release film recovery roller. This allows the brake to provide a certain damping to the film roll and simultaneously transmit power to the release film recovery roller, thus achieving linkage between the two actions of film delivery and release film recovery.
[0016] This utility model also includes a controller, which can be implemented using a PLC controller, and the controller is connected to each electric component.
[0017] In operation, this invention first moves the film supply assembly, which carries the set film roll, above the film application work area via the second linear displacement component. Then, the silicon wafer to be applied and its outer ring support are placed on the film application worktable. The first linear displacement component is activated, causing the film application worktable to enter the film application work area, with the film application starting end positioned below the suction rod in the film supply assembly. At this point, the suction rod lifting component is activated, causing the suction rod to descend and press against the film application starting end of the film application worktable. The film layer under the suction rod is then pressed onto the ring support and silicon wafer. Finally, the film roller lifting component drives the film roller to move along... The film layer at the rear end of the suction rod is pressed onto the annular support and silicon wafer to be processed. The first linear displacement component is activated again, causing the film application table, carrying the annular support and silicon wafer, to gradually move out of the film application area. During this process, the film roll roller continuously feeds out the film layer, and the release paper recovery roller promptly winds up and recovers the release paper between the film layers. The suction rod continues to pull the fed film layer onto the surface of the annular support and silicon wafer to be processed, and the film roll roller continuously expels the air between the film layer and the silicon wafer until the film application table is completely removed from the film application area. At this point, the film layer has completely covered the annular support and silicon wafer to be processed. The first linear displacement component is then closed, and the film cutter at the front of the suction rod is used to... The film is cut transversely along its width to separate the film adhering to the material from the film pulled out by the suction rod. Then, the circumferential blade holder is pulled down to the lamination table, and the blade tip of the circumferential blade engages with the annular groove on the lamination table. The circumferential blade is manually moved to remove excess film from the material surface along the annular groove. This completes the first lamination process, which is often a white film. After the white film is applied, the silicon wafer can proceed to the next process, such as dicing. After dicing, there are debris on the silicon wafer surface, requiring a film removal process, i.e., removing the original white film and applying a new film layer (blue film). The process of removing the white film is then utilized... Adhesion and Debris Removal: The second linear displacement component is activated again, moving the film supply assembly carrying the blue film to above the film application work area. The silicon wafer to be applied, along with its outer ring support, is then placed on the film application worktable. The film application operation is repeated. After applying the blue film, the white film can be removed. Removing the film at this time will not cause the diced chips to scatter, but it can remove debris. The film application operation is then repeated. After applying the white film, the blue film is finally removed, completing the film replacement operation. This invention eliminates the need for repeated film roll changes and pulling the free end of the film layer to the pressure rod during operation, thus significantly saving film application and rewinding time and improving work efficiency. Attached image description:
[0018] Appendix Figure 1 This is a schematic diagram of the structure of this utility model.
[0019] Appendix Figure 2 This is a schematic diagram of the film supply mechanism in this utility model.
[0020] Appendix Figure 3 This is a schematic diagram of the film-applying workbench in this utility model.
[0021] Appendix Figure 4 This is a schematic diagram of the film-applying workbench from another angle in this utility model.
[0022] Appendix Figure 5 This is a structural schematic diagram of an embodiment of the present utility model.
[0023] Appendix Figure 6 This is a schematic diagram of another aspect of the present invention.
[0024] Reference numerals: 1. Base plate; 2. Film application worktable; 3. Film supply mechanism; 4. First linear displacement component; 5. Second linear displacement component; 6. Wall panel; 7. Suction rod; 8. Suction rod lifting component; 9. Rolling film roller; 10. Rolling film roller lifting component; 11. Film roll roller; 12. Release film recovery roller; 13. Film cutter; 14. Circumferential cutter holder; 15. Cutter holder lifting component; 16. Circumferential cutter; 17. Circumferential guide rail; 18. Brake; 19. Guide roller; 20. Detailed implementation method:
[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0026] As attached Figure 1 As shown, this utility model proposes a film-applying device for silicon wafer processing, which includes a base plate 1, a film-applying working area on the base plate 1, a film-applying worktable 2, and a film-supplying mechanism 3 that can move relative to the worktable. The film-applying worktable 2 is mounted on the base plate via a first linear displacement component 4 and moves into / out of the film-applying working area under the drive of the first linear displacement component 4. The film-supplying mechanism 3 includes two sets of film-supplying components arranged side by side. The film-supplying mechanism 3 is mounted on the base plate 1 via a second linear displacement component 5, and under the drive of the second linear displacement component 5, either set of film-supplying components in the film-supplying mechanism 3 moves above the film-applying working area.
[0027] As attached Figure 1 As shown, the first linear displacement component 4 and the second linear displacement component 5 of this utility model are each provided with a linear guide rail, a slider, and a driving component. The driving component can be an electric cylinder or an electric push rod. The guide rail of the first linear displacement component 4 and the guide rail of the second linear displacement component 5 are located on different sides of the film application work area, and the guide rail of the first linear displacement component 4 is perpendicular to the guide rail of the second linear displacement component 5. Furthermore, position sensors are respectively provided on the sides of the guide rails in the first linear displacement component 4 and the second linear displacement component 5 to detect the translational positioning information of the film application worktable 2 or the film supply assembly.
[0028] As attached Figure 2As shown, the film supply mechanism 3 of this utility model is provided with a wall plate 6 for supporting two sets of film supply components. A set of film supply components is provided on each side of the wall plate 6. The bottom of the wall plate 6 is fixedly connected to the slider in the second linear displacement component 5. The film supply component includes a suction rod 7, a suction rod lifting component 8, a film roller 9, a film roller lifting component 10, a film roll roller 11, and a release film recovery roller 12. The suction rod 7 is installed at one end of the wall plate 6 near the film application working area. The suction rod 7 is connected to the wall plate 6 via the suction rod lifting component 8, and the film roller 9 is connected to the wall plate via the film roller lifting component 10. The film roller 9 is parallel to the suction rod 7. Located behind the suction rod, the suction rod lifting component 8 includes a vertical guide rail mounted on the wall panel 6, a slider cooperating with the guide rail, and a lifting cylinder. One end of the suction rod 7 is fixedly connected to the slider, one end of the lifting cylinder is connected to the wall panel 6, and the other end is connected to the suction rod 7. The lifting cylinder pushes the suction rod 7 to rise and fall along the vertical guide rail. The film roller lifting component 10 includes a vertical guide rail set on the wall panel, a slider cooperating with the vertical guide rail, and a film roller lifting cylinder. One end of the film roller lifting cylinder is mounted on the wall panel 6, and the other end is connected to the film roller 9. The film roller lifting cylinder drives the film roller 9 to rise and fall along the vertical guide rail.
[0029] As attached Figure 2 As shown, the film roll 11 of this utility model is located behind the film roller 9 and is higher than the suction rod 7 and the film roller 8. It is used to set up new film rolls. The release film recovery roller 12 is located behind the film roll 11 and is used to recover the release paper of the film roll. The film roll 11 / release film recovery roller 12 are also provided with corresponding roller shaft drive components. The roller shaft drive components can be components such as bearings and drive motors connected to the corresponding roller shafts. By adjusting the rotation speed of the roller shaft, the film layer extension tension can be adjusted, which is conducive to realizing the winding and unwinding of the film roll. This is the prior art and will not be described in detail. The roller shaft drive components and the corresponding film roll or release film recovery roller are respectively installed on both sides of the wall plate. Furthermore, in order to reasonably arrange the roller shaft drive components, each group of film supply components in the film supply mechanism is provided with a corresponding wall plate 6. The installation space of the roller shaft drive components is formed between the two wall plates 6, which facilitates equipment installation and subsequent debugging.
[0030] As attached Figure 2 As shown, the film supply assembly of this utility model also includes a film cutting blade 13. The film cutting blade 13 is installed on the front side of the suction rod 7 via a film cutting blade guide component, that is, on the side of the suction rod 7 close to the film application working area. The film cutting blade guide component includes a film cutting guide rail arranged along the length direction of the suction rod and a slider that cooperates with the film cutting guide rail. The film cutting blade is fixed on the slider. The length of the film cutting guide rail is greater than the length of the suction rod 7, so that when the operator manually pushes the upper end of the film cutting blade 13, the side cutting edge of the film cutting blade 13 can cut along one side of the suction rod 7 to the other side, completing the complete cutting of the film layer.
[0031] As attached Figure 3 As shown, the film-applying workbench 2 of this utility model has a placement area for placing silicon wafers on its table surface. An annular groove 14 is provided on the outer side of the placement area, and a circumferential blade holder 15 corresponding to the annular groove 14 is provided above the film-applying workbench. The circumferential blade holder 15 is set above the film-applying workbench 2 via a blade holder lifting component 16. A circumferential blade 17 is provided on the circumferential blade holder 15, and a circumferential guide rail 18 corresponding to the annular groove 14 on the outer side of the placement area is provided on the circumferential blade holder 15. The circumferential blade 17 is mounted on the circumferential guide rail 18 via a slider and slides along the circumferential guide rail 18. When the circumferential blade holder 15 is engaged with the table surface of the film-applying workbench 2, the blade tip of the circumferential blade 17 is embedded in the annular groove 14 on the outer side of the placement area. When the operator manually pushes the upper end of the circumferential blade 17 and the circumferential blade 17 slides along the circumferential guide rail 18, the blade tip of the circumferential blade 17 cuts off the excess film layer on the outer side of the silicon wafer along the annular groove 14.
[0032] Furthermore, since the silicon wafer to be coated is disc-shaped, and during the coating process, an annular metal support is often provided on the outer side of the silicon wafer, in some processes, it is necessary to separate the coated silicon wafer from the annular metal support. At this time, two concentrically arranged circumferential guide rails 18 are provided on the circumferential blade holder 15, and a circumferential blade 17 is set on each circumferential guide rail 18 via a slider. Correspondingly, two concentric annular grooves 14 are provided on the table surface of the coating worktable 2 to accommodate the blade tip of the circumferential blade 17 during cutting. The two circumferential blades 17 can be referred to as the inner circumferential blade and the outer circumferential blade, respectively. When in use, the circumferential blade holder is fastened to the table surface of the coating worktable 2, and the inner circumferential blade and the outer circumferential blade are pushed respectively to complete the cutting of the adjacent film layer or the removal of the excess film layer.
[0033] The circumferential blade holder 15 of this utility model is supported above the film application worktable 2 by a hydraulic cylinder (i.e., blade holder lifting component 16). The hydraulic cylinder can pull the circumferential blade holder 15 closer to and fasten it to the surface of the film application worktable, or push it away from the surface of the film application worktable.
[0034] To facilitate the adjustment of the tension during film roll-up and release paper recycling, this invention provides a first transmission gear at one end of the film roll 11. The first transmission gear meshes with the gear of the brake 19, which in turn meshes with the second transmission gear. The second transmission gear is coaxially mounted with a circular pulley, which is connected to a driven pulley via a transmission belt. The driven pulley is coaxially mounted with the release film recycling roller. This allows the brake to provide a certain damping to the film roll 11 and simultaneously transmit power to the release film recycling roller 12, thus achieving linkage between the two actions of film delivery and release film recycling. This part can be achieved with existing technology and is not the point of this invention.
[0035] This utility model also includes a controller, which can be implemented using a PLC controller, and the controller is connected to each electric component.
[0036] Example:
[0037] As attached Figure 5 and appendix Figure 6 As shown, this example proposes a film-applying device for silicon wafer processing, which includes a base plate 1, a film-applying working area on the base plate 1, a film-applying worktable 2, and a film-supplying mechanism 3 that can move relative to the worktable. The film-applying worktable 2 is mounted on the base plate via a first linear displacement component 4 and moves into / out of the film-applying working area under the drive of the first linear displacement component 4. The film-supplying mechanism 3 includes two sets of film-supplying assemblies arranged side by side. The film-supplying mechanism 3 is mounted on the base plate 1 via a second linear displacement component 5, and under the drive of the second linear displacement component 5, either set of film-supplying assemblies in the film-supplying mechanism 3 moves to above the film-applying working area.
[0038] In this example, the film supply mechanism 3 is provided with two wall plates 6 for installing two sets of film supply components respectively. The space between the two wall plates 6 can be used to install components such as brakes, first transmission gears, second transmission gears, round pulleys and driven pulleys to facilitate the adjustment of the tension of film layer feeding and release paper recycling, thereby reasonably allocating equipment space and facilitating subsequent maintenance and adjustment.
[0039] In this example, the film roller 9 is made of silicone rubber. Silicone rubber rollers are non-adhesive to plastics, resistant to high temperature, anti-static, highly resilient, have low compression set and good wear resistance. They are used to press the film layer on the film layer above the film application table 2 to eliminate air bubbles between the film layer and the silicon wafer to be processed, thereby improving the film application quality.
[0040] In this example, to facilitate the adjustment of the film conveying path to the front end of the suction rod 7, a guide roller 20 is also provided on the wall panel 6;
[0041] This example also includes indicator lights, displays and other display output devices installed on the base plate 1 to indicate the working status of the relevant mechanisms, as well as solenoid valves that cooperate with each lifting cylinder and switch buttons connected to the solenoid valves installed on the base plate 1. All such components work together through the PLC controller. The connection relationships of the above components are all existing technologies and will not be described in detail here.
[0042] During operation, the film supply assembly carrying the set film roll is first moved above the film application work area via the second linear displacement component 5. Then, the silicon wafer to be applied and the annular support on the outside of the silicon wafer are placed on the film application worktable 2. The first linear displacement component 4 is activated, causing the film application worktable 2 to enter the film application work area under the action of the first linear displacement component 4, with the film application starting end below the suction rod 7 in the film supply assembly. At this time, the suction rod lifting component 8 is activated, causing the suction rod 7 to descend and press against the film application starting end of the film application worktable 2. The film layer on the lower side of the suction rod 7 can then be pressed onto the annular support and silicon wafer to be processed, and then lifted by the rolling film roller. The lowering component 10 drives the rolling film roller 9, pressing it along the upper side of the film layer at the rear end of the suction rod 7 onto the annular support and silicon wafer to be processed. The first linear displacement component 4 is activated again, causing the film application table 2, carrying the annular support and silicon wafer to be processed, to gradually move out of the film application work area. During this process, the film roll roller 11 continuously feeds out the film layer, while the release paper recovery roller 12 promptly winds up and recovers the release paper between the film layers. The suction rod 7 continuously pulls the fed-out film layer onto the surface of the annular support and silicon wafer to be processed, and the rolling film roller 9 continuously expels the air between the film layer and the silicon wafer until the film application table 2 is completely removed from the film application work area. At this point, the film layer has completely covered the wafer to be processed. The annular support and silicon wafer are connected. The first linear displacement component 4 is closed. Using the cutting blade 13 on the front side of the suction rod 7, a transverse cut is made along the width direction of the film layer, separating the film layer attached to the material to be processed from the film layer pulled out by the suction rod 7. Then, the circumferential blade holder 15 is pulled down onto the film application table 2, so that the tip of the circumferential blade 17 on the circumferential blade holder 15 is engaged in the annular groove 14 on the film application table 2. The circumferential blade 17 is manually moved to remove the excess film layer on the surface of the material along the annular groove 14. At this time, the first film application is completed. The first film application process is often a white film. After the white film application process, the silicon wafer can enter the next process, such as dicing. After dicing, there are debris on the surface of the silicon wafer. At this time, a film replacement is required, which involves removing the original white film and attaching a new film layer (white film). The process of removing the white film is used to remove debris. The second linear displacement component 5 is activated again to move the film supply assembly carrying the blue film to the top of the film application work area. Then, the silicon wafer to be coated and the annular support on the outside of the silicon wafer are placed on the film application worktable 2. The above film application operation is repeated. After the blue film is applied, the white film can be removed. At this time, the film removal will not cause the chip after dicing to scatter, but the debris can be removed. Then the film application operation is repeated. After the white film is applied, the blue film is finally removed to complete the film replacement operation.
[0043] The technical solution provided in this example eliminates the need to repeatedly change the film roll and pull the free end of the film layer to the pressure rod during operation, thereby significantly saving time on film application and pouring and improving work efficiency.
Claims
1. A film-applying device for silicon wafer processing, comprising a base plate, a film-applying working area on the base plate, a film-applying worktable, and a film supply mechanism movable relative to the worktable, characterized in that, The film application workbench is mounted on the base plate via a first linear displacement component and moves in / out of the film application work area under the drive of the first linear displacement component. The film supply mechanism includes two sets of film supply assemblies arranged side by side. The film supply mechanism is mounted on the base plate via a second linear displacement component and, under the drive of the second linear displacement component, moves any one set of film supply assemblies in the film supply mechanism above the film application work area.
2. The film-applying device for silicon wafer processing according to claim 1, characterized in that, Both the first linear displacement component and the second linear displacement component are equipped with a linear guide rail, a slider, and a driving component. The driving component is an electric cylinder or an electric push rod. The guide rails of the first linear displacement component and the second linear displacement component are located on different sides of the film application work area, and the guide rails of the first linear displacement component and the second linear displacement component are perpendicular to each other.
3. The film-applying device for silicon wafer processing according to claim 2, characterized in that, It also includes position sensors respectively installed on the side of the guide rail in the first linear displacement component / second linear displacement component, used to detect the translational positioning information of the film application worktable or film supply assembly.
4. The film-applying device for silicon wafer processing according to claim 2, characterized in that, The film supply mechanism includes a wall panel supporting two sets of film supply assemblies. A set of film supply assemblies is located on each side of the wall panel. The bottom of the wall panel is fixedly connected to a slider in the second linear displacement component. Each film supply assembly includes a suction rod, a suction rod lifting component, a film roller, a film roller lifting component, a film roll roller, and a release film recovery roller. The suction rod is installed at one end of the wall panel near the film application area. The suction rod is connected to the wall panel via the suction rod lifting component, and the film roller is connected to the wall panel via the film roller lifting component. The film roller is parallel to the suction rod and located behind it. The suction rod lifting component includes a vertical guide rail mounted on a wall panel, a slider cooperating with the guide rail, and a lifting cylinder. One end of the suction rod is fixedly connected to the slider, one end of the lifting cylinder is connected to the wall panel, and the other end is connected to the suction rod. The lifting cylinder pushes the suction rod to rise and fall along the vertical guide rail. The rolling roller lifting component includes a vertical guide rail mounted on the wall panel, a slider cooperating with the vertical guide rail, and a rolling roller lifting cylinder. One end of the rolling roller lifting cylinder is mounted on the wall panel, and the other end is connected to the rolling roller. The rolling roller lifting cylinder drives the rolling roller to rise and fall along the vertical guide rail.
5. The film-applying device for silicon wafer processing according to claim 4, characterized in that, The film roll roller is located behind the film roller and is higher than the suction rod and the film roller. It is used to set up new film rolls. The release film recovery roller is located behind the film roll roller and is used to recover the release paper from the film roll roller.
6. The film-applying device for silicon wafer processing according to claim 4, characterized in that, The film supply assembly also includes a film cutting knife, which is installed on the front side of the suction rod, i.e., the side of the suction rod close to the film application area, via a film cutting knife guide component. The film cutting knife guide component includes a film cutting guide rail arranged along the length of the suction rod and a slider that cooperates with the film cutting guide rail. The film cutting knife is fixed on the slider. The length of the film cutting guide rail is greater than the length of the suction rod.
7. The film-applying device for silicon wafer processing according to claim 1, characterized in that, The film-applying worktable has a placement area for placing silicon wafers on its surface. An annular groove is provided on the outer side of the placement area, and a circumferential blade holder corresponding to the annular groove is provided above the film-applying worktable. The circumferential blade holder is positioned above the film-applying worktable via a blade holder lifting component. A circumferential blade is provided on the circumferential blade holder, and a circumferential guide rail corresponding to the annular groove on the outer side of the placement area is provided on the circumferential blade holder. The circumferential blade is mounted on the circumferential guide rail via a slider and slides along the circumferential guide rail. When the circumferential blade holder is engaged with the surface of the film-applying worktable, the tip of the circumferential blade is embedded in the annular groove on the outer side of the placement area. Pushing the upper end of the circumferential blade causes it to slide along the circumferential guide rail, and the tip of the circumferential blade cuts off the excess film layer on the outer side of the silicon wafer along the annular groove.
8. A film-applying device for silicon wafer processing according to claim 7, characterized in that, The circumferential knife holder has two concentric circumferential guide rails, and a circumferential knife is mounted on each circumferential guide rail via a slider. Correspondingly, two concentric annular grooves are set on the surface of the film application table to accommodate the tips of the circumferential knives during cutting. The two circumferential knives are referred to as the inner circumferential knife and the outer circumferential knife. In use, the circumferential knife holder is fastened to the surface of the film application table, and the inner circumferential knife and the outer circumferential knife are pushed to complete the cutting of the adjacent film layers or the removal of excess film layers.
9. A film-applying device for silicon wafer processing according to claim 7, characterized in that, The circumferential blade holder is supported above the film-applying worktable by a hydraulic cylinder. The hydraulic cylinder can pull the circumferential blade holder closer to and fasten it to the surface of the film-applying worktable, or push it away from the surface of the film-applying worktable.