Automatic baffle device, film thickness adjusting system and magnetron sputtering equipment

Abstract

The utility model relates to the field of solar photovoltaic technology, and discloses an automatic baffle device, a film thickness adjusting system and magnetron sputtering equipment. The automatic baffle device comprises a plurality of baffles which are installed in a film coating cavity of the magnetron sputtering equipment, the baffles are arranged between a target material and a film coating area in parallel and are arranged at intervals, the baffles are distributed at intervals, and each baffle is movably arranged in the first direction and the second direction relative to the film coating area, the first direction and the second direction are arranged at an angle and are both parallel to the coating area. According to the automatic baffle device of the magnetron sputtering equipment provided by the utility model, a plurality of baffles capable of moving in the first direction and the second direction at the same time are arranged, so that the accurate control on the film thickness can be realized by controlling the positions of the baffles under the condition that a cavity is not opened in the film coating process of a substrate; the consumption of manpower and material resources caused by the problem of adjusting the baffle by opening the cavity is reduced, and the coating quality and the coating rate are favorably optimized.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering technology, specifically to an automatic baffle device, a film thickness adjustment system, and a magnetron sputtering equipment. Background Technology

[0002] Current magnetron sputtering nickel oxide equipment suffers from significant uniformity issues in the deposited nickel oxide film during production. For example, the film thickness decreases continuously during production, leading to a deterioration in film uniformity. This decline in nickel oxide film quality directly impacts the efficiency of perovskite solar cells. To mitigate this issue, current technologies typically involve manually conducting extensive testing of nickel oxide film thickness data, summarizing and analyzing the data, and then manually adjusting the position of the baffles in the magnetron sputtering chamber. By changing the baffle position, the spatial distribution of nickel oxide along the deposition path is adjusted, thereby regulating the thickness of the nickel oxide film deposited on the module.

[0003] The above methods require significant manpower and resources for data collection, analysis, and baffle adjustment. Furthermore, the opening and closing of the chambers necessitates machine shutdown and restart, greatly impacting the production rhythm of the mass production line and affecting output. Moreover, it is difficult for manual labor to adjust the baffle to the appropriate position with just one chamber opening adjustment. If repeated chamber opening is required, it will severely disrupt the production rhythm and waste a large amount of manpower and resources. Utility Model Content

[0004] In view of this, the present invention provides an automatic baffle device, a film thickness adjustment system, and a magnetron sputtering device to solve the problems of inaccurate control of film thickness and high cost in related technologies.

[0005] In a first aspect, this utility model provides an automatic baffle device for a magnetron sputtering equipment, comprising:

[0006] Multiple baffles are installed in the coating chamber of a magnetron sputtering equipment. The baffles are arranged parallel to each other between the target material and the coating area in the coating chamber and are spaced apart. The multiple baffles are spaced apart and each baffle is movable relative to the coating area along a first direction and a second direction. The first direction and the second direction are arranged at an angle and are both parallel to the coating area.

[0007] Beneficial effects: This utility model provides an automatic baffle device for a magnetron sputtering equipment. By setting multiple baffles that can move simultaneously in the first and second directions, the film thickness can be precisely controlled by the position control of the baffles during the substrate coating process without opening a cavity. This reduces the manpower and material consumption caused by opening a cavity to adjust the baffles, and helps to optimize the coating quality and coating rate.

[0008] In one alternative implementation, the first direction is perpendicular to the second direction.

[0009] Beneficial effects: The above design enables the baffle system to achieve greater flexibility and precision, allowing for fine-tuning of film thickness on any part of the substrate as needed, without relying on multiple fixed-position baffles or complex mechanical structures to achieve a similar effect. This not only improves production efficiency but also enhances the ability to control film thickness uniformity and consistency.

[0010] In one optional embodiment, the plurality of baffles are divided into two groups, the two groups of baffles are respectively installed on both sides of the first direction, and a plurality of baffles in the same group are spaced apart along the first direction.

[0011] Beneficial effects: On the one hand, since the baffles can be operated independently on both sides of the first direction, and the baffles in the same group are spaced apart along the first direction, the spatial distribution of the material to be deposited in different areas in the deposition path can be controlled more precisely, thereby achieving higher film thickness adjustment accuracy. On the other hand, the design of dividing the baffles into two groups and installing them on both sides of the first direction increases the flexibility of the system, allowing the position of each baffle to be adjusted individually or in combination according to actual needs to adapt to different process requirements and substrate size variations.

[0012] In one alternative embodiment, the automatic baffle device further includes:

[0013] Two sets of sliding bases are fixed inside the coating cavity of the magnetron sputtering equipment. The two sets of sliding bases are located on both sides of the first direction, and each set of sliding bases extends along the first direction.

[0014] The two sets of baffles are slidably mounted on the two sets of sliding bases, and several baffles in the same set are spaced apart along the first direction.

[0015] Beneficial effects: By installing the baffle on the sliding base, the baffle can be dynamically adjusted in real time during the coating process. This allows for precise control of the spatial distribution of the material to be deposited in different areas of the deposition path according to actual needs, improving the accuracy and flexibility of film thickness adjustment.

[0016] In one alternative embodiment, each set of sliding bases includes at least two sliding bases arranged along a first direction, and each sliding base is tractively connected to a sliding drive member for driving the baffle located on the sliding base to slide along the first direction.

[0017] Beneficial effects: By setting multiple sliding bases, each with its own independent sliding drive, more precise and accurate control of the baffle position can be achieved. Furthermore, using multiple sliding bases instead of a single long base increases the system's stability and reliability.

[0018] In one alternative embodiment, the baffle is mounted on the sliding base via a telescopic base, and the baffle is telescopically oriented relative to the telescopic base along the second direction.

[0019] Beneficial effects: The telescopic base design allows the baffle to adjust its covering area more flexibly, enabling precise control over different width areas of the substrate surface. Simultaneously, this design increases the system's adaptability, allowing it to better cope with varying process requirements and substrate size changes.

[0020] In one optional embodiment, a telescopic drive component is installed on the telescopic base, the telescopic drive component is throttle-connected to the baffle, and the telescopic drive component is used to drive the baffle to extend or retract in a second direction.

[0021] Beneficial effects: The presence of the telescopic drive component fully automates the baffle's extension and retraction process, automatically adjusting the baffle's position based on preset parameters or real-time feedback. This not only improves work efficiency but also reduces human error, ensuring the consistency and uniformity of film thickness.

[0022] In one alternative embodiment, a plurality of baffle position sensors are mounted on the sliding base.

[0023] Beneficial effects: By monitoring the position of the baffle in real time, the system can obtain current status information instantly and make corresponding adjustments according to actual needs.

[0024] Secondly, this utility model also provides a film thickness adjustment system for a magnetron sputtering apparatus, comprising:

[0025] The automatic baffle device for magnetron sputtering equipment as described in the first aspect of this utility model;

[0026] An online film thickness tester is used to detect the thickness of the film deposited on a substrate;

[0027] The software operating system is connected to both the online film thickness tester and the automatic baffle device. The software operating system is used to acquire film thickness data from the online film thickness tester and control the action of the baffle in the automatic baffle device based on the film thickness data.

[0028] Thirdly, this utility model also provides a magnetron sputtering apparatus, comprising:

[0029] The film thickness adjustment system of the magnetron sputtering equipment as described in the second aspect embodiment of this utility model;

[0030] The equipment body has a coating cavity, a coating area is provided in the coating cavity, and the coating area is used to place the substrate to be coated. The automatic baffle device is installed in the coating cavity. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of an automatic baffle device for a magnetron sputtering equipment according to an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the film thickness adjustment system of a magnetron sputtering device according to an embodiment of the present invention;

[0034] Figure 3 This is a diagram showing the distribution of test points on the substrate using the online film thickness tester in the film thickness adjustment system of this utility model embodiment;

[0035] Figure 4 This is a monitoring image of the nickel oxide film thickness test before the baffle position is adjusted in the magnetron sputtering equipment of this utility model embodiment;

[0036] Figure 5 This is a monitoring diagram of nickel oxide film thickness test after the baffle position is adjusted in the magnetron sputtering equipment of this utility model embodiment;

[0037] Figure 6 This is a comparison diagram showing the changes in nickel oxide film thickness before and after baffle position adjustment in the magnetron sputtering equipment of this utility model embodiment;

[0038] Figure 7 This is a comparison diagram showing the change in uniformity of nickel oxide film thickness before and after adjusting the baffle position in the magnetron sputtering equipment of this utility model embodiment;

[0039] Figure 8 This is a comparison chart of the shift power of the magnetron sputtering equipment before and after the baffle position is adjusted, according to an embodiment of this utility model.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Baffle; 2. Sliding base; 3. Telescopic base; 4. Baffle position sensor; 5. Online film thickness tester; 6. Software operating system; 7. Coating chamber; 8. Substrate; 10. Automatic baffle device. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0043] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0045] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] The following description, with reference to the accompanying drawings, illustrates an automatic baffle device 10, a film thickness adjustment system, and a magnetron sputtering apparatus according to this invention. It should be noted that the magnetron sputtering apparatus of this invention includes either the aforementioned automatic baffle device 10 or the film thickness adjustment system. Furthermore, the magnetron sputtering apparatus of this invention can be used to deposit thin films of various materials onto a substrate 8, such as nickel oxide, transparent conductive films, optical coatings, etc. For ease of description, this invention will use the deposition of nickel oxide onto a substrate 8 using a magnetron sputtering apparatus as an example, without loss of generality.

[0047] like Figure 1 As shown, the automatic baffle device 10 of the magnetron sputtering equipment according to the first aspect of the present invention includes a plurality of baffles 1.

[0048] Multiple baffles 1 are installed in the coating chamber 7 of the magnetron sputtering equipment. The baffles 1 are arranged parallel to each other between the target material and the coating area in the coating chamber 7 and are spaced apart. The multiple baffles 1 are spaced apart and each baffle 1 is movable relative to the coating area along a first direction and a second direction. The first direction and the second direction are arranged at an angle and are both parallel to the coating area.

[0049] The automatic baffle device 10 of this utility model has the following specific structure: The automatic baffle device 10 consists of multiple independently controlled baffles 1. Each baffle 1 can move within the coating cavity 7 along a first direction and a second direction.

[0050] For example Figure 1 As shown, taking a square coating area as an example, when the magnetron sputtering equipment follows... Figure 1 When placing the coating in a specific orientation, the first direction can be along the length of the coating area, i.e., the first direction is the front-to-back direction, and the second direction can be along the width of the coating area, i.e., the second direction is the left-to-right direction.

[0051] For example, in one specific embodiment, the baffle 1 is mounted on the sliding base 2 via a telescopic base 3, allowing it to extend and retract in a second direction (e.g., the left-right direction). The sliding base 2 is fixed within the coating cavity 7 and extends along a first direction (e.g., the front-back direction). Each group of sliding bases 2 includes at least two sliding bases 2 arranged in a front-back configuration, and each sliding base 2 is drivenly connected to a sliding drive member for driving the baffle 1 to slide along the first direction. Multiple baffles 1 are divided into two groups, respectively installed on both sides of the first direction, i.e. Figure 1 On the left and right sides of the substrate 8, several baffles 1 within the same group are distributed at intervals along the first direction. It can be understood that the main function of the baffles 1 is to control the amount of material to be deposited on a specific area of ​​the substrate 8 by adjusting their positions, thereby adjusting the film thickness and its uniformity.

[0052] Based on the above description of the specific structure, the working principle of the automatic baffle device 10 is as follows: The automatic baffle device 10 adjusts the nickel oxide film thickness based on the positional change of the baffle 1. By changing the shielding area of ​​the baffle 1, the deposition effect of the material to be deposited on a specific area of ​​the substrate 8 can be precisely controlled. When it is necessary to increase the film thickness in a certain area, the shielding area of ​​the baffle 1 above that area is reduced; conversely, if it is necessary to reduce the film thickness, the shielding area of ​​the baffle 1 is increased.

[0053] Furthermore, the specific working process of the automatic baffle device 10 of this utility model is as follows: During operation, assuming that the film thickness in a certain area is too thin, the corresponding baffle 1 will be adjusted according to the instruction. In this case, the baffle 1 located directly above the area will be instructed to retract or move away, that is, reduce its blocking area, so that more material to be deposited can be deposited on this area of ​​the substrate 8, thereby thickening the nickel oxide film layer in that area. Conversely, if the film thickness in a certain area is too thick, the baffle 1 corresponding to that area will be instructed to extend, increasing the blocking area to block the deposition of some of the material to be deposited, thereby achieving the effect of thinning the film thickness in that area. This method of controlling the deposition of the material to be deposited by adjusting the position of the baffle 1 significantly improves the uniformity and consistency of the film thickness without the need for frequent opening of the cavity for manual adjustment, greatly improving production efficiency and product quality. This process relies on the precision design of the baffle 1 system and the accuracy of the actuator to ensure that each adjustment is accurate.

[0054] In existing magnetron sputtering processes, to control the film thickness and uniformity of the deposited material (such as nickel oxide), fixed-position baffles are typically used to partially shield the substrate, thereby adjusting the deposition effect of the material on different areas of the substrate. These baffles are usually adjusted manually or through limited movement using simple mechanical structures. This traditional baffle system is installed inside the deposition chamber of the magnetron sputtering equipment, positioned opposite the substrate and maintained at a certain distance.

[0055] However, traditional baffle systems often employ a fixed design or can only be moved and adjusted in a limited direction. Therefore, once production begins, if the film thickness in certain areas is found to be unsatisfactory, the machine must be stopped and the baffle position manually adjusted. This is not only time-consuming and labor-intensive but also severely impacts production line efficiency. Furthermore, the limited range and direction of movement of traditional baffle systems make it difficult to achieve precise film thickness control in specific areas. For applications requiring high precision, such as the manufacture of perovskite solar cells, this limitation can lead to unstable product quality, affecting the performance of the final module. In addition, when production process parameters change or when dealing with different batches or substrates of different sizes, traditional baffle systems may not be able to make corresponding adjustments quickly and effectively, exacerbating issues of film thickness uniformity and consistency.

[0056] In summary, in order to solve the technical defects existing in the above-mentioned related technologies, this utility model provides an automatic baffle device 10 for a magnetron sputtering equipment. By setting multiple baffles 1 that can move simultaneously in the first and second directions, the film thickness can be precisely controlled by the position control of the baffles 1 without opening a cavity during the coating process of the substrate 8. This reduces the consumption of manpower and material resources caused by the problem of opening a cavity to adjust the baffles, and helps to optimize the coating quality and coating rate.

[0057] Furthermore, the automatic baffle device 10 of this utility model has at least the following advantages compared with related technologies:

[0058] (1) Multi-directional adjustable baffle 1: Each baffle 1 can move in two angled directions (first direction and second direction), both of which are parallel to the coating area. This design allows the baffle 1 to be finely adjusted over a wider range, enabling it to quickly respond to changes in film thickness requirements in different areas without frequent shutdowns.

[0059] (2) Improve adjustment accuracy: Through the support of precise mechanical structures, such as sliding base 2 and telescopic base 3, the baffle 1 can be positioned very accurately to the required position, thereby providing higher precision film thickness control capability to meet the strict requirements of high-quality product production.

[0060] (3) Enhanced adaptability: Since the baffle 1 can be flexibly adjusted according to actual production needs, the system can effectively cope with changes in process parameters or different specifications of substrates 8, ensuring uniformity and consistency of film thickness, and greatly improving production efficiency and product quality.

[0061] like Figure 1 As shown, according to some embodiments of the present invention, the first direction and the second direction are perpendicular to each other.

[0062] For example, when the coating area is rectangular, the first direction refers to the length direction of the coating area. That is, the baffle 1 can slide back and forth in a direction parallel to the longer side of the substrate 8. This movement allows the baffle 1 to cover or expose different longitudinal areas of the substrate 8, thereby controlling the amount of material to be deposited in these areas.

[0063] The second direction refers to the width direction of the coating area. That is, the baffle 1 can move left or right or extend or retract in a direction parallel to the shorter side of the substrate 8. In this way, the baffle 1 can adjust its shading range in the lateral direction of the substrate 8, further refining the spatial distribution of the material to be deposited in the deposition path, thereby optimizing the deposition effect.

[0064] In this way, because the first and second directions are angled and both parallel to the coating area, the position of baffle 1 can be flexibly adjusted on a two-dimensional plane. This design gives the baffle 1 system greater flexibility and precision, allowing for fine-tuning of the film thickness at any point on the coating area as needed, without relying on multiple fixed-position baffles 1 or complex mechanical structures to achieve a similar effect. This not only improves production efficiency but also enhances the ability to control film thickness uniformity and consistency.

[0065] like Figure 1 As shown, in some specific embodiments, the baffle 1 can be rectangular in shape, which ensures the tightness of the arrangement of multiple baffles 1. It should also be noted that the above embodiment is only one of the many embodiments of this utility model and does not constitute a specific limitation on the shape of the baffle 1. The baffle 1 can also adopt other shapes, and this utility model does not impose any special limitations here.

[0066] like Figure 1 As shown, according to some embodiments of the present invention, multiple baffles 1 are divided into two groups, and the two groups of baffles 1 are respectively installed on both sides of the first direction, and several baffles 1 in the same group are distributed at intervals along the first direction.

[0067] In this embodiment, the multiple baffles 1 are divided into two groups, and these two groups of baffles 1 are respectively installed on both sides of the first direction.

[0068] Within the same group, several baffles 1 are distributed at intervals along the first direction, ensuring that the baffles 1 in each group can cover different longitudinal areas of the coating area, thereby achieving precise control over the amount of material to be deposited in the length direction of the entire coating area.

[0069] It should be noted that "both sides of the first direction" refers to the axis of the coating area in the first direction as the standard, and the two sides of the first direction are the two sides of this axis. For example, if the first direction is the front-back direction, then the two sets of baffles 1 are located on the left and right sides of the axis of the coating area in the front-back direction as the standard. As another example, if the first direction is the left-right direction, then the two sets of baffles 1 are located on the front and back sides of the axis of the coating area in the left-right direction as the standard.

[0070] In this way, on the one hand, since the baffles 1 can be operated independently on both sides of the first direction, and the baffles 1 in the same group are spaced apart along the first direction, the spatial distribution of the material to be deposited in different areas in the deposition path can be controlled more precisely, thereby achieving higher film thickness adjustment accuracy. On the other hand, the design of dividing the baffles 1 into two groups and installing them on both sides of the coating area increases the flexibility of the system, so that the position of each baffle 1 can be adjusted individually or in combination according to actual needs to adapt to different process requirements and changes in the size of the substrate 8.

[0071] At the same time, in this way, only a small number of baffles 1 are needed to cover a large area of ​​substrate 8, reducing unnecessary shading, improving resource utilization, and also reducing system complexity and maintenance costs.

[0072] Optionally, the heights of the two sets of baffles 1 are equal, and when all the baffles 1 in both sets are fully extended, the vertical projection of all the baffles 1 can completely cover the coating area. This can improve the baffles' ability to adjust the amount of material deposited in the entire coating area, avoid areas that cannot be adjusted, and help promote the uniformity of the coating in the coating area.

[0073] like Figure 1 As shown, according to some embodiments of the present invention, the automatic baffle device 10 further includes two sets of sliding bases 2. The two sets of sliding bases 2 are fixed within the coating cavity 7 of the magnetron sputtering equipment, and are located on opposite sides of a first direction, with each set of sliding bases 2 extending along the first direction. Two sets of baffles 1 are slidably mounted on the two sets of sliding bases 2, and several baffles 1 within the same set are spaced apart along the first direction.

[0074] In this embodiment, the automatic baffle device 10 includes two sets of sliding bases 2, which are fixed inside the coating cavity 7 of the magnetron sputtering equipment and located on opposite sides of a first direction (e.g., on the left and right sides of the coating area). Each set of sliding bases 2 extends along the first direction. Two sets of baffles 1 are slidably mounted on the two sets of sliding bases 2. Thus, each baffle 1 can slide freely on its corresponding sliding base 2, thereby enabling it to move along the first direction.

[0075] Several baffles 1 in the same group are distributed at intervals along the first direction (e.g., the length direction of the sliding base 2), ensuring that each baffle 1 can cover different longitudinal areas of the coating area, providing a basis for precise control of the deposition of the material to be deposited.

[0076] In this way, by mounting the baffle 1 on the sliding base 2, the position of the baffle 1 can be dynamically adjusted before or after the coating process begins. This allows for precise control of the spatial distribution of the material to be deposited in different areas along the deposition path, improving the accuracy and flexibility of film thickness adjustment. Furthermore, the design of the sliding base 2 simplifies the mechanical structure of the entire system, reduces complexity, and facilitates maintenance. Since the baffle 1 can slide directly on the sliding base 2, a complex transmission mechanism is not required, which reduces the failure rate and simplifies the maintenance process.

[0077] Furthermore, the above design allows the system to quickly respond to different process requirements or changes in substrate 8 size without reconfiguring the entire equipment. Changing the position of the baffle 1 or adjusting its shielding range can be easily accomplished, greatly enhancing the system's adaptability and efficiency.

[0078] like Figure 1 As shown, according to some embodiments of the present invention, each set of sliding bases 2 includes at least two sliding bases 2 arranged back and forth along a first direction, and each sliding base 2 is connected to a sliding drive member for driving the baffle 1 located on the sliding base 2 to slide along the first direction.

[0079] It can be understood that each set of sliding bases 2 actually consists of at least two sliding bases 2 arranged along a first direction (e.g., the front-to-back direction). That is, on each side (e.g., the left or right side of the coating area), there is not just one sliding base 2, but multiple sliding bases 2 connected in series to jointly support and guide the movement of the baffle 1. The sliding drive unit drives the sliding bases 2 to slide along the first direction, thereby driving the baffle 1 to slide along the first direction.

[0080] Each sliding base 2 is equipped with a sliding drive component, which is kinetically connected to the baffle 1 on the sliding base 2. The function of the sliding drive component is to provide power so that the baffle 1 can slide along the sliding base 2 (i.e., in a first direction, such as the length direction parallel to the coating area). The above design ensures that the baffle 1 can be precisely positioned over its entire length.

[0081] In this way, by setting multiple sliding bases 2, each with its own independent sliding drive component, more precise and accurate control over the position of the baffle 1 can be achieved. Furthermore, using multiple sliding bases 2 instead of a single long base increases the stability and reliability of the system. Relying solely on a single long base might result in excessive load or mechanical deformation affecting the smooth movement of the baffle 1. Multiple short bases, on the other hand, distribute the load, reducing the probability of these problems occurring.

[0082] Meanwhile, each sliding base 2 has an independent drive component, which can adjust the position of the baffle 1 individually or collaboratively as needed. This allows for flexible handling even with complex process requirements or different substrate 8 specifications, ensuring optimal deposition results. Furthermore, when a component malfunctions, it can be repaired or replaced specifically without requiring a complete shutdown for inspection. This greatly simplifies the maintenance process and reduces downtime.

[0083] like Figure 1 As shown, according to some embodiments of the present invention, the baffle 1 is mounted on the sliding base 2 via the telescopic base 3, and the baffle 1 can be telescopically extended or retracted relative to the telescopic base 3 in a second direction.

[0084] It is understood that the baffle 1 is not directly fixed to the sliding base 2, but is indirectly mounted on it via a telescopic base 3. The telescopic base 3 allows the baffle 1 to be extended or retracted along a second direction (e.g., left-right direction). In this way, each baffle 1 can expand or contract along its sliding base 2 as needed in the second direction. This design allows the baffle 1 to precisely adjust its coverage area without changing its position in the first direction, thereby providing more precise control over the deposition effect of the material to be deposited on a specific area.

[0085] In summary, the design of the telescopic base 3 allows the baffle 1 to adjust its covering area more flexibly, thereby achieving precise control over different width areas on the surface of the substrate 8. Simultaneously, this design increases the system's adaptability, enabling it to better cope with different process requirements and variations in the size of the substrate 8. For example, when it is necessary to increase the amount of material deposited in a specific width area, this can be achieved by shortening the width of the baffle 1 in the corresponding area; conversely, the same applies.

[0086] Furthermore, a telescopic drive component is installed on the telescopic base 3. The telescopic drive component is connected to the baffle 1 in a transmission manner. The telescopic drive component is used to drive the baffle 1 to extend and retract in the second direction.

[0087] In this embodiment, specialized telescopic drive components are installed on the telescopic base 3, and these drive components are directly connected to the baffle 1 for transmission. The function of the telescopic drive components is to provide power so that the baffle 1 can move telescopically along a second direction (e.g., left-right direction). That is, the baffle 1 can automatically expand or contract its coverage area as needed without manual intervention.

[0088] Thus, the presence of the telescopic drive component fully automates the extension and retraction process of baffle 1, allowing its position to be automatically adjusted based on preset parameters or real-time feedback. This not only improves work efficiency but also reduces human error, ensuring the consistency and uniformity of film thickness. Furthermore, by driving baffle 1 to extend and retract along the second direction via the telescopic drive component, very precise position adjustments can be achieved. This is particularly important for applications requiring high-precision film thickness control, such as nickel oxide thin film deposition in perovskite solar cell manufacturing.

[0089] like Figure 1 As shown, according to some embodiments of this utility model, a plurality of baffle position sensors 4 are installed on the sliding base 2. It can be understood that the main function of these sensors is to monitor the specific position of the baffle 1 on it in real time, ensuring that the baffle 1 can move accurately to the designated position according to the preset instructions.

[0090] Meanwhile, since the sliding base 2 extends along the first direction, and each group of sliding bases 2 contains at least two sliding bases 2, the reasonable distribution of multiple sensors on these bases can achieve all-round monitoring of the position of the baffle 1. This helps to improve the control accuracy and response speed of the entire system.

[0091] In this way, by monitoring the position of baffle 1 in real time, the system can instantly obtain current status information and make corresponding adjustments according to actual needs. For example, if it is detected that baffle 1 has not reached the expected position, the control system can immediately issue a command for fine-tuning to ensure the final film thickness uniformity and consistency.

[0092] like Figure 1 and Figure 2 As shown, the film thickness adjustment system of the magnetron sputtering apparatus according to the second aspect embodiment of the present invention includes an automatic baffle device 10 of the magnetron sputtering apparatus as described in the first aspect embodiment of the present invention, and also includes an online film thickness tester 5 and a software operating system 6. The online film thickness tester 5 is used to detect the thickness of the film deposited on the substrate 8. The software operating system 6 is connected to both the online film thickness tester 5 and the automatic baffle device 10, and is used to acquire the film thickness data from the online film thickness tester 5 and control the action of the baffle 1 within the automatic baffle device 10 based on the film thickness data.

[0093] The film thickness adjustment system of this invention combines an automatic baffle device 10, an online film thickness tester 5, and a software operating system 6 to achieve precise control of the film thickness on the substrate 8. Its core working principle is as follows:

[0094] Based on the design described above, the automatic baffle device 10 can move along a first direction (e.g., front-to-back) and a second direction (e.g., left-to-right), and adjust the position of the baffle 1 via a telescopic drive. This allows the baffle 1 to flexibly block or expose different parts of the coating area, thereby controlling the deposition effect of the material to be deposited. The online film thickness tester 5 is used to monitor the thickness of the nickel oxide film on the substrate 8 in real time and transmit the data to the software operating system 6. It can continuously measure the film thickness at different locations during the production process, ensuring that the acquired data is representative and accurate. Furthermore, the software operating system 6 receives data from the online film thickness tester 5 and analyzes it. Based on preset standards and film thickness distribution, the software operating system 6 calculates the specific baffle 1 that needs adjustment and its positional change, and then sends instructions to the automatic baffle device 10 to execute the corresponding actions.

[0095] This integrated design allows the system to dynamically respond to changes in film thickness during actual production, ensuring that the film thickness uniformity and consistency of the final product reach an optimal state.

[0096] In summary, based on the above working principle, the general working process of the film thickness adjustment system of this utility model is as follows:

[0097] (1) Data acquisition and analysis: The online film thickness tester 5 continuously detects the film thickness at various points on the surface of the substrate 8 during the magnetron sputtering process and transmits these data to the software operating system 6. For example, within a production cycle, the online film thickness tester 5 may perform multiple measurements at multiple predetermined points on the substrate 8 to establish a detailed film thickness distribution map.

[0098] After receiving this data, the software operating system 6 first processes and analyzes it. It compares the currently measured film thickness value with the set target value to identify which areas have film thicknesses exceeding the allowable deviation range.

[0099] (2) Baffle 1 adjustment and film thickness optimization: Once the area that needs to be adjusted is determined, the software operating system 6 will generate a specific baffle 1 adjustment scheme. For example, if the film thickness in a certain area is lower than the target value, the corresponding baffle 1 will be instructed to shrink inward to reduce the shading of the area and allow more material to be deposited to be deposited; conversely, if the film thickness in a certain area is too high, the corresponding baffle 1 will be instructed to expand outward to increase the shading area and reduce the amount of material to be deposited.

[0100] Subsequently, the software operating system 6 sends these adjustment commands to the automatic baffle device 10. The sliding drive and telescopic drive components within the automatic baffle device 10 operate according to the commands, precisely moving the baffle 1 to the designated position.

[0101] After a period of operation, the online film thickness tester 5 re-detects the film thickness on the substrate 8 to evaluate the adjustment effect. If the film thickness still does not reach the ideal state, the above process will continue to repeat until the film thickness at all detection points falls within the set standard range.

[0102] In summary, through this method, the film thickness adjustment system of this invention can dynamically adjust the film thickness without stopping the machine, which greatly improves production efficiency and product quality.

[0103] The following is a specific embodiment of the film thickness adjustment system of the magnetron sputtering equipment of this utility model, with reference to the accompanying drawings.

[0104] The film thickness adjustment system of the magnetron sputtering equipment is used to deposit nickel oxide thin films on substrate 8 and to adjust the thickness of the nickel oxide thin films. The system consists of three main parts: an online film thickness meter 5 (TDM), a software operating system 6, and an electric baffle device 1; the specific functions are as follows.

[0105] In this embodiment, the online film thickness tester 5 is installed at the feed port of the automatic nickel oxide conveyor. For example, in a process cycle, X modules are produced, and the online film thickness tester is calibrated. An online film thickness test is performed every time Y modules are fed. The test area of ​​the online film thickness tester is as follows: Figure 3 As shown, the online film thickness tester tested 12 points on a 0.6m×1.2m perovskite module and fed the film thickness data of the test points back to the software operating system 6 for summary and analysis.

[0106] Software Operating System 6 serves as a data collection, analysis, and anomaly feedback hub. Its implementation involves: summarizing film thickness data from the online film thickness meter; controlling the film thickness data according to standard control ranges, such as 16.5nm ± 1nm and intra-wafer uniformity within 5%. If the tested film thickness exceeds the control range, Software Operating System 6 will issue an anomaly alarm, such as… Figure 2 As shown; after the software operating system 6 alarms for abnormal film thickness points, it will feed back the abnormal point data to the electric baffle 1 device. The electric baffle 1 device will adjust the position of the baffle 1 in the abnormal film thickness area to adjust the film thickness.

[0107] by Figure 4 Taking the test data as an example, the film thickness was adjusted from... Figure 4The data shows three abnormal points, and the film thickness uniformity exceeds 5%, with a uniformity of 8.08%. The data indicates that the overall film thickness is too low. The overall film thickness can be improved by increasing the power of the nickel oxide target or reducing the processing speed. This method can improve the overall nickel oxide film thickness, causing the average film thickness to approach 16.5 nm. While the film thickness at point 2 can be improved to within the control range, the film thickness at points 4 and 12 is further outside the control range. Therefore, it is necessary to adjust the position of baffle 1 to adjust the film thickness at points 4 and 12. The baffle 1 area corresponding to point 4 is the third baffle 1, and the baffle 1 area corresponding to point 12 is the eighteenth baffle 1. At this point, it is only necessary to adjust the third and eighteenth baffles by extending them to increase the blocking area. Through multiple data tests, multiple adjustments of retraction or extension are made until the film thickness is within the standard control range. The adjusted film thickness data is as follows. Figure 5 As shown, the film thickness is controlled within the standard range, and the uniformity is 3.27%.

[0108] The adjustment principle is understandable: increasing the shielding area of ​​baffle 1 can block the deposition of the material to be deposited in that area, thereby reducing the amount of material deposited on the component surface and reducing the film thickness in that area. If the overall film thickness monitoring shows an excessively thick film, the adjustment method is the opposite of the above adjustment. After the overall adjustment, it is still necessary to identify which area has an abnormal point and adjust the baffle 1 of the corresponding abnormal point area to achieve the effect of adjusting the film thickness.

[0109] The electric baffle 1 device is a redesigned and modified version of the cavity surface. The baffle 1 is designed to enable automatic motion adjustment. The electric baffle 1 device functions to receive feedback from abnormal film thickness points in the software operating system 6, and automatically adjust the baffle 1 at the corresponding points to block or reduce the deposition of the material to be deposited on the substrate surface, thereby adjusting the film thickness in that area.

[0110] Specifically, the differences before and after the design modification are compared as follows:

[0111] (1) 30 infrared sensors (i.e., baffle position sensors 4) have been added: the position of baffle 1 in sliding base 2 can be monitored in real time. Each sliding base 2 is designed with 5 sensors and designed according to the width of baffle 1 and the length of the drive shaft, so that baffle 1 can be stopped at any position of sliding base 2 during the up and down movement.

[0112] (2) Six sliding bases 2 were added: the baffle 1 can move up and down, and the baffle 1 can move up and down freely on the sliding base 2. Combined with the infrared sensor, it can stop at any position. The cavity design with six sliding bases 2 is based on the film thickness test area to ensure that the film thickness test area can be adjusted accurately.

[0113] (3) Modify the fixed baffle 1 into a freely retractable electric baffle 1, and number each baffle 1: 1→18; each baffle 1 is independently controlled and can be freely retracted and extended.

[0114] In this way, through the coordinated work of the above three parts, the automatic film thickness testing and adjustment film thickness uniformity system of nickel oxide equipment can effectively monitor and adjust the film thickness to ensure that it is within the standard range and maintain the stability of the component power.

[0115] In summary, based on the aforementioned magnetron sputtering equipment, the film thickness adjustment system exhibits the following effects after numerous experiments:

[0116] (1) The online film thickness tester has increased the daily film thickness test data. Taking the production of 300 modules per day as an example, the data has increased from 4 sets per day to 30 sets, which greatly increases the film thickness data. It can more intuitively monitor the film thickness abnormality problem in the production process in real time; and it reduces labor costs and reduces personnel testing time.

[0117] (2) The number of times the cavity is opened when the film thickness is abnormal can be reduced by the automatic baffle device 10. Originally, when the film thickness is abnormal, the cavity needs to be opened and the baffle 1 needs to be adjusted manually. This solution requires a lot of manpower and resources, requires machine shutdown and restart, affecting the production rhythm, and if the adjustment is not in place, multiple cavity opening adjustments are required.

[0118] The automatic baffle device 10 can reduce the number of cavity openings. Based on feedback from abnormal film thickness data, it coordinates with process adjustments to make targeted adjustments to the abnormal areas. Multiple adjustments can be made to control the film thickness within the standard range. Figure 6 And control the film thickness uniformity to within 5%. Figure 7 .

[0119] (3) Through the monitoring and adjustment of this system, the power stability of perovskite solar cell modules is effectively stabilized, and the fluctuation of module power is reduced. Looking at the data before and after, for example... Figure 8 Because the film thickness uniformity remains stable, the impact of film thickness uniformity on module power is reduced, and the system increases the overall average power of the module by 2.6W.

[0120] According to a third aspect embodiment of the present invention, a magnetron sputtering apparatus includes a film thickness adjustment system for a magnetron sputtering apparatus as described in a second aspect embodiment of the present invention, and also includes an apparatus body. The apparatus body has a coating cavity 7, a coating area is provided in the coating cavity 7, and the coating area is used to place a substrate 8 to be coated. An automatic baffle device 10 is installed in the coating cavity 7.

[0121] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An automatic baffle device, characterized in that, include: Multiple baffles (1) are installed in the coating chamber (7) of the magnetron sputtering equipment. The baffles are arranged parallel to each other between the target material and the coating area in the coating chamber (7) and are spaced apart. The multiple baffles (1) are spaced apart and each baffle (1) is movable relative to the coating area along a first direction and a second direction. The first direction and the second direction are arranged at an angle and are both parallel to the coating area.

2. The automatic baffle device according to claim 1, characterized in that, The first direction and the second direction are perpendicular to each other.

3. The automatic baffle device according to claim 2, characterized in that, The baffles (1) are divided into two groups, and the two groups of baffles (1) are respectively installed on both sides of the first direction, and the baffles (1) in the same group are distributed at intervals along the first direction.

4. The automatic baffle device according to claim 3, characterized in that, Also includes: Two sets of sliding bases (2) are fixed inside the coating cavity (7) of the magnetron sputtering equipment. The two sets of sliding bases (2) are located on both sides of the first direction, and each set of sliding bases (2) extends along the first direction. The two sets of baffles (1) are slidably mounted on the two sets of sliding bases (2), and a number of baffles (1) in the same set are spaced apart along the first direction.

5. The automatic baffle device according to claim 4, characterized in that, Each set of sliding bases (2) includes at least two sliding bases (2) arranged along the first direction, and each sliding base (2) is connected to a sliding drive member for driving the baffle (1) located on the sliding base (2) to slide along the first direction.

6. The automatic baffle device according to claim 4, characterized in that, The baffle (1) is mounted on the sliding base (2) via the telescopic base (3), and the baffle (1) can be telescopically extended and retracted relative to the telescopic base (3) in the second direction.

7. The automatic baffle device according to claim 6, characterized in that, The telescopic base (3) is equipped with a telescopic drive component, which is connected to the baffle (1) in a transmission manner. The telescopic drive component is used to drive the baffle (1) to extend and retract in the second direction.

8. The automatic baffle device according to any one of claims 4 to 7, characterized in that, Several baffle position sensors (4) are installed on the sliding base (2).

9. A film thickness adjustment system, characterized in that, include: Automatic baffle device (10) as described in any one of claims 1 to 8; An online film thickness tester (5) is used to detect the thickness of the film deposited on the substrate (8); The software operating system (6) is connected to the online film thickness tester (5) and the automatic baffle device (10) respectively. The software operating system (6) is used to acquire the film thickness data of the online film thickness tester (5) and control the action of the baffle (1) in the automatic baffle device (10) according to the film thickness data.

10. A magnetron sputtering apparatus, characterized in that, include: The film thickness adjustment system as described in claim 9; The equipment body has a coating cavity (7), a coating area is provided in the coating cavity (7), and the automatic baffle device (10) is installed in the coating cavity (7).

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