Adhesive hardening speed testing device
By designing a mold adjustment unit and a material feeding detection unit, the problems of small capacity and inconvenient cleaning of existing devices are solved, enabling accurate testing of adhesive hardening speed and reducing errors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TAICANG CITY JINMAO NEW MATERIALS TECH CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-15
AI Technical Summary
Existing adhesive hardening speed testing devices have small mold capacity, cannot be adjusted, cannot guarantee consistent starting temperature, and are inconvenient to clean, resulting in large errors in test results.
A device for testing the curing speed of adhesives was designed, comprising a mold adjustment unit and a material feeding detection unit. The mold space and temperature are adjusted by a hydraulic cylinder and a heating wire, and real-time monitoring and data analysis are performed by combining a CCD camera and a force sensor.
It enables precise testing of adhesive curing characteristics under different areas, volumes, and depths, reduces testing errors, ensures consistent starting temperature, and facilitates cleaning.
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Figure CN224247599U_ABST