Optical module

Abstract

The utility model relates to an optical module. The optical module comprises a housing; the circuit board is arranged in the shell; the electronic component is arranged on one side of the circuit board and is electrically connected with the circuit board; the heat dissipation assembly is arranged in the shell; wherein the heat dissipation assembly comprises a first heat conduction part and a heat conduction boss, the heat conduction boss is arranged on the side, away from the circuit board, of the electronic component, the space between the heat conduction boss and the electronic component is filled with the first heat conduction part, and the first heat conduction part is constructed to be of a structure with heat conductivity and adhesion. According to the optical module, the arrangement of the first heat conduction piece reduces the thermal resistance between the heat conduction boss and the electronic component, so that the electronic component can rapidly dissipate heat and be cooled, and the operation performance of the optical module is stable; the heat-conducting boss and the electronic component are bonded and fixed through the first heat-conducting piece, no additional fixing piece needs to be arranged, and the overall structure and heat dissipation of the optical module are facilitated to be simplified.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] The ever-growing industries of high-computing applications such as artificial intelligence require higher-speed optical communication. Currently, data center Ethernet switches using pluggable optical modules are migrating to 800GbE. The electrical connection between the internal switching chip and the optical module needs to transmit 53Gbaud PAM4 signals. When transmitting high-speed signals over long distances, it is necessary to introduce chips that implement digital signal processing technology (DSP chips) to correct the high-speed signals. DSP chips are high-power electronic components, accounting for more than 60% of the total power consumption of the optical module, and the optical module needs to dissipate heat and cool down in a timely manner.

[0003] Currently, there are two main methods for heat dissipation of optical modules: (1) the chip conducts heat to the casing through the circuit board, and the casing transfers the heat to the external environment; (2) a silicone heat sink is attached to the chip, the silicone heat sink contacts the internal protrusion of the casing, the protrusion transfers the heat to the surface of the casing, and the casing then transfers the heat to the external environment. Method (1) is active cooling, which has poor heat dissipation capacity; Method (2) has a high degree of casing customization, poor product compatibility, and high thermal resistance between the heat-generating components and the heat dissipation parts. Neither of the above methods can meet the requirements for rapid heat dissipation of optical modules. Utility Model Content

[0004] Therefore, it is necessary to provide a new type of optical module to address the problem of poor heat dissipation in existing optical modules.

[0005] An optical module, comprising:

[0006] case;

[0007] The circuit board is disposed within the housing;

[0008] Electronic components are disposed on one side of the circuit board and electrically connected to the circuit board;

[0009] A heat dissipation assembly is disposed within the housing;

[0010] The heat dissipation assembly includes a first thermally conductive element and a thermally conductive protrusion. The thermally conductive protrusion is located on the side of the electronic component away from the circuit board. The first thermally conductive element is filled between the thermally conductive protrusion and the electronic component. The first thermally conductive element is configured to have thermal conductivity and adhesion.

[0011] In the aforementioned optical module, a first thermally conductive element is filled between the heat-conducting protrusion and the electronic components. The first thermally conductive element is constructed to have both thermal conductivity and adhesive properties. During the operation of the optical module, the heat generated by the electronic components is transferred to the heat-conducting protrusion through the first thermally conductive element, and then transferred from the heat-conducting protrusion to the housing, and then conducted from the housing to the external environment. The first thermally conductive element reduces the thermal resistance between the heat-conducting protrusion and the electronic components, enabling the electronic components to dissipate heat and cool down quickly, thus ensuring stable operation of the optical module. The heat-conducting protrusion and the electronic components are bonded and fixed together by the first thermally conductive element, eliminating the need for additional fixing components, which simplifies the overall structure and heat dissipation of the optical module.

[0012] In some embodiments, the thermally conductive boss has a first thermally conductive surface facing the electronic component, the electronic component has a first top surface facing the thermally conductive boss, and a first circumferential side surface surrounding the outer periphery of the first top surface; the first thermally conductive element is disposed between the first thermally conductive surface and the first top surface, and the first thermally conductive element at least partially covers the first circumferential side surface.

[0013] In some embodiments, the first heat-conducting member includes a first main body portion and a first edge portion surrounding the outer periphery of the first main body portion, the first main body portion being sandwiched between the heat-conducting boss and the first top surface; the first edge portion covers the outer side of the first circumferential side, and the height of the first circumferential side covered accounts for 1 / 4 to 1 / 3 of the total height of the electronic component.

[0014] In some embodiments, the thickness of the first main body portion ranges from 0.1 mm to 0.2 mm.

[0015] In some embodiments, the housing has an inner contact surface facing the heat-conducting boss, the heat-conducting boss has a second heat-conducting surface facing the housing, the second heat-conducting surface and the first heat-conducting surface are disposed opposite to each other along a first direction, the first direction being the height direction of the heat-conducting boss; the heat dissipation assembly further includes a second heat-conducting element, the second heat-conducting element is filled between the second heat-conducting surface and the inner contact surface, the second heat-conducting element is configured to have a structure with thermal conductivity and adhesion.

[0016] In some embodiments, the heat-conducting boss further has a second circumferential side surface surrounding the outer periphery of the second heat-conducting surface; the second heat-conducting member includes a second main body portion and a second edge portion surrounding the outer periphery of the second main body portion, the second main body portion being sandwiched between the second heat-conducting surface and the inner contact surface; the second edge portion covers the outer periphery of the second circumferential side surface, and the height of the second circumferential side surface covered accounts for 1 / 4 to 1 / 3 of the total height of the heat-conducting boss.

[0017] In some embodiments, the thickness of the second main body portion ranges from 0.1 mm to 0.2 mm.

[0018] In some embodiments, the second thermally conductive element and / or the first thermally conductive element is a thermally conductive gel structure having 5µm~10µm solid particles and a thermal conductivity of 10W / (m·K), and the adhesive peel strength of the thermally conductive gel is 0.5Mpa~2Mpa; and / or, the thermally conductive boss is a metal structure with a thermal conductivity of 390W / (m·K).

[0019] In some embodiments, the ratio of the area of ​​the second heat-conducting surface to the area of ​​the first heat-conducting surface is at least 2.

[0020] In some embodiments, the heat-conducting boss has a clearance portion on at least one side along the second direction, the clearance portion being located between the second heat-conducting surface and the first heat-conducting surface, the second direction being the length direction of the heat-conducting boss. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an optical module in some embodiments of this application.

[0022] Figure 2 for Figure 1 The image shows a cross-sectional view of the optical module along plane AA.

[0023] Figure 3 for Figure 2 A magnified view of part B of the optical module shown.

[0024] Figure label:

[0025] 100. Housing; 101. Inner contact surface;

[0026] 200. Circuit board;

[0027] 300. Electronic component; 301. First top surface; 302. First circumferential side surface;

[0028] 400, Heat dissipation assembly; 410, First heat-conducting component; 411, First main body portion; 412, First edge portion; 420, Heat-conducting boss; 421, First heat-conducting surface; 422, Second heat-conducting surface; 423, Second circumferential side surface; 424, Clearance portion; 430, Second heat-conducting component; 431, Second main body portion; 432, Second edge portion. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "initial," "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0035] Please refer to Figures 1 to 3 In one embodiment, the optical module includes a housing 100, a circuit board 200, electronic components 300, and a heat dissipation assembly 400. The circuit board 200 is disposed within the housing 100, and the electronic components 300 are disposed on one side of the circuit board 200 and electrically connected to the circuit board 200. The heat dissipation assembly 400 is disposed within the housing 100. The heat dissipation assembly 400 includes a first heat-conducting element 410 and a heat-conducting boss 420. The heat-conducting boss 420 is disposed on the side of the electronic components 300 away from the circuit board 200. The space between the heat-conducting boss 420 and the electronic components 300 is filled with the first heat-conducting element 410. The first heat-conducting element 410 is configured to have thermal conductivity and adhesion.

[0036] It should be noted that an optical module is an optoelectronic device that converts electrical signals into optical signals, and electronic component 300 is a chip that implements digital signal processing technology (i.e., a DSP chip). During the operation of the optical module, electronic component 300 generates a large amount of heat. The heat dissipation component 400 conducts the heat generated by electronic component 300 to the housing 100, and then from the housing 100 to the external environment, thereby dissipating heat and cooling electronic component 300.

[0037] Here, the heat-conducting boss 420, electronic components 300, and circuit board 200 are stacked sequentially from top to bottom, and the heat-conducting boss 420 and electronic components 300 are fixed and heat-transferred through the first heat-conducting component 410.

[0038] In the aforementioned optical module, a first thermally conductive element 410 is filled between the thermally conductive protrusion 420 and the electronic component 300. The first thermally conductive element 410 is constructed to have both thermal conductivity and adhesive properties. During the operation of the optical module, the heat generated by the electronic component 300 is transferred to the thermally conductive protrusion 420 through the first thermally conductive element 410, and then transferred from the thermally conductive protrusion 420 to the housing 100, and then conducted from the housing 100 to the external environment. The setting of the first thermally conductive element 410 reduces the thermal resistance between the thermally conductive protrusion 420 and the electronic component 300, enabling the electronic component 300 to dissipate heat and cool down quickly, thus ensuring stable operation of the optical module. The thermally conductive protrusion 420 and the electronic component 300 are bonded and fixed together by the first thermally conductive element 410, eliminating the need for additional fixing components, which simplifies the overall structure and heat dissipation of the optical module.

[0039] In the embodiments of this application, the housing 100 is a component used to provide installation space for the various parts of the optical module, and the housing 100 can adopt various structural forms. For example, the housing 100 includes an upper cover and a lower cover, which are closed to form an installation space. The upper cover and the lower cover can be a separate structure or an integral structure, and the overall shape of the housing 100 can be designed according to relevant regulations or design requirements.

[0040] In the embodiments of this application, the circuit board 200 is disposed within the housing 100. To prevent the circuit board 200 from shifting within the housing 100, a limiting structure can be provided within the housing 100 to limit and fix the circuit board 200 within the housing 100. For example, the limiting structure can be a limiting post or a limiting groove disposed within the housing 100.

[0041] In the embodiments of this application, the thermally conductive boss 420 is a component with thermal conductivity, and the thermally conductive boss 420 can be made of various thermally conductive materials and structural forms. For example, the thermally conductive boss 420 has a rectangular block structure, and the material of the thermally conductive boss 420 is C11000 copper.

[0042] In the embodiments of this application, the first thermal conductive element 410 is a structure with thermal conductivity and adhesion. The first thermal conductive element 410 can be a pure liquid material or a solid-liquid mixture material. For example, the first thermal conductive element 410 is a thermally conductive gel.

[0043] For details, please refer to Figure 2 and Figure 3 The heat-conducting boss 420 has a first heat-conducting surface 421 facing the electronic component 300. The electronic component 300 has a first top surface 301 facing the heat-conducting boss 420 and a first circumferential side surface 302 surrounding the outer periphery of the first top surface 301. The first heat-conducting element 410 is filled between the first heat-conducting surface 421 and the first top surface 301, and the first heat-conducting element 410 at least partially covers the first circumferential side surface 302.

[0044] It should be noted that the first circumferential side surface 302 is a surface surrounding the outer periphery of the first top surface 301 and extending downward from the top edge of the first top surface 301. When an excess of the first heat-conducting element 410 is filled between the first heat-conducting surface 421 and the first top surface 301, the excess first heat-conducting element 410 will overflow and cover the first circumferential side surface 302.

[0045] The beneficial effect here is that not only is a first heat-conducting element 410 provided between the first heat-conducting surface 421 and the first top surface 301 of the electronic component 300, but the first heat-conducting element 410 is also at least partially covered on the first circumferential side surface 302 of the electronic component 300, which further increases the contact area for heat conduction and facilitates the rapid heat dissipation of the electronic component 300.

[0046] In the embodiments of this application, the electronic component 300 is rectangular, with one first top surface 301 and four first circumferential side surfaces 302 connected end to end. Each side surface is partially covered by the first heat-conducting element 410, and the height to which each side surface is covered is the same. The first top surface 301 and the four side surfaces are planar structures. In other embodiments, the electronic component 300 may also be cylindrical or other shapes, and correspondingly, the first top surface 301 and the first circumferential side surfaces 302 may also be other shapes.

[0047] In the embodiments of this application, the first heat-conducting surface 421 faces the first top surface 301 of the electronic component 300. Since the first top surface 301 is a planar structure, the first heat-conducting surface 421 is also a planar structure to increase the contact area for heat conduction.

[0048] For more specific details, please refer to Figure 2 and Figure 3 The first heat-conducting component 410 includes a first main body portion 411 and a first edge portion 412 surrounding the outer periphery of the first main body portion 411. The first main body portion 411 is sandwiched between the heat-conducting boss 420 and the first top surface 301. The first edge portion 412 covers the outside of the first circumferential side surface 302, and the height of the first circumferential side surface 302 covered accounts for 1 / 4 to 1 / 3 of the total height of the electronic component 300.

[0049] Understandably, the first edge portion 412 surrounds the outer periphery of the first main body portion 411 and extends downward from the top edge of the first main body portion 411. The height to which the first circumferential side portion 302 is covered, that is, the height of the first circumferential side portion 302 at... Figure 2 and Figure 3 The dimensions covered in the X direction are shown; the total height of electronic component 300, that is, the height of electronic component 300 in... Figure 2 and Figure 3 The dimension in the X direction is shown.

[0050] The beneficial effect here is that the height of the first circumferential side 302 covered accounts for 1 / 4 to 1 / 3 of the total height of the electronic component 300, which can increase the contact area for heat conduction of the electronic component 300 without hindering the installation of other components inside the housing 100, and can reserve enough space for the installation of other components.

[0051] In the embodiments of this application, the electronic component 300 is in the shape of a cuboid, the number of first top surfaces 301 is one, the first circumferential side surfaces 302 include four side surfaces connected end to end, and correspondingly, the first edge portion 412 has a closed ring structure so that the first edge portion 412 can cover the outside of the first circumferential side surfaces 302.

[0052] In the embodiments of this application, an excess of the first heat-conducting element 410 is filled between the first heat-conducting surface 421 and the first top surface 301. The excess first heat-conducting element 410 overflows and covers the first circumferential side surface 302, thereby forming the first main body portion 411 and the first edge portion 412 surrounding the outer periphery of the first main body portion 411.

[0053] For a specific embodiment, please refer to Figure 2 and Figure 3 The thickness of the first main body 411 ranges from 0.1mm to 0.2mm.

[0054] It should be noted that the thickness of the first main body portion 411, that is, the thickness of the first main body portion 411 in... Figure 2 and Figure 3 The dimension in the X direction is shown.

[0055] The beneficial effect here is that by limiting the thickness of the first main body portion 411 of the first heat-conducting member 410 to a preset range, not only can the thermal resistance between the heat-conducting boss 420 and the electronic component 300 be reduced, enabling the electronic component 300 to dissipate heat and cool down quickly, but also the first main body portion 411 can be prevented from being too thick and occupying too much space.

[0056] In the embodiments of this application, the thickness of the first main body 411 can be 0.1 mm, 0.15 mm or 0.2 mm.

[0057] Please refer to Figure 2 and Figure 3 The housing 100 has an inner contact surface 101 facing the heat-conducting boss 420. The heat-conducting boss 420 has a second heat-conducting surface 422 facing the housing 100. The second heat-conducting surface 422 and the first heat-conducting surface 421 are arranged opposite to each other along a first direction, which is the height direction of the heat-conducting boss 420. The heat dissipation assembly 400 also includes a second heat-conducting element 430. The second heat-conducting element 430 is filled between the second heat-conducting surface 422 and the inner contact surface 101. The second heat-conducting element 430 is constructed to have a structure with thermal conductivity and adhesion.

[0058] It should be noted that the heat-conducting boss 420, electronic components 300, and circuit board 200 are stacked sequentially from top to bottom. The heat-conducting boss 420 and electronic components 300 are fixed and heat-transferring through the first heat-conducting component 410, and the heat-conducting boss 420 and housing 100 are fixed and heat-transferring through the second heat-conducting component 430. During the operation of the optical module, the heat generated by the electronic components 300 is transferred to the first heat-conducting surface 421 through the first heat-conducting component 410, then to the second heat-conducting surface 422, and finally to the inner contact surface 101 through the second heat-conducting component 430. The heat is then conducted from the inside of the housing 100 to the external environment, thereby cooling the electronic components 300.

[0059] The beneficial effect here is that the heat-conducting boss 420 and the housing 100 are fixed and heat-transferred through the second heat-conducting component 430, which reduces the thermal resistance between the heat-conducting boss 420 and the housing 100, enabling the electronic components 300 to dissipate heat and cool down quickly, thus making the optical module's operating performance stable.

[0060] In the embodiments of this application, the second thermal conductive element 430 is a structure with thermal conductivity and adhesion. The second thermal conductive element 430 can be a pure liquid material or a solid-liquid mixture material. For example, the second thermal conductive element 430 is a thermally conductive gel.

[0061] In the embodiments of this application, the second heat-conducting surface 422 faces the inner contact surface 101 of the housing 100. Since the inner contact surface 101 of the housing 100 is a planar structure, the second heat-conducting surface 422 is also a planar structure to increase the contact area for heat conduction.

[0062] Further, please refer to Figure 2 and Figure 3 The heat-conducting boss 420 also has a second circumferential side 423 surrounding the outer periphery of the second heat-conducting surface 422; the second heat-conducting member 430 includes a second main body portion 431 and a second edge portion 432 surrounding the outer periphery of the second main body portion 431, the second main body portion 431 being sandwiched between the second heat-conducting surface 422 and the inner contact surface 101; the second edge portion 432 covering the outer periphery of the second circumferential side 423, the height of the second circumferential side 423 being covered is in the range of 1 / 4 to 1 / 3 of the total height of the heat-conducting boss 420.

[0063] It should be noted that the second circumferential side 423 is a surface surrounding the outer periphery of the second heat-conducting surface 422 and extending downward from the top edge of the second heat-conducting surface 422. When an excess of the second heat-conducting element 430 is filled between the second heat-conducting surface 422 and the inner contact surface 101, the excess second heat-conducting element 430 will overflow and cover the second circumferential side 423.

[0064] The beneficial effect here is that the height of the second circumferential side 423 covered accounts for 1 / 4 to 1 / 3 of the total height of the heat-conducting boss 420. This can increase the contact area for heat conduction of the heat-conducting boss 420 without hindering the installation of other components inside the housing 100, and can reserve enough space for the installation of other components.

[0065] In embodiments of this application, the second circumferential side 423 includes four side surfaces connected end to end, each side surface being partially covered by the second heat-conducting element 430, and each side surface being covered to the same height; wherein, all four side surfaces are planar structures. In other embodiments, the second circumferential side surface 423 may also have other shapes.

[0066] In the embodiments of this application, an excess of the second heat-conducting element 430 is filled between the second heat-conducting surface 422 and the inner contact surface 101. The excess second heat-conducting element 430 overflows and covers the second circumferential side surface 423, thereby forming the second main body portion 431 and the first edge portion 412 surrounding the outer periphery of the second main body portion 431.

[0067] Furthermore, please refer to Figure 2 and Figure 3 The thickness of the second main body 431 ranges from 0.1 mm to 0.2 mm.

[0068] It should be noted that the thickness of the second main body portion 431, that is, the thickness of the second main body portion 431 in... Figure 2 and Figure 3 The dimension in the X direction is shown.

[0069] The beneficial effect here is that by limiting the thickness of the second main body portion 431 of the second heat-conducting member 430 to a preset range, not only can the thermal resistance between the heat-conducting boss 420 and the electronic component 300 be reduced, enabling the electronic component 300 to dissipate heat and cool down quickly, but also the second main body portion 431 can be prevented from being too thick and occupying too much space.

[0070] In the embodiments of this application, the thickness of the second main body 431 can be 0.1 mm, 0.15 mm or 0.2 mm.

[0071] Please refer to Figure 2 and Figure 3 The second thermal conductive element 430 and / or the first thermal conductive element 410 are thermally conductive gel structures with solid particles of 5µm to 10µm and a thermal conductivity of 10W / (m·K), and the adhesive peel strength of the thermally conductive gel is 0.5Mpa to 2Mpa; and / or the thermally conductive boss 420 is a metal structure with a thermal conductivity of 390W / (m·K).

[0072] As can be understood, thermal conductivity refers to the ability of a substance to conduct heat through a unit area per unit time under a unit temperature gradient. For example, the higher the thermal conductivity, the stronger the heat conduction ability of the substance.

[0073] The beneficial effects here are as follows: the second heat-conducting element 430 and / or the first heat-conducting element 410 are thermally conductive gel structures with solid particles of 5µm~10µm, a thermal conductivity of 10W / (m·K), and an adhesive peel strength of 0.5 MPa~2 MPa, so that the minimum gap distance of the adhesive joint is 0.05mm; the thermally conductive boss 420 is a metal structure with a thermal conductivity of 390W / (m·K), which is conducive to the rapid heat transfer of the thermally conductive boss 420.

[0074] Further, please refer to Figure 2 and Figure 3 The ratio of the area of ​​the second heat-conducting surface 422 to the area of ​​the first heat-conducting surface 421 is at least 2.

[0075] The beneficial effect here is that the area of ​​the second heat-conducting surface 422 is larger than that of the first heat-conducting surface 421. Heat can be quickly conducted to the second heat-conducting surface 422 through the heat-conducting protrusion 420, and then conducted to the inner contact surface 101 of the housing 100 through the second heat-conducting surface 422, which increases the contact area for heat conduction and is conducive to improving heat conduction efficiency.

[0076] In the embodiments of this application, the ratio of the area of ​​the second heat-conducting surface 422 to the area of ​​the first heat-conducting surface 421 can be a value such as 2, 3, or 4.

[0077] Furthermore, please refer to Figure 2 and Figure 3 The heat-conducting boss 420 has a clearance portion 424 on at least one side along the second direction. The clearance portion 424 is located between the second heat-conducting surface 422 and the first heat-conducting surface 421. The second direction is the length direction of the heat-conducting boss 420.

[0078] It should be noted that the second direction is Figure 2 and Figure 3 Y direction shown.

[0079] The beneficial effect here is that the clearance portion 424 is located between the second heat-conducting surface 422 and the first heat-conducting surface 421, which not only does not affect the heat transfer of the heat-conducting boss 420, but also provides sufficient clearance space for the installation of other components of the optical module.

[0080] In the embodiments of this application, the clearance portion 424 is stepped, for example, the clearance portion 424 is an L-shaped step. In other embodiments, the clearance portion 424 may also be other shapes.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An optical module, characterized in that, include: Casing (100); A circuit board (200) is disposed within the housing (100); An electronic component (300) is disposed on one side of the circuit board (200) and electrically connected to the circuit board (200); A heat dissipation assembly (400) is disposed within the housing (100); The heat dissipation assembly (400) includes a first heat-conducting element (410) and a heat-conducting boss (420). The heat-conducting boss (420) is disposed on the side of the electronic component (300) away from the circuit board (200). The first heat-conducting element (410) is filled between the heat-conducting boss (420) and the electronic component (300). The first heat-conducting element (410) is constructed to have thermal conductivity and adhesion.

2. The optical module according to claim 1, characterized in that, The heat-conducting boss (420) has a first heat-conducting surface (421) facing the electronic component (300), and the electronic component (300) has a first top surface (301) facing the heat-conducting boss (420) and a first circumferential side surface (302) surrounding the outer periphery of the first top surface (301). The first heat-conducting element (410) is disposed between the first heat-conducting surface (421) and the first top surface (301), and the first heat-conducting element (410) at least partially covers the first circumferential side surface (302).

3. The optical module according to claim 2, characterized in that, The first heat-conducting component (410) includes a first main body (411) and a first edge (412) surrounding the outer periphery of the first main body (411). The first main body (411) is sandwiched between the heat-conducting boss (420) and the first top surface (301). The first edge portion (412) covers the outside of the first circumferential side (302), and the height of the first circumferential side (302) covered is in the range of 1 / 4 to 1 / 3 of the total height of the electronic component (300).

4. The optical module according to claim 3, characterized in that, The thickness of the first main body (411) ranges from 0.1 mm to 0.2 mm.

5. The optical module according to claim 2, characterized in that, The housing (100) has an inner contact surface (101) facing the heat-conducting boss (420), and the heat-conducting boss (420) has a second heat-conducting surface (422) facing the housing (100). The second heat-conducting surface (422) and the first heat-conducting surface (421) are arranged opposite to each other along a first direction, which is the height direction of the heat-conducting boss (420). The heat dissipation assembly (400) further includes a second heat-conducting element (430), which fills the space between the second heat-conducting surface (422) and the inner contact surface (101). The second heat-conducting element (430) is configured to have thermal conductivity and adhesion.

6. The optical module according to claim 5, characterized in that, The heat-conducting boss (420) also has a second circumferential side surface (423) surrounding the outer periphery of the second heat-conducting surface (422). The second heat-conducting element (430) includes a second main body (431) and a second edge (432) surrounding the outer periphery of the second main body (431). The second main body (431) is sandwiched between the second heat-conducting surface (422) and the inner contact surface (101). The second edge portion (432) covers the second circumferential side surface (423), and the height of the second circumferential side surface (423) covered is in the range of 1 / 4 to 1 / 3 of the total height of the heat-conducting boss (420).

7. The optical module according to claim 6, characterized in that, The thickness of the second main body (431) ranges from 0.1 mm to 0.2 mm.

8. The optical module according to claim 5, characterized in that, The second thermal conductive element (430) and / or the first thermal conductive element (410) are thermally conductive gel structures with solid particles of 5µm to 10µm and a thermal conductivity of 10W / (m·K), and the adhesive peel strength of the thermally conductive gel is 0.5 MPa to 2 MPa. And / or, the thermally conductive boss (420) is a metal structure with a thermal conductivity of 390 W / (m·K).

9. The optical module according to claim 5, characterized in that, The ratio of the area of ​​the second heat-conducting surface (422) to the area of ​​the first heat-conducting surface (421) is at least 2.

10. The optical module according to claim 5, characterized in that, The heat-conducting boss (420) has a clearance portion (424) on at least one side along the second direction. The clearance portion (424) is located between the second heat-conducting surface (422) and the first heat-conducting surface (421). The second direction is the length direction of the heat-conducting boss (420).

Images