Display module
By integrating the display module and printed circuit board through a frame structure and connecting them with a flexible circuit board, the problem of unstable PCB board fixation in traditional display modules is solved, achieving the effects of compact structure, complete signal and reduced cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHEN ZHEN SUNSON ELEC-TECH CO LTD
- Filing Date
- 2025-07-15
- Publication Date
- 2026-05-15
AI Technical Summary
Traditional display modules lack anti-displacement and anti-warping designs for PCB board fixation, resulting in slow assembly speed, low yield, high cost, and PCB board susceptibility to mechanical stress damage.
The display module and printed circuit board are integrated using a plastic frame structure and connected by a flexible circuit board, which simplifies the assembly process, enhances mechanical stability, and eliminates the gold fingers by replacing them with low-cost tin plating.
This approach optimizes the display module's structural compactness, signal integrity, and mechanical stability, while reducing material and assembly costs and improving production efficiency and reliability.
Smart Images

Figure CN224248006U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of display technology, and specifically relates to a display module. Background Technology
[0002] In the traditional process of connecting the glass substrate and the PCB gold fingers with conductive adhesive strips, manual alignment of the ITO electrodes on the glass substrate and the PCB gold fingers is generally required. This requires high precision, is difficult to automate, and necessitates strict control of the adhesive strip compression ratio. Furthermore, it typically requires clamping, resulting in slow assembly speed and low yield. Other drawbacks of traditional conductive adhesive strips include: the silicone material is prone to deformation under long-term pressure, and changes in compression ratio lead to increased contact resistance, causing image loss and pixel loss; the strip is also prone to oxidation under high temperature and humidity environments. Traditional solutions require gold plating of the PCB edges to ensure contact conductivity, which is costly. Moreover, the PCB lacks anti-warping and anti-displacement fixing structures, making it susceptible to loosening or poor contact due to vibration or external forces. The PCB is directly exposed or simply fixed without buffer protection, making it vulnerable to mechanical stress damage. In traditional monochrome display modules, conductive adhesive strips are used to connect the LCD glass and PCB, with a metal frame used to fix the LCD glass, backlight, and PCB. Utility Model Content
[0003] To address the aforementioned issues, the primary objective of this utility model is to provide a display module that solves the technical problems of unreasonable layout caused by the entire PCB board being mounted on the display module, the lack of anti-displacement and anti-warping design in the existing frame for fixing the PCB board, and the lack of buffer design.
[0004] To achieve the above objectives, the technical solution of this utility model is as follows:
[0005] This utility model provides a display module, including:
[0006] Frame;
[0007] The display module is located on one side of the frame;
[0008] A printed circuit board is disposed on the side of the frame away from the display module, and the printed circuit board partially covers the frame;
[0009] A flexible circuit board, one end of which is connected to the display module, and the other end of which is connected to the printed circuit board.
[0010] Furthermore, the frame includes a first side and a second side disposed opposite to each other, and the two ends of the printed circuit board extend to connect with the first side and the second side respectively. The first side, the second side and the printed circuit board are connected and enclosed to form a middle area, and the entire surface of the printed circuit board covers the middle area.
[0011] Further, the printed circuit board includes:
[0012] The first interface is used to connect to the host's communication interface;
[0013] The second interface is used to connect to the button interface of the host.
[0014] Furthermore, the first side is provided with a first guide groove, and the second side is provided with a second guide groove; wherein,
[0015] One end of the printed circuit board is slidably fitted in the first guide groove, and the other end is slidably fitted in the second guide groove.
[0016] Furthermore, the adhesive frame includes:
[0017] A baffle, disposed on the second side, is used to abut against the printed circuit board;
[0018] The baffle and the rubber frame together form the second guide groove.
[0019] Furthermore, the adhesive frame includes:
[0020] An inverted buckle extends from the baffle toward the second guide groove and is bent to form the inverted buckle;
[0021] The printed circuit board has slots;
[0022] The buckle is used to engage with the slot.
[0023] Furthermore, the adhesive frame includes:
[0024] A positioning plate is disposed on the first side and forms the first guide groove with the frame, which is used to press the surface of the printed circuit board away from the frame.
[0025] Furthermore, it also includes:
[0026] Supporting cotton is placed between the printed circuit board and the frame.
[0027] Furthermore, the adhesive frame includes:
[0028] A partition, connected to the first side and the second side, is used to divide the frame into a first receiving groove and a second receiving groove that are opposite to each other.
[0029] Furthermore, the first receiving groove is connected to the first guide groove and the second guide groove and is used to install the printed circuit board; the supporting cotton is disposed in the first receiving groove;
[0030] The second accommodating slot is used to install the display module.
[0031] Compared with existing technologies, this application offers the following advantages: By incorporating a frame, display module, printed circuit board (PCB), and flexible circuit board; the display module is positioned on one side of the frame; the PCB is positioned on the side of the frame furthest from the display module, partially covering the frame; one end of the flexible circuit board connects to the display module, and the other end connects to the PCB. Using the frame as a support structure, the display module and PCB are integrated, simplifying the assembly process, enhancing the overall module's mechanical stability, and reducing the risk of component loosening. The design of the PCB partially covering the frame reduces PCB area and lowers procurement costs. Furthermore, it eliminates the need for gold plating processes; ordinary low-cost tin-plated PCBs can meet the requirements, significantly reducing supplier material costs and lowering overall costs. It also avoids component stacking conflicts. The frame integrates multiple functional components, reducing additional fixing structures and lowering material and assembly costs. Through the frame's support and space allocation, the efficient connection of the flexible circuit board, and the partial coverage of the PCB, the display module achieves comprehensive optimization in terms of structural compactness and signal integrity. Attached Figure Description
[0032] Figure 1 This is a three-dimensional schematic diagram of the display module of this utility model.
[0033] Figure 2 This is a schematic diagram of removing the display module from the display module of this utility model.
[0034] Figure 3 This is a three-dimensional schematic diagram of the display module of this utility model from another perspective.
[0035] Figure 4 This is a top view of the display module of this utility model.
[0036] Figure 5 This is a schematic diagram of removing the printed circuit board from the display module of this utility model.
[0037] In the diagram: 10, frame; 11, first side; 12, second side; 13, first guide groove; 14, second guide groove; 15, baffle; 16, inverted clip; 17, positioning plate; 18, partition; 101, first receiving groove; 102, second receiving groove; 20, display module; 30, printed circuit board; 31, first interface; 32, second interface; 33, slot; 40, flexible circuit board. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0039] To achieve the above objectives, the technical solution of this utility model is as follows:
[0040] It should be noted that traditional display module designs still have several drawbacks: the PCB board is typically mounted entirely on the back of the display module, resulting in a large footprint, hindering the design of thinner and lighter devices, and potentially interfering with heat dissipation and electromagnetic compatibility. Due to its large area, the PCB board has poor installation stability and is prone to loosening or poor contact due to vibration or external impact. Existing frame-based PCB board fixing methods are relatively simple, such as using screws or double-sided tape, lacking optimized designs to prevent displacement and warping. Long-term use may lead to PCB board deformation and FPC connection failure. In dynamic applications such as foldable screen devices and automotive displays, the mechanical stability of the PCB board is particularly important, but current technology fails to provide reliable shock and impact resistance solutions. The PCB board is susceptible to mechanical stress during installation and transportation, but current technology typically lacks cushioning structures, making electronic components (such as capacitors and resistors) on the PCB board easily damaged by squeezing or drops.
[0041] See Figures 1-5 As shown, this utility model provides a display module, including: a frame 10; a display module 20 disposed on one side of the frame 10; a printed circuit board 30 disposed on the side of the frame 10 away from the display module 20, with the printed circuit board 30 partially covering the frame 10; and a flexible circuit board 40, with one end connected to the display module 20 and the other end connected to the printed circuit board 30. By using the frame 10 as a support structure to integrate the display module 20 and the printed circuit board 30, the assembly process is simplified, the overall mechanical stability of the module is enhanced, and the risk of component loosening is reduced. The design of the printed circuit board 30 partially covering the frame 10 reduces the module thickness and avoids component stacking conflicts. The frame 10 integrates multiple functional components, reducing additional fixing structures and lowering material and assembly costs. Through the support and space allocation of the frame 10, the efficient connection of the flexible circuit board 40, and the partial coverage of the frame 10 by the printed circuit board 30, the display module achieves comprehensive optimization in terms of structural compactness and signal integrity.
[0042] Furthermore, the frame 10 includes a first side 11 and a second side 12 disposed opposite to each other. The printed circuit board 30 extends from both ends to connect with the first side 11 and the second side 12, respectively. The first side 11, the second side 12, and the printed circuit board 30 are connected and enclose a central area, with the entire surface of the printed circuit board 30 covering the central area. This forms a composite structure between the frame 10 and the printed circuit board 30. The first side 11 and the second side 12 of the frame 10 are rigidly connected to the printed circuit board 30, improving the overall module's resistance to bending and torsion, and reducing the risk of deformation during transportation or assembly. The design of the printed circuit board 30 covering the entire central area makes the printed circuit board 30 an auxiliary support layer, especially suitable for large-size display modules, preventing the frame 10 from cracking or deforming due to uneven stress. The printed circuit board 30 and the first side 11 and second side 12 of the frame 10 form a fixed structure, eliminating the need for additional positioning components. During assembly, precise positioning can be achieved simply by aligning the printed circuit board 30 with the first side 11 and second side 12 of the frame 20, reducing assembly errors, improving production yield, and reducing the need for screws or clips to separately fix the printed circuit board 30 in traditional solutions, thus lowering costs and shortening processing time. The printed circuit board 30 covers the central area, avoiding a gap in the middle of the frame 10 and making full use of the internal space of the frame 10. Additional components such as driver ICs and capacitors can be placed on the back of the printed circuit board 30, i.e., the side near the frame 10, to achieve high-density integration. Thus, through the rigid connection and full-coverage design of the printed circuit board 30 with the first side 11 and second side 12 of the frame 10, significant improvements are brought in terms of structural strength, electromagnetic compatibility, heat dissipation efficiency, assembly convenience, and space utilization.
[0043] Further, the printed circuit board 30 includes: a first interface 31 for connecting to the communication interface of the host; and a second interface 32 for connecting to the button interface of the host. The first interface 31 is a communication interface and is located on the surface of the printed circuit board 30 opposite to the frame 10. The second interface 32 is a button interface and is located on the surface of the printed circuit board 30 opposite to the frame 10. Preferably, the first interface 31 is located on the first side 11 of the frame 10, and the second interface 32 is located on the second side 12 of the frame 10. By integrating communication interfaces such as LVDS / eDP / MIPI and button interfaces such as power and volume buttons simultaneously on the printed circuit board 30, the traditional separate connection method is replaced, reducing the number of external cables between the host and the display module, reducing assembly complexity, avoiding wire tangling or incorrect insertion, and making it suitable for space-constrained devices such as smartwatches and AR glasses, optimizing the internal layout. By centrally arranging the communication interface and button interface on the printed circuit board 30, and connecting them through standardized wiring within the printed circuit board 30, cross-interference between high-frequency display signals and low-frequency button signals is avoided, reducing the risk of electromagnetic crosstalk. By integrating the interface function onto the printed circuit board 30, it forms an integrated structure with the frame 10 and the display module 20. The display module can directly interface with the host as an independent functional module. The interface position is fixed on the first side 11 or the second side 12, which facilitates the host manufacturer in designing matching connectors and reduces compatibility issues. By integrating a multi-functional interface on the printed circuit board 30, signal integration, space saving, production standardization, and improved reliability are achieved, making it particularly suitable for smart terminal devices with high requirements for interface density and reliability.
[0044] Furthermore, a first guide groove 13 is provided on the first side 11, and a second guide groove 14 is provided on the second side 12; wherein, one end of the printed circuit board 30 is slidably engaged in the first guide groove 13, and the other end is slidably engaged in the second guide groove 14. By slidably engaging the printed circuit board 30 into the first guide groove 13 and the second guide groove 14, no additional positioning structures such as screws or clips are required, simplifying the assembly process. Workers only need to push the printed circuit board 30 along the first guide groove 13 and the second guide groove 14 to achieve precise positioning, reducing manual alignment errors and improving production efficiency. The first guide groove 13 and the second guide groove 14 limit the two ends of the printed circuit board 30 respectively, forming a rigid constraint, preventing lateral displacement or warping of the printed circuit board 30 during transportation or drops, reducing the risk of solder joint cracking and component detachment. The printed circuit board 30 and the first guide groove 13 and the second guide groove 14... The groove 14 fits tightly, increasing the contact area. Heat can be quickly conducted through the first side 11 and the second side 12 of the frame 10, improving the heat dissipation efficiency of high-power components on the printed circuit board 30. The physical fit of the first guide groove 13 and the second guide groove 14 reduces electromagnetic leakage gaps between the printed circuit board 30 and the frame 10, enhancing overall shielding effectiveness. The printed circuit board 30 is fixed by sliding, without permanent bonding or soldering, facilitating later maintenance or replacement of the printed circuit board 30 without damaging the frame or display module, reducing after-sales costs, and supporting rapid upgrades such as replacing with a higher-performance printed circuit board 30, improving product iteration flexibility. In addition, the design of the first guide groove 13 and the second guide groove 14 forms a compact nested structure between the printed circuit board 30 and the first side 11 and the second side 12 of the frame 10, avoiding the space required for traditional screw fixing, further compressing the module thickness, making it suitable for ultra-thin devices. Therefore, the sliding fit design of the first guide groove 13 and the second guide groove 14 brings significant optimizations in terms of assembly convenience, structural strength, heat dissipation / shielding effectiveness, maintainability and space utilization, making it particularly suitable for display module application scenarios with high requirements for precision, reliability and production efficiency.
[0045] Further, the frame 10 includes a baffle 15 disposed on the second side 12 for abutting the printed circuit board 30; wherein the baffle 15 and the frame 10 enclose to form a second guide groove 14. Preferably, the baffle 15 and the frame 10 are integrally formed, and the baffle 15 and the frame 10 are integrally connected and enclose to form the second guide groove 14, reducing additional assembly parts, lowering production costs and assembly complexity, avoiding the risk of loosening of the split baffle, and improving the overall structural integrity. The baffle 15 acts as a physical stop for abutting the end of the printed circuit board 30, and the baffle 15 cooperates with the first guide groove 13 to form a bidirectional constraint. This ensures that the printed circuit board 30 is accurately positioned during sliding installation, avoiding poor contact caused by over-insertion or incomplete insertion. The baffle 15 provides rigid abutment to the printed circuit board 30, restricting the axial movement of the printed circuit board 30. To prevent the printed circuit board 30 from dislodging from the first guide groove 13 or the second guide groove 14 under vibration or impact, the reliability of the module is improved, and the micro-friction between the printed circuit board 30 and the frame 10 is reduced, avoiding connector wear after long-term use. The baffle 15 is embedded in the structure of the frame 10, eliminating the need for external fasteners. This saves lateral space, making the sides of the display module flatter and suitable for narrow-bezel devices. The integrated design of the baffle 15 and the second guide groove 14 avoids increased thickness, meeting the requirements of ultra-thin devices. Therefore, the design of the second guide groove 14 formed by the integrated baffle 15 and the frame 10 achieves structural simplification, precise positioning, vibration resistance enhancement, space saving, and optimized thermal / electromagnetic management, making it particularly suitable for high-reliability, thin and light display module applications.
[0046] Furthermore, the frame 10 includes an inverted buckle 16, which extends from the baffle 15 toward the second guide groove 14 and is bent to form the inverted buckle 16; the printed circuit board 30 has a slot 33; the inverted buckle 16 is used to engage with the slot 33. The three-dimensional engagement of the inverted buckle 16 with the slot 33 forms a multi-point fixation, effectively preventing the PCB 30 from sliding laterally and warping vertically under vibration and impact; the bending design of the inverted buckle 16 disperses the assembly stress to the body of the frame 10, avoiding concentrated loads that could cause the solder joints of the PCB 30 to crack. When the PCB slides along the guide groove 14, the inverted buckle 16 is automatically guided into the slot 33 without the need for precise alignment or auxiliary tools; the inverted buckle 16 and the baffle 15 are integrally formed (injection molding process), which reduces fasteners and module thickness compared to traditional screw fixing; therefore, the engagement design of the inverted buckle 16 with the slot 33 achieves breakthroughs in three dimensions: mechanical stability, production efficiency, and space economy, and is especially suitable for consumer electronics products with stringent requirements for reliability and thinness.
[0047] Furthermore, the frame 10 includes a positioning plate 17, disposed on the first side 11, which, together with the frame 10, forms a first guide groove 13 for pressing the surface of the printed circuit board 30 away from the frame 10. Through the coordinated pressing of the positioning plate 17 and the first guide groove 13, the printed circuit board 30 is pressed. The first guide groove 13 constrains the sliding path of the printed circuit board 30, and the positioning plate 17 presses the surface of the printed circuit board 30, eliminating the thickness-direction floating of the printed circuit board 30. The continuous support surface formed by the positioning plate 17 and the frame 10 effectively suppresses warping of the printed circuit board 30 caused by thermal expansion and contraction or external forces. By pressing the upper surface of the printed circuit board 30 with the positioning plate 17, and locking the edges of the printed circuit board 30 with the buckle 16, a rigid fixation across the entire area is achieved. Therefore, through the combined design of the first guide groove 13, the second guide groove 14, the positioning plate 17, the buckle 16, and the baffle 15, a fixation scheme for the printed circuit board 30 is achieved, offering advantages in precision, reliability, and space efficiency, and is particularly suitable for high-reliability electronic equipment.
[0048] Furthermore, the display module of this utility model also includes: a support cotton 50, which is disposed between the printed circuit board 30 and the frame 10.
[0049] Furthermore, the frame 10 includes a partition 18 connected to the first side 11 and the second side 12, used to divide the frame 10 into opposing first receiving grooves 101 and second receiving grooves 102. The support cotton 50 can be made of materials such as silicone foam or PORON. The elastic deformation of the support cotton 50 absorbs the mechanical impact and assembly stress on the printed circuit board 30, and the damping characteristics of the support cotton 50 can attenuate vibrations. The support cotton 50 provides base cushioning, and the positioning plate 17 applies uniform pressure, forming a "soft and hard" fixing system; the support cotton 50 compensates for the fit tolerance between the slot 33 and the buckle 16, ensuring reliable engagement.
[0050] Furthermore, the first receiving slot 101 is connected to the first guide slot 13 and the second guide slot 14 and is used to install the printed circuit board 30; the support cotton 50 is disposed in the first receiving slot 101; the second receiving slot 102 is used to install the display module 20. The first receiving slot 101 and the second receiving slot 102 prevent mechanical interference between the components of the display module 20 and the printed circuit board 30; the partition 18 serves as a structural support component, with the first receiving slot 101 installing the display module 20 and the second receiving slot 102 installing the printed circuit board 30, thereby improving assembly efficiency. Support cotton 50 with different properties can also be pre-attached to both sides of the partition 18. Therefore, the partition 18 and the frame 10 are connected to form a double receiving slot structure. Through the triple design of physical separation, functional coordination, and production optimization, the problems of space conflict and thermal management in highly integrated electronic devices are solved.
[0051] It should be added that the display module 20 is preferably a liquid crystal display screen, i.e., an LCD display screen, which includes: a glass substrate, liquid crystal material, ITO transparent electrode, alignment layer, color filter and polarizer.
[0052] When the display module 20 is selected as a liquid crystal display screen, the display module further includes a backlight system for providing a uniform backlight source. The backlight system includes a light source, a diffusion film, and a reflective sheet. The light source is preferably an LED light source, which is arranged in an edge-lit or direct-lit manner. When an edge-lit backlight is used, the backlight system also includes a light guide plate. The LCD display screen and the backlight system are disposed within the second receiving slot 102.
[0053] In other embodiments, the display module 20 can also be configured as an OLED display screen, etc. When the display module is selected as an OLED display screen, there is no need to set a backlight, as the OLED display screen can emit light on its own.
[0054] Furthermore, in the first receiving groove 101 and the second receiving groove 102, the flexible circuit board 40 is routed through the partition 18. Utilizing the thin-layer characteristics of the flexible circuit board 40, multi-layer stacked routing is achieved in the first guide groove 13 and the second guide groove 14 of the frame 10, supporting the same-board transmission of display driving and touch signals.
[0055] It should also be noted that in the process of connecting the glass substrate and the printed circuit board 30 (PCB gold fingers) using traditional conductive adhesive strips, it is generally necessary to manually align the ITO electrodes of the glass substrate and the PCB gold fingers. This requires high precision, is difficult to automate, and the compression ratio of the adhesive strip needs to be strictly controlled. In addition, clamps are usually required for fixation, resulting in slow assembly speed and low yield. In order to overcome the above-mentioned defects in the current technology, the display module of this utility model can realize the automated assembly of the LCD display and the PCB through surface mount technology (SMT), eliminating the need for manual alignment and enabling direct soldering of the flexible circuit board 40 (FPC). By pre-designing the first guide groove 13, the second guide groove 14, the first receiving groove 101, and the second receiving groove 102 on the frame 10, the LCD display and the PCB can be quickly assembled after being grasped by a robotic arm, which is compatible with assembly line operations, improves assembly efficiency, reduces labor costs, and is suitable for mass production.
[0056] Furthermore, traditional conductive adhesive strips suffer from several drawbacks: silicone materials are prone to deformation under prolonged pressure, and changes in compression ratio lead to increased contact resistance, resulting in missing images and pixel loss; also, the adhesive strips are susceptible to oxidation under high temperature and humidity conditions. To address these shortcomings, the advantages of this display module are: the flexible circuit board 40 (FPC) experiences no physical contact wear, resulting in high connection stability and increased lifespan; and the frame is fixed without continuous compressive force, preventing material fatigue.
[0057] Furthermore, traditional solutions require gold plating on the PCB edges to ensure contact conductivity, which is costly. To eliminate the aforementioned defects in current technology, this utility model's display module can eliminate the gold fingers and instead use tin plating. The FPC soldering area can be treated with low-cost tin plating, reducing the cost of PCB materials. Moreover, traditional conductive adhesive strips require a wide gold finger area, while FPCs can be bent and stacked, significantly reducing the PCB area. By integrating positioning and fixing functions through the adhesive frame, the traditional metal reinforcement frame is eliminated, reducing structural costs.
[0058] Therefore, the display module of this utility model can ensure the bending life of FPC and the impact resistance of LCD; the high-density wiring of FPC can avoid signal interference, such as differential wiring design, which is compatible with high-frequency signal transmission; the same frame can be adapted to multiple sizes of LCD, further reducing mold costs.
[0059] The display module provided by this utility model includes: a frame 10; a display module 20 disposed on one side of the frame 10; a printed circuit board 30 disposed on the side of the frame 10 away from the display module 20, with the printed circuit board 30 partially covering the frame 10; and a flexible circuit board 40, with one end connected to the display module 20 and the other end connected to the printed circuit board 30. By using the frame 10 as a support structure to integrate the display module 20 and the printed circuit board 30, the assembly process is simplified, the overall mechanical stability of the module is enhanced, and the risk of component loosening is reduced. The design of the printed circuit board 30 partially covering the frame 10 reduces the module thickness and avoids component stacking conflicts. The frame 10 integrates multiple functional components, reducing additional fixing structures and lowering material and assembly costs. Through the support and space allocation of the frame 10, the efficient connection of the flexible circuit board 40, and the partial coverage of the frame 10 by the printed circuit board 30, the display module achieves comprehensive optimization in terms of structural compactness and signal integrity.
[0060] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A display module, characterized in that, include: Frame; The display module is located on one side of the frame; A printed circuit board is disposed on the side of the frame away from the display module, and the printed circuit board partially covers the frame; A flexible circuit board, one end of which is connected to the display module, and the other end of which is connected to the printed circuit board.
2. A display module as described in claim 1, characterized in that, The frame includes: The first and second sides are set relative to each other; The two ends of the printed circuit board extend to the first side and the second side, respectively; The first side, the second side, and the printed circuit board are connected and enclosed to form a middle area, and the entire surface of the printed circuit board covers the middle area.
3. A display module as described in claim 2, characterized in that, The printed circuit board includes: The first interface is the communication interface used to connect to the host. The second interface is used to connect to the button interface of the host.
4. A display module as described in claim 2, characterized in that, The first side is provided with a first guide groove, and the second side is provided with a second guide groove; wherein, One end of the printed circuit board is slidably fitted in the first guide groove, and the other end is slidably fitted in the second guide groove.
5. A display module as described in claim 4, characterized in that, The frame includes: A baffle, disposed on the second side, is used to abut against the printed circuit board; The baffle and the rubber frame together form the second guide groove.
6. A display module as described in claim 5, characterized in that, The frame includes: An undercut is formed by extending from the baffle toward the guide groove and bending. The printed circuit board has slots; The buckle is used to engage with the slot.
7. A display module as described in claim 5, characterized in that, The frame includes: A positioning plate is disposed on the first side and forms the first guide groove with the frame, which is used to press the surface of the printed circuit board away from the frame.
8. A display module as described in claim 7, characterized in that, Also includes: Supporting cotton is placed between the printed circuit board and the frame.
9. A display module as described in claim 8, characterized in that, The frame includes: A partition, connected to the first side and the second side, is used to divide the frame into a first receiving groove and a second receiving groove that are opposite to each other.
10. A display module as described in claim 9, characterized in that, The first receiving groove is connected to the first guide groove and the second guide groove and is used to install the printed circuit board; the supporting cotton is disposed in the first receiving groove; The second accommodating slot is used to install the display module.