Cooling device of water-cooled transformer

Abstract

The utility model discloses a water-cooled transformer heat dissipation device. The water-cooled transformer heat dissipation device comprises a transformer body, a fixing base, a water-cooled assembly and a heat dissipation module. The transformer main body is fixed on the fixing seat, a mounting cavity is formed in the water cooling assembly, and when the fixing seat is arranged above the water cooling assembly, the transformer main body is arranged in the mounting cavity of the water cooling assembly; the heat dissipation assembly is arranged at the bottom of the water cooling assembly, and heat dissipation is conducted on the heating end of the water cooling assembly through the heat dissipation assembly. According to the water cooling assembly, the cooling cavity is formed, and heat generated by the transformer body can be rapidly absorbed and taken away by means of the high heat capacity characteristic of cooling liquid.

Description

Technical Field

[0001] This utility model relates to a transformer, specifically to a water-cooled transformer heat dissipation device. Background Technology

[0002] In modern power systems, transformers are crucial equipment. Their main function is to convert high-voltage electricity to low-voltage electricity, or vice versa, to facilitate long-distance power transmission and safe use. However, transformers generate a lot of heat during operation, especially under high load or long-term operation, which can easily lead to overheating, affecting their performance, lifespan, and even causing safety hazards.

[0003] Traditional transformer cooling methods primarily rely on air cooling, depending on natural convection or forced convection by fans to remove heat. However, this method is often insufficient under high load conditions, easily leading to overheating of the transformer and affecting its normal operation.

[0004] Because air has a low specific heat capacity, air cooling systems are less efficient than liquid cooling systems. Especially in high-temperature environments, the heat exchange capacity of airflow is greatly reduced, making it impossible to effectively and promptly remove the heat generated by the transformer. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a water-cooled transformer heat dissipation device to solve the problems existing in the background art.

[0006] The water-cooled transformer heat dissipation device of this utility model is achieved through the following technical solution, including a transformer body, a fixing base, a water-cooling component, and a heat dissipation module;

[0007] The transformer body is fixed on the mounting base, and the interior of the water-cooling component forms an installation cavity. When the mounting base is placed above the water-cooling component, the transformer body is placed inside the installation cavity of the water-cooling component. The heat dissipation module is located at the bottom of the water-cooling component and dissipates heat from the heat-generating end of the water-cooling component.

[0008] As a preferred technical solution, the water-cooling component includes an insulated outer frame, a heat-conducting inner frame, and a semiconductor cooling chip;

[0009] The heat-conducting inner frame is inserted into the heat-insulating outer frame and supported by support feet. The edge of the heat-conducting inner frame is sealed to the heat-insulating outer frame by a sealing ring. A cooling cavity for storing coolant is formed between the heat-conducting inner frame and the heat-conducting outer frame.

[0010] The semiconductor cooling chip is disposed at the bottom of the insulation frame, and a temperature-conducting plate is installed on the cooling end of the semiconductor cooling chip, and the temperature-conducting plate is in contact with the coolant in the cooling cavity.

[0011] As a preferred technical solution, the heat dissipation module includes a heat sink, an intake fan, and an exhaust fan;

[0012] The top of the heat sink is provided with an installation position, and a heat dissipation air channel is formed inside the heat sink. Heat dissipation fins are provided on the installation position, and the heat dissipation end of the heat dissipation fins is placed inside the heat dissipation air channel.

[0013] The heat-insulating outer frame is placed in the mounting position, and the heat dissipation fins are in contact with the heat-generating end of the semiconductor cooling chip, thereby dissipating heat from the semiconductor cooling chip;

[0014] The intake fan and exhaust fan are respectively located at both ends of the heat dissipation duct, and the exhaust end of the intake fan and the intake end of the exhaust fan are respectively located at the heat dissipation end of the heat dissipation fins.

[0015] As a preferred technical solution, heat-conducting columns are provided around the heat-conducting plate, and heat-conducting fins that increase the heat dissipation area are provided around the heat-conducting inner frame. The heat-conducting columns pass through the heat-conducting fins to cool them.

[0016] As a preferred technical solution, the terminals of the transformer body are placed externally through the mounting base for transformer wiring.

[0017] As a preferred technical solution, the system also includes a controller, which is connected to control the operation of the thermoelectric cooler, the intake fan, and the exhaust fan.

[0018] The beneficial effects of this utility model are:

[0019] The water-cooled assembly of this invention forms a cooling chamber and utilizes the high heat capacity of the coolant to quickly absorb and remove the heat generated by the transformer body.

[0020] The heat dissipation module of this invention introduces external cold air into the heat dissipation duct through the intake fan. After passing through the heat dissipation fins, it can effectively enhance the heat dissipation effect, form a good heat exchange cycle, and ensure the continuity and stability of heat dissipation. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the heat dissipation module structure of this utility model. Detailed Implementation

[0025] All features disclosed in this specification, or steps in all methods or processes disclosed herein, may be combined in any way, except for mutually exclusive features and / or steps.

[0026] like Figures 1-3 As shown, the present invention provides a water-cooled transformer heat dissipation device, which includes a transformer body 1, a fixing base 2, a water-cooling component 3, and a heat dissipation module 4.

[0027] The transformer body 1 is fixed on the mounting base 2. The water-cooling component 3 forms an installation cavity 5 inside. When the mounting base 2 is placed above the water-cooling component 3, the transformer body 1 is placed inside the installation cavity 5 of the water-cooling component 3. The heat dissipation module is set at the bottom of the water-cooling component 3 and dissipates heat from the heat-generating end of the water-cooling component 3 through the heat dissipation module.

[0028] The water-cooling component 3 includes an insulated outer frame 6, a heat-conducting inner frame 7, and a semiconductor cooling chip 12.

[0029] The heat-conducting inner frame 7 is inserted into the heat-insulating outer frame 6 and supported by the support feet 9. The edge of the heat-conducting inner frame 7 is sealed to the heat-insulating outer frame 6 by the sealing ring 10. A cooling cavity for storing coolant is formed between the heat-conducting inner frame 7 and the heat-conducting outer frame.

[0030] The semiconductor cooling chip 12 is disposed at the bottom of the heat insulation frame 6, and a temperature guiding plate 11 is installed on the cooling end of the semiconductor cooling chip 12, and the temperature guiding plate 11 is in contact with the coolant in the cooling cavity.

[0031] The heat dissipation module includes a heat sink 13, an intake fan 14, and an exhaust fan 15.

[0032] The top of the heat sink 13 is provided with an installation position, and a heat dissipation air duct is formed inside the heat sink 13. A heat dissipation fin 19 is provided on the installation position, and the heat dissipation end of the heat dissipation fin is placed inside the heat dissipation air duct 20.

[0033] The heat-insulating outer frame 6 is placed in the mounting position, and the heat dissipation fins 19 are in contact with the heat-generating end of the semiconductor cooling chip 12, thereby dissipating heat from the semiconductor cooling chip 12.

[0034] The intake fan 14 and the exhaust fan 15 are respectively located at both ends of the heat dissipation duct 20, and the exhaust end of the intake fan 14 and the intake end of the exhaust fan 15 are respectively located at the heat dissipation end of the heat dissipation fins.

[0035] To enhance heat dissipation, in this embodiment, heat-conducting columns 17 are provided around the heat-conducting plate 11, and heat-conducting fins 18 that increase the heat dissipation area are provided around the heat-conducting inner frame 7. The heat-conducting columns pass through the heat-conducting fins to cool them.

[0036] In addition, the terminals of the transformer body 1 are externally located through the mounting base 2 for transformer wiring.

[0037] For ease of control, this embodiment also includes a controller, which is connected to control the operation of the semiconductor cooling chip 12, the intake fan 14, and the exhaust fan 15.

[0038] The transformer body of this utility model is fixed on a fixed base, and the water-cooling component is installed below the transformer body. When the heat-insulating outer frame of the water-cooling component is combined with the heat-conducting inner frame, a cooling cavity is formed specifically for storing coolant. The transformer body generates heat during operation, and this heat is conducted to the coolant in the cooling cavity through the wall of the heat-conducting inner frame.

[0039] The coolant in the cooling chamber comes into direct contact with the cooling end of the semiconductor cooling chip under the action of the temperature guide plate, realizing heat exchange; the heat sink of the heat dissipation module forms a heat dissipation air channel, with the intake fan and exhaust fan located at both ends of the heat dissipation air channel respectively; the intake fan introduces external air into the heat dissipation air channel, absorbs its heat when passing through the heat dissipation fins, and then the exhaust fan exhausts the hot air, thereby ensuring the continuity and effectiveness of the heat dissipation effect.

[0040] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A water-cooled transformer heat dissipation device, characterized in that, It includes the transformer body (1), the mounting base (2), the water cooling assembly (3), and the heat dissipation module (4); The transformer body (1) is fixed on the mounting base (2), and the water-cooling component (3) forms an installation cavity (5). When the mounting base (2) is placed above the water-cooling component (3), the transformer body (1) is placed in the installation cavity (5) of the water-cooling component (3). The heat dissipation module is set at the bottom of the water-cooling component (3) and dissipates heat from the heat-generating end of the water-cooling component (3) through the heat dissipation module.

2. The water-cooled transformer heat dissipation device according to claim 1, characterized in that: The water-cooling assembly (3) includes an insulated outer frame (6), a heat-conducting inner frame (7), and a semiconductor cooling chip (12); The heat-conducting inner frame (7) is inserted into the heat-insulating outer frame (6) and supported by the support feet (9). The edge of the heat-conducting inner frame (7) is sealed to the heat-insulating outer frame (6) by the sealing ring (10). A cooling cavity for storing coolant is formed between the heat-conducting inner frame (7) and the heat-conducting outer frame. The semiconductor cooling chip (12) is disposed at the bottom of the heat insulation frame (6), and a temperature guiding plate (11) is installed on the cooling end of the semiconductor cooling chip (12), and the temperature guiding plate (11) is in contact with the coolant in the cooling chamber.

3. The water-cooled transformer heat dissipation device according to claim 1, characterized in that: The heat dissipation module includes a heat sink (13), an intake fan (14), and an exhaust fan (15); The heat sink (13) has an installation position on its top. A heat dissipation duct (20) is formed inside the heat sink (13). A heat dissipation fin (19) is provided on the installation position, and the heat dissipation end of the heat dissipation fin (19) is placed inside the heat dissipation duct (20). The heat-insulating outer frame (6) is placed in the mounting position, and the heat dissipation fins are in contact with the heat-generating end of the semiconductor cooling chip (12), thereby dissipating heat from the semiconductor cooling chip (12); The intake fan (14) and the exhaust fan (15) are respectively located at both ends of the heat dissipation duct (20), and the exhaust end of the intake fan (14) and the intake end of the exhaust fan (15) are respectively located at the heat dissipation end of the heat dissipation fins (19).

4. The water-cooled transformer heat dissipation device according to claim 1, characterized in that: The heat-conducting plate (11) is provided with heat-conducting columns (17) around its perimeter, and the heat-conducting inner frame (7) is provided with heat sinks (18) around its perimeter to increase the heat dissipation area. The heat-conducting columns (17) pass through the heat sinks (18) to cool the heat sinks (18).

5. The water-cooled transformer heat dissipation device according to claim 1, characterized in that: The wiring terminals of the transformer body (1) pass through the fixing seat (2) and are placed on the outside for wiring the transformer.

6. The water-cooled transformer heat dissipation device according to claim 1, characterized in that: It also includes a controller, which is connected to control the operation of the thermoelectric cooler (12), the intake fan (14) and the exhaust fan (15).

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