Circuit board and variable frequency driver

Abstract

The utility model discloses a circuit board and a variable frequency driver, the circuit board comprises a heat dissipation device, a heat dissipation piece and a circuit board body, the heat dissipation piece comprises a body part, a first connecting part and a second connecting part, the first connecting part and the second connecting part are located at the two ends of the body part, and the first connecting part and the second connecting part are inserted into the circuit board body; the current borne on the circuit board body can be shunted through the first connecting part, the body part and the second connecting part, so that the current borne on the circuit board body is reduced; the body part is arranged on the circuit board body, and the spacing distance is arranged between the body part and the circuit board body, so that a heat dissipation space between the circuit board body and the body part is provided under the condition that the body part and the circuit board body share and bear current, the phenomenon of heat concentration is reduced, and the phenomenon of overheat burnout of the circuit board body is reduced.

Description

Technical Field

[0001] This application relates to the field of frequency converter technology, and more specifically, to a circuit board and a frequency converter. Background Technology

[0002] Circuit boards control devices through electronic components mounted on them; however, due to the limited load-bearing capacity of circuit boards, when high-power electronic components are mounted on the circuit board, the circuit board may overheat and burn out due to the large current it carries.

[0003] In conclusion, how to reduce the overheating and burnout of circuit boards is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a circuit board and a frequency converter driver to reduce the phenomenon of overheating and burning of the circuit board.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A circuit board includes a heat sink and a circuit board body; wherein the heat sink includes a body portion and a first connecting portion and a second connecting portion located at both ends of the body portion; the first connecting portion and the second connecting portion are inserted into the circuit board body, such that the circuit board body and the heat sink are electrically connected, and there is a gap between the body portion and the circuit board body.

[0007] In some embodiments, the extension direction of the body portion is an axis, the first connecting portion and the second connecting portion are located on the same side of the axis of the body portion, the circuit board body includes a copper foil layer, the first connecting portion and the second connecting portion are connected to the copper foil layer, and the heat sink is made of copper.

[0008] In some embodiments, the circuit board body includes electronic components, and there is a gap between the body portion and the electronic components.

[0009] In some embodiments, the circuit board body includes traces, and the extension direction of the body portion is consistent with the extension direction of at least one end of the traces.

[0010] In some embodiments, the body portion is a U-shaped structure; or, the body portion is a wavy structure; or, the body portion is an arc-shaped structure; both the first connecting portion and the second connecting portion are straight-line structures.

[0011] In some embodiments, the diameter of the cross-section of the main body, the diameter of the cross-section of the first connecting part, and the diameter of the cross-section of the second connecting part are all L; the vertical distance between the crossbeam of the U-shaped main body and the first connecting part and the second connecting part is H; wherein, H > L, and there is at least a 3mm difference between H and L.

[0012] In some embodiments, the cross-sections of the body portion, the first connecting portion, and the second connecting portion are all circular;

[0013] Alternatively, the cross-sections of the main body, the first connecting portion, and the second connecting portion are all regular polygons.

[0014] In some embodiments, the copper foil layer has an interface for insertion and engagement with the first connecting portion and the second connecting portion; a first limiting portion is provided between the body portion and the first connecting portion; a second limiting portion is provided between the body portion and the second connecting portion; both the first limiting portion and the second limiting portion are used for limiting and engaging with the interface.

[0015] A variable frequency drive, comprising the circuit board as described above.

[0016] The circuit board provided in this application includes a heat sink and a circuit board body. The heat sink includes a body portion and a first connecting portion and a second connecting portion located at both ends of the body portion, and the first connecting portion and the second connecting portion are inserted into the circuit board body. The circuit board body is connected through the first connecting portion and the second connecting portion, so that the current carried on the circuit board body can be shunted through the first connecting portion, the body portion, and the second connecting portion to reduce the current carried on the circuit board body. Furthermore, there is a gap between the body portion and the circuit board body. When the body portion and the circuit board body share the current, a heat dissipation space is provided between the circuit board body and the body portion, reducing the phenomenon of heat concentration and thus reducing the phenomenon of overheating and burning of the circuit board body. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a heat sink provided in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of another heat sink provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of another heat sink provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1-Main body, 2-First connecting part, 3-Second connecting part, 4-First limiting part, 5-Second limiting part. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the embodiments of this application, "one or more" refers to one, two, or more; "and / or" describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0025] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0026] The "multiple" mentioned in the embodiments of this application refers to two or more. It should be noted that in the description of the embodiments of this application, terms such as "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0027] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.

[0028] like Figure 1 As shown in the embodiment of this application, the circuit board includes a heat sink and a circuit board body. The heat sink includes a body portion 1 and a first connecting portion 2 and a second connecting portion 3 located at both ends of the body portion 1. Both the first connecting portion 2 and the second connecting portion 3 are inserted into the circuit board body. Thus, in areas of the circuit board body that carry a large current, the connection between the first connecting portion 2 and the second connecting portion 3 and the circuit board body allows the current carried on the circuit board body to be diverted through the first connecting portion 2, the body portion 1, and the second connecting portion 3, thereby reducing the current carried on the circuit board body.

[0029] There is a gap between the main body 1 and the circuit board body. In this way, when the main body 1 and the circuit board body share the current, a heat dissipation space is provided between the main body 1 and the circuit board body, reducing the phenomenon of heat concentration and reducing the phenomenon of overheating and burning of the circuit board body.

[0030] It should be noted that the first connecting part 2 and the second connecting part 3 are not distinguished by positive and negative poles, but are only distinguished as two connecting ends. In the actual process of sharing the current carrying capacity, the current can also be shunted through the second connecting part 3, the main body part 1, and the first connecting part 2. This application embodiment does not limit this.

[0031] It should be noted that copper traces, also known as copper wires, are printed on the circuit board. Copper wires are usually made by etching copper foil to form a copper foil layer on the circuit board body. The copper foil layer carries current to realize the current transmission between electronic components and devices on the circuit board body. Holes are drilled in the copper foil layer to form interfaces that can be plugged into the first connection part 2 and the second connection part 3 to realize the connection between the heat sink and the copper foil layer.

[0032] like Figure 1 As shown, the extension direction of the main body 1 is the axis, and the first connecting part 2 and the second connecting part 3 are located on the same side of the main body 1 so that the first connecting part 2 and the second connecting part 3 can be connected to the same copper foil layer to realize the heat dissipation function of the heat sink.

[0033] In the circuit board provided in this application embodiment, the heat sink is made entirely of copper to improve conductivity and further enhance heat dissipation.

[0034] Since overheating can occur in the copper foil layer when carrying a large current, in the actual connection process, the heat sink provided in this application embodiment needs to be connected to the current concentration area on the copper foil layer. The first connection part 2 and the second connection part 3 are connected on the same section of the copper foil layer, and the axial distribution direction of the body part 1 is consistent with the connection distribution between two adjacent electronic components connected on the copper foil layer, so that the axial distribution direction of the body part 1 can be consistent with the current direction on the copper foil layer, so that the body part 1 can share more current and further reduce the current carried on the copper foil layer.

[0035] In actual operation, multiple electronic components are connected to the copper foil layer. When the main body 1 needs to cross the electronic components, there is a gap between the main body 1 and the electronic components to ensure heat dissipation space between the main body 1 and the copper foil layer, and further reduce heat concentration.

[0036] It should be noted that the heat sink is inserted into the copper foil layer between the two electronic components, and the axis of the main body 1 is aligned with the connection line between the two electronic components. The heat sink only shares the current on the copper foil layer between the two connected electronic components. The "case where the main body 1 needs to cross electronic components" mentioned in the manual refers to a situation where other electronic components are arranged in the area between the connection lines of two electronic components. After the heat sink is inserted into the copper foil layer, its physical structure crosses other electronic components, but it is not electrically connected to the two ends of other electronic components. The heat sink will not cause a short circuit when it crosses other electronic components.

[0037] To ensure that there is a gap between the body part 1 and the copper foil layer, such as Figure 1 As shown, the main body 1 has a U-shaped structure, and the first connecting part 2 and the second connecting part 3 are both straight structures. In this way, after the first connecting part 2 and the second connecting part 3 are connected to the copper foil layer, the main body 1 can be moved away from the copper foil layer by the raised U-shaped structure, increasing the distance between the main body 1 and the copper foil layer and improving the heat dissipation space.

[0038] In some other embodiments, such as Figure 2 and Figure 3 As shown, the body part 1 can also be an arc-shaped structure, a wave-shaped structure, etc., as long as there is a gap between the body part 1 and the copper foil layer. This application embodiment does not limit this.

[0039] In practice, the cross-sectional dimensions of the first connecting part 2, the main body part 1, and the second connecting part 3 are all the same. Figure 1 'a' is a front view of the heat sink. Figure 1b is a side view of the heat sink; for example Figure 1 As shown, the cross-sectional diameters of the main body 1, the first connecting part 2, and the second connecting part 3 are all L. The vertical distance between the crossbeam of the U-shaped main body 1 and the first connecting part 2 and the second connecting part 3 is H; and H > L, so that there is a certain gap between the main body 1 and the copper foil layer, so as to provide heat dissipation space between the main body 1 and the copper foil layer.

[0040] In actual operation, the diameter L needs to be selected according to the current to be shunted. The larger the current to be shunted, the larger the diameter L of the main body 1 needs to be shunted. The larger the current passing through the main body 1, the larger the heat dissipation space is needed for heat dissipation. Therefore, in order to ensure the heat dissipation effect, H and L in this embodiment of the application differ by at least 3mm.

[0041] In some embodiments, H and L may differ by 3mm, 4mm, 5mm, etc., which can be set according to actual needs. This application does not limit this.

[0042] In some embodiments, the cross-sections of the main body 1, the first connecting part 2, and the second connecting part 3 are all circular to facilitate the connection of the first connecting part 2 and the second connecting part 3 with the copper foil layer and improve the connection efficiency.

[0043] In other embodiments, the cross-sections of the main body 1, the first connecting part 2, and the second connecting part 3 are all regular polygons, such as equilateral triangles, squares, etc., to improve the stability of the connection between the first connecting part 2 and the second connecting part 3 and the copper foil layer, and to ensure the stable operation of the heat sink.

[0044] It should be noted that when the cross-sections of the main body 1, the first connecting part 2, and the second connecting part 3 are all regular polygons, the diameter L is the longest diagonal line of the connecting endpoints of the regular polygons that passes through the center.

[0045] like Figure 1 As shown, the bracket between the main body 1 and the first connecting part 2 is provided with a first limiting part 4, and the main body 1 and the second connecting part 3 are provided with a second limiting part 5. Both the first limiting part 4 and the second limiting part 5 are used to limit and cooperate with the interface opened on the copper foil layer to achieve connection positioning and further improve the connection efficiency of the heat sink; at the same time, it prevents the main body 1 from contacting the copper foil layer, further ensuring the spacing between the main body 1 and the copper foil layer, and further improving the heat dissipation effect.

[0046] like Figure 1As shown, the width of the first limiting part 4 and the second limiting part 5 is C. C needs to be larger than the diameter of the interface on the copper foil layer. It can be adjusted according to the actual diameter of the copper foil layer interface. This application embodiment does not limit this. The height of the first limiting part 4 and the second limiting part 5 is P. P can be adjusted according to the actual situation. This application embodiment does not limit this.

[0047] like Figure 1 As shown, the distance between the first connecting part 2 and the second connecting part 3 is W. When the span is large, W is larger; conversely, when the span is small, W is smaller. Therefore, the distance W between the first connecting part 2 and the second connecting part 3 can be adjusted according to actual usage requirements. This application embodiment does not limit this.

[0048] The connection height of the first connecting part 2 and the second connecting part 3 for connecting with the copper foil layer can be adjusted according to the size requirements of the copper foil layer interface, and this embodiment does not limit this.

[0049] During the circuit board operation provided in this application embodiment, in the area on the copper foil layer that carries a large current, the first connecting part 2 and the second connecting part 3 of the heat sink are connected to the interface of the copper foil layer along the direction of the current, so that the direction of the main body 1 is consistent with the direction of the current. This allows the current to pass through the first connecting part 2, the main body 1, and the second connecting part 3, thereby distributing the current carried on the copper foil layer and reducing the current carried on the copper foil layer. Furthermore, the spacing between the main body 1 and the copper foil layer provides a heat dissipation space between the main body 1 and the copper foil layer, reducing heat concentration and reducing the phenomenon of overheating and burning of the circuit board body.

[0050] This application also provides a frequency converter driver, which includes the circuit board described in the above embodiments.

[0051] Since the circuit board has the aforementioned technical effects, and the frequency converter driver includes the aforementioned circuit board, the frequency converter driver also has the corresponding technical effects, which will not be elaborated here.

[0052] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board, characterized in that, include: Heat sink and circuit board body; The heat sink includes a body (1) and a first connecting part (2) and a second connecting part (3) located at both ends of the body (1). The first connecting part (2) and the second connecting part (3) are inserted into the circuit board body, so that the circuit board body and the heat sink are electrically connected, and there is a gap between the body part (1) and the circuit board body.

2. The circuit board according to claim 1, characterized in that, The extension direction of the main body (1) is the axis, the first connecting part (2) and the second connecting part (3) are located on the same side of the axis of the main body (1), the circuit board body includes a copper foil layer, the first connecting part (2) and the second connecting part (3) are connected to the copper foil layer, and the heat sink is made of copper.

3. The circuit board according to claim 2, characterized in that, The circuit board body includes electronic components, and there is a gap between the body part (1) and the electronic components.

4. The circuit board according to claim 2, characterized in that, The circuit board body includes traces, and the extension direction of the body part (1) is consistent with the extension direction of at least one end of the traces.

5. The circuit board according to claim 2, characterized in that, The main body (1) has a U-shaped structure; or, the main body (1) has a wave-shaped structure; or, the main body (1) has an arc-shaped structure. Both the first connecting part (2) and the second connecting part (3) are linear structures.

6. The circuit board according to claim 5, characterized in that, The diameter of the cross-section of the main body (1), the diameter of the cross-section of the first connecting part (2), and the diameter of the cross-section of the second connecting part (3) are all L; The vertical distance between the crossbeam of the main body (1) of the U-shaped structure and the first connecting part (2) and the second connecting part (3) is H; Where H > L, and there is at least a 3mm difference between H and L.

7. The circuit board according to claim 2, characterized in that, The cross-sections of the main body (1), the first connecting part (2), and the second connecting part (3) are all circular; Alternatively, the cross-sections of the main body (1), the first connecting part (2), and the second connecting part (3) are all regular polygons.

8. The circuit board according to any one of claims 2-7, characterized in that, The copper foil layer has an interface for insertion and mating with the first connecting part (2) and the second connecting part (3); A first limiting part (4) is provided between the main body part (1) and the first connecting part (2). A second limiting part (5) is provided between the main body part (1) and the second connecting part (3); Both the first limiting part (4) and the second limiting part (5) are used to limit and cooperate with the interface.

9. A variable frequency drive, characterized in that, The circuit board includes any one of claims 1-8.

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