PCB with heat dissipation structure
By setting heat dissipation holes and connecting pipe groups on the PCB board, combined with heat dissipation fans and thermal conductive adhesive layers, active and passive heat dissipation are achieved in synergistic manner, solving the problem of heat accumulation in existing technologies and improving the heat dissipation effect and stability of the PCB board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI YUXI ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-05-15
AI Technical Summary
The existing PCB board heat dissipation structure causes heat to accumulate and affects the heat dissipation effect because the long plate blocks the heat-generating components and the airflow of the cooling fan blades.
Heat dissipation holes and connecting pipes are set on the PCB board, combined with heat dissipation fans and thermal adhesive layers to form an active and passive heat dissipation structure. The heat dissipation holes and connecting pipes form an airflow channel, the heat dissipation fan draws in cool air for active heat dissipation, and the thermal adhesive layer achieves passive heat dissipation.
It effectively avoids heat accumulation, improves heat dissipation, increases the operational stability of the PCB board, and meets the heat dissipation requirements of heat-generating components.
Smart Images
Figure CN224249899U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board technology, and in particular to a PCB board with a heat dissipation structure. Background Technology
[0002] PCB boards are made from different components and various complex processes. Most PCB circuit boards are typically single-layer, double-layer, or multi-layer structures, and the manufacturing methods vary. Therefore, PCB boards need to be used in conjunction with heat dissipation structures.
[0003] An existing PCB board with a heat dissipation structure (publication number: CN220798897U) has at least the following drawbacks: This device sets an elongated plate on the PCB board and places the heat-conducting block on the elongated plate against the heat-generating element, and then uses a cooling fan to actively dissipate heat. However, since the elongated plate directly covers the surface of the PCB board, it will block the top of the heat-generating element, and the heat-generating element will obstruct the airflow of the cooling fan, affecting the dissipation of hot air. This makes it easy for heat to accumulate between the elongated plate and the PCB board, affecting the heat dissipation effect. Therefore, this utility model is proposed. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a PCB board with a heat dissipation structure.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A PCB board with a heat dissipation structure includes a PCB board body. Heat dissipation components are provided on the top and bottom surfaces of the PCB board body. The heat dissipation components include a heat dissipation fan fixed at a corner on one side of the top surface of the PCB board body. A plurality of heat dissipation holes are opened on the surface of the PCB board body. Each heat dissipation hole is respectively set at the mounting position of the heat-generating element and the position of the heat dissipation fan. A metal connecting pipe assembly is fixed on the bottom surface of the PCB board body. The connecting pipe assembly is in close contact with the thermally conductive adhesive layer of the PCB board body. The connecting pipe assembly is a closed cavity structure with an opening on the bottom surface. Its cavity covers all the heat dissipation holes and maintains an insulating distance from the electrical contacts of the PCB board body.
[0007] As a further embodiment of this utility model, the aperture distribution of the heat dissipation holes satisfies the gradient change rule, and the ratio of the aperture D1 of the heat dissipation hole located in the high-heat area of the heat-generating element to the aperture D2 of the heat dissipation hole in the edge area is 1.2:1 to 1.5:1.
[0008] As a further embodiment of this utility model, the connecting pipe assembly is made of copper, and its top surface forms a thermally conductive connection with the bottom surface of the PCB board body.
[0009] As a further embodiment of this utility model, the top surface of the connecting pipe assembly is integrated with a heat dissipation fin assembly, which includes multiple heat dissipation fins arranged in parallel along the width direction of the PCB board body.
[0010] As a further embodiment of this utility model, the PCB board body (1) has four support pads at the bottom corners, and the installation height H of each support pad satisfies: H>h1+h2, where h1 is the vertical height of the connecting pipe group and h2 is the maximum protrusion height of the heat dissipation fin group.
[0011] As a further embodiment of this utility model, the support pad has a through mounting hole inside, and the axis of the mounting hole is perpendicular to the plane of the PCB board.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] By setting heat dissipation holes below each heat-generating element on the PCB board, and covering all the holes with the cavity of the connecting pipe assembly, an airflow channel is formed between the heat dissipation holes and the connecting pipe assembly. A cooling fan is installed on the PCB board. When the cooling fan exhausts air outward, it creates a negative pressure inside the heat dissipation holes and the connecting pipe assembly, forcing external cool air to flow into the cavity at high speed from the heat dissipation holes, achieving active "suction cooling". This allows the heat from the heat-generating element to be carried away by the airflow, achieving active cooling. This suction cooling method does not cause the problem of heat accumulation due to the obstruction of the heat-generating element, effectively ensuring the heat dissipation effect of the heat-generating element. During the suction cooling process, the connecting pipe assembly can quickly conduct the hot airflow from the high-heat area of the heat-generating element to the surface of the entire connecting pipe assembly, avoiding heat accumulation. The heat from the PCB board is also directly conducted to the surface of the connecting pipe assembly through the thermally conductive adhesive layer of the PCB board, thus achieving passive cooling. Through the design of active and passive synergistic cooling, the heat dissipation effect of the PCB board can be increased, and the stability of the PCB board main body operation can be increased. Attached Figure Description
[0014] Figure 1 This is a three-dimensional top structure diagram of a PCB board with a heat dissipation structure proposed in this utility model.
[0015] Figure 2 This is a three-dimensional schematic diagram of the bottom surface of a PCB board with a heat dissipation structure proposed in this utility model.
[0016] Figure 3 This is a schematic diagram of the bottom three-dimensional disassembled structure of a PCB board with a heat dissipation structure proposed in this utility model.
[0017] Figure 4 for Figure 3 A schematic diagram of the partial three-dimensional structure of A.
[0018] In the diagram: 1. Main body of PCB board; 2. Cooling fan; 3. Heat dissipation holes; 4. Connecting pipe assembly; 5. Heat dissipation fin assembly; 6. Support pad; 7. Mounting holes. Detailed Implementation
[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0020] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0022] like Figures 1-4As shown, a PCB board with a heat dissipation structure includes a PCB board body 1. Heat dissipation components are provided on both the top and bottom surfaces of the PCB board body 1. Each heat dissipation component includes a cooling fan 2 fixed to a corner on one side of the top surface of the PCB board body 1. A plurality of heat dissipation holes 3 are formed on the surface of the PCB board body 1, each corresponding to a heating element mounting position and the position of the cooling fan 2. A metal connecting pipe assembly 4 is fixed to the bottom surface of the PCB board body 1. The connecting pipe assembly 4 is in close contact with the thermally conductive adhesive layer of the PCB board body 1. The connecting pipe assembly 4 is a closed cavity structure with an opening on the bottom surface. Its cavity covers all the heat dissipation holes 3 and maintains an insulating distance from the electrical contacts of the PCB board body 1. By providing heat dissipation holes 3 corresponding to the lower surfaces of the heating elements on the PCB board body 1, all heat dissipation holes 3 are covered by the cavity of the connecting pipe assembly 4. This design creates an airflow channel between the heat dissipation hole 3 and the connecting pipe assembly 4. A cooling fan 2 is installed on the PCB board body 1. When the cooling fan 2 exhausts air outward, it creates a negative pressure inside the heat dissipation hole 3 and the connecting pipe assembly 4, forcing external cold air to flow into the cavity at high speed from the heat dissipation hole 3, achieving active "suction cooling". This allows the heat of the heating element to be carried away by the airflow, achieving active cooling. This suction cooling method does not cause the problem of concentrated heat accumulation due to the obstruction of the heating element, effectively ensuring the heat dissipation effect of the heating element. During the suction cooling process, the connecting pipe assembly 4 can quickly conduct the hot airflow from the high-heat area of the heating element to the surface heat accumulation of the entire connecting pipe assembly 4, achieving passive cooling. Through the design of active and passive synergistic cooling, the heat dissipation effect of the PCB board can be increased, and the stability of the main body of the PCB board 1 can be increased.
[0023] like Figures 2-4 As shown, in this embodiment, the aperture distribution of the heat dissipation holes 3 satisfies the gradient change rule. The ratio of the aperture D1 of the heat dissipation holes 3 located in the high-heat area of the heating element to the aperture D2 of the heat dissipation holes 3 in the edge area is 1.2:1 to 1.5:1. By setting the ratio of the aperture D1 of the heat dissipation holes 3 located in the high-heat area of the heating element to the aperture D2 of the heat dissipation holes 3 in the edge area to 1.2:1 to 1.5:1, the air flow generated by the D1 aperture heat dissipation holes 3 is larger, which better meets the heat dissipation needs of the high-heat area of the heating element. Meanwhile, the air flow generated by the D2 aperture heat dissipation holes 3 is smaller, which better meets the heat dissipation needs of the low-heat area of the heating element. Thus, gradient heat dissipation can be achieved according to the heat distribution of the heating element.
[0024] like Figures 2-4As shown, in this embodiment, the connecting pipe assembly 4 is made of copper, and its top surface forms a thermally conductive connection with the bottom surface of the PCB board body 1. By setting the connecting pipe assembly 4 to be made of copper, the hot airflow of the high-heat area of the heat-generating element can be quickly conducted to the surface heat accumulation of the entire connecting pipe assembly 4 during the heat dissipation process. The heat of the PCB board body 1 can also be directly conducted to the surface of the connecting pipe assembly 4 through the thermally conductive adhesive layer of the PCB board body 1, thereby achieving passive heat dissipation.
[0025] like Figures 2-4 As shown, in this embodiment, the top surface of the connecting pipe group 4 is integrated with a heat dissipation fin group 5. The heat dissipation fin group 5 includes multiple heat dissipation fins arranged parallel to each other along the width direction of the PCB board body 1. By setting the heat dissipation fin group 5, the surface area of the connecting pipe group 4 can be further increased, the active heat dissipation capacity can be increased, and the heat dissipation fin group 5 can be used in conjunction with external active heat dissipation equipment to further increase the heat dissipation effect of the PCB board body 1.
[0026] like Figures 2-4 As shown in this embodiment, the four corners of the bottom surface of the PCB board body 1 are provided with support pads 6. The installation height H of each support pad 6 satisfies: H>h1+h2, where h1 is the vertical height of the connecting pipe group 4 and h2 is the maximum protrusion height of the heat dissipation fin group 5. By setting the formulaic design of the height of the support pad 6, it is ensured that the connecting pipe group 4 and the heat dissipation fin group 5 maintain a safe distance from the mounting plane, and assembly interference caused by the protrusion of the heat dissipation structure of the PCB board body 1 is avoided.
[0027] like Figures 2-4 As shown in this embodiment, the support pad 6 has a through mounting hole 7 inside. The axis of the mounting hole 7 is perpendicular to the plane of the PCB board body 1. The mounting hole 7 is used to insert self-tapping screws and bolts into the mounting hole 7 to assemble the PCB board body 1.
[0028] From the above description, it can be seen that the above embodiments of this utility model achieve the following technical effects: In use, by providing heat dissipation holes 3 below the heating elements on the PCB board body 1, and covering all the heat dissipation holes 3 with the cavity of the connecting pipe group 4, an airflow channel is formed between the heat dissipation holes 3 and the connecting pipe group 4. A cooling fan 2 is provided on the PCB board body 1. When the cooling fan 2 exhausts air outward, a negative pressure is formed inside the heat dissipation holes 3 and the connecting pipe group 4, forcing external cold air to flow into the cavity at high speed from the heat dissipation holes 3, achieving active "suction cooling." This allows the heat of the heating elements to be carried away by the airflow, achieving active cooling. This suction cooling method avoids the problem of concentrated heat accumulation due to the obstruction of the heating elements, effectively ensuring the heat dissipation effect of the heating elements. During the suction cooling process, the connecting pipe group 4 can quickly conduct the hot airflow from the high-heat area of the heating elements to the surface heat accumulation of the entire connecting pipe group 4. The heat of the PCB board body 1 is also directly conducted to the surface of the connecting pipe group 4 through the thermally conductive adhesive layer of the PCB board body 1, achieving passive cooling. Through the design of active and passive synergistic cooling, the PC's heat dissipation efficiency can be increased. The heat dissipation effect of board B increases the stability of the main body of PCB board 1. By setting the ratio of the diameter D1 of the heat dissipation hole 3 in the high-heat area of the heat-generating element to the diameter D2 of the heat dissipation hole 3 in the edge area to 1.2:1 to 1.5:1, the heat dissipation hole 3 with diameter D1 can generate a larger air flow, which better meets the heat dissipation needs of the high-heat area of the heat-generating element. The heat dissipation hole 3 with diameter D2 can generate a smaller air flow, which better meets the heat dissipation needs of the low-heat area of the heat-generating element. Thus, gradient heat dissipation can be achieved according to the heat distribution of the heat-generating element. By setting the heat dissipation fin group 5, the surface area of the connecting pipe group 4 can be further increased, which increases the active heat dissipation capacity. The heat dissipation fin group 5 can also be used in conjunction with external active heat dissipation equipment to further increase the heat dissipation effect of the main body of PCB board 1. By setting the formula design of the height of the support pad 6, it is ensured that the connecting pipe group 4 and the heat dissipation fin group 5 maintain a safe distance from the mounting plane, avoiding assembly interference caused by the protrusion of the heat dissipation structure of the main body of PCB board 1. The mounting hole 7 is used to insert self-tapping screws and bolts into the mounting hole 7 to assemble the main body of PCB board 1.
[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A PCB board with a heat dissipation structure, comprising a PCB board body (1), characterized in that, The PCB board body (1) is provided with heat dissipation components on both the top and bottom surfaces. The heat dissipation components include a heat dissipation fan (2) fixed at one corner of the top surface of the PCB board body (1). Several heat dissipation holes (3) are opened on the surface of the PCB board body (1). Each heat dissipation hole (3) is set to the position of the heat-generating element and the position of the heat dissipation fan (2). A metal connecting pipe assembly (4) is fixed on the bottom surface of the PCB board body (1). The connecting pipe assembly (4) is in close contact with the thermally conductive adhesive layer of the PCB board body (1). The connecting pipe assembly (4) is a closed cavity structure with an opening on the bottom surface. Its cavity covers all the heat dissipation holes (3) and maintains an insulating distance from the electrical contacts of the PCB board body (1).
2. The PCB board with a heat dissipation structure according to claim 1, characterized in that, The aperture distribution of the heat dissipation holes (3) satisfies the gradient variation rule.
3. A PCB board with a heat dissipation structure according to claim 2, characterized in that, The connecting pipe assembly (4) is made of copper, and its top surface forms a thermally conductive connection with the bottom surface of the PCB board body (1).
4. A PCB board with a heat dissipation structure according to claim 3, characterized in that, The top surface of the connecting pipe group (4) is integrated with a heat dissipation fin group (5), which includes multiple heat dissipation fins arranged in parallel along the width direction of the PCB board body (1).
5. A PCB board with a heat dissipation structure according to claim 4, characterized in that, The PCB board body (1) has four support pads (6) at the bottom corners. The installation height H of each support pad (6) satisfies: H>h1+h2, where h1 is the vertical height of the connecting pipe group (4) and h2 is the maximum protrusion height of the heat dissipation fin group (5).
6. A PCB board with a heat dissipation structure according to claim 5, characterized in that, The support pad (6) has a through mounting hole (7) inside, and the axis of the mounting hole (7) is perpendicular to the plane of the PCB board body (1).