PCB (Printed Circuit Board) processing equipment

Abstract

The utility model discloses a PCB processing device comprising a bearing module and a detection module, and the detection module is arranged on the bearing module. The bearing module is provided with a bearing position, the detection module is provided with a detection position, the PCB is placed at the bearing position, and the bearing module can drive the PCB to move between the bearing position and the detection position, so that the detection module can detect the thickness of the PCB, whether the thickness of the PCB meets the requirement or not can be judged, and the detection accuracy of the PCB is improved. And the problem of machining errors caused by plate thickness errors is effectively avoided.

Description

Technical Field

[0001] This utility model relates to the field of PCB processing technology, and in particular to a PCB processing equipment. Background Technology

[0002] In the PCB (Printed Circuit Board) manufacturing process, errors can easily occur due to incorrect board thickness. For example, some PCBs have similar thicknesses, making it difficult to detect the difference with the naked eye. This can easily lead to errors during material loading, resulting in incorrect board thickness.

[0003] As a result of the above, the product yield is low, leading to a waste of resources. Utility Model Content

[0004] This utility model provides a PCB processing equipment designed to solve processing errors caused by incorrect board thickness.

[0005] This utility model provides a PCB processing equipment, including a carrier module and a detection module, wherein the detection module is disposed on the carrier module; the carrier module has a carrier position, and the detection module has a detection position; the PCB is placed on the carrier position, and the carrier module can drive the PCB to move between the carrier position and the detection position, so that the detection module can detect the thickness of the PCB.

[0006] Optionally, the PCB processing equipment further includes a processing module for processing the PCB located at the bearing position.

[0007] Optionally, the support module includes a worktable, a lifting drive assembly, and a lifting assembly; the support position is located on the end face of the worktable; the lifting drive assembly connects the worktable and the lifting assembly, and the lifting assembly is movably connected to the worktable; the lifting drive assembly is used to drive the lifting assembly to reciprocate, so as to move the PCB placed on the worktable between the support position and the detection position.

[0008] Optionally, in the third direction, the worktable has a first surface and a second surface disposed opposite to each other; the first surface is used to place the PCB; when the lifting component moves along the direction from the second surface to the first surface, one end of the lifting component can protrude from the first surface to lift the PCB placed on the first surface, so that the PCB moves to the detection position; when the lifting component moves along the direction from the first surface to the second surface, it can place the lifted PCB on the first surface, so that the PCB moves to the bearing position.

[0009] Optionally, a clearance window is provided on the first surface, and the clearance window extends through the second surface; the lifting component is capable of reciprocating within the clearance window along the third direction.

[0010] Optionally, the detection module includes a detection component; the detection component is connected to the worktable and is used to detect the thickness of the PCB; the detection component is capable of reciprocating relative to the worktable along a first direction to detect the thickness of the PCB at different positions along the first direction; wherein, the first direction intersects with a third direction.

[0011] Optionally, the detection component is a laser detection module, which includes a transmitter and a receiver; the transmitter and the receiver are spaced apart on both sides of the worktable along a second direction; the transmitter is used to emit laser light, and the receiver is used to receive the laser light; the first direction, the second direction, and the third direction are all perpendicular to each other.

[0012] Optionally, the detection module further includes a detection driving component connected to the detection component for driving the detection component to reciprocate along the first direction; and / or, the detection module further includes a guide component connected to the worktable and the detection component for guiding the movement of the detection component along the first direction.

[0013] Optionally, the detection module includes multiple detection components, all of which are connected to the carrier module and are spaced apart along a first direction; each detection component is used to detect the thickness at different locations on the PCB.

[0014] Optionally, the PCB processing equipment further includes a carrier drive module connected to the carrier module. The carrier drive module can drive the PCB located at the detection position to move along a first direction, so that the detection module can detect the thickness of the PCB at different positions along the first direction.

[0015] Optionally, the detection module includes a pressure detection unit, a pressing member, and a stroke detection unit; the pressure detection unit is disposed on the support module to detect the weight of the PCB placed on the support module; the pressing member is connected to the support module and can reciprocate along a third direction to move closer to or away from the support module; when the pressing member approaches the support module, it can abut against the pressure detection unit disposed on the support module or against the PCB placed on the support module; the stroke detection unit is used to detect the displacement of the pressing member along the third direction.

[0016] Optionally, the pressing member and the carrier module can move relative to each other along a first direction, such that the pressing member can abut against different positions of the PCB placed on the carrier module, wherein the first direction is perpendicular to the third direction; and / or, the pressing member and the carrier module can move relative to each other along a second direction, such that the pressing member can abut against different positions of the PCB placed on the carrier module, wherein the second direction is perpendicular to the third direction.

[0017] Optionally, the detection module further includes a pressing drive unit, which is connected to the bearing module and the pressing member; the pressing drive unit is used to drive the pressing member to reciprocate along a third direction.

[0018] Optionally, the PCB processing equipment further includes a processing module for processing the PCB located at the bearing position.

[0019] In the PCB processing equipment provided in this embodiment of the utility model, the thickness of the PCB on the carrier module is detected by the detection module, which can determine whether the thickness of the PCB meets the requirements, effectively avoiding the problem of processing errors caused by incorrect board thickness, thereby improving the product yield and reducing resource waste. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a PCB processing equipment provided in one embodiment of the present invention.

[0022] Instruction manual drawing reference numerals:

[0023] 10. Thickness detection device;

[0024] 1. Load-bearing module; 11. Clearance window;

[0025] 2. Detection module; 21. Detection component; 211. Transmitter; 212. Receiver; 22. Guide component; 221. First guide mechanism; 222. Second guide mechanism;

[0026] 3. Lifting components. Detailed Implementation

[0027] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] Example 1

[0030] like Figure 1 As shown, in Embodiment 1, the PCB processing equipment includes a support module 1 and a detection module 2. The support module 1 has a support position, and the detection module 2 has a detection position. The PCB is placed at the support position, and the support module 1 can drive the PCB to move between the support position and the detection position so that the detection module 2 can detect the thickness of the PCB. Specifically, when the PCB is located at the detection position, the detection module 2 can detect its thickness.

[0031] In this embodiment, the thickness of the PCB on the carrier module 1 is detected by the detection module 2, which can determine whether the PCB thickness meets the requirements. This effectively avoids the problem of incorrect PCB thickness during processing, thereby improving product yield and reducing resource waste. In this embodiment, the PCB processing equipment can be a drilling machine, a forming machine, or a drilling and routing machine, etc., and is not limited thereto.

[0032] In one feasible implementation, the PCB processing equipment further includes a processing module for processing the PCB that has been inspected by the inspection module 2. That is, during operation, the PCB can be inspected by the inspection module 2, and only after passing the inspection can it be processed by the processing module.

[0033] The processing module can process the PCB placed on the support module 1. Specifically, the processing module is used to process the PCB located at the support position. This arrangement can reduce the adverse effects of the corresponding components set up to process the PCB on the inspection work of the inspection module 2. At the same time, this arrangement can also reduce the adverse effects of the corresponding components set up to inspect the PCB on the processing module's processing work.

[0034] In one feasible implementation, the support module 1 includes a worktable for placing the PCB. The support position is located on the end face of the worktable; that is, when the PCB is in the support position, it is actually placed on that end face of the worktable. In one application scenario, the support position is located on the upper surface of the worktable.

[0035] like Figure 1 As shown, in one feasible embodiment, the support module 1 further includes a lifting drive assembly and a lifting assembly 3;

[0036] The lifting drive assembly connects the worktable and the lifting assembly 3, and the lifting assembly is movably connected to the worktable. The lifting drive assembly is used to drive the lifting assembly 3 to reciprocate, so as to move the PCB on the worktable between the bearing position and the detection position.

[0037] When the PCB is in the detection position, the PCB is spaced apart from the worktable.

[0038] In practical applications, dust and other debris on the workbench can lift the PCB to a certain height when it is placed on the workbench. During inspection, this debris can negatively impact the inspection results, leading to reduced accuracy. In this embodiment, however, the PCB is moved along a third direction to maintain a certain distance from the workbench before thickness measurement. This avoids the negative impact of dust and other debris on the PCB thickness measurement.

[0039] In practical scenarios, the area of ​​the workbench used to contact the PCB is smaller than the area of ​​the lifting component 3 that contacts the PCB, in order to reduce the adverse effects of dust and other debris on the thickness detection of the board.

[0040] In addition, the lifting drive assembly actually drives the lifting assembly 3 to reciprocate along a third direction, thereby moving the PCB on the worktable between the bearing position and the detection position. Among these, in Figure 1 Of the directions shown, the third direction is parallel to the Z-axis.

[0041] In one feasible implementation, the third direction is the vertical direction. In this case, the detection position can be located above the bearing position.

[0042] In one feasible implementation, in a third-party orientation, the worktable has a first surface and a second surface disposed opposite to each other; the first surface is used to place a PCB; wherein, when the PCB is placed on the first surface, it is in a bearing position. When the lifting assembly 3 moves along the direction from the second surface to the first surface, one end of the lifting assembly 3 can protrude from the first surface to lift the PCB placed on the first surface, moving the PCB to a detection position; when the lifting assembly 3 moves along the direction from the first surface to the second surface, it can place the lifted PCB on the first surface, moving the PCB to a bearing position. The bearing position is at least a portion of the first surface.

[0043] When the lifting component 3 moves along the direction from the first surface to the second surface and the PCB is placed on the first surface, the lifting component 3 can move along the direction from the second surface to the first surface until it does not protrude from the first surface. This can avoid the lifting drive component and the lifting component 3 from having an adverse effect on the operation of the processing module and other components.

[0044] In this configuration, when the third direction is vertical, the first surface is located above the second surface. In this case, the first surface can be the upper surface of the worktable, and the second surface can be the lower surface of the worktable. Furthermore, when the lifting assembly 3 moves along the direction from the first surface to the second surface, the PCB lifted by the lifting assembly 3 can move downwards under its own gravity until it lands on the first surface. This configuration simplifies the structural design of the lifting drive assembly and the lifting assembly 3.

[0045] like Figure 1 As shown, in one feasible embodiment, a clearance window 11 is provided on the first surface, extending through to the second surface; the lifting assembly 3 is capable of reciprocating along a third direction within the clearance window 11. This facilitates the installation of the lifting drive assembly and the lifting assembly 3 while avoiding interference between the worktable and the lifting assembly 3.

[0046] In one feasible implementation, the lifting drive assembly may be located on one side of the second surface of the worktable, that is, when the third direction is vertical, the lifting drive assembly may be located below the worktable.

[0047] In one feasible implementation, there are multiple avoidance windows 11 and multiple lifting components 3. Each lifting component 3 corresponds one-to-one with an avoidance window 11, and each lifting component 3 can reciprocate along a third direction within its corresponding avoidance window 11. Furthermore, the avoidance windows 11 are spaced apart from each other, and the lifting components 3 are also spaced apart from each other. Here, "multiple" means two or more, and the meaning of the term "multiple" is the same in all embodiments and will not be repeated hereafter.

[0048] In one feasible implementation, the lifting drive assembly includes a cylinder, and the lifting assembly 3 includes a push rod; the cylinder is connected to the push rod and drives the push rod to reciprocate in a third direction. Specifically, the lifting assembly 3 lifts the PCB, which is actually the push rod lifting the PCB. Furthermore, when the PCB is lifted to its maximum position by the lifting assembly 3, it is located at the detection position.

[0049] In addition, the reciprocating motion of the lifting component 3 in the third direction within its corresponding clearance window 11 actually refers to the reciprocating motion of the push rod of the lifting component 3 in the third direction within its corresponding clearance window 11.

[0050] In addition, a lifting assembly 3 may consist of only one push rod.

[0051] In one feasible implementation, the push rods of each lifting assembly 3 are connected to a cylinder, which can drive each push rod to move synchronously in a third direction. Specifically, each push rod can be connected to a cylinder via a connector, so that all push rods can be driven to move up and down synchronously by a single cylinder. This connector can be a connecting plate, etc.

[0052] In one feasible implementation, the detection module 2 can detect the thickness of the PCB at different locations within the detection area. By detecting the thickness at different locations, it can also determine whether the thickness variation of the PCB meets the requirements, thereby determining whether the PCB surface deformation is excessive. In other words, through the setup of this embodiment, both the board thickness and the extent of surface deformation can be detected simultaneously, thus avoiding processing errors caused by incorrect board thickness or excessive surface deformation, thereby improving product yield and reducing resource waste.

[0053] In one feasible implementation, the detection module 2 includes a detection component 21; the detection component 21 is connected to the worktable and is used to detect the thickness of the PCB; the detection component 21 is capable of reciprocating relative to the support module 1 along a first direction to detect the thickness of the PCB at different locations along the first direction. The first direction intersects with a third direction, and the two directions may be perpendicular to each other.

[0054] This allows for the use of a single detection component 21 to detect the thickness at different locations on the PCB, thereby reducing the cost of the thickness detection device 10.

[0055] exist Figure 1 In the directions shown, the first direction is parallel to the X-axis. Furthermore, in a real-world scenario, the first direction can be a front-to-back direction. When the PCB is in the detection position, it is opposite to the detection component 21, allowing the detection component 21 to detect it. When the PCB is in the bearing position, it is offset from the detection component 21, at which point the detection component 21 cannot detect the PCB. The detection component 21 can be connected to the first surface.

[0056] During operation, the detection component 21 is moved sequentially to different positions along the first direction. Each time it moves a certain distance (this distance can be freely set according to actual needs, such as 1mm), the thickness of a point is detected and recorded.

[0057] When determining whether the thickness of a PCB meets the requirements, the average thickness at each point can be calculated and compared with a standard value. If the absolute value of the difference between the average value and the standard value is within a first predetermined range, the thickness of the PCB meets the requirements. If the absolute value of the difference between the average value and the standard value exceeds the first predetermined range, the thickness of the PCB does not meet the requirements.

[0058] To determine if a PCB has excessive deformation, one can calculate the average thickness of each point and subtract the average thickness from the thickness of each point. If the absolute value of the difference between the average thickness and the thickness of the point is within a second predetermined range, it indicates that the PCB does not have excessive deformation. If the absolute value of the difference between the average thickness and the thickness of the point exceeds the second predetermined range, it indicates that there is excessive deformation at that point on the PCB.

[0059] If the difference between the thickness value and the average value of a point is negative, it indicates that the point is located in a concave area; if the difference between the thickness value and the average value of a point is negative, it indicates that the point is located in a convex area.

[0060] In addition, the second predetermined range may not exceed 5% of the standard value.

[0061] Furthermore, during the complete inspection of a PCB, the movement of the inspection component 21 along the first direction can be unidirectional.

[0062] like Figure 1 As shown, in one feasible implementation, the detection component 21 is a laser detection module, which includes a transmitter 211 and a receiver 212. The transmitter 211 and the receiver 212 are spaced apart on both sides of the worktable along a second direction. The transmitter 211 is used to emit laser light, and the receiver 212 is used to receive laser light. The first direction, the second direction, and the third direction intersect each other, and each of the three directions can be perpendicular to the other. This enables non-contact detection and effectively avoids damage to the PCB due to thickness detection.

[0063] exist Figure 1 Of the directions shown, the second direction is parallel to the Y-axis. Furthermore, in real-world scenarios, the second direction can be left or right.

[0064] In this manner, the movement of the detection component 21 along the first direction means that the transmitter 211 moves along the first direction and the receiver 212 also moves along the first direction. Moreover, the transmitter 211 and the receiver 212 usually move synchronously along the first direction.

[0065] The laser detection module can be a light curtain detection module, in which case the laser emitted by the transmitter 211 acts as a laser light curtain. During operation, the PCB placed on the carrier module 1 can pass between the transmitter 211 and the receiver 212, thus blocking the light curtain and allowing the determination of the PCB's thickness. Specifically, in actual use, the detection component 21 is also connected to a controller to calculate the PCB's thickness. The PCB's passage through the light curtain causes it to block the light curtain, and the controller can calculate the PCB's thickness based on this blocking effect. This method primarily detects whether the PCB's bulge deformation is excessive.

[0066] In addition, both the transmitter 211 and the receiver 212 are connected to a corresponding controller. The controller can control the operation of the transmitter 211, while the receiver 212 can transmit the received signal to the controller. The controller can obtain the situation of laser obstruction based on the signal in order to calculate the thickness of the PCB.

[0067] The controller can be a PLC controller, computer controller, or microcontroller controller, or other device with logic operation capabilities. The controller can be part of the detection module 2, or it can be a device independent of the detection module 2.

[0068] In one feasible implementation, the detection module 2 further includes a guide component 22, which connects the support module 1 and the detection component 21 and guides the movement of the detection component 21 along a first direction. This avoids deviations in the movement path of the detection component 21 and ensures the accuracy of the detection results.

[0069] When the transmitter 211 and receiver 212 of the detection assembly 21 are spaced apart on both sides of the worktable along a second direction, the guide assembly 22 includes a first guide mechanism 221 and a second guide mechanism 222, which are spaced apart on both sides of the worktable along the second direction. The first guide mechanism 221 is connected to the transmitter 211 to guide its movement along the first direction; the second guide mechanism 222 is connected to the receiver 212 to guide its movement along the first direction.

[0070] The first guiding mechanism 221 includes a guide rail and a slider. The guide rail is connected to the support module 1, the slider is connected to the guide rail, and the transmitter 211 is connected to the slider. The length direction of the guide rail is parallel to a first direction, and the slider can slide relative to the guide rail along the first direction. The guide rail can guide the movement of the slider along the first direction, thereby guiding the movement of the transmitter 211 along the first direction. Specifically, the guide rail can be mounted on a first surface, in which case the detection component 21 is connected to the first surface through the first guiding mechanism 221.

[0071] In addition, the second guide mechanism 222 and the first guide mechanism 221 can be the same. This embodiment will not impose too many restrictions on the setting of the second guide mechanism 222.

[0072] In one feasible implementation, the detection module 2 further includes a detection driving component connected to the detection component 21, which drives the detection component 21 to reciprocate along a first direction. This makes it easier to drive the detection component 21 to move along the first direction.

[0073] In one feasible implementation, the detection drive component can be an electric component, which may include a rotary motor, a lead screw drive mechanism, etc. The rotary motor is connected to the lead screw of the lead screw drive mechanism, the axis of the lead screw being parallel to the first direction, and the nut of the lead screw drive mechanism is connected to the detection component 21. When the rotary motor rotates, it can drive the lead screw to rotate, thereby driving the nut to move along the first direction, thus driving the detection component 21 to move along the first direction. Of course, the lead screw drive mechanism can also be replaced by any one of a gear and rack drive mechanism, a chain drive mechanism, and a belt drive mechanism.

[0074] In another feasible implementation, the detection drive component can also be a manual component, wherein the manual component can be formed by removing the rotary motor from the electric component in the above-described manner.

[0075] In one feasible implementation, the PCB processing equipment can be a drilling equipment, in which case the processing module is a drilling module.

[0076] In one feasible implementation, the device further includes an alarm unit connected to the controller. When the plate thickness is incorrect, the controller can activate the alarm unit to sound an alarm, allowing operators to address the issue promptly. Similarly, when the plate surface deformation is excessive, the controller can also activate the alarm unit to sound an alarm, enabling operators to handle the situation promptly and thereby improving production efficiency.

[0077] In addition, the alarm messages for incorrect plate thickness and excessive plate deformation can be different. For example, if the alarm is an indicator light, the color of the light emitted by the alarm for incorrect plate thickness is different from the color of the light emitted by the alarm for excessive plate deformation.

[0078] It should be understood that the above settings can also be replaced in other ways, such as:

[0079] In other feasible implementations, after the detection module 2 detects the PCB on the carrier module 1, the detected and qualified PCB is first transferred to the corresponding processing station, and then the processing module processes the PCB at the processing station.

[0080] In this method, the PCB can be transferred by the operator manually moving the PCB from the carrier module 1 to the processing station; or by the robot in the PCB processing equipment moving the PCB from the carrier module 1 to the processing station. The robot can be an existing design, and this embodiment does not impose any restrictions on it.

[0081] Example 2

[0082] The difference between Embodiment 2 and Embodiment 1 is that in Embodiment 2, the PCB processing equipment further includes a carrier drive module connected to the carrier module. The carrier drive module is used to drive the PCB located at the detection position to move along the first direction, so that the detection module can detect the thickness of the PCB at different positions along the first direction.

[0083] In this embodiment, by moving the PCB along the first direction, different areas of the PCB are moved to the detection module 2, thereby enabling the detection module 2 to detect the thickness of different positions of the PCB.

[0084] In this embodiment, the detection module 2 may only include the detection component 21 as described in Embodiment 1, without including the detection driving component and the guiding component 22 as described in Embodiment 1.

[0085] In one feasible implementation, the carrier drive module includes a carrier drive component and a pusher. The carrier drive component is connected to the pusher and can drive the pusher to move along a first direction. When the pusher moves along the first direction, it can push the PCB located at the detection position to move along the first direction.

[0086] Among them, the load-bearing drive component can be a device such as an electric cylinder or a pneumatic cylinder that can drive the object to move linearly.

[0087] In addition, the load-bearing drive assembly can be connected to the worktable via a corresponding support frame. After assembly, both the load-bearing drive assembly and the pusher can be located above the worktable.

[0088] In one feasible implementation, two drive modules can be provided, namely a first module and a second module, wherein the first module and the second module are spaced apart along a first direction. During operation, the first module can push the PCB closer to the second module. During this process, the detection module can detect the thickness of the PCB. After detecting the PCB, the second module can push the PCB closer to the first module to reset the PCB.

[0089] Apart from the differences mentioned above, the other settings in Embodiment 2 can be the same as in Embodiment 1.

[0090] Example 3

[0091] The difference between Embodiment 3 and Embodiment 1 is that in Embodiment 3, the detection module 2 includes multiple detection components 21, all of which are connected to the carrier module 1 and are spaced apart along the first direction; each detection module 2 is used to detect the thickness of different positions on the PCB.

[0092] In this embodiment, the thickness of the PCB at different locations can be detected without moving the PCB and the detection component 21 relative to each other along the first direction. That is, in this embodiment, the detection module 2 does not need to include the detection driving component and the guide component 22 as in Embodiment 1.

[0093] Apart from this, the other settings in Embodiment 3 can be the same as in Embodiment 1.

[0094] Example 4

[0095] The difference between Embodiment 4 and Embodiment 1 is that, in Embodiment 4, the detection module 2 includes a pressure detection unit, a pressing component, and a stroke detection unit; the pressure detection unit is disposed on the support module 1 to detect the weight of the PCB placed on the support module 1; the pressing component is connected to the support module 1 and can reciprocate along a third direction to move closer to or away from the support module 1; when the pressing component moves closer to the support module 1, it can abut against the pressure detection unit disposed on the support module 1 or against the PCB placed on the support module 1; the stroke detection unit is used to detect the displacement of the pressing component along a third direction.

[0096] In this embodiment, when the PCB is not placed on the support module 1, the push button moves from the initial position close to the support module 1 to the contact pressure detection unit, and then stops moving the push button close to the support module 1. At this time, the distance between the push button and the pressure detection unit when it is in the initial position can be determined by the stroke detection unit, and this distance is defined as H1.

[0097] When the PCB is placed on the carrier module 1, the driving pressing component moves from the initial position close to the carrier module 1 to the first position that abuts the PCB, and then stops moving the pressing component close to the carrier module 1. At this time, the distance between the pressing component and the first position of the PCB when it is in the initial position can be determined by the stroke detection unit, and this distance is defined as H2.

[0098] The thickness of the first position of the PCB to be processed is then H1-H2. By pressing the pressing component onto different positions of the PCB, the thickness of different positions of the PCB can be obtained.

[0099] It should be understood that when no PCB is placed on the carrier module 1, if the pressing component presses against the pressure detection unit, the detection value of the pressure detection unit will change, thus confirming that the pressing component is in contact with the pressure detection unit. Similarly, when a PCB is placed on the carrier module 1, if the pressing component presses against the PCB, the detection value of the pressure detection unit will change, thus confirming that the pressing component is in contact with the PCB.

[0100] In one feasible implementation, there may be multiple pressure detection units, and each pressure detection unit may be evenly arranged on the bearing module 1.

[0101] In one feasible implementation, the pressure detection unit may be installed on the lifting component 3, so that its weight can be detected when the lifting component 3 lifts the PCB.

[0102] In one feasible implementation, the stroke detection unit may include a grating ruler and a reading head. The grating ruler is connected to the pressing support, and the reading head is connected to the pressing member. By cooperating with the grating ruler and the reading head, the displacement of the pressing member can be obtained.

[0103] In one feasible implementation, the detection module further includes a pressing drive unit, which is connected to the carrier module 1 and the pressing member; the pressing drive unit is used to drive the pressing member to reciprocate along a third direction.

[0104] In one feasible implementation, a detection module press support is used, wherein the press support is disposed on the bearing module 1, and the press drive unit is disposed on the press support. After assembly, the press support can be connected to a worktable, and the press drive unit and the mounting component can both be located above the worktable.

[0105] In one feasible implementation, the pressing drive unit may include components such as a linear motor, which drives the pressing element to reciprocate along a third direction. The stator of the linear motor may be mounted on a pressing support, and the mover of the linear motor is connected to the pressing element. When the stator is energized, it drives the mover to move along a third direction. By changing the energizing direction of the stator, the direction of movement of the mover can be adjusted. Of course, in other embodiments, the pressing drive unit may be a device such as an electric cylinder capable of driving linear motion of an object.

[0106] In one feasible implementation, the pressing member and the carrier module 1 can move relative to each other along a first direction, such that the pressing member can abut against different positions on the PCB placed on the carrier module 1; and / or, the pressing member and the carrier module 1 can move relative to each other along a second direction, such that the pressing member can abut against different positions on the PCB placed on the carrier module 1. This allows for thickness detection at multiple locations on the PCB.

[0107] In one feasible implementation, the detection module 2 includes a first position adjustment drive assembly, which can drive the pressing member to move along a first direction. In this embodiment, the first position adjustment drive assembly may be connected to the pressing support member, and the pressing drive unit may be connected to the first position adjustment drive assembly.

[0108] In addition, the structure of the first position adjustment component can be the same as that of the press drive unit.

[0109] In one feasible implementation, the detection module 2 includes a second position adjustment drive assembly in addition to the first position adjustment drive assembly. The second position adjustment drive assembly can drive the pressing member to move along a second direction. In this embodiment, the first position adjustment drive assembly can be connected to the pressing support member, and the pressing drive unit is connected to the first position adjustment drive assembly through the second position adjustment drive assembly.

[0110] In addition, the structure of the second position adjustment component can be the same as that of the press drive unit.

[0111] It should be understood that the structure of the drive component used to drive the linear motion of an object can also be the same as the structure of the detection drive component.

[0112] Apart from this, the other settings in Embodiment 4 can be the same as in Embodiment 1.

[0113] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0114] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A PCB processing equipment, characterized in that, It includes a load-bearing module and a detection module, wherein the detection module is disposed on the load-bearing module; The carrier module has a carrier position, the detection module has a detection position, the PCB is placed at the carrier position, and the carrier module can drive the PCB to move between the carrier position and the detection position so that the detection module can detect the thickness of the PCB.

2. The PCB processing equipment according to claim 1, characterized in that, The load-bearing module includes a worktable, a lifting drive assembly, and a lifting assembly; The bearing position is located on the end face of the workbench; The lifting drive assembly is connected to the worktable and the lifting assembly, and the lifting assembly is movably connected to the worktable; The lifting drive assembly is used to drive the lifting assembly to reciprocate, so as to move the PCB placed on the worktable between the bearing position and the detection position.

3. The PCB processing equipment according to claim 2, characterized in that, In the third direction, the worktable has a first surface and a second surface disposed opposite to each other; The first surface is used to place the PCB; When the lifting assembly moves along the direction from the second surface to the first surface, one end of the lifting assembly can protrude from the first surface to lift the PCB placed on the first surface, so that the PCB moves to the detection position; When the lifting assembly moves along the direction from the first surface to the second surface, it can place the lifted PCB on the first surface, thereby moving the PCB to the bearing position.

4. The PCB processing equipment according to claim 3, characterized in that, An avoidance window is provided on the first surface, and the avoidance window extends through the second surface; The lifting component is capable of reciprocating along the third direction within the avoidance window.

5. The PCB processing equipment according to claim 2, characterized in that, The detection module includes detection components; The detection component is connected to the worktable and is used to detect the thickness of the PCB; The detection component is capable of reciprocating relative to the worktable along a first direction to detect the thickness of the PCB at different positions along the first direction; Wherein, the first direction intersects with the third direction.

6. The PCB processing equipment according to claim 5, characterized in that, The detection component is a laser detection module, which includes a transmitter and a receiver. The transmitter and the receiver are spaced apart on both sides of the workbench along a second direction; The transmitter is used to emit laser light, and the receiver is used to receive the laser light. The first direction, the second direction, and the third direction intersect each other.

7. The PCB processing equipment according to claim 5, characterized in that, The detection module further includes a detection driving component, which is connected to the detection component and is used to drive the detection component to reciprocate along the first direction. And / or, The detection module further includes a guide component, which connects the worktable and the detection component and is used to guide the movement of the detection component along the first direction.

8. The PCB processing equipment according to any one of claims 1-7, characterized in that, The detection module includes multiple detection components, all of which are connected to the carrier module and are spaced apart along a first direction; Each of the aforementioned detection components is used to detect the thickness at different locations on the PCB.

9. The PCB processing equipment according to any one of claims 1-7, characterized in that, The PCB processing equipment further includes a carrier drive module connected to the carrier module. The carrier drive module can drive the PCB located at the detection position to move along a first direction, so that the detection module can detect the thickness of the PCB at different positions along the first direction.

10. The PCB processing equipment according to claim 1, characterized in that, The detection module includes a pressure detection unit, a pressing component, and a stroke detection unit; The pressure detection unit is mounted on the support module to detect the weight of the PCB placed on the support module; The pressing element is connected to the bearing module and can reciprocate along a third direction to move closer to or further away from the bearing module; When the pressing member approaches the support module, it can abut against the pressure detection unit provided on the support module or against the PCB placed on the support module; The stroke detection unit is used to detect the displacement of the pressing member along the third direction.

11. The PCB processing equipment according to claim 10, characterized in that, The pressing member and the carrier module can move relative to each other along a first direction, so that the pressing member can abut against different positions of the PCB placed on the carrier module, wherein the first direction and the third direction are perpendicular. And / or, The pressing member and the carrier module are capable of relative movement along a second direction, such that the pressing member can abut against different positions of the PCB placed on the carrier module, wherein the second direction is perpendicular to the third direction.

12. The PCB processing equipment according to claim 10, characterized in that, The detection module further includes a pressing drive unit, which is connected to the bearing module and the pressing component; the pressing drive unit is used to drive the pressing component to reciprocate along a third direction.

13. The PCB processing equipment according to claim 1, characterized in that, The PCB processing equipment also includes a processing module, which is used to process the PCB located at the bearing position.

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