Liquid cooling plate and liquid cooling device
By adopting a parallel DC flow channel structure in the liquid cooling plate, the problems of high flow resistance and uneven heat exchange are solved, achieving low power consumption and high-efficiency heat exchange, simplifying the production process and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- PREGIS NEW MATERIALS (SHENZHEN) PTE LTD
- Filing Date
- 2025-03-25
- Publication Date
- 2026-05-15
AI Technical Summary
Existing liquid cooling plates suffer from high flow resistance, high pump power consumption, and uneven heat exchange, especially in serpentine flow channels and traditional direct flow channels.
The parallel DC flow channel structure includes an inlet hole, a first liquid guiding channel, a main flow channel, first and second branch channels, and an outlet hole. The parallel DC flow channel is formed by the first and second heat dissipation components, which reduces flow resistance and improves heat exchange uniformity.
It effectively reduces flow resistance, pump power consumption, improves heat exchange uniformity, simplifies production processes, and reduces costs.
Smart Images
Figure CN224250016U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, and in particular to a liquid cooling plate and a liquid cooling device. Background Technology
[0002] As electronic components and related electronic devices become smaller and smaller, their integration becomes higher and higher, and their heat flux density also increases. Traditional air cooling technology can no longer meet the heat dissipation requirements of electronic components with high heat flux density. Since liquid cooling technology mainly utilizes the properties of liquids with high specific heat capacity and high thermal conductivity, liquid cooling plates with good heat exchange effect based on liquid cooling technology have begun to be widely used.
[0003] In related technologies, most liquid cooling plates are internally designed with either a serpentine flow channel or a traditional long direct-flow channel. The serpentine flow channel structure typically results in a longer flow path and time for the coolant within the liquid cooling plate, leading to high flow resistance, high pump power consumption, significant differences in heat exchange capacity at different locations, and complex manufacturing processes for the coolant pipes. Similarly, traditional direct-flow channels also suffer from high flow resistance, high pump power consumption, and uneven heat exchange at both ends. Utility Model Content
[0004] The technical problem to be solved by this utility model is to provide a liquid-cooled cold plate and a liquid-cooling device.
[0005] The technical solution adopted by this utility model to solve its technical problem is: to construct a liquid cooling plate, the liquid cooling plate including a liquid cooling cavity, the liquid cooling cavity having liquid inlet holes and liquid outlet holes on opposite sides, the liquid cooling cavity having a first baffle and a second baffle arranged parallel to each other at intervals, and both extending along a first direction, the first baffle being arranged close to the liquid inlet hole, the second baffle being arranged close to the liquid outlet hole, and the area between the two forming a heat dissipation area;
[0006] The first baffle is provided with a first liquid guiding channel in the middle, and the two ends of the second baffle are respectively formed with second liquid guiding channels; the heat dissipation area is provided with a first heat dissipation component and a second heat dissipation component at intervals, and a main channel is formed between the two; the first heat dissipation component has a plurality of first branch channels, and the second heat dissipation component has a plurality of second branch channels, and the first branch channels and the second branch channels are both extended along a first direction.
[0007] The inlet hole, the first liquid guiding channel, the main channel, the first branch channel, the second branch channel, the second liquid guiding channel, and the outlet hole are connected to form a parallel direct flow channel.
[0008] In some embodiments, the liquid-cooled plate includes an upper cover plate and a substrate assembled together;
[0009] The upper cover plate includes a plate body, and a first side plate, a second side plate, a third side plate, and a fourth side plate are sequentially connected on the side of the plate body facing the substrate. The first side plate and the third side plate are arranged in parallel and spaced apart, and the second side plate and the fourth side plate are arranged in parallel and spaced apart. The plate body, the first side plate, the second side plate, the third side plate, the fourth side plate, and the substrate together define the liquid cooling cavity.
[0010] The first side plate has the liquid inlet hole at the end near the second side plate, and the third side plate has the liquid outlet hole at the end near the fourth side plate;
[0011] The two ends of the first baffle are respectively connected to the second side plate and the fourth side plate, and the two ends of the second baffle are respectively spaced apart from the second side plate and the fourth side plate;
[0012] The substrate is provided with the first heat dissipation component and the second heat dissipation component.
[0013] In some embodiments, the first liquid guiding channel is disposed opposite to the middle portion of the second baffle.
[0014] In some embodiments, the top cover plate is further provided with a plurality of mounting holes.
[0015] In some embodiments, the first heat dissipation component includes a plurality of first heat dissipation fins, the plurality of first heat dissipation fins being arranged at intervals along a second direction, and the gap between two adjacent first heat dissipation fins forming the first branch channel.
[0016] The second heat dissipation component includes a plurality of second heat dissipation fins, which are arranged at intervals along a second direction, and the gap between two adjacent second heat dissipation fins forms the second branch channel;
[0017] The second direction is perpendicular to the first direction.
[0018] In some embodiments, the number of the first heat dissipation fins is the same as the number of the second heat dissipation fins, or the number of the first heat dissipation fins is greater than the number of the second heat dissipation fins, or the number of the first heat dissipation fins is less than the number of the second heat dissipation fins.
[0019] In some embodiments, the thickness of the first heat dissipation fin is the same as the thickness of the second heat dissipation fin, or the thickness of the first heat dissipation fin is less than the thickness of the second heat dissipation fin, or the thickness of the first heat dissipation fin is greater than the thickness of the second heat dissipation fin.
[0020] In some embodiments, the substrate has a first surface and a second surface, wherein the first surface of the substrate is disposed toward the side of the upper cover plate;
[0021] The first surface of the substrate is provided with a boss, and the boss is provided with the first heat dissipation component and the second heat dissipation component.
[0022] In some embodiments, the first surface of the substrate, except for the portion of the boss, forms a contact surface, which is sealed together with the first side plate, the second side plate, the third side plate, and the fourth side plate.
[0023] This utility model also discloses a liquid cooling device, including the liquid cooling plate described in any of the above embodiments, and further including a coolant pipeline connected to the liquid inlet and the liquid outlet respectively, and a pump connected to the coolant pipeline.
[0024] The present invention has the following advantages: the parallel DC flow channel of the liquid cooling plate can effectively reduce the flow resistance of the liquid cooling plate, reduce the power consumption of the pump, and effectively improve the heat exchange uniformity. Attached Figure Description
[0025] To more clearly illustrate the technical solution of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the following drawings only show some embodiments of this utility model and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort. In the drawings:
[0026] Figure 1 This is a schematic diagram of the liquid-cooled plate in some embodiments of the present invention from a certain perspective;
[0027] Figure 2 yes Figure 1 Exploded view of the liquid cooling plate in the middle;
[0028] Figure 3 This is a schematic diagram of the liquid-cooled plate in some embodiments of the present invention from another perspective;
[0029] Figure 4 yes Figure 3 A schematic diagram of the liquid-cooled cold plate in the middle;
[0030] Figure 5 This is a cross-sectional view of the liquid-cooled cold plate in some embodiments of this utility model;
[0031] Figure 6 This is a schematic diagram of the substrate structure in some embodiments of this utility model;
[0032] Figure 7 yes Figure 6 A detailed view of the first heat dissipation component on the substrate.
[0033] Figure 8 This is a schematic diagram of the substrate structure in some other embodiments of the present invention. Detailed Implementation
[0034] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the device or component referred to must have a specific orientation; therefore, they should not be construed as limitations on this utility model.
[0035] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0036] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the present invention. However, those skilled in the art will understand that the present invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
[0037] See Figures 1 to 5This utility model discloses a liquid-cooled plate, which includes a liquid-cooled cavity A. The liquid-cooled cavity A has an inlet hole 121 and an outlet hole 141 on opposite sides. A first baffle 16 and a second baffle 17 are arranged parallel to each other at intervals in the liquid-cooled cavity A, and both extend along a first direction. The first baffle 16 is located near the inlet hole 121, and the second baffle 17 is located near the outlet hole 141. The area between the two forms a heat dissipation area.
[0038] The first baffle 16 has a first liquid guiding channel a in its middle, which can be arranged opposite to the middle of the second baffle 17. Second liquid guiding channels b are formed at both ends of the second baffle 17. A first heat dissipation component 22 and a second heat dissipation component 23 are spaced apart within the heat dissipation area, forming a main flow channel c between them. The first heat dissipation component 22 has several first branch channels d, and the second heat dissipation component 23 has several second branch channels e, both extending along a first direction. The area of the first heat dissipation component 22 can form a heat dissipation area a, and the area of the second heat dissipation component 23 can form a heat dissipation area b.
[0039] The inlet hole 121, the first liquid guiding channel a, the main channel c, the first branch channel d, the second branch channel e, the second liquid guiding channel b, and the outlet hole 141 are connected to form a parallel direct flow channel.
[0040] The liquid-cooled plate adopts a parallel DC flow channel, which can effectively reduce the flow resistance of the liquid-cooled plate, reduce pump power consumption, and effectively improve heat exchange uniformity. Moreover, the liquid-cooled plate has a relatively simple structure, which can effectively reduce production costs and improve product competitiveness.
[0041] In some embodiments, all the first branch channels d have the same width, and all the second branch channels e have the same width. In some embodiments, the width of the first branch channel d is the same as the width of the second branch channel e (e.g., Figure 6 and Figure 7 As shown). In some embodiments, the width of the first branch channel d is greater than the width of the second branch channel e (e.g. Figure 8 (as shown), or, the width of the first branch channel d is smaller than the width of the second branch channel e.
[0042] Please refer to the following: Figures 1 to 5The liquid cooling plate includes an upper cover plate 10 and a substrate 20 assembled together. The upper cover plate 10 may include a plate body 11, on the side of the plate body 11 facing the substrate 20, there are a first side plate 12, a second side plate 13, a third side plate 14 and a fourth side plate 15 connected in sequence. The first side plate 12 and the third side plate 14 are arranged in parallel and spaced apart, and the second side plate 13 and the fourth side plate 15 are arranged in parallel and spaced apart. The plate body 11, the first side plate 12, the second side plate 13, the third side plate 14, the fourth side plate 15 and the substrate 20 together define the liquid cooling cavity A.
[0043] The first side plate 12 is provided with the liquid inlet 121 at the end near the second side plate 13, and the third side plate 14 is provided with the liquid outlet 141 at the end near the fourth side plate 15.
[0044] The first baffle 16 is connected to the second side plate 13 and the fourth side plate 15 at both ends, and is arranged parallel to the first side plate 12. A first liquid guiding channel a is provided in the middle of the first baffle 16, which can divide the first baffle 16 into a first sub-baffle 161 and a second sub-baffle 162 (e.g., ...). Figure 2 As shown, the first sub-baffle 161 and the second sub-baffle 162 have the same length. Further, a liquid inlet channel can be formed in the area between the first baffle 16 and the first side plate 12, and this liquid inlet channel is connected to the first liquid guiding channel a. Preferably, the first liquid guiding channel a is positioned opposite to the middle of the second baffle 17.
[0045] The second baffle 17 is arranged parallel to the third side plate 14, and its two ends are respectively spaced apart from the second side plate 13 and the fourth side plate 15, so as to define the second liquid guiding channel b at both ends of the length direction of the second baffle 17. The two second liquid guiding channels b have the same flow area. Furthermore, the area between the second baffle 17 and the third side plate 14 can form a liquid outlet channel, which is connected to the second liquid guiding channel b.
[0046] The substrate 20 is provided with a first heat dissipation component 22 and a second heat dissipation component 23. The first heat dissipation component 22 and the second heat dissipation component 23 are disposed in the heat dissipation area between the first baffle 16 and the second baffle 17, and the first heat dissipation component 22 is spaced apart from the second side plate 13, so that a first confluence channel is formed between the first heat dissipation component 22 and the second side plate 13. The first confluence channel is connected to a first branch channel d and a second liquid guiding channel b (here, the second liquid guiding channel b is the second liquid guiding channel b near the end of the first heat dissipation component 22).
[0047] The second heat dissipation component 23 is spaced apart from the fourth side plate 15, so that a second confluence channel is formed between the second heat dissipation component 23 and the fourth side plate 15. The second confluence channel is connected to the second branch channel e and the second liquid guiding channel b (the second liquid guiding channel b is the second liquid guiding channel b near the end of the second heat dissipation component 23).
[0048] Furthermore, the end of the first heat dissipation component 22 away from the second heat dissipation component 23 may be flush with the end of one end of the second baffle 17, and the end of the second heat dissipation component 23 away from the first heat dissipation component 22 may be flush with the end of the other end of the second baffle 17.
[0049] In some embodiments, the upper cover plate 10 is further provided with a plurality of mounting holes 18 for mounting on equipment requiring heat dissipation. The mounting holes 18 include, but are not limited to, round holes, and the number of mounting holes 18 can be four or any other arbitrary number. The shape and number of mounting holes 18 can be selected according to actual needs and are not specifically limited here.
[0050] In some embodiments, the first heat dissipation component 22 includes a plurality of first heat dissipation fins 221, which are arranged at intervals along a second direction. The gap between any two adjacent first heat dissipation fins 221 forms the first branch channel d. Of course, the gap between the first heat dissipation fins 221 and the first baffle 16 can also form the first branch channel d, and the gap between the first heat dissipation fins 221 and the second baffle 17 can also form the first branch channel d.
[0051] The second heat dissipation component 23 includes a plurality of second heat dissipation fins 231, which are arranged at intervals along a second direction. The gap between two adjacent second heat dissipation fins 231 forms the second branch channel e. Of course, the gap between the second heat dissipation fins 231 and the first baffle 16 can also form the second branch channel e, and the gap between the second heat dissipation fins 231 and the second baffle 17 can also form the second branch channel e.
[0052] Wherein, the second direction is perpendicular to the first direction, for example, as Figure 5 As shown, when the cross-sectional shape of the liquid cooling cavity A is approximately rectangular, the first direction can be the length direction, and the second direction can be the width direction. Of course, the liquid cooling cavity A can also have other structural shapes, which are not specifically limited here.
[0053] In some embodiments, the number of the first heat dissipation fins 221 is the same as the number of the second heat dissipation fins 231, or the number of the first heat dissipation fins 221 is greater than the number of the second heat dissipation fins 231, or the number of the first heat dissipation fins 221 is less than the number of the second heat dissipation fins 231.
[0054] In some embodiments, the thickness of the first heat dissipation fin 221 is the same as the thickness of the second heat dissipation fin 231, or the thickness of the first heat dissipation fin 221 is less than the thickness of the second heat dissipation fin 231, or the thickness of the first heat dissipation fin 221 is greater than the thickness of the second heat dissipation fin 231.
[0055] Specifically, the first heat dissipation component 22 includes a plurality of first heat dissipation fins 221, which may be rectangular sheet structures. The second heat dissipation component 23 includes a plurality of second heat dissipation fins 231, which may also be rectangular sheet structures. The number (or density) of the first heat dissipation fins 221 and the number (or density) of the second heat dissipation fins 231 may be the same or different, and can be selected according to actual needs; no specific limitation is made here. Furthermore, the thickness of the first heat dissipation fins 221 and the thickness of the second heat dissipation fins 231 may be the same or different, and can be selected according to actual needs; no specific limitation is made here.
[0056] like Figures 4 to 8 As shown, the substrate 20 has a first surface and a second surface. The first surface of the substrate 20 is disposed on the side facing the upper cover plate 10. The first surface of the substrate 20 is provided with a boss 21, and the first heat dissipation component 22 and the second heat dissipation component 23 are disposed on the boss 21.
[0057] In some embodiments, the first surface of the substrate 20, except for the portion of the boss 21, forms a contact surface 24. The contact surface 24 is sealed together with the first side plate 12, the second side plate 13, the third side plate 14, and the fourth side plate 15, which may be welded together, for example, by vacuum brazing.
[0058] In some embodiments, the upper cover plate 10 and the substrate 20 can be made of all-copper, all-aluminum, or a combination of copper and aluminum. Of course, the materials and dimensions of the upper cover plate 10 and the substrate 20 can be selected and set according to actual needs, and no specific limitation is made here.
[0059] In some embodiments, the upper cover plate 10 can be manufactured using CNC (Computer Numerical Control) technology, and the substrate 20 can be manufactured using a combination of CNC technology and tooth-scraping technology. Vacuum brazing is performed through the contact surface 24 to combine the two into a liquid-cooled plate. This processing technology is simple, allows for large-scale production, and effectively reduces costs. Simultaneously, to address the heat dissipation requirements of different power consumption areas of special chips, the tooth density can be changed in different areas, i.e., parameters such as the fin thickness and fin spacing of the first heat dissipation component 22 or the second heat dissipation component 23 can be modified. Figure 6 and Figure 8The two configurations shown further change the heat exchange area of different heat dissipation areas to adapt to the heat dissipation requirements of different power consumption areas of special chips, which can effectively improve the practicality and applicability of the liquid cooling plate.
[0060] The liquid cooling plate is applied as follows: In actual operation, the heat generated by the equipment that needs heat dissipation (including but not limited to the chips of electronic devices) is transferred to the bottom surface of the substrate 20 through the thermal pad, and then transferred to the interior of the liquid cooling plate through the thermal conductivity of the substrate 20. It undergoes convective heat exchange with the coolant in the parallel channel of the liquid cooling plate, and carries away the heat. The flow path of the coolant is as follows: it enters from the inlet hole 121, flows into the main channel c through the guiding effect of the first baffle 16, and then flows through the first branch channel d of the first heat dissipation component 22 and the second branch channel e of the second heat dissipation component 23 respectively. After that, it converges at the outlet hole 141 and flows out through the guiding effect of the second baffle 17.
[0061] Compared to serpentine flow channels and traditional long direct-flow channels, using parallel direct-flow channels for liquid cooling disperses the fluid into multiple short branches, reducing the flow velocity and flow resistance. Simultaneously, the shorter length of each branch reduces frictional losses and further lowers flow resistance, placing lower demands on pump capacity and effectively reducing pump power consumption and saving energy. Furthermore, as the coolant flows through the parallel direct-flow channels, it simultaneously flows through the first heat dissipation component 22 and the second heat dissipation component 23, significantly shortening the flow time and reducing the flow path. This effectively reduces the difference in heat exchange capacity at different locations on the liquid-cooled plate and enhances the overall heat exchange uniformity of the liquid-cooled plate.
[0062] This utility model also discloses a liquid cooling device, which includes the liquid cooling plate of the above embodiment, and also includes a coolant pipeline connected to the liquid inlet 121 and the liquid outlet 141 respectively, and a pump connected to the coolant pipeline. The pump is used to drive the coolant to flow in the parallel direct current channel in the liquid cooling plate.
[0063] It is understood that the above embodiments only illustrate preferred embodiments of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present utility model patent. It should be noted that for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present utility model, all of which fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present utility model should fall within the coverage of the claims of the present utility model.
Claims
1. A liquid-cooled cold plate, characterized in that, The liquid cooling plate includes a liquid cooling cavity (A), which has an inlet hole (121) and an outlet hole (141) on opposite sides. A first baffle (16) and a second baffle (17) are arranged parallel to each other in the liquid cooling cavity (A), and both extend along a first direction. The first baffle (16) is located near the inlet hole (121), and the second baffle (17) is located near the outlet hole (141). The area between the two forms a heat dissipation area. The first baffle (16) has a first liquid guiding channel (a) in the middle, and the second baffle (17) has second liquid guiding channels (b) at both ends; the heat dissipation area is provided with a first heat dissipation component (22) and a second heat dissipation component (23) at intervals, and a main channel (c) is formed between them; the first heat dissipation component (22) has a plurality of first branch channels (d), and the second heat dissipation component (23) has a plurality of second branch channels (e), and the first branch channels (d) and the second branch channels (e) are both extended along a first direction; The inlet hole (121), the first liquid guiding channel (a), the main channel (c), the first branch channel (d), the second branch channel (e), the second liquid guiding channel (b), and the outlet hole (141) are connected to form a parallel direct flow channel.
2. The liquid-cooled cold plate according to claim 1, characterized in that, The liquid-cooled plate includes an upper cover plate (10) and a base plate (20) assembled together; The upper cover plate (10) includes a plate body (11). The plate body (11) has a first side plate (12), a second side plate (13), a third side plate (14), and a fourth side plate (15) connected in sequence on the side facing the substrate (20). The first side plate (12) and the third side plate (14) are arranged parallel and spaced apart, and the second side plate (13) and the fourth side plate (15) are arranged parallel and spaced apart. The plate body (11), the first side plate (12), the second side plate (13), the third side plate (14), the fourth side plate (15), and the substrate (20) together define the liquid cooling cavity (A). The first side plate (12) is provided with the liquid inlet (121) at one end near the second side plate (13), and the third side plate (14) is provided with the liquid outlet (141) at one end near the fourth side plate (15); The two ends of the first baffle (16) are respectively connected to the second side plate (13) and the fourth side plate (15), and the two ends of the second baffle (17) are respectively spaced apart from the second side plate (13) and the fourth side plate (15); The substrate (20) is provided with the first heat dissipation component (22) and the second heat dissipation component (23).
3. The liquid-cooled cold plate according to claim 1 or 2, characterized in that, The first liquid guiding channel (a) is positioned opposite the middle of the second baffle (17).
4. The liquid-cooled cold plate according to claim 2, characterized in that, The upper cover plate (10) is also provided with several mounting holes (18).
5. The liquid-cooled cold plate according to claim 1 or 2, characterized in that, The first heat dissipation component (22) includes a plurality of first heat dissipation fins (221), which are arranged at intervals along the second direction, and the gap between two adjacent first heat dissipation fins (221) forms the first branch channel (d). The second heat dissipation component (23) includes a plurality of second heat dissipation fins (231), which are arranged at intervals along the second direction, and the gap between two adjacent second heat dissipation fins (231) forms the second branch channel (e); The second direction is perpendicular to the first direction.
6. The liquid-cooled cold plate according to claim 5, characterized in that, The number of the first heat dissipation fins (221) is the same as the number of the second heat dissipation fins (231), or the number of the first heat dissipation fins (221) is greater than the number of the second heat dissipation fins (231), or the number of the first heat dissipation fins (221) is less than the number of the second heat dissipation fins (231).
7. The liquid-cooled cold plate according to claim 5, characterized in that, The thickness of the first heat dissipation fin (221) is the same as the thickness of the second heat dissipation fin (231), or the thickness of the first heat dissipation fin (221) is less than the thickness of the second heat dissipation fin (231), or the thickness of the first heat dissipation fin (221) is greater than the thickness of the second heat dissipation fin (231).
8. The liquid-cooled cold plate according to claim 5, characterized in that, The substrate (20) has a first surface and a second surface, and the first surface of the substrate (20) is disposed on the side facing the upper cover plate (10); The first surface of the substrate (20) is provided with a boss (21), and the boss (21) is provided with the first heat dissipation component (22) and the second heat dissipation component (23).
9. The liquid-cooled cold plate according to claim 8, characterized in that, The first surface of the substrate (20) except for the portion of the boss (21) forms a contact surface (24), which is sealed together with the first side plate (12), the second side plate (13), the third side plate (14) and the fourth side plate (15).
10. A liquid cooling device, characterized in that, The device includes the liquid-cooled plate according to any one of claims 1 to 9, and further includes a coolant pipeline connected to the inlet hole (121) and the outlet hole (141) respectively, and a pump connected to the coolant pipeline.