Electronic device

Abstract

The utility model provides electronic equipment which comprises a circuit board, a first element, a second element, a mounting part and a cooling part, the mounting part is provided with a fixing part and a cold conduction part connected with the fixing part, the fixing part is provided with a mounting hole, the mounting part is fixed on the circuit board, the first element is located in the mounting hole, and the second element is located in the cooling part. The cooling part is provided with a cooling part, and the cooling part is installed on the installation part and located at the installation hole so that the cooling part can be connected with the first element in a heat conduction mode. According to the electronic equipment, the connection reliability of the cooling piece and the first element and the connection reliability of the cooling piece and the installation piece are improved, and then the heat dissipation reliability of the cooling piece on the first element and the second element is improved.

Description

Technical Field

[0001] This application relates to the heat dissipation technology of electronic devices, and particularly to an electronic device. Background Art

[0002] As the power of components in electronic devices continues to increase, it has become very difficult for traditional air cooling to solve the heat dissipation problems of these components. At present, liquid cooling technology has also been widely applied in the electronic field and has good heat dissipation effects for some components with high heat dissipation requirements.

[0003] See Figure 1 , there has emerged a circuit layout scheme in the prior art: a VR chip 2 capable of supplying power to the GPU / CPU chip 1 is arranged beside the GPU / CPU chip 1 on the circuit board. The VR chip 2 also generates a large amount of heat, so a radiator needs to be configured for heat dissipation. The heat dissipation scheme of this circuit is as follows: the bracket 3 is fixed on the circuit board by spring screws 4 at the four corners, the cold plate 5 is fixed on the bracket 3, and the cooling surface of the cold plate 5 is made to fit with the GPU / CPU chip 1 to use the cold plate 5 to dissipate heat from the GPU / CPU chip 1. In addition, one end of the VR radiator 6 is attached to the VR chip 2 through a thermal pad 7, and the other end is fixed to the bracket 3 by screws and connected to the cold plate 5 to dissipate heat from the VR chip 2 through the cold plate 5.

[0004] This heat dissipation scheme has certain defects: both the connection between the bracket 3 and the VR radiator 6 and the connection between the bracket 3 and the cold plate 5 are rigid connections. Four compression springs need to simultaneously press the VR radiator 6 against the VR chip 2 and the cold plate 5 against the GPU / CPU chip 1. However, after the thermal pad 7 is compressed, an upward rebound force F3 will be generated, and F3 will cause uneven spring forces between the GPU / CPU chip 1 and the bracket 3, that is, it is possible that F2 < F1, so that the left and right pressures on the CPU / GPU chip by the cooling surface are not equal, and the performance of the GPU / CPU chip 1 will be affected after long-term use; when F2 is close to F3 or less than F3, the pressure on the left end of the GPU / CPU chip 1 by the cooling surface is 0, that is, the contact between the GPU / CPU chip 1 and the cold plate 5 is poor, resulting in a high-temperature alarm. Therefore, improvements are needed to more reliably achieve heat dissipation for the GPU / CPU chip 1 and the VR chip 2. Utility Model Content

[0005] The embodiments of this application provide an electronic device, which can improve the reliability of component heat dissipation.

[0006] To achieve the above object, this application adopts the following technical solutions:

[0007] This application provides an electronic device, including a circuit board, a first element and a second element disposed on the circuit board; it further includes: a mounting member having a fixing portion and a cooling portion connected to the fixing portion, the fixing portion having a mounting hole, the mounting member being fixed to the circuit board such that the first element is located within the mounting hole, and the cooling portion being connected to the second element through a thermal pad; and a cooling member having a cooling portion, the cooling member being mounted on the mounting member and located at the mounting hole such that the cooling portion is thermally connected to the first element.

[0008] As an optional implementation, the mounting component also includes a connecting portion formed between the fixing portion and the cooling portion to integrally connect the fixing portion and the cooling portion.

[0009] As an alternative implementation, the mounting component is made of metal.

[0010] As an optional implementation, the electronic device further includes a support member disposed on the circuit board between the circuit board and the mounting member, for supporting the mounting member.

[0011] As an optional implementation, the cooling component includes: an outer shell portion, a liquid flow chamber defined within the outer shell portion, and an inlet and an outlet respectively communicating with the liquid flow chamber on the outer shell portion; the cooling component is configured to: facilitate the formation of a heat exchange medium that enters the liquid flow chamber through the inlet and exits the liquid flow chamber through the outlet; and the cooling section is connected to the outer shell portion.

[0012] As an optional implementation, the cooling component includes: a cold source for providing cooling to the heat exchange medium, having an inlet and an outlet; an inlet pipe connected to the outlet and the inlet; and an outlet pipe connected to the inlet and the outlet.

[0013] As an optional implementation, the fixing part further includes a stop ring formed on the inner edge of the mounting hole; the outer shell part further includes a body and a contact ring, a fluid flow cavity is formed inside the body, and the contact ring is formed on the outer periphery of the body; when the cooling component is installed on the mounting part, the contact ring abuts against the stop ring.

[0014] As an optional implementation, the contact ring has a guide hole; the electronic device also includes: a guide rod, one end of which is provided with a rod cap, the other end of which passes through the guide hole and is fixedly connected to the stop ring; and a fastener, which is sleeved on the guide rod and located between the contact ring and the rod cap, for applying a force close to the stop ring to the contact ring.

[0015] As an alternative implementation, the contact ring defines a clearance space communicating with the guide hole; the guide rod has a protrusion within the clearance space; the electronic device further includes a stop ring disposed in the clearance space, the stop ring being used to abut against the protrusion to prevent the guide rod from disengaging from the contact ring.

[0016] As an alternative implementation, the electronic device is a server; and / or, the first element is a central processing unit or a graphics processing unit, and the second element is a power supply chip for supplying power to the central processing unit or the graphics processing unit.

[0017] The electronic device provided in this application embodiment has a mounting component fixed to a circuit board, with the first component positioned within a mounting hole. A cooling component is connected to a second component via a thermal pad, and a cooling element is mounted on the mounting component and located at the mounting hole, allowing for thermal connection between the cooling component and the first component. When the cooling component is connected to the second component via the thermal pad, if the thermal pad deforms and exerts an upward rebound force on the cooling component, the connection between the cooling component and the fixing component is not significantly affected. Furthermore, this rebound force is overcome by the mounting force of the mounting component. Therefore, it does not significantly affect the mounting component, and consequently, it does not cause displacement of the cooling element mounted on the mounting component. This improves the reliability of the connection between the cooling element and the first component, as well as between the cooling element and the mounting component, thereby improving the reliability of the cooling element's heat dissipation for both the first and second components. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a heat dissipation structure for a circuit board in the prior art;

[0020] Figure 2 This is a schematic diagram of the heat dissipation structure of a circuit board in an electronic device according to an embodiment of this application;

[0021] Figure 3 This is an exploded view of the heat dissipation structure of a circuit board of an electronic device according to an embodiment of this application;

[0022] Figure 4 A cross-section of the heat dissipation structure of the circuit board of an electronic device according to an embodiment of this application. Figure 1 ;

[0023] Figure 5 for Figure 4 Enlarged view of part A;

[0024] Figure 6 A cross-section of the heat dissipation structure of the circuit board of an electronic device according to an embodiment of this application. Figure 2 ;

[0025] Figure 7 for Figure 6Enlarged view of part B;

[0026] Figure 8 Cross-sectional view of the circuit board heat dissipation structure of the electronic device according to another embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100, circuit board; 110, first component; 120, second component; 130, heat conductive pad; 200, mounting member; 210, fixing portion; 211, mounting hole; 212, retaining ring; 220, heat conducting portion; 230, connecting portion; 300, cooling member; 310, cooling portion; 320, housing portion; 321, liquid flow chamber; 322, liquid inlet; 323, liquid outlet; 324, main body; 324a, upper shell; 324b, lower shell; 325, contact ring; 325a, guiding hole; 325b, avoidance space; 340, liquid inlet pipe; 350, liquid outlet pipe; 360, flow valve; 370, heat exchange fins; 400, support member; 410, opening; 510, guiding rod; 512, rod cap; 514, protruding portion; 520, fastener; 530, retaining ring. Detailed implementation manners

[0029] Referring to the background art part and Figure 1 , in the prior art, both the bracket 3 and the VR radiator 6, and the bracket 3 and the cold plate 5 are rigidly connected. The 4 compression springs need to simultaneously press the VR radiator 6 and the VR chip 2 tightly, and the cold plate 5 and the GPU / CPU chip pressing force is uneven, that is, it is possible that F2 < F1, so the left and right pressures on the CPU / GPU chip by the cooling surface are not equal, and the performance of the GPU / CPU chip 1 will be affected after long-term use; when F2 is close to F3 or less than F3, the pressure on the left end of the CPU / GPU chip by the cooling surface is 0, that is, the CPU / GPU chip is in poor contact with the cold plate 5, resulting in a high temperature alarm.

[0030] To overcome the deficiencies in the prior art, this application provides an electronic device in which a mounting component is fixed to a circuit board, a first component is positioned within a mounting hole, and a cooling component is connected to a second component via a thermal pad. A cooling component is mounted on the mounting component and located at the mounting hole, enabling thermal connection between the cooling component and the first component. When the cooling component is connected to the second component via the thermal pad, if the thermal pad deforms and exerts an upward rebound force on the cooling component, the connection between the cooling component and the fixing component is not significantly affected. Furthermore, this rebound force is overcome by the mounting force of the mounting component. Therefore, it does not significantly affect the mounting component, and consequently, it does not cause displacement of the cooling component mounted on the mounting component. This improves the reliability of the connection between the cooling component and the first component, as well as between the cooling component and the mounting component, thereby improving the reliability of heat dissipation from the cooling component to the first and second components.

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0032] See Figures 2 to 7 This application provides an electronic device that may include a circuit board 100, a first element 110 disposed on the circuit board 100, and a second element 120.

[0033] The circuit board 100 provides mechanical support and fixation for the first element 110 and the second element 120, and also enables electrical connection and signal transmission between the first element 110 and the second element 120, so that each of the first element 110 and the second element 120 can perform its respective function. In some specific embodiments, the circuit board 100 may also be a single-sided board, that is, the first element 110 and the second element 120 are both arranged on one side of the circuit board 100.

[0034] The first element 110 and the second element 120 are both disposed on the circuit board 100. Since the first element 110 and the second element 120 have their own resistance, they will generate heat during operation. In addition, as the power of the components increases, the first element 110 and the second element 120 will generate more heat during operation. Therefore, the heat dissipation problem of the first element 110 and the second element 120 needs to be given special attention in the design.

[0035] In some embodiments, the electronic device may further include a mounting member 200 and a cooling member 300. The mounting member 200 has a fixing portion 210 and a cooling-conducting portion 220 connected to the fixing portion 210. The fixing portion 210 has a mounting hole 211. The mounting member 200 is fixed to the circuit board 100, with a first component 110 positioned within the mounting hole 211, and the cooling-conducting portion 220 connected to a second component 120 via a thermal pad 130. The cooling member 300 has a cooling portion 310, which is mounted to the mounting member 200 and located at the mounting hole 211, so that the cooling portion 310 is thermally connected to the first component 110.

[0036] In this embodiment, the cooling element 300 can provide cooling to the first element 110 and the second element 120, that is, it can absorb the heat on the first element 110 and the second element 120 to dissipate heat from the first element 110 and the second element 120.

[0037] When the mounting component 200 is mounted on the circuit board 100, the first component 110 is located in the mounting hole 211 of the fixing part 210. The cooling component 300 is mounted on the mounting component 200 and is located at the mounting hole 211. In this way, the cooling part 310 of the cooling component 300 can be thermally connected to the first component 110 in the mounting hole 211. The heat on the first component 110 can be transferred to the cooling part 310 of the cooling component 300 to dissipate heat from the first component 110.

[0038] The aforementioned thermally conductive connection can be understood as enabling the heat of the first element 110 to be transferred to the cooling section 310. This thermally conductive connection can be either a direct contact between the first element 110 and the cooling section 310, i.e., heat is transferred through thermal conduction, or a separation between the first element 110 and the cooling section 310, i.e., heat is transferred through thermal radiation or thermal convection.

[0039] Since the cooling component 300 is mounted on the mounting component 200, and the heat conduction part 220 is connected to the second component 120 through the heat conduction pad 130, the heat on the second component 120 can be transferred to the cooling component 300 through the heat conduction part 220 and the fixing part 210. In this way, the cooling component 300 can be used to dissipate heat for both the first component 110 and the second component 120 at the same time.

[0040] The thermal pad 130 can be made of a thermally conductive material with good thermal conductivity. It has a certain degree of flexibility and elasticity. The cooling part 220 is connected to the second element 120 through the thermal pad 130. The thermal pad 130 can not only conduct heat, but also protect the second element 120, preventing long-term direct compression of the second element 120 and preventing damage to the second element 120.

[0041] In this embodiment, since both the fixing part 210 and the cooling part 220 are part of the mounting member 200, they are integrally connected. When the cooling part 220 is connected to the second element 120 through the thermal pad 130, if the thermal pad 130 exerts an upward rebound force on the cooling part 220 due to deformation, the connection between the cooling part 220 and the fixing part 210 will not be significantly affected. Moreover, the rebound force is small and can be overcome by the mounting force of the mounting member 200 (such as the mounting force applied by the screw). Therefore, after the mounting member 200 is fixed to the circuit board 100, the upward rebound force exerted by the thermal pad 130 on the cooling part 220 will not have a significant impact on the mounting member 200, and consequently, it will not cause displacement of the cooling element 300 mounted on the mounting member 200. This improves the reliability of the connection between the cooling element 300 and the first element 110 and the cooling element 300 and the mounting member 200, thereby improving the reliability of the cooling element 300 in dissipating heat from the first element 110 and the second element 120.

[0042] Furthermore, in the existing technology, in order to maintain stable contact between the cold plate 5 and the CPU / GPU chip 1, and at the same time ensure that the thermal pad 130 has a certain amount of compression (so that the VR heat sink 6 is fully connected to the VR chip 2), the cold plate 5 and the VR heat sink 6 need to maintain a high processing precision during processing, which results in a high processing cost.

[0043] In this embodiment, since the cooling part 220 and the fixing part 210 are designed as the same part, it is only necessary to ensure general machining accuracy to satisfy that the cooling part 310 is in contact with the first element 110 while the cooling part 220 is in contact with the second element 120.

[0044] Furthermore, designing the cooling section 220 and the fixing section 210 as the same part can reduce the number of parts and lower costs.

[0045] See Figures 2 to 7 In some embodiments, the mounting member 200 may further include a connecting portion 230, which is formed between the fixing portion 210 and the cooling portion 220 to integrally connect the fixing portion 210 and the cooling portion 220.

[0046] In this embodiment, since the first element 110 and the second element 120 are separated, the fixing part 210 is entirely disposed at the first element 110, the cooling part 220 is entirely disposed at the second element 120, and the connecting part 230 connects the fixing part 210 and the cooling part 220, making them an integral structure. When the mounting member 200 is fixed on the circuit board 100, it counteracts the rebound force of the thermal pad 130 on the cooling part 220, improving the overall stability of the mounting member 200.

[0047] In some embodiments, the mounting component 200 is made of a metallic material, such as copper, aluminum, or other metals and alloys.

[0048] On the one hand, since the cooling component 300 is mounted on the mounting component 200, and the heat-conducting part 220 of the mounting component 200 is connected to the second element 120 through the thermal pad 130, the heat on the second element 120 needs to be transferred to the cooling component 300 through the mounting component 200 in order to dissipate heat from the second element 120. The mounting component 200 is made of metal, which typically has good thermal conductivity, thus improving the efficiency of heat transfer from the second element 120 to the cooling component 300.

[0049] On the other hand, metal materials have strong mechanical strength, so when the mounting component 200 is installed on the circuit board 100, it is not easy to deform, which improves the fixing reliability of the mounting component 200, so as to offset the influence of the rebound force of the thermal pad 130, and further improve the reliability of the cooling component 300 in dissipating heat from the first element 110 and the second element 120.

[0050] See Figures 2 to 7 In some embodiments, the electronic device may further include a support member 400, which is disposed on the circuit board 100 and located between the circuit board 100 and the mounting member 200, for supporting the mounting member 200.

[0051] In this embodiment, the support member 400 can be fixed to the circuit board 100 with screws. An opening 410 is formed in the center of the support member 400. When the support member 400 is fixed to the circuit board 100, the first element 110 is located inside the opening 410. The fixing part 210 of the mounting member 200 is disposed above the support member 400 and is fixed to the support member 400 with screws. When the fixing part 210 is fixed to the support member 400, the mounting hole 211 on the fixing part 210 communicates with the opening 410 of the support member 400, so that the first element 110 is also located inside the mounting hole 211. The cooling member 300 is installed at the mounting hole 211 of the mounting member 200, so that its cooling part 310 sinks down to the first element 110 and is thermally connected to the first element 110, thereby achieving heat dissipation for the first element 110.

[0052] See Figure 8 In some embodiments, the mounting component 200 can also be directly fixed to the circuit board 100. Specifically, the fixing part 210 of the mounting component 200 is fixed to the circuit board 100 by fasteners 520. When the cooling part 220 of the mounting component 200 abuts against the thermal pad 130 on the second element 120, a thermally conductive connection is achieved between the second element 120 and the cooling part 220.

[0053] In some embodiments, the cooling element 300 may include a housing portion 320. A liquid flow chamber 321 is defined within the housing portion 320, and an inlet 322 and an outlet 323, respectively communicating with the liquid flow chamber 321, are provided on the housing portion 320. The cooling element 300 is configured to facilitate the formation of a heat exchange medium that enters the liquid flow chamber 321 through the inlet 322 and exits the liquid flow chamber 321 through the outlet 323. A cooling section 310 is disposed in the housing portion 320.

[0054] In this embodiment, the outer shell 320 is also made of a metal material with good thermal conductivity. The interior of the outer shell 320 defines a liquid flow cavity 321. A heat exchange medium with a lower temperature can enter the liquid flow cavity 321 through the liquid inlet 322. When the heat exchange medium flows in the liquid flow cavity 321, it can absorb heat from the outer shell 320 through convection heat transfer.

[0055] Since the cooling section 310 is disposed on the outer casing 320 and is thermally connected to the first element 110, the heat absorbed by the cooling section 310 on the first element 110 can be transferred to the outer casing 320, where the heat is absorbed by the heat exchange medium.

[0056] After absorbing heat, the heat exchange medium is discharged from the liquid outlet 323 into the liquid flow chamber 321 to be cooled again at the cold source, forming a cycle.

[0057] Furthermore, the cooling component 300 may also include a cold source (not shown in the figure), an inlet pipe 340, and an outlet pipe 350. The cold source provides cooling to the heat exchange medium and has an inlet and an outlet. The inlet pipe 340 is connected to the outlet of the cold source and the inlet 322 of the outer casing 320 to transport the cooler heat exchange medium to the liquid flow chamber 321. The outlet pipe 350 is connected to the inlet of the cold source and the outlet 323 of the outer casing 320 to transport the heat exchange medium that has absorbed heat to the cold source for recooling.

[0058] Alternatively, the form of the cold source can be various. For example, the cold source can be a forced cooling device, or it can be a semiconductor cooling element.

[0059] Optionally, the cooling element 300 may also include a flow valve 360, which may be disposed on the inlet pipe 340 and / or the outlet pipe 350, for controlling the flow rate of the heat exchange medium in order to adjust the heat exchange efficiency.

[0060] Optionally, the liquid flow chamber 321 is divided into an interconnected inlet chamber and an outlet chamber, with the inlet chamber connected to the inlet port 322 and the outlet chamber connected to the outlet port 323. In this way, the heat exchange medium entering the liquid flow chamber 321 first flows in the inlet chamber, then flows in the outlet chamber, and finally exits through the outlet port 323. This division allows the heat exchange medium to flow orderly within the liquid flow chamber 321 and extends the flow path, thereby improving the heat exchange efficiency between the heat exchange medium and the shell.

[0061] Optionally, multiple heat exchange fins 370 may be provided in the liquid flow cavity 321 to increase the heat exchange area with the heat exchange medium and further improve the heat exchange efficiency between the heat exchange medium and the outer shell 320.

[0062] In some embodiments, the fixing portion 210 may further include a stop ring 212, which is formed on the inner edge of the mounting hole 211. The housing portion 320 may further include a body 324 and a contact ring 325, wherein a fluid flow cavity 321 is formed in the body 324, and the contact ring 325 is formed on the outer periphery of the body 324. When the cooling member 300 is mounted on the mounting member 200, the contact ring 325 abuts against the stop ring 212.

[0063] Optionally, the main body 324 may also include an upper shell 324a and a lower shell 324b, which are engaged to define the liquid outlet cavity 321. This not only facilitates the manufacture of the outer shell 320, but also makes it easier to disassemble the outer shell 320 for maintenance.

[0064] Optionally, the contact ring 325 may be disposed on the outer periphery of the upper housing 324a.

[0065] In this embodiment, since the stop ring 212 is formed on the inner edge of the mounting hole 211, the cooling member 300 is mounted on the mounting member 200 and located at the mounting hole 211, and the contact ring 325 on the outer shell 320 is formed on the outer periphery of the main body 324, the contact ring 325 can abut against the stop ring 212 when the cooling member 300 is mounted on the mounting member 200.

[0066] When the contact ring 325 abuts against the stop ring 212, on the one hand, the stop ring 212 supports the contact ring 325, that is, the mounting member 200 supports the cooling member 300, so that the cooling member 300 can be stably thermally connected to the first element 110; on the other hand, heat transfer can be achieved when the contact ring 325 contacts the stop ring 212, so that the heat on the second element 120 can be transferred to the cooling member 300 through the mounting member 200, thereby achieving heat dissipation of the second element 120.

[0067] In some embodiments, the contact ring 325 has a guide hole 325a. The electronic device may also include a guide rod 510 and a fastener 520. A rod cap 512 is attached to one end of the guide rod 510, and the end of the guide rod 510 away from the rod cap 512 passes through the guide hole 325a and is fixedly connected to the stop ring 212. The fastener 520 is sleeved on the guide rod 510 and located between the contact ring 325 and the rod cap 512, for applying a force to the contact ring 325 close to the stop ring 212.

[0068] In this embodiment, the ends of the guide rod 510 and the rod cap 512 opposite each other can pass through the guide hole 325a from top to bottom, reaching the stop ring 212, and are fixedly connected to the stop ring 212 (e.g., threaded connection).

[0069] The fastener 520 can be a compression spring. The fastener 520 is sleeved on the guide rod 510 and located between the contact ring 325 and the rod cap 512. When the guide rod 510 is screwed down and fixedly connected to the stop ring 212, the fastener 520 can be compressed to apply a force (i.e., downward pressure) to the contact ring 325 towards the stop ring 212, so that the cooling part 310 of the cooling component 300 can be pressed against the first element 110 to achieve a thermally conductive connection.

[0070] In other words, in this embodiment, a compression spring is used to provide a force to the cooling component 300 to press the cooling part 310 against the first element 110. This force provided by the compression spring can ensure that the cooling part 310 and the first element 110 are in close contact, and the force is relatively gentle, so as not to over-compress the first element 110 and improve the safety of the first element 110.

[0071] Furthermore, a clearance space 325b communicating with the guide hole 325a is defined within the contact ring 325. The guide rod 510 has a protrusion 514 located within the clearance space 325b. The electronic device may also include a stop ring 530 disposed in the clearance space 325b, the stop ring 530 being used to abut against the protrusion 514 to prevent the guide rod 510 from disengaging from the contact ring 325.

[0072] In some embodiments, the electronic device may be a server, the first element 110 is a central processing unit (CPU) or a graphics processing unit (GPU), and the second element 120 is a power supply chip used to supply power to the central processing unit or the graphics processing unit.

[0073] In some embodiments, the electronic device may also be a mobile phone, tablet computer, computer, television, wearable device, etc.

[0074] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0075] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0076] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0077] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, comprising a circuit board, a first element and a second element disposed on the circuit board; characterized in that, Also includes: The mounting component has a fixing part and a cooling part connected to the fixing part. The fixing part has a mounting hole. The mounting component is fixed to the circuit board, so that the first element is placed in the mounting hole, and the cooling part is connected to the second element through a thermal pad. A cooling component having a cooling section is mounted on the mounting component and located at the mounting hole so that the cooling section is thermally connected to the first element.

2. The electronic device according to claim 1, characterized in that, The mounting component further includes a connecting portion formed between the fixing portion and the cooling portion to integrally connect the fixing portion and the cooling portion.

3. The electronic device according to claim 1, characterized in that, The mounting component is made of metal.

4. The electronic device according to claim 1, characterized in that, Also includes: A support member is disposed on the circuit board and located between the circuit board and the mounting member, for supporting the mounting member.

5. The electronic device according to any one of claims 1 to 4, characterized in that, The cooling component includes: The outer casing has a liquid flow cavity defined inside it, and the outer casing is provided with an inlet and an outlet that are respectively connected to the liquid flow cavity; The cooling element is configured to facilitate the formation of a heat exchange medium that enters the liquid flow chamber through the liquid inlet and exits the liquid flow chamber through the liquid outlet. The cooling unit is connected to the outer casing.

6. The electronic device according to claim 5, characterized in that, The cooling component also includes: A cold source is used to provide cooling for the heat exchange medium and has an inlet and an outlet. An inlet pipe, wherein the inlet pipe is connected to the outlet and the inlet; A liquid outlet pipe is connected to the inlet and the outlet.

7. The electronic device according to claim 5, characterized in that, The fixing part also includes a stop ring, which is formed on the inner edge of the mounting hole; The outer casing also includes a main body and a contact ring, wherein the fluid flow cavity is formed within the main body, and the contact ring is formed on the outer periphery of the main body; When the cooling component is installed on the mounting component, the contact ring abuts against the stop ring.

8. The electronic device according to claim 7, characterized in that, The contact ring has a guide hole; The electronic device also includes: A guide rod, one end of which is provided with a rod cap, and the end of the guide rod away from the rod cap passes through the guide hole and is fixedly connected to the stop ring; A fastener, which is sleeved on the guide rod and located between the contact ring and the rod cap, is used to apply a force to the contact ring close to the stop ring.

9. The electronic device according to claim 8, characterized in that, The contact ring defines a clearance space that communicates with the guide hole; The guide rod has a protrusion located within the clearance space; The electronic device also includes: A stop ring is provided in the clearance space and is used to abut against the protrusion to prevent the guide rod from disengaging from the contact ring.

10. The electronic device according to any one of claims 1 to 4, characterized in that, The electronic device is a server; and / or, The first component is a central processing unit or a graphics processing unit, and the second component is a power supply chip, which is used to supply power to the central processing unit or the graphics processing unit.

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