Round carrying disc structure

Abstract

The utility model relates to the technical field of semiconductor cleaning equipment, and discloses a circular carrying disc structure, which comprises a semiconductor carrying disc, the bottom of the semiconductor carrying disc comprises a carrying disc base, the top of the carrying disc base is provided with a circular carrying disc, and the inner side of the circular carrying disc is provided with a semiconductor placing inner disc. Semiconductor products are placed in an inner cavity of the semiconductor placing inner disc. According to the circular carrying disc structure, the carrying disc base is used for controlling the circular carrying disc to rotate, angle swing of the carrying disc in the rotating process is improved through the gap between the base and the driving mechanism, semiconductor products in the carrying disc can be conveniently spin-dried and cleaned, and a mechanical arm can conveniently conduct clamping operation treatment; through the connection mode between the inner disc and the carrying disc, separation between the carrying disc and the inner disc is facilitated, semiconductor products can be conveniently placed, and the products can be conveniently operated in the circular carrying disc, so that the semiconductor products can be conveniently cleaned, and the circular carrying disc is more convenient for a cleaning machine to use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning equipment technology, specifically a circular carrier disk structure. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors. From both a technological and economic development perspective, the importance of semiconductors is immense. Most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in their applications.

[0003] During the manufacturing process of semiconductor products, effective cleaning is performed. However, if the cleaned semiconductor products cannot be quickly dehydrated, water stains will appear on the semiconductor products. Inadequate cleaning can also easily cause quality problems in semiconductor products. Therefore, this utility model provides a circular carrier disk structure for semiconductor cleaning equipment. Utility Model Content

[0004] In view of the shortcomings of existing circular carrier structures, this utility model provides a circular carrier structure that has the advantages of solving the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a circular carrier structure, including a semiconductor carrier, the bottom of which includes a carrier base, the top of which is mounted with a circular carrier, the inner side of which is mounted with a semiconductor placement inner plate, and the inner cavity of which holds semiconductor products. Both the circular carrier and the semiconductor placement inner plate are circular structures, and the semiconductor placement inner plate can be rectangular. A pressing and fixing plate is mounted on the surface of the semiconductor placement inner plate, and the semiconductor placement inner plate uses the pressing and fixing plate to press and fix the semiconductor products. The circular carrier and the semiconductor placement inner plate are fixed by a connection. The bottom of the carrier base is provided with a base, which is fixedly installed with a semiconductor cleaning machine. A driving mechanism is mounted on the top of the base, and a connecting seat is provided on the top of the driving mechanism. The top of the connecting seat is fixedly installed with the bottom of the circular carrier.

[0006] Preferably, the top of the inner cavity of the circular carrier disk is provided with a connection port, and the bottom of the semiconductor placement inner disk is provided with a connection connector. The connection port is connected to the connection connector, and there are four connection ports and four connection connectors, which are arranged symmetrically to maintain stable connection.

[0007] Preferably, there is a gap between the base and the drive mechanism, the drive mechanism can rotate in both directions, and the drive mechanism can swing above the base.

[0008] Preferably, the outer side of the drive mechanism is provided with a buffer mechanism, and the buffer mechanism is composed of a rod structure and a buffer component.

[0009] Preferably, the top of the circular carrier plate and the connecting seat are fixedly installed, and can be connected as an integral part or as a separate part.

[0010] Preferably, the inner cavity of the semiconductor placement inner disk is provided with a card holder, the pressing edge fixing plate is adapted to the card holder, the pressing edge fixing plate is housed in the card holder, and a hydraulic drive device is installed inside the semiconductor placement inner disk, the drive shaft of the hydraulic drive device is connected to the bottom of the pressing edge fixing plate.

[0011] Compared with existing circular carrier disk structures, this utility model has the following advantages:

[0012] 1. This circular carrier structure controls the rotation of the circular carrier through the carrier base. The gap between the base and the drive mechanism increases the oscillation angle during the rotation of the carrier, which facilitates the drying and cleaning of semiconductor products inside the carrier and makes it easier for the robot to perform gripping operations.

[0013] 2. This circular carrier structure, through the connection method between the inner tray and the carrier tray, facilitates the separation of the carrier tray and the inner tray, making it easy to place semiconductor products and operate the products inside the circular carrier tray. This facilitates the cleaning and processing of semiconductor products. Furthermore, the inner tray can be arranged in a rectangular or other shapes, making it easy to replace it according to different semiconductor products, thus making the circular carrier tray more convenient for use in cleaning machines. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the main structure of the present utility model;

[0015] Figure 2 This is a schematic diagram showing the disassembled structure of the main body of this utility model;

[0016] Figure 3 This is a schematic diagram showing the disassembled structure of the carrier disk of this utility model;

[0017] Figure 4 This is a schematic diagram of an embodiment of the inner disc structure of this utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the fixed equipment of this utility model.

[0019] In the figure: 1. Semiconductor carrier; 2. Circular carrier; 3. Semiconductor placement inner tray; 4. Semiconductor product; 5. Carrier base; 6. Base; 7. Drive mechanism; 8. Connecting seat; 9. Connecting port; 10. Connecting joint; 11. Edge clamping plate; 12. Hydraulic drive equipment. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-3A circular carrier structure includes a semiconductor carrier 1, a carrier base 5 at the bottom of the semiconductor carrier 1, a circular carrier 2 mounted on the top of the carrier base 5, and a semiconductor placement inner tray 3 mounted inside the circular carrier 2. A connection port 9 is provided at the top of the inner cavity of the circular carrier 2, and a connection connector 10 is provided at the bottom of the semiconductor placement inner tray 3. The connection port 9 and the connection connector 10 are connected, and there are four connection ports 9 and four connection connectors 10, arranged symmetrically to maintain a stable connection. This connection method between the inner tray and the carrier facilitates the separation of the carrier and the inner tray, facilitates the placement of semiconductor products 4, facilitates the operation of the products inside the circular carrier 2, and facilitates the cleaning and processing of the semiconductor products 4. The inner tray 2 is more convenient for use with the cleaning machine. The inner cavity of the semiconductor placement tray 3 holds the semiconductor product 4. The inner cavity of the semiconductor placement tray 3 is equipped with a retainer. The edge-fixing plate 11 is adapted to the retainer and is stored in the retainer. The inner tray 3 is equipped with a hydraulic drive device 12. The drive shaft of the hydraulic drive device 12 is connected to the bottom of the edge-fixing plate 11. Both the circular carrier tray 2 and the semiconductor placement tray 3 are circular structures, and the semiconductor placement tray 3 can be rectangular. The surface of the semiconductor placement tray 3 is equipped with the edge-fixing plate 11. The semiconductor placement tray 3 uses the edge-fixing plate 11 to press and fix the semiconductor product 4. The edge-fixing plate 11 can be set for various corners of the board-level package. To ensure it doesn't warp, the hydraulic drive device 12 effectively controls the lifting and lowering of the fixing plate, facilitating storage and concealment. The circular carrier tray 2 and the semiconductor placement inner tray 3 are fixed together via a connection. A base 6 is located at the bottom of the carrier tray base 5, and the base 6 is fixedly installed with the semiconductor cleaning machine. A drive mechanism 7 is installed on the top of the base 6. A gap exists between the base 6 and the drive mechanism 7, allowing the drive mechanism 7 to rotate bidirectionally and swing above the base 6. The circular carrier tray 2 is rotated by controlling the carrier tray base 5. The gap between the base 6 and the drive mechanism 7 increases the angle of the carrier tray's rotation, facilitating the drying and cleaning of the semiconductor products 4 inside the tray, and also facilitating gripping by the robotic arm. The operation and processing, and the structural design of the gaps, allow the carrier tray to be tilted in all directions, so that the four sides of the chip gaps can be precisely aligned with the nozzle. The outer side of the drive mechanism 7 is equipped with a buffer mechanism, which is composed of a rod structure and a buffer component. The design of the buffer mechanism facilitates the stability of the overall equipment during the swing of the carrier tray and improves the long-term use effect of the device. The top of the drive mechanism 7 is equipped with a connecting seat 8, and the top of the connecting seat 8 is fixedly installed with the bottom of the circular carrier tray 2. The entire circular carrier tray 2 can rotate, so that the nozzle can clean the four sides of the semiconductor product 4 chip on the carrier tray. That is, the four sides of the chip are cleaned. The top of the circular carrier tray 2 and the connecting seat 8 are fixedly installed and can be connected as an integral part or separately.

[0022] Working principle: When using this circular carrier, the semiconductor placement inner tray 3 is removed, and the semiconductor product 4 is placed into the inner tray and fixed. The inner tray is then connected to the carrier. The carrier rotates based on the drive mechanism 7, and the gap can increase the swing amplitude of the carrier, thereby facilitating the cleaning and drying of the product. After the operation is completed, the inner tray is disassembled and the processed semiconductor product 4 is taken out to complete the processing operation.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circular carrier disk structure, comprising a semiconductor carrier disk (1), characterized in that: The bottom of the semiconductor carrier (1) includes a carrier base (5), and a circular carrier (2) is mounted on the top of the carrier base (5). A semiconductor placement inner disk (3) is mounted on the inner side of the circular carrier (2). A semiconductor product (4) is placed in the inner cavity of the semiconductor placement inner disk (3). Both the circular carrier (2) and the semiconductor placement inner disk (3) are circular structures, and the semiconductor placement inner disk (3) can be rectangular. A pressing and fixing plate (11) is mounted on the surface of the semiconductor placement inner disk (3). The conductor placement inner plate (3) presses and fixes the semiconductor product (4) by the edge fixing plate (11). The circular carrier (2) and the semiconductor placement inner plate (3) are fixed by connection. The bottom of the carrier base (5) is provided with a base (6). The base (6) is fixedly installed with the semiconductor cleaning machine. The top of the base (6) is provided with a drive mechanism (7). The top of the drive mechanism (7) is provided with a connecting seat (8). The top of the connecting seat (8) is fixedly installed with the bottom of the circular carrier (2).

2. The circular carrier structure according to claim 1, characterized in that: The top of the inner cavity of the circular carrier disk (2) is provided with a connection port (9), and the bottom of the semiconductor placement inner disk (3) is provided with a connection connector (10). The connection port (9) is connected to the connection connector (10), and the number of the connection port (9) and the connection connector (10) is four, and they are arranged in a symmetrical manner to maintain a stable connection.

3. The circular carrier disk structure according to claim 1, characterized in that: There is a gap between the base (6) and the drive mechanism (7), the drive mechanism (7) can rotate in both directions, and the drive mechanism (7) can swing above the base (6).

4. The circular carrier disk structure according to claim 1, characterized in that: The outer side of the drive mechanism (7) is provided with a buffer mechanism, and the buffer mechanism is composed of a rod structure and a buffer component.

5. A circular carrier disk structure according to claim 1, characterized in that: The top of the circular carrier (2) and the connecting seat (8) are fixedly installed and can be connected in an integrated manner or in a separate manner.

6. The circular carrier disk structure according to claim 1, characterized in that: The inner cavity of the semiconductor placement inner plate (3) is provided with a card seat, the pressing edge fixing plate (11) is adapted to the card seat, the pressing edge fixing plate (11) is housed in the card seat, and a hydraulic drive device (12) is installed inside the semiconductor placement inner plate (3), the drive shaft of the hydraulic drive device (12) is connected to the bottom of the pressing edge fixing plate (11).

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