Atomization assembly and electronic atomizer

Abstract

The utility model discloses an atomization assembly and an electronic atomizer, and the atomization assembly comprises a structure base body which is provided with a channel for accommodating paste; the porous base body is arranged on the structural base body and located at one end of the channel, the porous base body is configured to be capable of preventing paste from passing through and allowing liquid to pass through, and the end, away from the channel, of the porous base body is provided with an atomizing face for atomizing the liquid; and the thermal conductivity of the structural matrix is greater than that of the porous matrix. According to the atomization assembly and the electronic atomizer, the paste can be rapidly melted, and the temperature of the atomization surface is prevented from being too high.

Description

Technical Field

[0001] This utility model relates to electronic atomizers, and more particularly to an atomizing component and an electronic atomizer. Background Technology

[0002] In related technologies, atomizers for paste-like substances are devices that convert paste-like materials into inhalable aerosols through contact conduction heating, and are widely used in e-cigarettes, medical drug delivery, and other fields. Their core technology is based on the principle of controllable heating, using metal heating wires, ceramic or thin-film heating elements to convert electrical energy into heat energy, causing the paste to undergo a physical phase change within a specific temperature range (typically 150–350℃), forming micron-sized atomized particles. During atomizer operation, if the paste cannot quickly melt into a liquid and be transferred to the atomizing surface, severe dry burning will occur, resulting in a burnt core. Excessively high temperatures on the atomizing surface can cause the atomized liquid to decompose at high temperatures, generating harmful substances. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an atomizing component that can quickly melt paste to avoid excessively high temperatures on the atomizing surface.

[0004] This invention also proposes an electronic atomizer having the above-mentioned atomizing components.

[0005] The atomizing component according to a first aspect embodiment of the present invention includes:

[0006] The structural matrix has channels for containing the paste;

[0007] A porous substrate is disposed in the structural substrate and located at one end of the channel. The porous substrate is configured to impede the passage of paste and allow the passage of liquid. The end of the porous substrate opposite to the channel has an atomizing surface for liquid atomization. The thermal conductivity of the structural substrate is greater than that of the porous substrate.

[0008] The atomizing component according to the embodiments of the present utility model has at least the following beneficial effects:

[0009] The paste is placed inside the channel and adheres to the inner wall of the channel. In the working state, heat is transferred to the structural matrix and the porous matrix. Since the thermal conductivity of the structural matrix is ​​greater than that of the porous matrix, the heat can be transferred to the entire structural matrix at a faster speed. This allows the paste that is adhered to the channel wall of the structural matrix to be melted quickly and slide towards the end with the porous matrix, thereby avoiding dry burning and core scorching.

[0010] According to some embodiments of the present invention, the porous substrate includes a substrate sidewall and a substrate bottomwall. The substrate sidewall is connected to the substrate bottomwall and protrudes from the substrate bottomwall along the channel extension direction to form a groove with the substrate bottomwall. The atomizing surface is the surface of the substrate bottomwall that is away from the substrate sidewall.

[0011] According to some embodiments of the present invention, the inner wall of one end of the channel is radially recessed to form an installation groove, and the porous substrate is disposed in the installation groove and abuts against the bottom surface of the installation groove.

[0012] According to some embodiments of the present invention, the thermal conductivity of the structural matrix is ​​greater than 30 W / (m·K), and the thermal conductivity of the porous matrix is ​​less than 1 W / (m·K).

[0013] According to some embodiments of the present invention, the porous matrix is ​​a porous ceramic, the structural matrix is ​​a structural ceramic, and the porous matrix and the structural matrix are integrally sintered together.

[0014] or,

[0015] The porous substrate is porous glass, and the structural substrate is structural ceramic.

[0016] According to some embodiments of the present invention, the surface of the porous substrate facing the channel includes a first central region and a first peripheral region surrounding the first central region, wherein the ratio of the radial dimension of the first central region to the radial dimension of the first peripheral region is greater than 0.5, and wherein the atomizing component includes a first heating element disposed in the first peripheral region.

[0017] According to some embodiments of the present invention, the atomizing surface includes a second central region and a second peripheral region, wherein the ratio of the radial dimension of the second central region to the radial dimension of the second peripheral region is greater than 0.5;

[0018] The atomizing component includes a second heating element, which is disposed in the second peripheral region.

[0019] According to some embodiments of the present invention, the second heating element includes two sets of heating wires, which are symmetrically arranged on opposite sides of the atomizing surface.

[0020] According to some embodiments of the present invention, along the channel extension direction, the structural substrate includes a first segment and a second segment connected to each other, the porous substrate is disposed in the second segment, and the outer diameter of the second segment is larger than the outer diameter of the first segment.

[0021] An electronic atomizer according to a second aspect of the present invention includes the atomizing components described in the above embodiments.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0024] Figure 1 This is a schematic diagram of the atomizing component according to an embodiment of the present invention;

[0025] Figure 2 This is a top view of the atomizing component according to an embodiment of the present utility model;

[0026] Figure 3 for Figure 2 AA section view;

[0027] Figure 4 This is a rear view schematic diagram of the first heating element of the atomizing component according to an embodiment of the present utility model;

[0028] Figure 5 This is a top view of the first heating element of the atomizing component according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the first embodiment of the second heating element of the atomizing component according to an embodiment of the present utility model;

[0030] Figure 7 This is a schematic diagram of a second embodiment of the second heating element of the atomizing component according to an embodiment of the present utility model;

[0031] Figure 8 This is a schematic diagram of a third embodiment of the second heating element of the atomizing component according to an embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of a fourth embodiment of the second heating element of the atomizing component according to an embodiment of the present invention.

[0033] Figure label:

[0034] 100. Structural base; 100a. Channel; 100b. Mounting slot; 110. First segment; 120. Second segment;

[0035] 200, porous substrate; 200a, atomizing surface; 210, substrate sidewall; 220, substrate bottomwall; 200b, groove;

[0036] 300. Second heating element; 310. Heating wire; 320. Second wire;

[0037] 400, First heating element; 410, Horizontal section; 411, Spiral section; 420, Vertical section; 430, Connecting section; 440, First conductor. Detailed Implementation

[0038] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0040] In the description of the embodiments of this application, the technical terms "first," "second," "third," etc., are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0043] In the description of the embodiments of this application, the technical terms "top", "bottom", "upper", "lower", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0044] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0045] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0046] Please refer to Figures 1-9 This application provides an atomizing component, including a structural substrate 100, a porous substrate 200, a first heating element 400, and a second heating element 300.

[0047] Please refer to Figures 1-3 The structural substrate 100 has a channel 100a for containing an ointment. A porous substrate 200 is disposed in the structural substrate 100 and located at one end of the channel 100a. The porous substrate 200 is configured to impede the passage of the ointment while allowing the passage of liquid. That is, the ointment is contained within the channel 100a, the porous substrate 200 prevents the ointment from moving out of the channel 100a, and after heating the ointment to turn it into a liquid, the liquid can flow out of the channel 100a from the porous substrate 200.

[0048] Please refer to Figure 3 The porous substrate 200 has an atomizing surface 200a at one end opposite to the channel 100a for liquid atomization. Liquid in the channel 100a can permeate through the porous substrate 200 to the atomizing surface 200a. In some specific embodiments, the atomizing component includes a second heating element 300 disposed on the atomizing surface 200a, thereby enabling the atomizing surface 200a to perform liquid atomization.

[0049] The thermal conductivity of the structural substrate 100 is greater than that of the porous substrate 200, so that heat can be transferred to the entire structural substrate 100 more quickly, ensuring that the paste does not stick to the structural substrate 100. In some specific embodiments, the thermal conductivity of the structural substrate 100 is greater than 30 W / (m·K), and the thermal conductivity of the porous substrate 200 is less than 1 W / (m·K).

[0050] For example, the structural substrate 100 is a cylindrical structure made of structural ceramic with high density and no pores or a porosity close to 0. The porous substrate 200 is made of porous ceramic or porous glass with a porosity of 45%-60% and a small pore size range of 20-25 micrometers. Along the extension direction of channel 100a, the height of the structural substrate 100 is 1.5-2.0 times the height of the porous substrate 200.

[0051] Understandably, the paste is placed inside the channel 100a and adheres to the inner wall of the channel 100a. In operation, heat is transferred to the structural substrate 100 and the porous substrate 200. Since the thermal conductivity of the structural substrate 100 is greater than that of the porous substrate 200, heat can be transferred to the entire structural substrate 100 at a faster speed. This allows the paste adhered to the wall of the channel 100a of the structural substrate 100 to be melted quickly and slide toward the end with the porous substrate 200, thereby avoiding dry burning and core scorching.

[0052] Please refer to Figure 3 In some embodiments, the porous substrate 200 includes a substrate sidewall 210 and a substrate bottom wall 220. The substrate sidewall 210 is annular, and the atomizing surface 200a is the surface of the substrate bottom wall 220 facing away from the substrate sidewall 210. The substrate sidewall 210 connects to the substrate bottom wall 220 and protrudes from the substrate bottom wall 220 along the extension direction of the channel 100a, thereby forming a groove 200b with the substrate bottom wall 220. It should be noted that the thickness of the substrate bottom wall 220 is 1.0mm-1.5mm. The strength of the porous substrate 200 is not high relative to the structural substrate 100. By setting it to have a structure where the substrate sidewall 210 and the substrate bottom wall 220 are connected, its thickness dimension can be increased, thereby improving its strength, and it can also form a groove 200b to collect liquid.

[0053] In some embodiments, the inner wall of one end of the channel 100a is radially recessed outward to form a mounting groove 100b. The porous substrate 200 is disposed within the mounting groove 100b and abuts against the bottom surface of the mounting groove 100b. In this way, the porous substrate 200 can be positioned by abutting against the bottom surface of the mounting groove 100b, thereby facilitating the installation of the porous substrate 200. Furthermore, the mounting groove 100b also prevents liquid from flowing directly out along the inner wall of the channel 100a, improving sealing performance.

[0054] The outer annular surface of the base sidewall 210 is axially aligned with the outer annular surface of the base bottom wall 220, and both abut against the inner sidewall of the mounting groove 100b.

[0055] Please refer to Figure 3Along the extension direction of channel 100a, a portion of the projection of the substrate sidewall 210 is distributed within channel 100a. Specifically, the portion of the substrate sidewall 210 near the outer annular surface abuts against the bottom wall of the mounting groove 100b, while the remaining portion is within channel 100a.

[0056] In some embodiments, the porous ceramic matrix 200 is integrally sintered with the structural ceramic matrix 100, thereby improving the bonding strength.

[0057] Please refer to Figure 4 In some embodiments, the atomizing assembly includes a first heating element 400 disposed on the surface of the porous substrate 200 facing the channel 100a, wherein the structural substrate 100 is connected to and transfers heat to the porous substrate 200. Thus, heat can be transferred from the porous substrate 200 to the structural substrate 100, thereby preheating both the porous substrate 200 and the structural substrate 100 to melt the paste.

[0058] The first heating element 400 is a heating wire, which can be made of 316L, 904L, or 406 stainless steel. The first heating element 400 has a certain TCR (temperature resistivity), enabling it to work in conjunction with the MCU chip to dynamically adjust the output voltage / power and match the ceramic resistance curve, thus maintaining a constant preheating temperature. In some specific embodiments, the resistivity of the first heating element 400 is in the range of 0-0.8 μΩ·m, it is compatible with operating voltages of 0.5-2V, and its power range is 0.4-7W.

[0059] The porous substrate 200, facing the channel 100a, includes a first central region and a first peripheral region surrounding the first central region. The ratio of the radial dimension of the first central region to the radial dimension of the first peripheral region is greater than 0.5, meaning that the radial dimension of the first central region exceeds one-third or more of the radial dimension of the surface of the porous substrate 200 facing the channel 100a. The atomizing component includes a first heating element 400, which is disposed in the first peripheral region to prevent the temperature of the first central region from becoming too high.

[0060] For the structure of the first heating element 400, please refer to... Figure 4 and Figure 5 In some embodiments, the first heating element 400 includes a horizontal segment 410 and a vertical segment 420. The horizontal segment 410 is attached to the bottom wall 220 of the substrate, and the vertical segment 420 is connected to the horizontal segment 410 and attached to the side wall 210 of the substrate. The horizontal segment 410 includes two spirally extending outwards helical portions 411, the starting ends of which are electrically connected via a first wire 440. There are multiple vertical segments 420, each connected to the horizontal segment 410. The end of the vertical segment 420 opposite to the horizontal segment 410 has a fork.

[0061] Please refer to the following: Figure 4 and Figure 5 The first heating element 400 also includes a connecting section 430, which is connected to the wire between the two spiral sections 411 and extends in a direction away from the vertical section 420. Correspondingly, a slot is formed in the porous substrate 200, and the first heating element 400 is positioned by inserting the connecting section 430 into the slot.

[0062] Please refer to Figure 3 , Figures 6-9 In some embodiments, the atomizing surface 200a includes a second central region and a second peripheral region, wherein the ratio of the radial dimension of the second central region to the radial dimension of the second peripheral region is greater than 0.5. The atomizing assembly includes a second heating element 300, which is disposed in the second peripheral region of the atomizing surface 200a to prevent the temperature of the second central region from becoming too high.

[0063] For example, the resistivity of the material of the second heating element 300 is in the range of 0-1.2 μΩ·m, the operating voltage is 2-8V, and the power range is 4-64W.

[0064] Please refer to Figures 6-9 In some embodiments, the second heating element 300 includes two sets of heating wires 310, which are symmetrically arranged on opposite sides of the atomizing surface 200a. The shape of the two sets of heating wires 310 is not limited; please refer to [reference needed]. Figure 6 In some specific embodiments, one set of heating wires 310 consists of two semicircles, and the other set also consists of two semicircles, thus forming approximately two rings. Please refer to [reference needed]. Figures 7-9 In other specific embodiments, the two sets of heating wires 310 are in a zigzag shape, and each set of heating wires 310 extends along a straight line or along an arc. The two sets of heating wires 310 are connected by a second wire 320.

[0065] Please refer to Figure 3. In some embodiments, along the extension direction of channel 100a, the structural substrate 100 includes a first segment 110 and a second segment 120 connected together. A porous substrate 200 is disposed in the second segment 120. The first segment 110 and the second segment 120 are configured for shaft support, and the outer diameter of the second segment 120 is larger than the outer diameter of the first segment 110. Thus, a step is formed at the connection between the first segment 110 and the second segment 120 to facilitate installation and disassembly, and also to reduce the volume of the structural ceramic, thereby reducing specific heat capacity, reducing heat loss, and saving materials.

[0066] The ratio of the length of the structural substrate 100 to the diameter of the channel 100a is 1:1 to 5:1.

[0067] This application also provides an electronic atomizer, including an atomizing component. The scope of the electronic atomizer includes, but is not limited to, electronic cigarettes.

[0068] The above embodiments are merely illustrative of the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and all should be covered within the scope of the specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of protection.

Claims

1. An atomizing component, characterized in that, include: The structural matrix has channels for containing the paste; A porous substrate is disposed in the structural substrate and located at one end of the channel. The porous substrate is configured to impede the passage of paste and allow the passage of liquid. The end of the porous substrate opposite to the channel has an atomizing surface for liquid atomization. The thermal conductivity of the structural substrate is greater than that of the porous substrate.

2. The atomizing component according to claim 1, characterized in that, The porous substrate includes a substrate sidewall and a substrate bottomwall. The substrate sidewall is connected to the substrate bottomwall and protrudes from the substrate bottomwall along the channel extension direction to form a groove with the substrate bottomwall. The atomizing surface is the surface of the substrate bottomwall that is away from the substrate sidewall.

3. The atomizing component according to claim 1, characterized in that, The inner wall of one end of the channel is radially recessed outward to form an installation groove, and the porous substrate is disposed in the installation groove and abuts against the bottom surface of the installation groove.

4. The atomizing component according to claim 1, characterized in that, The thermal conductivity of the structural matrix is ​​greater than 30 W / (m·K), and the thermal conductivity of the porous matrix is ​​less than 1 W / (m·K).

5. The atomizing component according to claim 1, characterized in that, The porous matrix is ​​a porous ceramic, the structural matrix is ​​a structural ceramic, and the porous matrix and the structural matrix are integrally sintered together. or, The porous substrate is porous glass, and the structural substrate is structural ceramic.

6. The atomizing component according to claim 1, characterized in that, The porous substrate surface facing the channel includes a first central region and a first peripheral region surrounding the first central region. The ratio of the radial dimension of the first central region to the radial dimension of the first peripheral region is greater than 0.

5. The atomizing component includes a first heating element disposed in the first peripheral region.

7. The atomizing component according to claim 1, characterized in that, The atomizing surface includes a second central region and a second peripheral region, wherein the ratio of the radial dimension of the second central region to the radial dimension of the second peripheral region is greater than 0.5; The atomizing component includes a second heating element, which is disposed in the second peripheral region.

8. The atomizing component according to claim 7, characterized in that, The second heating element includes two sets of heating wires, which are symmetrically arranged on opposite sides of the atomizing surface.

9. The atomizing component according to claim 1, characterized in that, Along the channel extension direction, the structural matrix includes a first segment and a second segment connected to each other, the porous matrix is ​​disposed in the second segment, and the outer diameter of the second segment is larger than the outer diameter of the first segment.

10. An electronic atomizer, characterized in that, Includes the atomizing component as described in any one of claims 1-9.

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