Solder smearing device and solder recycling device for PCB (printed circuit board) welding plate

Abstract

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a PCB welding plate solder smearing device and a solder recycling device, the device comprises a coating table, a bearing seat, a bearing seat, a bearing seat and a bearing seat, the material brushing net is arranged in the coating position so as to be attached to the upper end face of the PCB on the surface of the bearing seat when the bearing seat enters the welding position; the at least two solder recovery positions are respectively positioned on two sides of the brushing net; the scraping mechanism is connected with the coating table and comprises a scraper, and the blade of the scraper is attached to the brushing net so that redundant solder can be scraped to a solder recycling position when the driver drives the scraper to reciprocate on the full-breadth surface of the brushing net; the material brushing net is arranged in the center of the coating table, the welding flux recycling positions are arranged on the portions, located on the two sides of the material brushing net, of the coating table, after a scraper scrapes welding flux on the surface of the material brushing net to conduct welding flux on a PCB, the scraper pushes redundant welding flux into the welding flux recycling positions to be recycled, and the situation that when the material brushing net is lifted, the redundant welding flux penetrates through the material brushing net to fall on the surface of the PCB, and consequently pollution is caused is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically relating to a PCB solder coating device and a solder recycling device. Background Technology

[0002] In the prior art, before the product particles are soldered to the PCB board at high temperature, a brush screen needs to be placed on the upper surface of the PCB board manually, and liquid solder is applied to the surface of the brush screen so that the solder passes through the mesh openings on the surface of the brush screen to form solder joints on the surface of the PCB board. Then the brush screen is removed, and the product particles to be soldered are placed one by one to correspond to the solder joints, and then high-temperature soldering is performed.

[0003] Since the brushing mesh is a single flat plate with a baffle fixed around it, excess solder will accumulate on the surface of the brushing mesh after brushing. During the process of removing the brushing mesh after brushing, excess solder will drip through the mesh holes onto the PCB soldering board surface, causing contamination.

[0004] Therefore, it is necessary to design a solder recovery device for PCB soldering board to solve the problem that the existing brushing screen cannot recover excess solder, which causes excess solder to pass through the mesh and contaminate the PCB board when the brushing screen is lifted after brushing.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0006] This disclosure provides at least one PCB solder coating device and a solder recycling device.

[0007] In a first aspect, embodiments of this disclosure provide a PCB solder coating apparatus, comprising:

[0008] The paint station has a central area for accommodating the paint support.

[0009] A brush screen is provided within the coating position to adhere to the upper surface of the PCB board on the surface of the carrier when the carrier enters the solder position.

[0010] At least two solder recovery points are located on either side of the solder brush; and

[0011] The scraping mechanism, connected to the coating station, includes:

[0012] The scraper, with its blade in contact with the brush screen, scrapes excess solder to the solder recovery position when the driver drives the scraper to reciprocate across the full width of the brush screen.

[0013] In one optional embodiment, a support plate is provided on the coating table;

[0014] The driver is mounted on the support plate, and a lead screw is connected to the output end of the driver;

[0015] A connecting plate is provided above the scraper;

[0016] The lead screw passes through the connecting plate and is threadedly connected to the connecting plate; and

[0017] A guide rod is provided on the support plate, and the guide rod passes through the connecting plate; wherein

[0018] The driver is adapted to drive the lead screw to rotate upon startup, thereby moving the connecting plate and the scraper below it along the axial direction of the guide rod to scrape material.

[0019] In one optional embodiment, a vertical moving mechanism is provided above the coating table, comprising:

[0020] Several sliding rods pass through the coating table;

[0021] A fixing plate is provided on the upper end face of the slide rod, and a vertical drive cylinder is provided on the upper end face of the fixing plate; wherein

[0022] The output end of the vertical drive cylinder passes through the fixed plate and is connected to a vertical push rod; and

[0023] A push plate, the upper end of which is connected to the vertical push rod, and the lower end of which is connected to the connecting plate;

[0024] The vertical drive cylinder is adapted to push the connecting plate through the push rod, so that the coating table moves along the axis of the slide rod to attach the brush screen to the PCB board.

[0025] In one optional embodiment, a plurality of solder tubes are inserted into the fixing plate; wherein

[0026] The bottom end of each of the solder tubes faces the upper surface of the brush screen, and the top end of each of the solder tubes is connected to the external liquid solder.

[0027] In one optional embodiment, a horizontal moving mechanism is provided below the coating station, comprising:

[0028] A movable platform is positioned below the coating station;

[0029] A horizontal drive cylinder is provided on the moving platform; wherein

[0030] The output end of the horizontal drive cylinder is connected to a horizontal push rod, and the horizontal push rod is connected to the support seat.

[0031] In one optional embodiment, the upper surface of the mobile platform is provided with at least one slide rail;

[0032] A movable seat is provided below the support base, and a groove adapted to the slide rail is opened on the lower end face of the movable seat.

[0033] In one alternative embodiment, the number of the support seats is at least two, and one of the support seats is connected to the horizontal push rod;

[0034] The two bearing seats are connected by a connector.

[0035] Secondly, this disclosure also provides a solder recycling device, including: a coating table, wherein a solder position for accommodating a support seat is provided in the center;

[0036] A brush screen is provided within the solder position to adhere to the upper surface of the PCB board on the surface of the carrier when the carrier enters the solder position.

[0037] At least two solder recovery points are located on either side of the solder brush; and

[0038] The scraping mechanism, connected to the coating station, includes:

[0039] A scraper, the blade of which is in contact with the brush screen, applies solder to the PCB board surface when the driver moves the scraper across the brush screen surface.

[0040] In one optional embodiment, a support plate is provided on the coating table;

[0041] The driver is mounted on the support plate, and a lead screw is connected to the output end of the driver;

[0042] A connecting plate is provided above the scraper;

[0043] The lead screw passes through the connecting plate and is threadedly connected to the connecting plate; and

[0044] A guide rod is provided on the support plate, and the guide rod passes through the connecting plate; wherein

[0045] The driver is adapted to drive the lead screw to rotate upon startup, thereby moving the connecting plate and the scraper below it along the axial direction of the guide rod to scrape material.

[0046] In one optional embodiment, each of the solder recovery positions is provided with a recovery hole; wherein

[0047] Each of the aforementioned recycling holes is connected to an external solder recycling box via a pipeline.

[0048] The beneficial effect of this utility model is that by setting the brush screen in the center of the coating table and opening solder recovery positions on both sides of the brush screen on the coating table, when the scraper scrapes the solder on the surface of the brush screen to solder the PCB board, the scraper will scrape the excess solder into the solder recovery position to recover the solder, thus avoiding the excess solder from passing through the brush screen and falling onto the PCB board surface when the brush screen is lifted, causing pollution.

[0049] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0050] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0051] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0052] Figure 1 A first-view cross-sectional structural diagram of the PCB board solder coating device provided in an embodiment of this disclosure;

[0053] Figure 2 A second-view cross-sectional structural diagram of the PCB board solder coating device provided in an embodiment of this disclosure;

[0054] Figure 3 This is a perspective view of the PCB board solder coating device provided in an embodiment of this disclosure.

[0055] In the picture:

[0056] 1. Support base; 10. PCB board;

[0057] 2. Scraping mechanism; 20. Coating table; 200. Coating position; 201. Solder recovery position; 21. Driver; 22. Support plate; 23. Lead screw; 24. Guide rod; 25. Connecting plate; 26. Scraper; 27. Brush screen; 28. Recovery hole;

[0058] 3. Vertical moving mechanism; 30. Fixed plate; 31. Vertical drive cylinder; 310. Vertical push rod; 32. Welding tube; 33. Slide rod; 34. Push plate;

[0059] 4. Horizontal moving mechanism; 40. Horizontal drive cylinder; 41. Horizontal push rod; 42. Moving seat; 43. Connecting piece; 44. Moving table; 45. Slide rail. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0061] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0062] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0063] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0064] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0065] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0066] Research has revealed that in existing technologies, the brushing screen is a single flat plate with a baffle plate fixed around its perimeter. After brushing, excess solder accumulates on the surface of the brushing screen. During the removal of the brushing screen after brushing, excess solder drips through the mesh and onto the PCB board surface, causing contamination.

[0067] Based on the above research, this disclosure provides a PCB solder coating device and a solder recovery device. By setting the brush screen in the center of the coating table and opening solder recovery positions on both sides of the brush screen on the coating table, when the scraper scrapes the solder on the surface of the brush screen to apply solder to the PCB board, the scraper will scrape the excess solder into the solder recovery position to recover the solder, thus avoiding excess solder from falling through the brush screen and falling onto the PCB board surface when the brush screen is lifted, causing contamination.

[0068] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0069] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0070] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0071] In some embodiments, such as Figure 1 As shown, before applying solder to the surface of the PCB board 10, the PCB board 10 is placed on the upper surface of the support 1, and the coating stage 20 is lowered. The coating stage 20 moves the brush screen 27 set in the center of it toward the support 1 until the support 1 enters the coating position 200. At this time, the lower end face of the brush screen 27 is in contact with the upper end face of the PCB board 10. Liquid solder is poured onto the upper end face of the brush screen 27. The driver 21 (preferably a rotary motor) is started, which drives the lead screw 23 to rotate, thereby driving the connecting plate 2 that is threadedly engaged with the lead screw 23. 5. Moving along the axis of the guide rod 24, the connecting plate 25 drives the scraper 26 set on its lower end face to scrape the liquid solder on the surface of the brush screen 27. The liquid solder drips through the mesh of the brush screen 27 onto the upper end face of the PCB board. As the scraper 26 moves away from the surface of the brush screen, the excess liquid solder is pushed into the solder recovery position 201 by the scraper to collect, so as to avoid the accumulation of excess liquid solder on the surface of the brush screen 27. At this time, the coating table 20 is placed on the upper stage, so that the brush screen 27 is separated from the PCB board 10, and the PCB board 10 is removed to complete the solder coating operation.

[0072] In some embodiments, such as Figure 2 and Figure 3 As shown, liquid solder enters the surface of the brush screen 27 through each solder tube 32 (the liquid solder is drawn from the solder box by an externally driven pump and introduced through the solder tube, which is existing technology and will not be described in detail here). The vertical drive cylinder 31 is activated, and its output end drives the vertical push rod 310 to move down, which in turn pushes the push plate 34 and the connecting plate 25 connected to the vertical push rod 310 to move down. At this time, the connecting plate 25, together with the coating table 20 and the brush screen 27, moves down until the support seat 1 enters the coating position 200. After the scraping is completed, the vertical drive cylinder 31 drives each component to reset. The scraper 26 scrapes the excess liquid solder to the solder recovery position 201. The excess solder then flows along the recovery holes 28 in each solder recovery position 201 to the external solder recovery box (the connection method between the recovery hole and the external solder recovery box and the setting of the external solder recovery box are existing technologies and will not be described in detail here).

[0073] Furthermore, after the liquid solder is applied to the surface of the PCB board 10 on one of the carrier seats 1, the vertical drive cylinder 31 drives the coating stage 20 to move upward and reset. At this time, the horizontal drive cylinder 40 is activated, and its output end drives the horizontal push rod 41 to retract, thereby driving the carrier seat 1 connected to the horizontal push rod 41 to move horizontally. At this time, the moving stage 42 set below the current carrier seat 1 moves along the guide direction of the guide rail 43. Due to the presence of the connecting piece 43, after the current carrier seat 1 is driven away from below the coating stage 20, the carrier seat 1 connected to it is driven to move below the coating stage 20. The above steps are repeated to coat the next PCB board. The PCB board 10 that has been coated is removed, and the operator can place the PCB board 10 to be coated.

[0074] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0075] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0076] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0077] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0078] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A PCB soldering board soldering device, characterized in that, include: The paint station (20) has a paint position (200) in the center to accommodate the support seat (1). A brush screen (27) is set in the coating position (200) to adhere to the upper surface of the PCB board (10) on the surface of the carrier (1) when the carrier (1) enters the coating position (200); At least two solder recovery points (201) are located on both sides of the brush mesh (27); as well as The scraping mechanism (2), connected to the coating table (20), includes: The scraper (26) has its blade in contact with the brush screen (27) to scrape excess solder to the solder recovery position (201) when the driver (21) drives the scraper (26) to reciprocate across the full width of the brush screen (27).

2. The PCB solder coating device as described in claim 1, characterized in that, A support plate (22) is provided on the paint table (20); The driver (21) is mounted on the support plate (22), and the output end of the driver (21) is connected to a lead screw (23). A connecting plate (25) is provided above the scraper (26); The lead screw (23) passes through the connecting plate (25) and is threadedly connected to the connecting plate (25); and A guide rod (24) is provided on the support plate (22), and the guide rod (24) passes through the connecting plate (25); wherein The driver (21) is adapted to drive the lead screw (23) to rotate during startup so as to move the connecting plate (25) and the scraper (26) below it along the axial direction of the guide rod (24) to scrape material.

3. The PCB solder coating device as described in claim 2, characterized in that, A vertical moving mechanism (3) is provided above the coating table (20), which includes: Several sliding rods (33) pass through the paint table (20); A fixing plate (30) is provided on the upper end face of the slide rod (33), and a vertical drive cylinder (31) is provided on the upper end face of the fixing plate (30); wherein The output end of the vertical drive cylinder (31) passes through the fixed plate (30) and is connected to a vertical push rod (310); and The push plate (34) has its upper end face connected to the vertical push rod (310) and its lower end face connected to the connecting plate (25); The vertical drive cylinder (31) is adapted to push the connecting plate (25) by the vertical push rod (310), so that the coating table (20) moves along the axial direction of the slide rod (33) to attach the brush screen (27) to the PCB board (10).

4. The PCB solder coating device as described in claim 3, characterized in that, A plurality of welding tubes (32) are inserted into the fixing plate (30); wherein The bottom end of each of the solder tubes (32) faces the upper end of the brush screen (27), and the top end of each of the solder tubes (32) is connected to the external liquid solder.

5. The PCB solder coating device as described in claim 1, characterized in that, A horizontal moving mechanism (4) is provided below the coating station (20), which includes: A movable platform (44) is positioned below the paint station (20); A horizontal drive cylinder (40) is provided on the mobile platform (44); wherein The output end of the horizontal drive cylinder (40) is connected to a horizontal push rod (41), and the horizontal push rod (41) is connected to the bearing seat (1).

6. The PCB solder coating device as described in claim 5, characterized in that, The upper surface of the mobile platform (44) is provided with at least one slide rail (45). A movable seat (42) is provided below the bearing seat (1), and a groove adapted to the slide rail (45) is provided on the lower end face of the movable seat (42).

7. The PCB solder coating device as described in claim 6, characterized in that, The number of the bearing seats (1) is at least two, and one of the bearing seats (1) is connected to the horizontal push rod (41); The two bearing seats (1) are connected by a connector (43).

8. A solder recycling device, characterized in that, include: The paint station (20) has a paint position (200) in the center to accommodate the support seat (1). A brush screen (27) is set in the coating position (200) to adhere to the upper surface of the PCB board (10) on the surface of the carrier (1) when the carrier (1) enters the coating position (200); At least two solder recovery points (201) are located on both sides of the brush mesh (27); as well as The scraping mechanism (2), connected to the coating table (20), includes: The scraper (26) has its blade in contact with the brush mesh (27) to apply solder to the surface of the PCB board (10) when the driver (21) drives the scraper (26) to move on the surface of the brush mesh (27).

9. The solder recycling device as described in claim 8, characterized in that, A support plate (22) is provided on the paint table (20); The driver (21) is mounted on the support plate (22), and the output end of the driver (21) is connected to a lead screw (23). A connecting plate (25) is provided above the scraper (26); The lead screw (23) passes through the connecting plate (25) and is threadedly connected to the connecting plate (25); and A guide rod (24) is provided on the support plate (22), and the guide rod (24) passes through the connecting plate (25); wherein The driver (21) is adapted to drive the lead screw (23) to rotate during startup so as to move the connecting plate (25) and the scraper (26) below it along the axial direction of the guide rod (24) to scrape material.

10. The solder recycling device as described in claim 9, characterized in that, Each of the aforementioned solder recovery positions (201) is provided with a recovery hole (28); wherein Each of the aforementioned recycling holes (28) is connected to an external solder recycling box via a pipeline.

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