Wafer hot-pressing die structure assembly

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to a wafer hot-pressing die structure assembly. Comprising an upper die plate assembly and an upper die insert. The upper mold plate assembly is provided with an upper mold insert mounting groove, an upper mold insert is mounted in the mounting groove, and a vacuum loop is formed between the peripheral wall of the upper mold insert and the inner wall of the mounting groove; an annular vacuum groove is formed in the upper die plate assembly and located on the outer side of the vacuum annular channel, vacuum holes are formed in the annular vacuum groove, and a communicating groove is formed between the vacuum annular channel and the annular vacuum groove. The upper die plate assembly is further provided with a first air suction channel, a second air suction channel and an air injection channel which are communicated with the corresponding vacuum holes and the corresponding vacuum annular channels respectively. According to the utility model, sufficient and uniform exhaust and bubble elimination in the cavity are realized through the communicating grooves, so that glue fluid is flatly attached and free of wrinkles and local bulges in the hot pressing process, the total thickness deviation after fluid forming and laminating is effectively reduced, the wafer laminating TTV precision is greatly improved, and the high-end semiconductor wafer processing requirement is met.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a wafer hot pressing mold structure assembly. Background Technology

[0002] In high-end manufacturing fields such as semiconductor manufacturing and precision electronic component processing, fluid forming hot pressing coating process is one of the core processes for surface protection, functional modification and interconnect packaging of precision devices such as wafers. Its core principle is to achieve tight bonding between the coating material and the wafer surface through precise mold closing of the upper and lower mold boxes, under the synergistic effect of high temperature, high pressure and fluid-assisted forming, thereby ensuring the structural integrity, electrical performance and feasibility of subsequent processing of the wafer.

[0003] Among them, the upper mold box, as the core execution component of the hot press laminating equipment, directly undertakes the key functions of laminating positioning, pressure transmission, temperature control and cavity sealing. The rationality of its structural design directly determines the final quality of hot press laminating, especially the two core indicators of total thickness deviation (TTV) and adhesion between the laminating film and the wafer.

[0004] Currently, the upper mold box of existing resin encapsulation hot pressing equipment mostly adopts a closed structure for its cavity design. Since the resin does not generate gas during the hot pressing process, there is a lack of a dedicated high-efficiency cavity venting mechanism. However, the upper mold box structure cannot meet the requirement of timely venting of gas generated by the adhesive fluid during the rapid hot pressing process.

[0005] Gas retention in the mold cavity can hinder the tight bonding of the adhesive fluid material with the wafer surface after hot pressing, resulting in defects such as local suspension and wrinkles in the wafer coating. This leads to a significant decrease in adhesion and the total coating thickness deviation (TTV) exceeding the allowable range, failing to meet the processing requirements of the wafer back-end process. Utility Model Content

[0006] To address the technical problem of low exhaust efficiency in the upper mold box of existing hot pressing coating equipment, this utility model provides a wafer hot pressing mold structure component.

[0007] Therefore, the present invention provides the following technical solution:

[0008] A wafer hot pressing mold structure assembly includes an upper template assembly and an upper mold insert;

[0009] The upper template assembly is provided with an upper mold insert mounting groove, in which the upper mold insert is fixedly installed. An annular gap exists between the outer peripheral wall of the upper mold insert and the inner sidewall of the upper mold insert mounting groove, forming a vacuum channel (facilitating vacuuming and venting of the cavity during mold closing). The upper template assembly is provided with an annular vacuum groove outside the vacuum channel, and a vacuum hole is provided in the annular vacuum groove (to achieve uniform venting in the peripheral area and improve the venting coverage). A connecting groove is provided between the upper template assembly and the annular vacuum groove (forming a multi-stage venting structure to improve the gas discharge efficiency inside the cavity).

[0010] The upper template component is also equipped with a first suction channel, a second suction channel and a first injection channel. The first suction channel is connected to the vacuum hole, the second suction channel is connected to the vacuum ring, and the first injection channel is connected to the vacuum ring (to achieve independent air extraction from multiple channels, ensuring stable exhaust in each area and preventing interference between them).

[0011] Furthermore, the upper template assembly includes an upper template enclosure and an upper suction template;

[0012] The vacuum hole, the connecting groove, the first suction channel, the second suction channel, and the first injection channel are all set on the upper suction template;

[0013] The upper mold plate is fixedly installed below the upper suction plate. The upper mold plate and the upper suction plate are provided with corresponding coaxial through holes. The upper mold insert pad is fixedly installed in the through hole of the upper mold plate. The upper mold insert pad and the upper suction plate together form the upper mold insert mounting groove (to ensure accurate installation and positioning of the upper mold insert and stable and reliable structure). The upper mold insert is fixedly installed on the upper mold insert pad. There is an annular gap between the outer peripheral wall of the upper mold insert and the inner side wall of the through hole of the upper suction plate (to form a continuous closed annular vacuum channel and improve the vacuuming effect).

[0014] Furthermore, the upper mold surround plate and the upper suction plate are fixedly connected by screws, and the lower end of the screw is integrally formed with a guide post; the upper mold insert pad and the upper mold insert are provided with a positioning pin at the center (to realize the center positioning between the upper mold insert and the upper mold base plate and prevent misalignment); the upper mold plate assembly also includes an upper mold base plate, which is slidably installed on the guide post, and the lower end of the positioning pin extends into the upper mold base plate. A spring is connected between the upper mold base plate and the upper mold surround plate (to realize buffering and reset during the mold closing process, protect the wafer and the coating, and ensure the smooth movement of the upper mold base plate through the guide post and the positioning pin).

[0015] Furthermore, an extended pad is fixedly installed on the outer wall of the upper suction template. The extended pad has a first suction channel, a second suction channel, and a second injection channel. An upper vacuum block is fixedly installed at the end of the extended pad away from the upper suction template. The upper vacuum block has a first suction hole, a second suction hole, and an injection hole. The first suction hole is connected to the first suction channel through the first suction channel. The second suction hole is connected to the second suction channel through the second suction channel. The injection hole is connected to the first injection channel through the second injection channel (moving the suction interface outward facilitates connection to external vacuum equipment).

[0016] Furthermore, a first sealing ring is provided between the upper mold insert pad and the upper mold surround plate (to prevent air leakage in the vacuum ring); a second sealing ring is installed between the upper suction plate and the upper mold surround plate, located on the outer side of the annular vacuum groove (to isolate external air from entering, improve the overall sealing effect, and ensure air extraction efficiency).

[0017] Furthermore, the upper mold base plate is fixedly provided with a positioning block, which is used to achieve positioning cooperation with the lower mold (to achieve precise mold closing and positioning of the upper and lower molds and improve the accuracy of the film coating position).

[0018] Furthermore, the upper mold base plate is fixedly provided with a guide block, which is used to guide and cooperate with the lower mold (to ensure a smooth and stable mold closing process).

[0019] Advantages and positive effects of this utility model:

[0020] This invention uses a vacuum ring channel and an annular vacuum groove on the upper mold box to adsorb the release film. At the same time, a connecting groove is provided between the vacuum ring channel and the annular vacuum groove, which can quickly and thoroughly remove residual air and coating volatile gases between the release film and the wafer during the hot pressing process through the connecting groove from the vacuum system on the lower mold box, avoiding coating defects caused by gas trapping. In addition, after vacuuming, the release film will adsorb and seal the gaps on the upper mold assembly, and the adhesive will not seep into the gaps of the upper mold assembly.

[0021] This invention achieves full and uniform venting inside the cavity through a connecting groove, eliminating air bubbles and air clusters, and ensuring that the adhesive fluid adheres smoothly and without wrinkles or local bulges during hot pressing. This effectively reduces the deviation in total film thickness, significantly improves the TTV accuracy of film coating, and meets the requirements of high-end semiconductor wafer processing. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a first-view three-dimensional structural cross-sectional view of a wafer hot pressing mold structural component provided by this utility model.

[0024] Figure 2 This is a second-view perspective sectional view of a wafer hot pressing mold structure assembly provided by this utility model.

[0025] In the diagram: 1. Upper mold insert; 2. Upper mold insert mounting groove; 3. Vacuum ring; 4. Annular vacuum groove; 5. Vacuum hole; 6. Connecting groove; 7. Upper mold surround plate; 8. Upper suction plate; 9. Upper mold insert pad; 10. Screw; 11. Guide post; 12. Positioning pin; 13. Upper mold base plate; 14. Spring; 15. Extended pad; 16. Upper vacuum block; 17. First evacuation hole; 18. Second evacuation hole; 19. Air injection hole; 20. First evacuation channel; 21. Second evacuation channel; 22. Second air injection channel; 23. First suction channel; 24. Second suction channel; 25. First air injection channel; 26. First sealing ring; 27. Second sealing ring; 28. Positioning block; 29. ​​Guide block. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0027] This utility model provides a wafer hot pressing mold structure component, such as Figure 1-2 As shown, it includes an upper template assembly and an upper mold insert 1. A positioning block 28 is fixedly provided on the upper mold base plate 13, which is used for positioning and engagement with the lower mold. A guide block 29 is fixedly provided on the upper mold base plate 13, which is used for guiding and engagement with the lower mold.

[0028] The upper mold plate assembly includes an upper mold surround plate 7, an upper suction mold plate 8, and an upper mold base plate 13. The upper mold surround plate 7 is fixedly connected to the lower part of the upper suction mold plate 8 by screws 10, and the lower end of the screws 10 is integrally formed with a guide post 11. The upper mold surround plate 7 and the upper suction mold plate 8 are respectively provided with coaxial through holes. An upper mold insert pad 9 is fixedly installed in the through hole of the upper mold surround plate 7. The upper mold insert pad 9 and the upper suction mold plate 8 together form an upper mold insert mounting groove 2. The upper mold insert 1 is located in the upper mold insert mounting groove 2 and is fixedly installed on the upper mold insert pad 9. There is an annular gap between the outer peripheral wall of the upper mold insert 1 and the inner side wall of the through hole of the upper suction mold plate 8. This annular gap forms a vacuum ring 3.

[0029] A first sealing ring 26 is provided between the upper mold insert pad 9 and the upper mold surrounding plate 7; a second sealing ring 27 is installed between the upper suction plate 8 and the upper mold surrounding plate 7, and located on the outer side of the annular vacuum groove 4.

[0030] A positioning pin 12 is provided at the center of the upper mold insert pad 9 and the upper mold insert 1; the upper mold base plate 13 is slidably installed on the guide post 11, and the lower end of the positioning pin 12 extends into the upper mold base plate 13; a spring 14 is connected between the upper mold base plate 13 and the upper mold surrounding plate 7.

[0031] The upper suction template 8 is provided with an annular vacuum groove 4 on the outside of the vacuum ring channel 3, and a vacuum hole 5 is provided in the annular vacuum groove 4; the upper suction template 8 is provided with a connecting groove 6 between the vacuum ring channel 3 and the annular vacuum groove 4.

[0032] The upper suction template 8 is also provided with a first suction channel 23, a second suction channel 24 and a first gas injection channel 25. The first suction channel 23 is connected to the vacuum hole 5, the second suction channel 24 is connected to the vacuum ring 3, and the first gas injection channel 25 is connected to the vacuum ring 3.

[0033] An extended pad 15 is fixedly installed on the outer wall of the upper suction template 8. The extended pad 15 has a first suction channel 20, a second suction channel 21, and a second air injection channel 22. An upper vacuum block 16 is fixedly installed at the end of the extended pad 15 away from the upper suction template 8. The upper vacuum block 16 has a first suction hole 17, a second suction hole 18, and an air injection hole 19. The first suction hole 17 is connected to the first suction channel 23 through the first suction channel 20. The second suction hole 18 is connected to the second suction channel 24 through the second suction channel 21. The air injection hole 19 is connected to the first air injection channel 25 through the second air injection channel 22.

[0034] Working principle:

[0035] In the mold-closed state, from top to bottom, the components are: upper mold box, release film, adhesive, wafer, and lower mold box.

[0036] The external vacuum system is connected through the first suction hole 17 and the second suction hole 18 on the upper vacuum block 16. The vacuum suction force is transmitted sequentially through the first suction channel 20 and the second suction channel 21 in the extended pad block 15 to the first suction channel 23 and the second suction channel 24 on the upper suction template 8.

[0037] Vacuum suction enters the vacuum hole 5 within the annular vacuum groove 4 through the first suction channel 23, and enters the vacuum ring 3 through the second suction channel 24. Simultaneously, the air injection hole 19, the second air injection channel 22, and the first air injection channel 25 remain closed during the vacuuming phase and do not participate in exhaust. At this time, the release film is adsorbed onto the upper suction template 8 through the annular vacuum groove 4 and the vacuum ring 3, while the release film at the position of the connecting groove 6 is also adsorbed into the connecting groove 6.

[0038] During this process, the first sealing ring 26 and the second sealing ring 27 achieve a seal, preventing external air from entering the vacuum channel, ensuring a stable vacuum level in the vacuum channel, ensuring consistency between exhaust efficiency and exhaust effect, and avoiding incomplete exhaust problems caused by air leakage and pressure loss.

[0039] After the release film is adsorbed, the upper mold box is fixed, and the lower mold box moves upward to begin the mold closing action. When the equipment starts the mold closing action, the positioning block 28 and guide block 29 on the upper mold base plate 13 are precisely aligned with the corresponding structures of the lower mold, realizing the pre-positioning and guidance of the upper and lower molds, ensuring the alignment accuracy of the upper and lower molds during the mold closing process, and preventing mold misalignment and jamming. During the mold closing process, the upper mold base plate 13 slides downward along the guide post 11, compressing the spring 14 between the upper mold base plate 13 and the upper mold surrounding plate 7. The spring 14 plays a buffering role to avoid excessive impact force during mold closing that could damage the wafer and the upper mold assembly.

[0040] After mold closing, the hot-pressing laminating equipment applies high temperature and pressure. The upper mold insert 1 evenly transfers heat and pressure to the wafer and the adhesive. The vacuum system on the lower mold box is activated, and the gas in the wafer and adhesive area within the cavity is discharged through the connecting groove 6 by the vacuum system of the lower mold box. Because the gas inside the cavity has been fully discharged, the adhesive fluid can completely adhere to the wafer surface under high temperature and pressure, without bubbles, air gaps, or wrinkles, effectively avoiding defects such as localized protrusions and incomplete adhesion caused by gas retention.

[0041] After hot pressing and bonding, and after the holding pressure time ends, the equipment initiates the demolding action, and the upper mold assembly resets upwards. At this time, the compressed spring 14 returns to its original position. The positioning block 28 and guide block 29 separate from the lower mold, the external vacuum system stops working, and the external air source enters through the air injection hole 19 on the upper vacuum block 16. The gas sequentially enters the vacuum ring 3 through the second air injection channel 22 and the first air injection channel 25, uniformly injecting gas into the area between the release film and the upper mold insert 1, thereby achieving the separation of the release film from the upper mold insert 1. This completes one hot pressing and bonding cycle, and the process begins the next round of processing.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer hot pressing mold structure assembly, characterized in that, Includes upper template components and upper mold inserts (1); The upper template assembly is provided with an upper mold insert mounting groove (2), and the upper mold insert (1) is fixedly installed in the upper mold insert mounting groove (2). There is an annular gap between the outer peripheral wall of the upper mold insert (1) and the inner side wall of the upper mold insert mounting groove (2), and the annular gap forms a vacuum channel (3). The upper template assembly is provided with an annular vacuum groove (4) on the outside of the vacuum channel (3), and a vacuum hole (5) is provided in the annular vacuum groove (4). The upper template assembly is provided with a connecting groove (6) between the vacuum channel (3) and the annular vacuum groove (4), and the vacuum channel (3) and the annular vacuum groove (4) are connected through the connecting groove (6). The upper template assembly is also provided with a first air intake channel (23), a second air intake channel (24) and a first air injection channel (25). The first air intake channel (23) is connected to the vacuum hole (5), the second air intake channel (24) is connected to the vacuum ring channel (3), and the first air injection channel (25) is connected to the vacuum ring channel (3).

2. The wafer hot pressing mold structure assembly according to claim 1, characterized in that, The upper template assembly includes an upper template plate (7) and an upper suction template (8); Vacuum hole (5), connecting groove (6), first suction channel (23), second suction channel (24) and first injection channel (25) are all provided on the upper suction template (8); The upper mold plate (7) is fixedly installed below the upper suction plate (8); the upper mold plate (7) and the upper suction plate (8) are respectively provided with coaxial through holes. The upper mold insert pad (9) is fixedly installed in the through hole of the upper mold plate (7). The upper mold insert pad (9) and the upper suction plate (8) together form the upper mold insert mounting groove (2). The upper mold insert (1) is fixedly installed on the upper mold insert pad (9). There is an annular gap between the outer peripheral wall of the upper mold insert (1) and the inner side wall of the through hole of the upper suction plate (8).

3. The wafer hot pressing mold structure assembly according to claim 2, characterized in that, The upper mold plate (7) and the upper suction plate (8) are fixedly connected by screws (10), and the lower end of the screw (10) is integrally formed with a guide post (11); the upper mold insert pad (9) and the upper mold insert (1) are provided with a positioning pin (12) at the center; the upper template assembly also includes an upper mold base plate (13), the upper mold base plate (13) is slidably installed on the guide post (11), and the lower end of the positioning pin (12) extends into the upper mold base plate (13), and a spring (14) is connected between the upper mold base plate (13) and the upper mold plate (7).

4. A wafer hot pressing mold structure assembly according to claim 2, characterized in that, An extended pad (15) is fixedly installed on the outer wall of the upper suction template (8). The extended pad (15) is provided with a first suction channel (20), a second suction channel (21) and a second air injection channel (22). An upper vacuum block (16) is fixedly installed at the end of the extended pad (15) away from the upper suction template (8). The upper vacuum block (16) is provided with a first suction hole (17), a second suction hole (18) and an air injection hole (19). The first suction hole (17) is connected to the first suction channel (23) through the first suction channel (20). The second suction hole (18) is connected to the second suction channel (24) through the second suction channel (21). The air injection hole (19) is connected to the first air injection channel (25) through the second air injection channel (22).

5. A wafer hot pressing mold structure assembly according to claim 2, characterized in that, A first sealing ring (26) is provided between the upper mold insert pad (9) and the upper mold surrounding plate (7); a second sealing ring (27) is installed between the upper suction plate (8) and the upper mold surrounding plate (7), and at the outer position of the annular vacuum groove (4).

6. A wafer hot pressing mold structure assembly according to claim 3, characterized in that, The upper mold base plate (13) is fixedly provided with a positioning block (28), which is used to achieve positioning cooperation with the lower mold.

7. A wafer hot pressing mold structure assembly according to claim 3, characterized in that, The upper mold base plate (13) is fixedly provided with a guide block (29), which is used to guide and cooperate with the lower mold.

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