ALD tail gas treatment device and atomic layer deposition equipment

Abstract

The utility model relates to the technical field of photovoltaic cell manufacturing equipment, in particular to an ALD (atomic layer deposition) tail gas treatment device and atomic layer deposition equipment. The atomic layer deposition equipment comprises an ALD tail gas treatment device; the ALD tail gas treatment device comprises a filtering device and a liquid supply device, the filtering device comprises a filter, and the filter is provided with a filtering cavity; the liquid supply device comprises a liquid storage device, an air inlet pipe and a conveying pipe; wherein the liquid storage device is provided with a storage cavity, and the storage cavity is used for storing liquid; the gas inlet pipe is connected with the liquid storage device and used for introducing gas into the liquid stored in the storage cavity to form water vapor; the conveying pipe is connected between the storage cavity and the filter, communicates the storage cavity with the filtering chamber, and is used for introducing water vapor in the storage cavity into the filtering chamber. According to the tail gas treatment device, residual TMA gas can be reduced, the service life of the air pump is greatly prolonged, the problem that the air pump is stuck by aluminum oxide powder is solved, and the risk that dust flows backwards is improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cell manufacturing equipment technology, specifically to an ALD exhaust gas treatment device and an atomic layer deposition device. Background Technology

[0002] In the fabrication of solar cells, related technologies employ atomic layer deposition (ALD) to prepare thin films. ALD is a high-precision thin film deposition technology based on chemical vapor deposition (CVD). This technology can deposit materials as single-atom films layer by layer on the substrate surface based on chemical vapor deposition.

[0003] In the fabrication of thin films for solar cells using atomic layer deposition (ALD), TMA and H2O are typically used as precursors, which are introduced in a pulsed manner to react and deposit within a reaction chamber. To ensure reliable deposition, a sufficient quantity of precursor is usually introduced, followed by purging with an inert gas to remove excess gas. This results in excess precursor being pumped away by a gas pump, inevitably producing alumina powder during the venting process and shortening the pump's lifespan. Related technologies address this by adding an exhaust gas treatment device upstream of the pump to filter and decompose the residual precursor gas extracted from the reaction chamber, thereby reducing alumina powder generation at the pump.

[0004] However, the exhaust gas treatment devices provided by the relevant technologies are not very effective in filtering and decomposing precursor gases, and residual TMA will still pass through the air pump, resulting in limited effect on extending the service life of the air pump. Utility Model Content

[0005] The purpose of this invention is to provide an ALD exhaust gas treatment device and an atomic layer deposition (ALD) equipment. The ALD exhaust gas treatment device can be used in an ALD equipment. The exhaust gas treatment device can reduce residual TMA gas, greatly extend the service life of the air pump, improve the problem of the air pump being jammed by alumina powder, and reduce the risk of dust backflow.

[0006] The embodiments of this utility model can be implemented as follows:

[0007] In a first aspect, this utility model provides an ALD exhaust gas treatment device, comprising:

[0008] The filtration device includes a filter, and the filter is provided with a filtration chamber;

[0009] A liquid supply device includes a liquid reservoir, an air inlet pipe, and a delivery pipe; wherein, the liquid reservoir is provided with a storage chamber for storing liquid; the air inlet pipe is connected to the liquid reservoir and is used to introduce gas into the liquid stored in the storage chamber to form water vapor;

[0010] The delivery pipe connects the storage chamber and the filter, and links the storage chamber and the filter chamber. The delivery pipe is used to pass water vapor from the storage chamber into the filter chamber.

[0011] In an optional embodiment, the ALD exhaust gas treatment device further includes a liquid level detection component disposed in the liquid reservoir for detecting the liquid level in the storage chamber.

[0012] In an optional embodiment, the ALD exhaust gas treatment device further includes a replenishment pipe connected to a liquid reservoir for replenishing liquid into the reservoir.

[0013] In an optional implementation, the replenishment tube is connected to the bottom of the storage chamber.

[0014] In an optional embodiment, the ALD exhaust gas treatment device further includes a first valve, which is disposed in the intake pipe and is used to open and close the intake pipe.

[0015] In an optional embodiment, the ALD exhaust gas treatment device further includes a second valve disposed on the delivery pipe for opening and closing the delivery pipe.

[0016] In an alternative embodiment, the delivery pipe has an outlet located at the top of the filter chamber, allowing water vapor to flow downwards from the top of the filter chamber.

[0017] In an optional embodiment, the delivery pipe has an inlet that is distributed near the top of the storage chamber so that the inlet is spaced apart from the liquid surface of the liquid stored in the storage chamber.

[0018] In an optional embodiment, the air inlet pipe is provided with an air outlet, which is distributed near the bottom of the storage cavity.

[0019] In an optional embodiment, the filtration device further includes a filter element disposed within the filtration chamber.

[0020] Secondly, this utility model provides an atomic layer deposition apparatus, which includes a deposition apparatus body, an air pump and the aforementioned ALD exhaust gas treatment device. The deposition apparatus body has a reaction chamber, and a filter is connected between the reaction chamber and the air pump.

[0021] The beneficial effects of the ALD exhaust gas treatment device of this utility model embodiment include: the ALD exhaust gas treatment device provided by this utility model embodiment can use the inlet pipe to transport gas to the liquid stored in the reservoir to form water vapor, and the formed water vapor is allowed to enter the filter chamber through the delivery pipe, so that the water vapor entering the filter chamber can react with the TMA in the filter chamber to form alumina powder, thereby reducing the TMA transported to the downstream air pump; moreover, the delivery of water vapor to the filter chamber can also improve the adhesion rate of TMA precursor and the alumina powder produced by the reaction, so as to ensure that the TMA in the filter chamber reacts efficiently and reliably to generate alumina powder by increasing the adhesion of TMA gas in the filter chamber, and the generated alumina powder adheres to the filter chamber, reducing the problem of residual TMA or produced alumina powder being transported to the downstream air pump, thereby greatly extending the service life of the air pump, improving the problem of the air pump being jammed by alumina powder, and reducing the risk of dust backflow.

[0022] The atomic layer deposition equipment of this utility model embodiment includes all the beneficial effects of the aforementioned ALD exhaust gas treatment device, such as: reducing the problem of residual TMA or produced alumina powder being transported to the downstream air pump, thereby greatly extending the service life of the air pump, improving the problem of the air pump being jammed by alumina powder, and reducing the risk of dust backflow. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the ALD exhaust gas treatment device in an embodiment of this utility model.

[0025] Icons: 010-ALD exhaust gas treatment device; 100-filtration device; 101-filtration chamber; 200-liquid supply device; 210-liquid reservoir; 211-storage chamber; 221-air inlet pipe; 222-transfer pipe; 223-liquid replenishment pipe; 231-first valve; 232-second valve. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0031] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0032] This embodiment provides an atomic layer deposition apparatus, which includes a deposition apparatus body, an air pump, and an ALD exhaust gas treatment device 010 (such as...). Figure 1 As shown), the deposition equipment body has a reaction chamber for introducing precursors (e.g., TMA (trimethylaluminum) and H2O) to form a single-atom film; an ALD exhaust gas treatment device 010 is connected between the reaction chamber and the gas pump, which provides the power to extract the gas from the reaction chamber, and the ALD exhaust gas treatment device 010 is used to filter and decompose the residual precursors extracted from the reaction chamber.

[0033] Furthermore, the ALD exhaust gas treatment device 010 includes a filtration device 100 and a liquid supply device 200. The filtration device 100 includes a filter connected between the reaction chamber and the air pump. The filter is provided with a filtration chamber 101, and the residual precursor output from the reaction chamber can enter the filtration chamber 101. The liquid supply device 200 includes a liquid reservoir 210, an air inlet pipe 221, and a delivery pipe 222. The liquid reservoir 210 is provided with a storage chamber 211 for storing liquid (e.g., water). The air inlet pipe 221 is connected to the liquid reservoir 210 and is used to introduce gas into the liquid stored in the storage chamber 211 to form water vapor. The delivery pipe 222 is connected between the storage chamber 211 and the filter, and connects the storage chamber 211 and the filtration chamber 101. The delivery pipe 222 is used to pass the water vapor in the storage chamber 211 into the filtration chamber 101.

[0034] The ALD exhaust gas treatment device 010 can use the inlet pipe 221 to deliver gas to the liquid stored in the reservoir 210 to form water vapor. The formed water vapor is then delivered into the filter chamber 101 through the delivery pipe 222. This allows the water vapor entering the filter chamber 101 to react with the TMA in the filter chamber 101 to form alumina powder, thereby reducing the amount of TMA delivered to the downstream air pump. Furthermore, delivering water vapor to the filter chamber 101 can also improve the adhesion rate of the TMA precursor and the alumina powder produced by the reaction. By increasing the adhesion of TMA gas in the filter chamber 101, it ensures that the TMA in the filter chamber 101 reacts efficiently and reliably to generate alumina powder. The generated alumina powder adheres to the filter chamber 101, reducing the problem of residual TMA or the produced alumina powder being delivered to the downstream air pump. This greatly extends the service life of the air pump, improves the problem of the air pump being jammed by alumina powder, and reduces the risk of dust backflow.

[0035] Furthermore, the filtration device 100 also includes a filter element disposed within the filtration chamber 101. The filter element can be used to adsorb TMA entering the filtration chamber 101, and under the action of water vapor, it can more reliably generate alumina powder from TMA, and the generated alumina powder can be reliably adsorbed onto the filter element under the action of water vapor, thereby significantly reducing residual TMA. This reduces the amount of residual TMA transported to the downstream air pump, and also reduces the amount of alumina powder produced that is transported to the downstream air pump, thus significantly extending the service life of the air pump.

[0036] Optionally, the filter includes a filter canister and a canister cover. The canister cover is movably or detachably connected to the filter canister to open or close the opening of the filter canister. The filter canister is provided with a filter chamber 101, which communicates with the opening. When the canister cover is opened, the filter element can be taken out or put in through the opening. This facilitates the replacement of the filter element.

[0037] It should be noted that the gas supplied by the air inlet pipe 221 to the storage chamber 211 can be nitrogen, and no specific limitation is made here.

[0038] Optionally, the ALD exhaust gas treatment device 010 also includes a liquid level detection component (e.g., a liquid level sensor, not shown in the figure). The liquid level detection component is disposed in the liquid reservoir 210 and is used to detect the liquid level in the storage chamber 211. By setting the liquid level detection component, the amount of liquid in the storage chamber 211 can be monitored in a timely manner, so that liquid can be replenished in a timely manner when the liquid level is insufficient, thereby ensuring that the liquid supply device 200 can reliably supply water vapor to the filter chamber 101.

[0039] Please refer to Figure 1 Furthermore, the ALD exhaust gas treatment device 010 also includes a replenishment pipe 223, which is connected to the reservoir 210 for replenishing liquid into the storage chamber 211. For example, when the liquid level detection component detects that the liquid level (liquid surface height) in the storage chamber 211 is at one-third (or one-half) of the height of the storage chamber 211, liquid can be replenished into the storage chamber 211 using the replenishment pipe 223.

[0040] Furthermore, the replenishment tube 223 is connected to the bottom of the storage cavity 211. Of course, in other embodiments, the replenishment tube 223 may also be connected to the middle or top of the storage cavity 211, which is not specifically limited here.

[0041] Optionally, the ALD exhaust gas treatment device 010 also includes an electrically controlled valve, which is disposed in the replenishment pipe 223 and is used to control the opening and closing of the replenishment pipe 223. When the liquid level detection component detects that the liquid level in the storage chamber 211 has dropped to a set liquid level (e.g., one-third of the height of the storage chamber 211), the electrically controlled valve opens the replenishment pipe 223 to replenish liquid into the storage chamber 211 through the replenishment pipe 223.

[0042] Please refer to Figure 1 In this embodiment, the air inlet pipe 221 is provided with an air outlet, which is distributed near the bottom of the storage chamber 211. This arrangement allows for more reliable delivery of gases such as nitrogen to the liquid in the storage chamber 211 via the air inlet pipe 221, facilitating more reliable formation of water vapor, and ensuring that the water vapor formed in the storage chamber 211 can be reliably delivered to the filter chamber 101 via the delivery pipe 222.

[0043] Optionally, the ALD exhaust gas treatment device 010 further includes a first valve 231, which is disposed on the intake pipe 221 and used to open and close the intake pipe 221. In this way, gas supply can be saved by opening and closing the intake pipe 221.

[0044] Optionally, the ALD exhaust gas treatment device 010 further includes a second valve 232, which is disposed on the delivery pipe 222 and used to open and close the delivery pipe 222. By setting the second valve 232, sufficient water vapor can be sprayed into the filter chamber 101 as needed.

[0045] For example, both the first valve 231 and the second valve 232 can be solenoid valves. The atomic layer deposition equipment also includes a controller (e.g., a computer or PLC control device). Both the first valve 231 and the second valve 232 communicate with the controller to control the opening and closing of the first valve 231 and the second valve 232. For example, the controller can control the first valve 231 and the second valve 232 to open for a second set time interval at a first set time interval.

[0046] Furthermore, the electrically controlled valve and liquid level detection component installed in the replenishment pipe 223 communicate with the controller so that when the liquid level detection component sends a detection signal indicating that the liquid level has dropped to the set liquid level to the controller, the controller controls the electrically controlled valve to open for replenishment.

[0047] Please refer to Figure 1 In this embodiment, the delivery pipe 222 has an outlet located at the top of the filter chamber 101, allowing water vapor to flow downwards from the top of the filter chamber 101. This arrangement facilitates a wider coverage of the water vapor entering the filter chamber 101, ensuring reliable reaction between the TMA and water vapor within the filter chamber 101. This not only improves efficiency but also significantly reduces residual TMA.

[0048] Of course, in other embodiments, the outlet of the delivery pipe 222 may also be located at the bottom or middle of the filter chamber 101, without specific limitation.

[0049] Furthermore, the delivery pipe 222 has an inlet located near the top of the storage chamber 211, so that the inlet is spaced apart from the liquid surface of the liquid stored in the storage chamber 211. This ensures that water vapor, rather than the liquid from the storage chamber 211, enters the delivery pipe 222 from the inlet. This, in turn, effectively promotes the TMA reaction within the filter chamber 101 to generate alumina powder by ensuring the water vapor covers the filter chamber 101, significantly reducing TMA residue.

[0050] The ALD exhaust gas treatment device 010 of this utility model can use the inlet pipe 221 to deliver gas to the liquid in the storage chamber 211 to form water vapor, and then deliver the formed water vapor into the filter chamber 101 through the delivery pipe 222, so that the water vapor can react with the TMA in the filter chamber 101.

[0051] In summary, the ALD exhaust gas treatment device 010 of this utility model can be used in atomic layer deposition equipment. This exhaust gas treatment device can reduce residual TMA gas, greatly extend the service life of the air pump, improve the problem of the air pump being stuck by alumina powder, and reduce the risk of dust backflow.

[0052] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. An ALD exhaust gas treatment device, characterized in that, include: A filtration device (100) includes a filter having a filter chamber (101); A liquid supply device (200) includes a liquid reservoir (210), an air inlet pipe (221), and a delivery pipe (222); wherein the liquid reservoir (210) is provided with a storage chamber (211) for storing liquid; the air inlet pipe (221) is connected to the liquid reservoir (210) and is used to introduce gas into the liquid stored in the storage chamber (211) to form water vapor; The delivery pipe (222) is connected between the storage chamber (211) and the filter, and connects the storage chamber (211) and the filter chamber (101). The delivery pipe (222) is used to pass water vapor in the storage chamber (211) into the filter chamber (101).

2. The ALD exhaust gas treatment device according to claim 1, characterized in that, The ALD exhaust gas treatment device also includes a liquid level detection component, which is disposed in the liquid reservoir (210) and is used to detect the liquid level in the storage chamber (211).

3. The ALD exhaust gas treatment device according to claim 1, characterized in that, The ALD exhaust gas treatment device also includes a liquid replenishment pipe (223), which is connected to the liquid reservoir (210) and is used to replenish liquid into the storage chamber (211).

4. The ALD exhaust gas treatment device according to claim 3, characterized in that, The replenishment tube (223) is connected to the bottom of the storage chamber (211).

5. The ALD exhaust gas treatment device according to claim 1, characterized in that, The ALD exhaust gas treatment device also includes a first valve (231), which is disposed on the intake pipe (221) and is used to open and close the intake pipe (221).

6. The ALD exhaust gas treatment device according to claim 1, characterized in that, The ALD exhaust gas treatment device also includes a second valve (232), which is disposed on the conveying pipe (222) and is used to open and close the conveying pipe (222).

7. The ALD exhaust gas treatment device according to any one of claims 1-6, characterized in that, The delivery pipe (222) has an outlet located at the top of the filter chamber (101) to allow water vapor to flow downward from the top of the filter chamber (101).

8. The ALD exhaust gas treatment device according to any one of claims 1-6, characterized in that, The delivery pipe (222) has an inlet, which is distributed near the top of the storage cavity (211) such that the inlet is spaced apart from the liquid surface of the liquid stored in the storage cavity (211); and / or, The air inlet pipe (221) is provided with an air outlet, which is distributed near the bottom of the storage cavity (211).

9. The ALD exhaust gas treatment device according to any one of claims 1-6, characterized in that, The filtration device (100) also includes a filter element disposed within the filtration chamber (101).

10. An atomic layer deposition apparatus, characterized in that, The device includes a deposition equipment body, an air pump, and an ALD exhaust gas treatment apparatus according to any one of claims 1-9, wherein the deposition equipment body has a reaction chamber, and the filter is connected between the reaction chamber and the air pump.

Images