Semiconductor refrigeration sensitive component convenient to disassemble and assemble

By designing a fixing device, the problem of difficult disassembly of soldered connecting wires in semiconductor cooling sensitive components was solved, achieving stable connection and convenient disassembly of the connecting wires, thus improving maintenance efficiency.

CN224261977UActive Publication Date: 2026-05-19宿迁奇斯灵智能科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
宿迁奇斯灵智能科技有限公司
Filing Date
2025-05-21
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

In existing semiconductor cooling sensitive components, the disassembly and repair of the soldered connection wires are difficult, resulting in inconvenience in the repair process.

Method used

A fixing device was designed, including an upper plate and a lower plate. Through the cooperation of a limiting device and a threaded post, the connecting wire is firmly fixed and easily disassembled. The matching of the limiting groove and the threaded groove simplifies the installation and disassembly process.

Benefits of technology

It achieves a stable connection of the connecting wires, simplifies the installation and disassembly process, improves the efficiency of assembly and disassembly, and saves time and effort.

✦ Generated by Eureka AI based on patent content.

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Abstract

The semiconductor refrigeration sensitive component comprises a refrigeration sheet body, two connecting wires are symmetrically arranged on the side face of the refrigeration sheet body, fixing devices are arranged on the side faces of the connecting wires, each fixing device comprises an upper plate, and a lower plate with the same size is movably connected to the lower portion of the upper plate. Semicircular grooves with the same size are symmetrically formed in the two sides of the upper plate and the two sides of the lower plate, a square groove is formed in the middle of the upper surface of the lower plate, trapezoidal grooves with the same length and height are symmetrically formed in the two sides of the square groove, limiting grooves are formed in the two ends of the square groove, first circular grooves are formed in the two ends of the two sides of the lower plate, and limiting devices are arranged on the side faces of the first circular grooves. Second circular grooves are formed in the two ends of the limiting plates; a threaded groove is formed in the upper portion of the upper plate; a placement groove is formed in the lower surface of the upper plate; connecting plates with the same length are movably connected into the placement groove, fixing square blocks are arranged in the middles of the lower portions of the connecting plates, and trapezoidal blocks are arranged at the two ends of the lower portions of the connecting plates; the utility model is convenient to disassemble and assemble when in use.
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Description

Technical Field

[0001] This utility model belongs to the technical field of cold-sensitive components, and in particular relates to a semiconductor cold-sensitive component that is easy to assemble and disassemble. Background Technology

[0002] Semiconductor cooling sensitive components include temperature sensors, pressure sensors, humidity sensors, and cooling coils. During installation, the cooling coil is connected to the electrical appliance's connection wires via its connecting wires. These two connecting wires are usually fixed together by welding. This makes disassembly and repair difficult when the cooling coil malfunctions. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor cooling sensitive component that is easy to disassemble and install, in order to solve the problem that disassembling welded connection wires during maintenance is troublesome.

[0004] This utility model achieves the above-mentioned objectives through the following technical solution: It includes a cooling chip body, with two connecting lines symmetrically arranged on the side of the cooling chip body. Each connecting line has a fixing device on its side. The fixing device includes an upper plate, with a lower plate of the same size movably connected below the upper plate. The upper and lower plates have symmetrically arranged semi-circular grooves of the same size on both sides. A square groove is located in the middle of the upper surface of the lower plate. Trapezoidal grooves of the same length and height are symmetrically arranged on both sides of the square groove. Limiting grooves are located at both ends of the square groove. First circular grooves are located at both ends of both sides of the lower plate. Limiting devices are located on the sides of the first circular grooves. Limiting plates are located at both ends of the upper plate. Second circular grooves are located at both ends of the limiting plates. A threaded groove is located above the upper plate. A placement groove is located on the lower surface of the upper plate. Connecting plates of the same length are movably connected inside the placement groove. A fixed square block is located in the middle below the connecting plate. Trapezoidal blocks are located at both ends below the connecting plate. A threaded post of the same size is movably connected inside the threaded groove. A movable post is located above the threaded post.

[0005] Furthermore, the limiting device includes a fixed plate, a support plate is provided on the upper surface of the fixed plate away from the first circular groove, a support groove is provided through the side of the support plate, a movable column of the same size is movably connected inside the support groove, a spring is surrounded on the outer surface of the movable column, a limiting column is provided on the side of the movable column near the first circular groove, and a limiting circular plate is provided on the side of the movable column away from the limiting column.

[0006] Furthermore, the fixing plate is fixedly connected to the lower plate, the length of the fixing plate is greater than the length of the limiting post, and the diameter of the limiting circular plate is greater than the diameter of the support groove.

[0007] Furthermore, the limiting post is movably connected inside the first circular groove and the second circular groove, the limiting post is sized to match the first circular groove, and the spring is fixed between the limiting post and the support plate.

[0008] Furthermore, the semicircular grooves on both sides of the upper plate and the semicircular grooves on both sides of the lower plate are symmetrically arranged, and the semicircular grooves at both ends of the upper plate and the lower plate form a circular channel. The connecting line is movably connected within the circular channel and the two are of the same size.

[0009] Furthermore, the limiting plate is movably connected inside the limiting groove and the two are of the same size. The first circular groove is located on the side of the second circular groove and the two have the same diameter. The first circular groove and the limiting groove are connected through each other.

[0010] Furthermore, the threaded groove and the placement groove are connected through each other, the threaded groove and the threaded post are threadedly matched, and the sum of the heights of the threaded post, the fixing block, and the connecting plate is the same as the height of the lower plate.

[0011] Furthermore, the fixed block is movably connected inside the square groove and the two are of the same size, the trapezoidal blocks are all movably connected inside the trapezoidal groove and the two are of the same size, and the threaded groove is located directly above the middle position of the connecting plate.

[0012] Furthermore, the sum of the heights of the fixed block and the connecting plate is less than the height of the placement slot.

[0013] Beneficial effects: This utility model is reasonably designed and has the following beneficial effects:

[0014] 1. This utility model provides a stable connection. Through the cooperation of the upper and lower plates, the limiting post of the limiting device is inserted into the first and second circular grooves, and the threaded post, connecting plate, fixing block and trapezoidal block are connected to the corresponding grooves. This makes the two connecting lines firmly fixed between the upper and lower plates, forming a Z-shape fixed together. The applied pressure can effectively prevent the connecting lines from moving and separating, ensuring the stability of the connection.

[0015] 2. This utility model is easy to assemble and disassemble. During installation, simply operate the limiting circular plate to move the limiting post out, align the upper plate and the lower plate, and then release the limiting circular plate. The spring will then push the limiting post to fix it inside the two circular grooves, thus fixing the upper plate and the lower plate together. Then, rotate the threaded post to complete the fixation. Disassembly is done by reversing the operation. The whole process is simple and quick, greatly improving the efficiency of assembly and disassembly and saving time and effort. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the fixing device structure of this utility model;

[0018] Figure 3 This is an exploded cross-sectional view of the fixing device of this utility model;

[0019] Figure 4 This is a three-dimensional sectional view of the fixing device of this utility model;

[0020] Figure 5 This is an exploded view of the fixing device of this utility model;

[0021] Figure 6 This is an exploded view of the limiting device of this utility model.

[0022] In the diagram: 1-Refrigeration chip body, 2-Connecting wire, 3-Fixing device, 4-Upper plate, 5-Lower plate, 6-Limiting groove, 7-First circular groove, 8-Limiting device, 9-Square groove, 10-Trapezoidal groove, 11-Semi-circular groove, 12-Limiting plate, 13-Second circular groove, 14-Placement groove, 15-Fixing block, 16-Threaded groove, 17-Threaded column, 18-Moving column, 19-Trapezoidal block, 20-Connecting plate;

[0023] 81-Fixed plate, 82-Support plate, 83-Support groove, 84-Moving column, 85-Spring, 86-Limiting round plate, 87-Limiting column. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Combination Figures 1 to 6The semiconductor cooling sensitive component shown includes a cooling chip body 1. Two connecting lines 2 are symmetrically arranged on the side of the cooling chip body 1. Each connecting line 2 has a fixing device 3 on its side. The fixing device 3 includes an upper plate 4, and a lower plate 5 of the same size is movably connected below the upper plate 4. Semicircular grooves 11 of the same size are symmetrically arranged on both sides of the upper plate 4 and the lower plate 5. A square groove 9 is provided in the middle of the upper surface of the lower plate 5. Trapezoidal grooves 10 of the same length and height are symmetrically arranged on both sides of the square groove 9. Limiting grooves 6 are provided at both ends of the square groove 9. First circular grooves 7 are provided at both ends of both sides of the lower plate 5. 7. Limiting devices 8 are provided on all sides. Limiting plates 12 are provided at both ends of the upper plate 4. Second circular grooves 13 are provided at both ends of the limiting plates 12. Threaded grooves 16 are provided on the upper plate 4. Placement grooves 14 are provided on the lower surface of the upper plate 4. Connecting plates 20 of the same length are movably connected inside the placement grooves 14. Fixed blocks 15 are provided in the middle position below the connecting plates 20. Trapezoidal blocks 19 are provided at both ends below the connecting plates 20. Threaded columns 17 of matching size are movably connected inside the threaded grooves 16. Movable columns 18 are provided above the threaded columns 17. The cooling chip body and connecting wires in this utility model are existing technologies and are not described in detail.

[0026] The limiting device includes a fixed plate 81. A support plate 82 is provided on the upper surface of the fixed plate 81 away from the first circular groove 7. A support groove 83 is provided through the side of the support plate 82. A movable column 84 of the same size is movably connected inside the support groove 83. A spring 85 is surrounded on the outer surface of the movable column 84. A limiting column 87 is provided on the side of the movable column 84 close to the first circular groove 7. A limiting circular plate 86 is provided on the side of the movable column 84 away from the limiting column 87.

[0027] The fixing plate 81 is fixedly connected to the lower plate 5. The length of the fixing plate 81 is greater than the length of the limiting post 87, and the diameter of the limiting circular plate 86 is greater than the diameter of the support groove 83.

[0028] The limiting post 87 is movably connected inside the first circular groove 7 and the second circular groove 13. The limiting post 87 is the same size as the first circular groove 7. The spring 85 is fixed between the limiting post 87 and the support plate 82. When the limiting post 87 moves out of the second circular groove 13, the spring 85 is in a compressed state.

[0029] The semi-circular grooves 11 on both sides of the upper plate 4 and the semi-circular grooves 11 on both sides of the lower plate 5 are symmetrically arranged. The semi-circular grooves 11 at both ends of the upper plate 4 and the lower plate 5 form a circular channel. The connecting line 2 is movably connected in the circular channel and the two are of the same size.

[0030] The limiting plate 12 is movably connected inside the limiting groove 6 and the two are of the same size. The first circular groove 7 is located on the side of the second circular groove 13 and the two have the same diameter. The first circular groove 7 and the limiting groove 6 are connected through each other.

[0031] The threaded groove 16 is connected to the placement groove 14 through the threaded groove 16 and the threaded column 17 are threaded and matched. The sum of the heights of the threaded column 17, the fixed block 15, and the connecting plate 20 is the same as the height of the lower plate 5.

[0032] The fixed block 15 is movably connected inside the square groove 9 and the two are of the same size. The trapezoidal blocks 19 are all movably connected inside the trapezoidal groove 10 and the two are of the same size. The threaded groove 16 is located directly above the middle position of the connecting plate 20.

[0033] The sum of the heights of the fixed block 15 and the connecting plate 20 is less than the height of the placement slot 14.

[0034] Working principle: In use, the connecting wire 2 and the connecting wire on the electrical appliance are first placed inside the square groove 9. Then, the limiting circular plate 86 on the limiting device 8 is moved backward. With the cooperation of the moving column 84, the limiting column 87 is moved out of the first circular groove 7. Then, the limiting plate 12 below the upper plate 4 is inserted into the limiting groove 6 of the lower plate 5, so that the first circular groove 7 and the second circular groove 13 are aligned. Then, the limiting circular plate 86 is released. With the action of the spring 85, the limiting column 87 enters into the first circular groove 7 and the second circular groove 13, so that the limiting plate 12 is fixed inside the limiting groove 6, thereby fixing the lower plate 5 and the upper plate 4. The two wires are joined together, and then the threaded column 17 is rotated by the movable column 18, which, in conjunction with the threaded groove 16, causes the threaded column 17 to move downwards. This, through the connecting plate 20, causes the fixing block 15 and trapezoidal block 19 to be fixed inside the square groove 9 and trapezoidal groove 10, respectively. This fixes the middle connecting part of the two connecting wires within the square groove 9, and the two ends of the two connecting wires within the two trapezoidal grooves 10. This results in the two connecting wires being fixed in a "Z" shape between the upper plate 4 and the lower plate 5. The pressure from the fixing block 15, trapezoidal block 19, and the square groove 9 and trapezoidal groove 10 prevents the connecting wires from moving or separating, thus fixing them together. When it is necessary to separate the two connecting wires, the reverse operation can be performed quickly.

[0035] This invention is not limited to the details of the exemplary embodiments described above, and can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor cooling sensitive component that is easy to assemble and disassemble, characterized in that: The device includes a cooling chip body (1), on which two connecting lines (2) are symmetrically arranged on the side. Each connecting line (2) has a fixing device (3) on its side. The fixing device (3) includes an upper plate (4), and a lower plate (5) of the same size is movably connected below the upper plate (4). Both sides of the upper plate (4) and the lower plate (5) have symmetrically arranged semi-circular grooves (11) of the same size. A square groove (9) is provided in the middle of the upper surface of the lower plate (5). Trapezoidal grooves (10) of the same length and height are symmetrically arranged on both sides of the square groove (9). Limiting grooves (6) are provided at both ends of the square groove (9). First circular grooves (7) are provided at both ends of both sides of the lower plate (5). The first circular groove (7) is provided with a limiting device (8) on its side. The upper plate (4) is provided with a limiting plate (12) at both ends. The limiting plate (12) is provided with a second circular groove (13) at both ends. The upper plate (4) is provided with a threaded groove (16) on its upper side. The upper plate (4) is provided with a placement groove (14) on its lower surface. The placement groove (14) is connected to a connecting plate (20) of the same length. The connecting plate (20) is provided with a fixed block (15) at the middle position below it. The connecting plate (20) is provided with trapezoidal blocks (19) at both ends below it. The threaded groove (16) is connected to a threaded column (17) of the same size. The threaded column (17) is provided with a movable column (18) above it.

2. The easily detachable semiconductor cooling sensitive component according to claim 1, characterized in that: The limiting device includes a fixed plate (81), and a support plate (82) is provided on the upper surface of the fixed plate (81) away from the first circular groove (7). A support groove (83) is provided through the side of the support plate (82). A movable column (84) of the same size is movably connected inside the support groove (83). A spring (85) is surrounded on the outer surface of the movable column (84). A limiting column (87) is provided on the side of the movable column (84) close to the first circular groove (7). A limiting circular plate (86) is provided on the side of the movable column (84) away from the limiting column (87).

3. The easily detachable semiconductor cooling sensitive component according to claim 2, characterized in that: The fixing plate (81) is fixedly connected to the lower plate (5). The length of the fixing plate (81) is greater than the length of the limiting post (87), and the diameter of the limiting circular plate (86) is greater than the diameter of the support groove (83).

4. The easily detachable semiconductor cooling sensitive component according to claim 2, characterized in that: The limiting post (87) is movably connected inside the first circular groove (7) and the second circular groove (13). The limiting post (87) is the same size as the first circular groove (7). The spring (85) is fixed between the limiting post (87) and the support plate (82).

5. A semiconductor cooling sensitive component that is easy to assemble and disassemble according to claim 1, characterized in that: The semicircular grooves (11) on both sides of the upper plate (4) and the semicircular grooves (11) on both sides of the lower plate (5) are symmetrically arranged. The semicircular grooves (11) at both ends of the upper plate (4) and the lower plate (5) form a circular channel. The connecting line (2) is movably connected in the circular channel and the two are of the same size.

6. The easily detachable semiconductor cooling sensitive component according to claim 1, characterized in that: The limiting plate (12) is movably connected to the inside of the limiting groove (6) and the two are the same size. The first circular groove (7) is located on the side of the second circular groove (13) and the two have the same diameter. The first circular groove (7) and the limiting groove (6) are connected through each other.

7. A semiconductor cooling sensitive component that is easy to assemble and disassemble according to claim 1, characterized in that: The threaded groove (16) is connected to the placement groove (14) through the threaded groove (16) and the threaded column (17) are threadedly matched. The sum of the heights of the threaded column (17), the fixed block (15), and the connecting plate (20) is the same as the height of the lower plate (5).

8. A semiconductor cooling sensitive component that is easy to assemble and disassemble according to claim 1, characterized in that: The fixed block (15) is movably connected to the inside of the square groove (9) and the two are of the same size. The trapezoidal blocks (19) are all movably connected to the inside of the trapezoidal groove (10) and the two are of the same size. The threaded groove (16) is located directly above the middle position of the connecting plate (20).

9. A semiconductor cooling sensitive component that is easy to assemble and disassemble according to claim 1, characterized in that: The sum of the heights of the fixed block (15) and the connecting plate (20) is less than the height of the placement slot (14).