Novel photoelectric sensor

Abstract

A novel photoelectric sensor comprises an integrally-formed shell assembly, and the shell assembly is composed of a light-transmitting part and a non-light-transmitting part. The light-transmitting part comprises two lenses, the non-light-transmitting part is a wrapping shell integrally connected to the peripheries of the lenses, a circuit board is further arranged in the wrapping shell, a signal processing area of the circuit board right faces the light-transmitting part, and light rays are emitted into the shell assembly through the lenses or are emitted outwards from the interior of the shell assembly through the lenses. The photoelectric sensor structure provided by the scheme adopts an integrated injection molding scheme, integrates the lens and the shell, and has the advantages of being compact in structure, simple and convenient to assemble, accurate in light path alignment, high in production consistency, low in manufacturing cost and the like.

Description

Technical Field

[0001] This utility model relates to the field of sensor processing and manufacturing technology, and in particular to a novel photoelectric sensor. Background Technology

[0002] Photoelectric sensors are devices that use optical principles to sense the position, distance, shape, or presence / absence of target objects. They are widely used in various fields such as industrial automation, consumer electronics, and security equipment. For example, ranging photoelectric sensors, as a key branch, are widely deployed in intelligent detection and precision control systems due to their non-contact measurement capabilities.

[0003] However, existing photoelectric sensors still have the following shortcomings in terms of structural design and manufacturing process: In existing products, the lens and the housing are usually two independent components, each molded using injection molding. Because they are separate structures, they must be manually assembled in subsequent production processes. This design not only increases the investment cost of molds and equipment, but also leads to low assembly efficiency, high labor costs, and may affect product consistency and performance stability due to assembly errors. At the same time, existing photoelectric sensors assembled from two independent components require a three-dimensional circuit board to achieve spatial layout optimization and functional integration. Furthermore, since the lens and housing are molded separately, two sets of independent molds and two injection molding machines are often required, which restricts production and increases the burden of equipment investment and maintenance costs.

[0004] Therefore, there is an urgent need for a photoelectric sensor structure with high structural integration, simplified manufacturing process, and excellent cost control to address the shortcomings of existing technologies in terms of structural assembly, circuit layout, and manufacturing efficiency, and to improve overall product performance and production efficiency. Utility Model Content

[0005] In view of the shortcomings of the existing technology, this utility model provides a new type of photoelectric sensor that can effectively reduce production costs and reduce assembly errors.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A novel photoelectric sensor includes an integrally formed housing assembly, which is composed of a light-transmitting part and a light-blocking part. The light-transmitting part includes two lenses, and the light-blocking part is an integrally connected housing surrounding the lenses. A circuit board is also provided inside the housing, with the signal processing area of ​​the circuit board facing the light-transmitting part. Light enters the housing assembly through the lenses or exits the housing assembly from the inside through the lenses.

[0008] Furthermore, the circuit board can be either a double-sided printed planar circuit board or a three-dimensional circuit board.

[0009] Furthermore, the signal processing area of ​​the circuit board includes a signal transmitting end and a signal receiving end, and the signal transmitting end and the signal receiving end each correspond to two lenses.

[0010] Furthermore, a mounting groove is provided inside the non-transparent portion of the housing, and the circuit board is disposed in the mounting groove.

[0011] Furthermore, the connection method between the circuit board and the mounting slot includes, but is not limited to, any one of snap-fit, adhesive bonding, or soldering.

[0012] Furthermore, the light-transmitting part uses a resin material of the first color, and the non-light-transmitting part uses a resin material of the second color. Multiple resin materials are sequentially injected into the same mold during the injection molding process to form a continuous and stable integrated shell assembly.

[0013] Furthermore, the housing assembly has a cuboid structure, and the two lenses are disposed on the same end face covering the housing.

[0014] This utility model has the following beneficial effects:

[0015] 1. This application integrates the traditionally separate and independent housing and lens of a photoelectric sensor into a single process, reducing the necessary assembly steps in existing technologies, lowering production costs, and improving production efficiency. Simultaneously, it avoids measurement errors caused by tolerances between the lens and housing during assembly.

[0016] 2. In traditional photoelectric sensors, the housing and lens are independent components, and the two parts usually need to be assembled using a stepped positioning and fitting structure. To adapt to this stepped frame structure and improve space utilization, a three-dimensional circuit board is typically required. However, since this application integrates the lens and housing into a single unit, a double-sided printed circuit board can be used. Compared with imported three-dimensional circuit boards, this reduces the price and simplifies the manufacturing process, thereby reducing the overall hardware cost of the sensor, while maintaining the original functionality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0018] Figure 2 This is a structural schematic diagram from another perspective of an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of a double-sided printed planar circuit board according to an embodiment of the present utility model;

[0020] Figure 4 This is a schematic diagram of the structure of a three-dimensional circuit board in the prior art;

[0021] Figure 5 This is a schematic diagram of the structure of a split lens in the prior art;

[0022] Figure 6 This is a schematic diagram of the structure of a split-type shell in the prior art.

[0023] In the above figures: 1. Housing assembly; 2. Lens; 3. Encasing housing; 4. Double-sided printed circuit board; 5. Mounting slot. Detailed Implementation

[0024] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.

[0025] like Figure 1 As shown, this embodiment of the present invention provides a novel photoelectric sensor, specifically a ranging sensor, comprising an integrally formed housing assembly 1. The housing assembly 1 has an overall cuboid structure and consists of a light-transmitting portion and a light-blocking portion.

[0026] The light-transmitting part includes two lenses 2 arranged side by side. Light enters the housing assembly 1 through the lenses 2 or exits from the housing assembly 1 through the lenses 2. The non-light-transmitting part is a housing 3 integrally connected to the periphery of the lenses 2, and the two lenses 2 are disposed on the same end face of the housing 3.

[0027] like Figure 2 As shown, the housing 3 has a mounting groove 5 for mounting the circuit board. In this embodiment, the mounting groove 5 is a recessed slot that mates with the circuit board. This recessed slot is located on one surface of the housing 3. A portion of the lens 2 located inside the housing 3 is exposed within the mounting groove 5, allowing light to pass through normally without obstruction. Its shape is rectangular, which defines the position of the circuit board, with the signal processing area of ​​the circuit board facing the light-transmitting portion.

[0028] The circuit board can be any one of a double-sided printed planar circuit board or a three-dimensional circuit board. In this embodiment, such as... Figure 3 As shown, the circuit board is preferably a double-sided printed circuit board 4, whose signal processing area is provided with a signal transmitting end and a signal receiving end. After the double-sided printed circuit board 4 is installed in the mounting slot 5, the signal transmitting end and the signal receiving end are respectively facing the two lenses 2, which can realize the functions of light signal emission and incidence. Among them, light can be emitted from the signal transmitting end through one of the lenses 2 and exit the housing assembly 1, or external light can enter the housing assembly 1 through the other lens 2 and reach the signal receiving end, forming a complete photoelectric ranging path.

[0029] The housing assembly 1 is manufactured using a two-color injection molding process. The light-transmitting parts use a first-color optical-grade resin, such as PC or PMMA, while the non-light-transmitting parts use a second-color light-shielding resin, such as black ABS or PA+GF. Conductive fillers such as graphene can also be added to the resin material of the non-light-transmitting parts to provide conductivity. The first and second-color resin materials work together to interconnect. The two-color injection molding process uses a professional two-color injection molding machine to continuously inject different materials into the same mold cavity, achieving a division of light-transmitting / light-shielding functions while maintaining structural continuity and boundary stability. This ensures consistency in product dimensional stability, assembly accuracy, and optical performance.

[0030] The connection methods between the circuit board and the housing 3 include, but are not limited to, snap-fit ​​connection, adhesive fixing, or welding fixing. In this embodiment, it is preferable to adhesive the circuit board in the mounting groove 5 to achieve rapid assembly of the circuit board.

[0031] Furthermore, the two lenses 2 can be spherical lenses, aspherical lenses, Fresnel lenses, or cylindrical lenses, and can be customized and optimized according to different optical focusing requirements. A light-shielding isolation structure or an inner cavity wall can be provided between the two lenses 2 to isolate the optical path and avoid signal interference or crosstalk.

[0032] The shape of the housing component 1 is not limited to a cuboid; it can also be changed to a cylinder, an irregularly shaped housing, etc., depending on the actual installation environment, as long as it meets the requirements of integrated structure, optical precision control, and installation space constraints.

[0033] The existing technology requires the assembly of photoelectric sensor structures such as Figure 4-6 As shown, in existing products, the lens and the housing are usually two separate parts, which are formed by injection molding. Since they are separate structures, they must be manually assembled in subsequent production processes.

[0034] The photoelectric sensor structure provided in this embodiment adopts an integrated injection molding scheme, integrating the lens 2 and the covering shell 3. Compared with the prior art, the solution in this application has the advantages of compact structure, simple assembly, accurate optical path alignment, high production consistency, and low manufacturing cost, and is suitable for photoelectric ranging or object recognition scenarios with high requirements for consistency and reliability.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A novel photoelectric sensor, characterized in that: The device includes an integrally formed housing assembly (1), which is composed of a light-transmitting part and a non-light-transmitting part; the light-transmitting part includes two lenses (2), and the non-light-transmitting part is a housing (3) integrally connected to the periphery of the lenses (2). A circuit board is also provided inside the housing (3), and the signal processing area of ​​the circuit board faces the light-transmitting part. Light enters the housing assembly (1) through the lenses (2) or light exits from the inside of the housing assembly (1) through the lenses (2).

2. The novel photoelectric sensor according to claim 1, characterized in that, The circuit board can be either a double-sided printed planar circuit board (4) or a three-dimensional circuit board.

3. The novel photoelectric sensor according to claim 1, characterized in that, The signal processing area of ​​the circuit board includes a signal transmitting end and a signal receiving end, and the signal transmitting end and the signal receiving end correspond to two lenses (2) respectively.

4. A novel photoelectric sensor according to claim 1, characterized in that, A mounting groove (5) is provided inside the non-transparent housing (3), and the circuit board is placed in the mounting groove (5).

5. A novel photoelectric sensor according to claim 4, characterized in that, The connection method between the circuit board and the mounting groove (5) includes, but is not limited to, any one of snap-fit, adhesive bonding, or welding.

6. A novel photoelectric sensor according to claim 1, characterized in that, The light-transmitting part uses a resin material of the first color, and the non-light-transmitting part uses a resin material of the second color. Multiple resin materials are sequentially injected into the same mold during the injection molding process to form a continuous and stable integrated shell assembly (1).

7. A novel photoelectric sensor according to claim 1, characterized in that, The housing assembly (1) has a cuboid structure, and the two lenses (2) are disposed on the same end face of the housing (3).

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