Internal memory heat dissipation module

Abstract

The utility model provides a memory heat dissipation module which comprises a heat dissipation assembly composed of a front plate and a back plate, the front plate and the back plate form a cavity structure comprising a phase change area and a backflow area in a welding mode, the lower portion of a vacuum cavity is filled with phase change media, and the phase change media can be transferred to the upper backflow area after being heated. According to the utility model, the vacuum cavity is divided into a plurality of backflow channels by the support bumps, the heat dissipation teeth and the heat dissipation through holes covering the surfaces of the support bumps are formed on the front plate through a stamping process, heat of the support bumps can be transmitted to the heat dissipation teeth and the heat dissipation through holes without any obstruction, and the heat dissipation capability is improved while the front plate is supported. According to the embodiment of the invention, a structure for clamping the memory by the two groups of heat dissipation assemblies is provided, and the whole heat dissipation device is divided into an upper air cooling area and a lower clamping area, so that the installation of the memory is not influenced. The utility model can satisfy the radiating effect of 30W power consumption of the memory, and is particularly suitable for the memory of a data center / server / intelligent chip.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device, and more particularly to a memory heat dissipation module. Background Technology

[0002] With the rise of artificial intelligence, the demand for computing power in data centers, servers, and smart chips has increased significantly, leading to a substantial increase in the power consumption of individual servers and their associated memory modules. Relying solely on the memory's own heat dissipation is insufficient to meet its thermal performance requirements. Traditional improvements to memory heat dissipation have focused on enhancing the materials or structure of the memory itself to increase the heat dissipation area or improve heat dissipation capacity. However, these improvements are limited and cannot meet the ever-increasing heat dissipation demands. Therefore, it is necessary to design new heat dissipation devices to enhance the heat dissipation capacity of the memory. Utility Model Content

[0003] To solve the above technical problems, this utility model provides a memory heat dissipation module, including a heat dissipation component, the heat dissipation component comprising:

[0004] Front panel, one side of which is in contact with a heat source;

[0005] A back plate is disposed on the opposite side of the front plate and together with the front plate forms a sealed vacuum cavity;

[0006] A phase change region is located in the lower part of the vacuum cavity, and the phase change region is filled with a phase change medium.

[0007] The reflux zone is located in the upper part of the vacuum cavity and is connected to the phase change zone;

[0008] Multiple sets of support protrusions are set in the recirculation zone, connecting the front plate and the back plate and isolating the vacuum cavity. The multiple sets of support protrusions form a vertically arranged recirculation channel.

[0009] It also has multiple heat dissipation holes on the front panel, which are positioned corresponding to the support protrusions. The inner side of the heat dissipation holes is sealed to the support protrusions, and heat dissipation teeth are provided on the outer side of the heat dissipation holes.

[0010] Furthermore, the front plate is provided with a heat-conducting part that contacts the heat source on the outside of the phase change zone to enhance the heat transfer capability of the heat source to the phase change medium.

[0011] Furthermore, the heat-conducting part is a heat-conducting block that adheres to the surface of the heat source or an interface material coated on the outer side of the front panel.

[0012] Furthermore, the back panel includes an outer sealing edge surrounding the edge and a recessed area enclosed by the outer sealing edge, with a support protrusion formed within the recessed area; the front panel is sealed to the outer sealing edge and the support protrusion.

[0013] Furthermore, multiple support portions are arranged within the phase transition zone, and the support portions are located between the front plate and the back plate.

[0014] Furthermore, the heat dissipation components are in two sets, respectively connected to both sides of the heat source. The outer sides of the two sets of front panels are arranged opposite each other, forming a clamping position at the bottom and a cooling channel at the top between the two sets of front panels.

[0015] Furthermore, an air-cooling component is also provided, with openings at both ends of the air-cooling channel, and the airflow generated by the air-cooling component flows from one end of the air-cooling channel to the other end.

[0016] Furthermore, the opposing surfaces of the two sets of heat dissipation components are provided with connecting edges, which extend from the edges of the heat dissipation components, and the two sets of heat dissipation components are connected by the connecting edges.

[0017] Furthermore, the heat dissipation fins on the two sets of front panels are arranged at intervals in the vertical direction.

[0018] This invention provides a memory heat dissipation module, including a heat dissipation assembly composed of a front plate and a back plate. The front plate and back plate are welded together to form a cavity structure containing a phase change region and a reflux region. The lower part of the vacuum cavity is filled with a phase change medium, which transfers heat to the upper reflux region. The supporting protrusions of this invention divide the vacuum cavity into multiple reflux channels. The front plate is stamped to form heat dissipation teeth and heat dissipation holes covering the surface of the supporting protrusions. The heat from the supporting protrusions can be transferred unimpeded to the heat dissipation teeth and heat dissipation holes, increasing heat dissipation capacity while supporting the front plate. The embodiment provides a structure with two sets of heat dissipation assemblies clamping the memory, dividing the entire heat dissipation device into an upper air-cooling area and a lower clamping area, without affecting memory installation. This invention has the advantages of stable structure and convenient assembly, and can meet the heat dissipation effect of 30W memory power consumption, making it particularly suitable for memory use in data centers / servers / intelligent chips. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the heat dissipation component of this utility model;

[0020] Figure 2 This is an exploded view of the heat dissipation component of this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of a memory heat dissipation module according to the present invention;

[0022] Figure 4 This is an exploded view of a memory heat dissipation module according to the present invention;

[0023] Figure 5 This is a side view of a memory heat dissipation module according to the present invention.

[0024] Reference numerals: 1. Front plate; 2. Back plate; 3. Vacuum cavity; 4. Supporting protrusion; 5. Heat dissipation hole; 6. Heat dissipation tooth; 7. Outer sealing edge; 8. Support part; 9. Connecting edge; 10. First connecting hole; 11. Second connecting hole; 12. Liquid injection port; 13. Memory; 14. Slot; 15. Phase change zone; 16. Recirculation zone; 17. Air cooling channel. Detailed Implementation

[0025] Example 1: A memory heat dissipation module suitable for memory heat dissipation in electronic devices such as servers, data centers, and GPU chips. See [link to example]. Figure 1 and Figure 2 The system includes a heat dissipation assembly consisting of a front plate 1 and a back plate 2 arranged opposite each other. Both the front plate 1 and the back plate 2 are plate-like structures, sealed together at their edges. Gas is extracted from between the front plate 1 and the back plate 2, forming a sealed vacuum chamber 3. The vacuum chamber 3 is divided into a reflux zone 16 and a phase change zone 15 from top to bottom. The phase change zone 15 is filled with a phase change medium, and the reflux zone 16 is located above and connected to the phase change zone 15. The outer surface of the front plate 1, corresponding to the phase change zone 15, contacts the heat source. Heat is transferred from the front plate 1 to the phase change medium within the vacuum chamber. Upon heating, the phase change medium undergoes a phase change and flows upwards. Upon reaching the reflux zone 16, it releases heat, condenses into a liquid, and returns to the lower phase change zone 15 to continue participating in heat exchange with the heat source. The vacuum chamber provides a sufficient and stable phase change environment for the phase change medium, reducing heat loss due to heat conduction and convection, and improving the thermal radiation efficiency of the phase change medium.

[0026] In this embodiment, phase change media such as water and alcohol are selected. The phase change temperature in a vacuum environment is close to room temperature, which can better dissipate heat from the memory 13 in the heat source environment.

[0027] The purpose of this invention is to construct a heat dissipation component based on the phase change principle. Multiple sets of support protrusions 4 made of thermally conductive material are arranged side-by-side within the reflux zone 16. These support protrusions 4 connect the front plate 1 and the back plate 2, separating the vacuum cavity 3, thus forming multiple vertically arranged reflux channels between the support protrusions 4. These reflux channels are connected to the phase change zone 15. The phase change medium in the reflux zone 16 exchanges heat with each support protrusion 4, and after cooling, returns to the phase change zone 15 along the reflux channels. The front plate 1 has heat dissipation holes 5 corresponding to the positions of each support protrusion 4. The inner side of each heat dissipation hole 5 is sealed to the support protrusion 4, and the outer side of each heat dissipation hole 5 has outwardly extending heat dissipation teeth 6. The heat exchanged between the support protrusions 4 and the phase change medium is transferred to the atmosphere through the heat dissipation teeth 6, achieving sufficient heat exchange with the external atmospheric environment.

[0028] In the above structure, the support protrusion 4 is connected to the inner side of the front plate 1, dividing the reflux zone 16 into multiple reflux channels without affecting the sealing of the vacuum chamber 3; the support protrusion 4 can support the front plate 1 and prevent the front plate 1 from deforming during the vacuum extraction process. The heat dissipation holes 5 are arranged in an array on the surface of the front plate 1, so that the outer surface of the support protrusion 4 is unobstructed, and the heat in the reflux channel is directly transferred to the atmosphere through the support protrusion 4. The heat dissipation teeth 6 concentrate the heat transferred from the support protrusion 4 onto the heat dissipation teeth 6, extending the heat exchange area with the atmosphere without blocking the heat dissipation holes 5.

[0029] Furthermore, the front panel 1 has a heat-conducting part on the outer side of the phase change zone 15 that contacts the heat source, thereby enhancing the heat transfer process from the heat source to the phase change medium. The heat-conducting part can be a heat-conducting block made of heat-conducting material that contacts the heat exchange surface of the heat source, transferring heat while positioning the heat source; or it can be an interface material coated on the outer side of the front panel 1, through which heat is dissipated.

[0030] Furthermore, both the back plate 2 and the front plate 1 are made of thermally conductive metal materials, such as stainless steel or copper. The back plate 2 includes an outer sealing edge 7 around its edge and a recessed area enclosed by the outer sealing edge 7. A support protrusion 4 is formed in the recessed area, and its upper surface is approximately flush with the surface of the outer sealing edge 7. Heat dissipation holes 5 are formed on the surface of the front plate 1, and heat dissipation teeth 6 are formed by stamping the edges of the heat dissipation holes 5, which is convenient and quick. The front plate 1 and the back plate 2 are sealed by laser welding. After assembly, the edge of the front plate 1 is attached to the outer sealing edge 7 of the back plate 2, and the middle part of the front plate 1 is attached to the edge of the support protrusion 4. The support protrusion 4 is connected to the edges of each heat dissipation hole 5, which can effectively support the front plate 1 and maintain a high vacuum in the return channel. The heat dissipation holes 5 are opened on the surface of the support protrusion 4, and the support protrusion 4 transfers heat to the front plate 1. Some of the heat from the support protrusion 4 flows into the atmosphere without obstruction, and some of the heat is concentrated in the heat dissipation teeth 6, thereby improving the heat exchange efficiency of the support protrusion 4.

[0031] Furthermore, the edge of the heat dissipation component, specifically the outer sealing edge 7 area on the back plate 2, is provided with a liquid injection port 12. The liquid injection port 12 connects to the vacuum chamber 3. After the back plate 2 and the front plate 1 are welded together, a phase change medium is injected into the vacuum chamber through the liquid injection port 12. The liquid injection port 12 is then connected to a vacuum pump to extract the gas from the vacuum chamber 3. The liquid injection port 12 is then cut off or sealed to ensure the vacuum level in the vacuum chamber 3. The entire molding process is simple and easy to implement, and the supporting protrusion 4 provides sufficient support to the front plate 1.

[0032] Furthermore, multiple support portions 8 are arranged within the phase transition zone 15. The support portions 8 are located between the front plate 1 and the back plate 2. The support portions 8 can be rib structures, columnar structures, etc., and are distributed within the phase transition zone 15. The function of the support portions 8 is similar to that of the support protrusions 4, which is to provide support for the front plate 1 during the vacuuming stage and prevent the front plate 1 from undergoing excessive deformation.

[0033] This invention differs from existing capillary heat dissipation structures. It is designed based on the principle of phase change medium reflux, and has the advantages of strong heat dissipation capacity, low molding difficulty, and high structural strength.

[0034] Example 2: As Figure 3 and Figure 4 The diagram illustrates an application example of the aforementioned heat dissipation components in a memory cooling system. The system includes a slot 14, a cooling component located at the end of the slot 14 along its length, and a memory module inserted into the slot 14 as the heat source. Two sets of heat dissipation components, as shown in Embodiment 1, are also provided. These components are connected to both sides of the memory module 13. The front plates 1 of each phase-change cooling component are positioned opposite each other and are in contact with one surface of the memory module 13 for heat exchange. The two front plates 1 are divided into an upper heat absorption zone and a lower heat dissipation zone corresponding to the phase-change zone 15 and the recirculation zone 16. The memory module 13 is located within the heat absorption zone and is held between the cooling components on both sides. The heat dissipation fins 6 of the two front plates 1 are positioned opposite each other, forming a cooling channel 17 between them. The cooling channel 17 is open at both ends, allowing the cooling airflow generated by the cooling component to enter through one opening and exit through the other, carrying away heat from the cooling channel 17 through airflow, thereby cooling the support protrusion 4 and the heat dissipation fins 6.

[0035] Furthermore, the heat dissipation fins 6 on the two sets of front panels 1 are not necessarily symmetrically arranged in the vertical direction, but are arranged in a staggered pattern. This arrangement allows the width of the air-cooling channel 17 to be adapted to the width of the memory 13, increasing the heat dissipation area of ​​the heat dissipation fins 6 without increasing the width of the air-cooling channel 17. In this embodiment, the support protrusions 4 are arranged in eight sets, and each set of support protrusions 4 has 4-6 vertically arranged heat dissipation through holes 5. The size of a single heat dissipation fin 6 is approximately half that of the air-cooling channel 17. This arrangement structure can enhance the convection area between the heat dissipation fins 6 and the cooling gas.

[0036] In this embodiment, the surfaces of the two sets of heat dissipation components facing each other are provided with connecting edges 9. The connecting edges 9 extend from the edge of the heat dissipation components to the opposite side from the edge of the front panel 1. First connecting holes 10 are provided at corresponding positions of the two sets of connecting edges 9. Connectors, such as rivets or screws, are inserted into the first connecting holes 10 to fix the positions of the two sets of heat dissipation components by riveting or screwing, thus fixing the two sets of heat dissipation components into a whole. This allows the two sets of heat dissipation components to stably clamp the memory 13. The fact that the connecting edges 9 are located at the edge of the front panel 1 makes them easier to process. Since the bottom of the heat dissipation components is the heat conduction and clamping area of ​​the memory 13, the connecting edges 9 are preferably located at the upper edge and side edge of the front panel 1. The position of the side edge connecting edges 9 is preferably located in the lower clamping area to avoid obstructing the air cooling channel 17.

[0037] Furthermore, positioning components are provided on the opposing surfaces of the two sets of heat dissipation components to position the two sets of heat dissipation components, including, for example... Figure 2 The second connecting holes 11 shown are provided on the surfaces of two sets of heat dissipation components. These holes are formed on the surface of the thermally conductive protrusions to prevent affecting the vacuum level of the vacuum chamber 3 during connection. A connector is inserted into the second connecting hole 11 to fix the position of the two sets of heat dissipation components from the middle. It should be noted that this positioning component is not limited to riveting or screwing structures; other common snap-fit ​​or fastening structures can also be used. For example, a positioning post can be provided on one set of heat dissipation components, and a positioning hole can be provided on the other set of heat dissipation components to achieve the positioning function of the two sets of heat dissipation components.

[0038] Combination Figures 3 to 5 The preparation process of this embodiment is roughly as follows: two sets of back plates 2 and front plates 1 are prepared respectively. A support protrusion 4 is stamped on one side surface of the back plate 2, and a heat dissipation through hole 5 and a heat dissipation tooth 6 are stamped on the front plate 1 at the position corresponding to the support protrusion 4. The back plate 2 and the front plate 1 are assembled, and the edge of the back plate 2 and the edge of the support protrusion 4 are sealed by welding to maintain the sealing of the vacuum cavity 3. The phase change medium is injected into the vacuum cavity 3 through the injection port 12 and the vacuum is drawn off, and the injection port 12 is sealed. The two sets of heat dissipation components are connected, and the heat source is clamped between the two sets of front plates 1 so that the heat dissipation surfaces on both sides of the heat source are in contact with the outer side of the phase change zone 16.

[0039] In this embodiment, the memory 13 is sandwiched between two sets of heat dissipation components. The lower part of the memory 13 extends out of the lower surface of the front panel 1, and the two sets of heat dissipation components and the memory 13 form a whole. When the memory 13 is inserted into the slot 14, the heat generated by the memory 13 is transferred to the phase change medium. After the phase change medium undergoes a phase change, the heat is transferred to the heat dissipation through-holes 5 and heat dissipation teeth 6 via thermally conductive bumps. The two opposing front panels 1 limit the air-cooling area, and the air-cooling components dissipate heat from the air-cooling channel 17. Actual testing shows that this embodiment can meet the power consumption requirements of memory exceeding 30W, which is far greater than the heat dissipation devices made using capillary structures in the prior art.

[0040] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A memory heat dissipation module, characterized in that: Includes a heat dissipation component, the heat dissipation component comprising: Front panel (1), one side of which is in contact with a heat source; The back plate (2) is located on the opposite side of the front plate (1) and forms a sealed vacuum cavity (3) with the front plate (1); A phase change region (15) is located in the lower part of the vacuum cavity (3), and the phase change region (15) is filled with a phase change medium; The reflux zone (16) is located at the top of the vacuum cavity (3) and is connected to the phase change zone (15); Multiple sets of support protrusions (4), made of thermally conductive material, are set in the reflux area (16), connecting the front plate (1) and the back plate (2) and separating the vacuum cavity (3). The multiple sets of support protrusions (4) form a vertically arranged reflux channel. And multiple heat dissipation through holes (5) opened on the front plate (1), the heat dissipation through holes (5) are set at the position corresponding to the support protrusion (4), the inner side of the heat dissipation through hole (5) is sealed to the support protrusion (4), and heat dissipation teeth (6) are opened on the outer side of the heat dissipation through hole (5).

2. The memory heat dissipation module as described in claim 1, characterized in that: The front plate (1) is provided with a heat-conducting part that contacts the heat source on the outside of the phase change zone (15) to enhance the heat transfer capability of the heat source to the phase change medium.

3. A memory heat dissipation module as described in claim 2, characterized in that: The heat-conducting part is a heat-conducting block that fits onto the surface of the heat source or an interface material coated on the outer side of the front plate (1).

4. A memory heat dissipation module as described in claim 1, characterized in that: The back panel (2) includes an outer sealing edge (7) around the edge and a recessed area surrounded by the outer sealing edge (7), and a support protrusion (4) is formed in the recessed area; the front panel (1) is sealed to the outer sealing edge (7) and the support protrusion (4).

5. A memory heat dissipation module as described in claim 1, characterized in that: Multiple support parts (8) are arranged in the phase transition zone (15), and the support parts (8) are located between the front plate (1) and the back plate (2).

6. A memory heat dissipation module as described in any one of claims 1-5, characterized in that: The heat dissipation components are in two sets, which are respectively connected to the two sides of the heat source. The outer sides of the two sets of front plates (1) are arranged opposite each other, forming a clamping position at the bottom and a cooling channel (17) at the top between the two sets of front plates (1).

7. A memory heat dissipation module as described in claim 6, characterized in that: It is also equipped with an air-cooling component, with openings at both ends of the air-cooling channel (17), and the airflow generated by the air-cooling component flows from one end of the air-cooling channel (17) to the other end.

8. A memory heat dissipation module as described in claim 6, characterized in that: Two sets of heat dissipation components are provided with connecting edges (9) on their opposite surfaces. The connecting edges (9) extend from the edges of the heat dissipation components, and the two sets of heat dissipation components are connected by the connecting edges (9).

9. A memory heat dissipation module as described in claim 6, characterized in that: The heat dissipation teeth (6) on the two sets of front plates (1) are arranged at intervals in the vertical direction.

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