PCB pin injection molding integrated support and injection mold thereof

Abstract

The utility model discloses a PCB pin injection molding integrated support and an injection mold thereof, the PCB pin injection molding integrated support comprises an integrated base, and the base is provided with metal pins, a plurality of pin fixing structures distributed in a matrix, at least two asymmetric positioning holes used for being matched with mounting holes of a PCB, and a heat dissipation structure. The mold cavity is formed after the upper mold and the lower mold are assembled, the shape of the mold cavity is matched with that of the support, a pin positioning mechanism is arranged in the lower mold, and the lower mold is further provided with an ejection mechanism. The support is integrally formed to improve the stability of the structure, the metal pins are fixed and connected reliably through injection molding, the functions of accurate positioning and dislocation prevention are achieved, and the installation accuracy is guaranteed. The heat dissipation efficiency is effectively improved, and the method is suitable for high-power scenes. The guide grooves facilitate assembly guiding, and the installation efficiency is improved. The elastic clamping jaw in the mold ensures that the contact pin is accurately positioned, and the ejection mechanism facilitates smooth demolding.

Description

Technical Field

[0001] This utility model relates to the field of PCB pin injection molding technology, specifically to an integrated PCB pin injection molding bracket and its injection mold. Background Technology

[0002] In the field of electronic circuits, PCB pin headers are key components for achieving electrical connections between circuit boards and external devices. Traditional PCB pin headers often employ a split structure, with metal pins and bases fixed by simple plugging or glue. This results in insufficient connection strength and loosening over time, leading to poor contact. Furthermore, existing header positioning methods rely on symmetrical hole structures, which are prone to rotation or misalignment during installation, affecting the precise alignment of pins with PCB pads and reducing production efficiency. In addition, the heat generated by high-density electronic components during operation is difficult to dissipate effectively. Traditional heat dissipation designs rely solely on natural heat dissipation from the base surface, resulting in low efficiency and leading to oxidation of metal pins and aging of the base material, affecting equipment stability. Utility Model Content

[0003] In order to overcome the shortcomings of existing technical solutions, this utility model provides an integrated PCB pin injection molded bracket and its injection mold, which can effectively solve the problems raised in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A PCB pin injection molded integrated bracket includes an integrally formed base. The base is provided with metal pins, a plurality of pin fixing structures arranged in a matrix, at least two asymmetric positioning holes for matching with mounting holes on the PCB board, and a heat dissipation structure. The asymmetric positioning holes are respectively provided on both sides of the base edge.

[0006] The bottom of the metal pin is embedded in the pin fixing structure and fixed by injection molding, and the top of the metal pin extends out of the base surface to form a plug end;

[0007] The heat dissipation structure includes a heat conduction channel inside the base and heat dissipation fins on the outer surface of the base. The heat conduction channel is connected to the pin fixing structure.

[0008] As a further description of the above technical solution, the pin fixing structure is a blind hole structure, the inner wall of the pin fixing structure is provided with an annular groove, and the bottom of the metal pin is provided with a protrusion that is interference-fitted with the annular groove.

[0009] As a further description of the above technical solution, the lower surface of the base is provided with an anti-misalignment boss, the outline of which matches the corresponding mounting area of ​​the PCB board.

[0010] As a further description of the above technical solution, the side wall of the base is also provided with a guide groove, the depth direction of which is perpendicular to the extension direction of the pin.

[0011] As a further description of the above technical solution, the heat dissipation structure is filled with a thermally conductive silicone layer in the heat conduction channel, and the thermally conductive silicone layer is in contact with the bottom of the metal pin.

[0012] As a further description of the above technical solution, the asymmetric positioning holes have different diameters, and the inner wall of one of the positioning holes is provided with an anti-rotation plane.

[0013] An injection mold for an integrated PCB pin injection bracket includes an upper mold, a lower mold, and a mold cavity formed by closing the upper and lower molds to match the shape of the bracket. The lower mold is provided with a pin positioning mechanism, which includes multiple retractable elastic claws. The ends of the elastic claws are provided with locking grooves that are adapted to the bottom protrusions of the pins. The lower mold is also provided with an ejection mechanism, which includes an elastic ejector rod located at the bottom of the mold cavity and a limiting block that cooperates with a guide groove.

[0014] As a further description of the above technical solution, the lower mold is provided with cooling water channels, which are distributed in a spiral shape around the mold cavity, and the inlet and outlet of the cooling water channels are respectively located on both sides of the lower mold.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] The PCB pin injection molded integrated bracket and its injection mold of this utility model have at least one of the following beneficial effects during use:

[0017] The integrated bracket design enhances structural stability, while the metal pins are reliably fixed via injection molding. Asymmetrical positioning holes, anti-misalignment bosses, and anti-rotation planes ensure precise positioning and prevent misalignment and rotation, guaranteeing accurate installation. The heat dissipation structure, through heat conduction channels, heat dissipation fins, and a thermally conductive silicone layer, effectively improves heat dissipation efficiency, making it suitable for high-power applications. Guide grooves facilitate assembly guidance, improving installation efficiency. Elastic claws in the mold ensure precise pin positioning, the ejection mechanism facilitates smooth demolding, and spiral cooling channels provide uniform cooling, improving production efficiency and product quality. Overall, the design achieves a stable structure, convenient installation, excellent heat dissipation, and high production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a PCB pin injection molded integrated bracket and its injection mold according to the present invention;

[0019] Figure 2 This is a schematic diagram of the overall structure of a PCB pin injection molding integrated bracket according to the present invention;

[0020] Figure 3 This is a top view of the integrated injection-molded bracket for PCB pins according to the present invention.

[0021] Figure 4 This is a side view of the PCB pin injection molded integrated bracket of the present invention.

[0022] Figure 5 This is a perspective structural diagram of a PCB pin injection molded integrated bracket and its injection mold according to the present invention.

[0023] Numbering on the map:

[0024] 101. Base; 102. Heat dissipation structure; 103. Metal pin; 104. Pin fixing structure; 105. Heat dissipation fins; 106. Asymmetric positioning hole; 107. Guide groove; 108. Heat conduction channel; 109. Thermally conductive silicone layer; 110. Annular slot; 201. Upper mold; 202. Mold cavity; 203. Lower mold; 204. Pin positioning mechanism; 205. Ejection mechanism; 206. Limiting block; 207. Cooling water channel. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1-5 As shown, this utility model provides a PCB pin injection molded integrated bracket, including an integrally formed base 101. The base 101 is provided with metal pins 103, a plurality of pin fixing structures 104 arranged in a matrix, at least two asymmetric positioning holes 106 for matching with the mounting holes of the PCB board, and a heat dissipation structure 102. The asymmetric positioning holes 106 are respectively provided on both sides of the base 101.

[0027] The bottom of the metal pin 103 is embedded in the pin fixing structure 104 and fixed by injection molding, and the top of the metal pin 103 extends out of the surface of the base 101 to form a plug end.

[0028] The heat dissipation structure 102 includes a heat conduction channel 108 disposed inside the base 101 and heat dissipation fins 105 disposed on the outer surface of the base. The heat conduction channel 108 is connected to the pin fixing structure 104.

[0029] In this embodiment, insulating material (such as high-temperature nylon or PBT) is injected into a mold using an injection molding process to form a base 101 in one step, which includes a pin fixing structure 104, asymmetrical positioning holes 106, heat dissipation fins 105, and guide grooves 107. The metal pin 103 is pre-positioned by elastic claws before injection molding, and the injection molding material covers the protrusion at the bottom of the pin, forming a mechanical interlock after curing.

[0030] The heat from the metal pin 103 is transferred to the heat conduction channel 108 through the thermally conductive silicone layer 109 at the bottom, and then dissipated by convection through the heat dissipation fins 105 (thickness 0.5-1mm, spacing 2mm) on the outer surface of the base 101, reducing the overall thermal resistance by more than 30%.

[0031] This PCB pin injection molded integrated bracket uses a one-piece molded base 101, organically integrating metal pins 103, pin fixing structures 104, asymmetric positioning holes 106, and heat dissipation structures 102 into a single unit. During operation, the metal pins 103, acting as conductive components, extend from the top of the base 101 to form a plug-in end for electrical connection with external devices or components, enabling signal or power transmission. The bottom is embedded in the pin fixing structure 104 and fixed by injection molding, ensuring stable and reliable transmission without loosening or detachment. Multiple matrix-distributed pin fixing structures 104 provide uniform and stable support for the metal pins 103, ensuring precise positioning of each pin on the base 101 and guaranteeing overall electrical performance.

[0032] Furthermore, the pin fixing structure 104 is a blind hole structure, the inner wall of the pin fixing structure 104 is provided with an annular groove 110, and the bottom of the metal pin 103 is provided with a protrusion that is interference-fitted with the annular groove 110.

[0033] The pin fixing structure 104 is a blind hole structure with an annular groove 110 on its inner wall. The bottom of the metal pin 103 has a protrusion that interferes with the annular groove 110. During injection molding, the metal pin 103 is first placed in the predetermined position of the pin fixing structure 104. The protrusion and the annular groove 110 initially engage, providing positioning and initial fixation for the metal pin 103. Injection molding then occurs, and the molten plastic material covers the bottom of the metal pin 103, filling the blind hole structure. After cooling and solidification, the plastic, the bottom of the metal pin 103, and the pin fixing structure 104 form a strong bond. During operation, the external mechanical force borne by the metal pin 103 is transmitted to the base 101 through the interference fit between the protrusion and the annular groove 110. Simultaneously, electrical signals or power are stably transmitted through the plug-in terminal at the top of the metal pin 103.

[0034] The protrusion at the bottom of the metal pin 103 is interference-fitted with the annular groove 110 on the inner wall of the pin fixing structure 104 (tolerance design is ±0.05mm). The pin is double-fixed by secondary encapsulation with injection molding material (mechanical snap-fit ​​+ injection molding wrapping) to ensure that the pin pull-out force is ≥50N.

[0035] Furthermore, the lower surface of the base 101 is provided with an anti-misalignment boss, the outline of which matches the corresponding mounting area of ​​the PCB board. During installation, the anti-misalignment boss is embedded in the corresponding groove or outline area on the PCB board, providing mechanical positioning and guidance. Through the precise fit between the anti-misalignment boss and the PCB board mounting area, the accurate mounting position of the base 101 on the PCB board is ensured, avoiding problems such as misalignment between pins and PCB board pads caused by installation position deviations.

[0036] Furthermore, the sidewall of the base 101 is also provided with a guide groove 107, the depth direction of which is perpendicular to the extension direction of the pin. The guide groove 107, with its depth direction perpendicular to the extension direction of the pin, provides a guiding path for these components when used in conjunction with other components (such as connectors, protective covers, etc.). For example, when a connector that mates with a bracket is inserted, the guide structure on the connector can be smoothly inserted along the direction of the guide groove 107, ensuring accurate mating between the connector and the insertion end of the metal pin 103, avoiding problems such as pin bending or damage caused by insertion direction deviation.

[0037] Furthermore, the heat dissipation structure 102 has a thermally conductive silicone layer 109 filling the heat conduction channel 108, which contacts the bottom of the metal pin 103. The heat dissipation structure 102 includes a heat conduction channel 108 located inside the base 101 and heat dissipation fins 105 located on the outer surface of the base 101. The heat conduction channel 108 communicates with the pin fixing structure 104, and the thermally conductive silicone layer 109 can be filled within the heat conduction channel 108, contacting the bottom of the metal pin 103. When the metal pin 103 generates heat during current transmission, the heat is first transferred through the bottom of the metal pin 103 to the thermally conductive silicone layer 109. The thermally conductive silicone layer 109 has excellent thermal conductivity and can quickly conduct heat into the heat conduction channel 108. The heat conduction channel 108 serves as a heat transfer path, guiding heat from inside the base 101 to the heat dissipation fins 105 on the outer surface. The heat dissipation fins 105 have a large surface area and are in contact with the air. They dissipate heat to the surrounding environment through heat conduction and heat convection, thereby reducing the temperature of the base 101 and the metal pins 103.

[0038] Furthermore, the asymmetric positioning holes 106 have different diameters, and one of the positioning holes has an anti-rotation plane on its inner wall. At least two asymmetric positioning holes 106 are provided on each of the two sides of the base 101, and these positioning holes have different diameters, with one of the positioning holes having an anti-rotation plane on its inner wall. When mounted on a PCB board, the PCB board has mounting holes that match the asymmetric positioning holes 106. Due to the asymmetry of the positioning holes, including the difference in diameter and the presence of the anti-rotation plane, the bracket can only be aligned with the mounting holes on the PCB board in a single correct direction. The anti-rotation plane cooperates with the corresponding structure within the mounting holes on the PCB board, restricting the rotation of the bracket within the mounting plane and ensuring precise alignment between the bracket and the PCB board.

[0039] An injection mold for an integrated PCB pin injection bracket includes an upper mold 201, a lower mold 203, and a mold cavity 202 formed by the upper mold 201 and the lower mold 203 after being closed to form a shape matching the bracket. The lower mold 203 is provided with a pin positioning mechanism 204, which includes multiple retractable elastic claws. The ends of the elastic claws are provided with locking grooves that are adapted to the bottom protrusions of the pins. The lower mold 203 is also provided with an ejection mechanism 205, which includes an elastic ejector rod located at the bottom of the mold cavity 202 and a limiting block 206 that cooperates with a guide groove 107.

[0040] The pin positioning mechanism 204 includes multiple retractable elastic claws, the ends of which are provided with engaging grooves that fit the protrusions at the bottom of the pin. Before the mold closes, the elastic claws are in the extended state, and the engaging grooves accurately engage the protrusions at the bottom of the metal pin 103, fixing the metal pin 103 in a predetermined position within the mold cavity 202, ensuring that the metal pin 103 will not shift during injection molding. After injection molding is completed and the mold opens, the elastic claws retract, releasing the metal pin 103 for subsequent ejection operations.

[0041] The ejection mechanism 205 includes an elastic ejector rod located at the bottom of the mold cavity 202 and a limiting block 206 that cooperates with the guide groove 107. When the mold opens, the elastic ejector rod is pushed upward by a power device (such as a hydraulic cylinder, spring, etc.), pushing the formed bracket away from the bottom of the mold cavity 202. At the same time, the limiting block 206 cooperates with the guide groove 107 on the side wall of the bracket to limit and guide the bracket during the ejection process, ensuring that the bracket is ejected smoothly in the correct direction and avoiding deformation or damage to the bracket due to deviation in the ejection direction.

[0042] Furthermore, the lower mold 203 is provided with cooling water channels 207, which are distributed in a spiral shape around the mold cavity 202, and the inlet and outlet of the cooling water channels 207 are respectively located on both sides of the lower mold 203.

[0043] The lower mold 203 is equipped with cooling channels 207, which are spirally distributed around the mold cavity 202, with inlets and outlets located on both sides of the lower mold 203. During injection molding, cooling water flows into the cooling channels 207 from the inlets, flows around the mold cavity 202 along the spiral path, absorbs the heat released during the curing process of the plastic material in the mold cavity 202, and then flows out from the outlets. The spiral cooling channel 207 design ensures full contact between the cooling water and the surface of the mold cavity 202, uniformly removes heat, and accelerates the cooling and curing speed of the plastic material. The spiral cooling channels 207 (diameter Φ8mm, pitch 20mm) allow the cooling water to flow evenly around the periphery of the mold cavity 202, shortening the injection molding cycle by 20% and reducing the internal stress of the base 101.

[0044] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A PCB pin injection molded integrated bracket, characterized in that: The device includes an integrally molded base, on which are provided metal pins, multiple pin fixing structures arranged in a matrix, at least two asymmetric positioning holes for matching with mounting holes on a PCB board, and a heat dissipation structure. The asymmetric positioning holes are respectively located on the two sides of the base. The bottom of the metal pin is embedded in the pin fixing structure and fixed by injection molding, and the top of the metal pin extends out of the base surface to form a plug end; The heat dissipation structure includes a heat conduction channel inside the base and heat dissipation fins on the outer surface of the base. The heat conduction channel is connected to the pin fixing structure.

2. The PCB pin injection molded integrated bracket according to claim 1, characterized in that: The pin fixing structure is a blind hole structure, the inner wall of the pin fixing structure is provided with an annular groove, and the bottom of the metal pin is provided with a protrusion that is interference-fitted with the annular groove.

3. The PCB pin injection molded integrated bracket according to claim 1, characterized in that: The lower surface of the base is provided with an anti-misalignment boss, the outline of which matches the corresponding mounting area of ​​the PCB board.

4. The PCB pin injection molded integrated bracket according to claim 1, characterized in that: The side wall of the base is also provided with a guide groove, the depth direction of which is perpendicular to the extension direction of the pin.

5. The PCB pin injection molded integrated bracket according to claim 1, characterized in that: The heat dissipation structure has a thermally conductive silicone layer filling the heat conduction channel, and the thermally conductive silicone layer is in contact with the bottom of the metal pin.

6. The PCB pin injection molded integrated bracket according to claim 1, characterized in that: The asymmetrical positioning holes have different diameters, and one of the positioning holes has an anti-rotation plane on its inner wall.

7. An injection mold for the PCB pin injection molding integrated bracket according to any one of claims 1-6, characterized in that: The system includes an upper mold, a lower mold, and a mold cavity formed by the upper and lower molds after they are closed to match the shape of the bracket. The lower mold is provided with a pin positioning mechanism, which includes multiple retractable elastic claws. The ends of the elastic claws are provided with locking grooves that are adapted to the bottom protrusions of the pins. The lower mold is also provided with an ejection mechanism, which includes an elastic ejector rod located at the bottom of the mold cavity and a limiting block that cooperates with the guide groove.

8. The injection mold for the PCB pin injection molded integrated bracket according to claim 7, characterized in that: The lower mold is provided with cooling water channels, which are distributed in a spiral shape around the mold cavity, and the inlet and outlet of the cooling water channels are respectively located on both sides of the lower mold.

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