PCB structure for improving heat dissipation effect of rectifier packaging device

Abstract

The utility model discloses a PCB structure capable of improving the heat dissipation effect of a rectifier packaging device, in the X-axis direction, a plurality of first heat dissipation holes are arranged in a linear manner, so that one or more air flow channels are formed, when air passes through the plurality of first heat dissipation holes, heat in the area can be effectively taken away, and the phenomenon of local overheating is avoided; in the Y-axis direction, the multiple first heat dissipation holes are arranged in a staggered mode, when air flows through the first heat dissipation holes arranged in the staggered mode, due to the fact that an airflow path becomes complex and irregular, local small vortexes are formed, the vortexes can mix cold air and hot air together, heat is prevented from being concentrated in a certain area, and the heat dissipation efficiency is improved. And the process of transferring heat from the heating element to the surrounding environment is accelerated.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a PCB structure for improving the heat dissipation effect of rectifier packaged devices. Background Technology

[0002] Printed circuit boards (PCBs) are an indispensable part of electronic devices, providing not only physical support but also ensuring the effective transmission of signals. With the advancement of technology, the role of power modules in PCBs has become crucial. A key component of power modules is the rectifier, which is responsible for converting alternating current (AC) to direct current (DC) to meet the needs of most electronic components.

[0003] The working principle of the power supply is to step down the high-voltage AC power to a low-voltage AC power, and then convert the AC power to DC power through a rectifier. The DC power is then used at the power supply terminals of the modules inside the PCB board.

[0004] However, during the conversion process, the rectifier generates heat due to energy loss. If this heat cannot be effectively dissipated, it can lead to overheating of the rectifier, affecting the performance and reliability of the entire power module and even the entire circuit board. When the temperature rises, the semiconductor materials and other components inside the rectifier may experience performance degradation due to excessively high temperatures, such as reduced efficiency and increased ripple. Furthermore, rectifiers operating in high-temperature environments for extended periods are prone to failure, shortening their lifespan. For example, the lifespan of capacitors decreases significantly with increasing operating temperature, directly impacting the reliability and stability of the rectifier.

[0005] Besides affecting the rectifier itself, poor heat dissipation can have a cascading effect on the entire power module. Since the rectifier is one of the core components of the power module, its failure often means that the entire power module's function will be severely impacted. Specifically, the power module will be unable to provide a stable output voltage or current, thus affecting the performance of all downstream electronic modules that rely on it for power. Secondly, if the heat dissipation problem is not properly addressed, heat will continue to accumulate and spread to other critical components on the circuit board, such as the microprocessor, memory, or other sensitive components, leading to malfunctions or even permanent damage. Utility Model Content

[0006] In order to overcome the shortcomings of the prior art, this utility model provides a PCB structure to improve the heat dissipation effect of rectifier packaged devices.

[0007] The technical solution of this utility model is as follows: A PCB structure for improving the heat dissipation effect of rectifier packaged devices includes a substrate and a rectifier package area disposed on the substrate. The rectifier package area includes an AC input device disk area and a DC output device disk area. A plurality of first heat dissipation holes are disposed in the AC input device disk area. In the X-axis direction, the plurality of first heat dissipation holes are arranged in a straight line. In the Y-axis direction, the plurality of first heat dissipation holes are staggered with each other. A plurality of second heat dissipation holes are disposed around the outer periphery of the DC output device disk area.

[0008] Furthermore, the diameter of the first heat dissipation hole is equal to the diameter of the second heat dissipation hole.

[0009] Furthermore, a first heat-dissipating copper foil area and a second heat-dissipating copper foil area are also provided. In the orthogonal projection direction of the substrate, the first heat-dissipating copper foil area and the AC input device disk area overlap by at least a portion, and the second heat-dissipating copper foil area and the DC output device disk area overlap by at least a portion.

[0010] Furthermore, the diameter of both the first heat dissipation hole and the second heat dissipation hole is 0.5 mm.

[0011] Furthermore, at least four of the second heat dissipation holes are provided.

[0012] Furthermore, a no-drilling area is provided on the substrate, which is located between the AC input device area and the DC output device area.

[0013] Furthermore, the substrate includes a surface layer, an inner layer, and a bottom layer, wherein the surface layer, the inner layer, and the bottom layer are each provided with a first heat dissipation copper foil area and a second heat dissipation copper foil area.

[0014] The advantages of this utility model based on the above solution are as follows:

[0015] (1) The present invention provides a PCB structure for improving the heat dissipation effect of rectifier packaged devices. In the X-axis direction, multiple first heat dissipation holes are arranged in a straight line. This design forms one or more air flow channels. When air passes through multiple first heat dissipation holes, it can effectively remove the heat in the area and avoid local overheating. In the Y-axis direction, multiple first heat dissipation holes are staggered. When air flows through these staggered first heat dissipation holes, the airflow path becomes complex and irregular, thus forming local small vortices. The vortices can mix hot and cold air together, avoid heat concentration in a certain area, and accelerate the process of heat transfer from the heat-generating element to the surrounding environment.

[0016] (2) The present invention provides a PCB structure for improving the heat dissipation effect of rectifier packaged devices. Multiple second heat dissipation holes are arranged around the outer periphery of the DC output device disk area. This design enables heat to be effectively transferred from the heat-generating element to the surrounding environment, ensuring that heat can be dissipated by radiation and convection, thereby reducing the temperature of the PCB board and rectifier packaged devices. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a PCB structure for improving the heat dissipation effect of a rectifier package device according to an embodiment of the present invention.

[0019] In the figure, 1 is the substrate; 2 is the rectifier packaging area; 21 is the AC input device disk area; 211 is the first heat dissipation hole; 22 is the DC output device disk area; 221 is the second heat dissipation hole; 3 is the first heat dissipation copper foil area; 4 is the second heat dissipation copper foil area; and 5 is the area where drilling is prohibited. Detailed Implementation

[0020] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention by way of example, but should not be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0021] To better understand this utility model, the following description, in conjunction with the accompanying drawings and embodiments, will further illustrate the present utility model:

[0022] See Figure 1 As shown, the present invention provides a PCB structure for improving the heat dissipation effect of rectifier packaged devices, including a substrate 1 and a rectifier packaged area 2 disposed on the substrate 1. The rectifier packaged area 2 includes an AC input device disk area 21 and a DC output device disk area 22. The AC input device disk area 21 is provided with a plurality of first heat dissipation holes 211. In the X-axis direction, the plurality of first heat dissipation holes 211 are arranged in a straight line. In the Y-axis direction, the plurality of first heat dissipation holes 211 are staggered with each other. The DC output device disk area 22 is surrounded by a plurality of second heat dissipation holes 221.

[0023] Specifically, in the X-axis direction, multiple first heat dissipation holes 211 are arranged in a straight line. This design forms one or more airflow channels. When air passes through multiple first heat dissipation holes 211, it can effectively remove heat from the area and avoid local overheating. In the Y-axis direction, multiple first heat dissipation holes 211 are staggered. When air flows through these staggered first heat dissipation holes 211, the airflow path becomes complex and irregular, thus forming local small vortices. The vortices can mix hot and cold air together, preventing heat from concentrating in a certain area and accelerating the process of heat transfer from the heat-generating element to the surrounding environment.

[0024] Multiple second heat dissipation holes 221 are arranged around the outer periphery of the DC output device disk area 22. This design allows heat to be effectively transferred from the heat-generating element to the surrounding environment, ensuring that heat can be dissipated by radiation and convection, thereby reducing the temperature of the PCB board and rectifier package device.

[0025] In some specific embodiments, the diameter of the first heat dissipation hole 211 and the diameter of the second heat dissipation hole 221 are equal. Specifically, the diameters of the first heat dissipation hole 211 and the second heat dissipation hole 221 are the same. This design simplifies the PCB manufacturing process. In actual production, drilling operations on the substrate 1 can be completed using only one set of tools, which can reduce manufacturing complexity and cost, help achieve standardized design, and facilitate mass production and quality control.

[0026] It is worth mentioning that the diameter of the first heat dissipation hole 211 and the diameter of the second heat dissipation hole 221 are equal, which avoids the problem of uneven airflow in certain areas due to differences in hole diameter, thus affecting the overall heat dissipation effect and reducing local overheating (i.e., "hot spots").

[0027] In this embodiment, a PCB structure for improving the heat dissipation effect of rectifier packaged devices is further provided with a first heat dissipation copper area 3 and a second heat dissipation copper area 4. In the orthogonal projection direction of the substrate 1, the first heat dissipation copper area 3 and the AC input device disk area 21 overlap by at least a portion, and the second heat dissipation copper area 4 and the DC output device disk area 22 overlap by at least a portion.

[0028] Specifically, the first heat dissipation copper foil area 3 at least partially overlaps with the AC input device disk area 21. The heat from the AC input device disk can be quickly conducted away directly through the heat dissipation copper foil below. As a material with high thermal conductivity, copper foil can effectively disperse and transfer heat, avoiding localized overheating. Similarly, the overlapping design of the second heat dissipation copper foil area 4 with the DC output device disk area 22 also ensures that the heat from the DC output device disk can be quickly conducted and dispersed, reducing the operating temperature of the device.

[0029] Preferably, the diameter of both the first heat dissipation hole 211 and the second heat dissipation hole 221 is 0.5mm. This design ensures sufficient airflow while avoiding excessive airflow resistance. If the hole diameter is too large, the airflow will be too concentrated, reducing heat dissipation efficiency; while if the hole diameter is too small, it will increase airflow resistance and affect airflow. Secondly, this design also helps to achieve a uniform airflow distribution, with each heat dissipation hole having essentially the same airflow resistance, making the airflow on the entire PCB more balanced, thereby improving the overall heat dissipation effect.

[0030] It is worth mentioning that the 0.5mm aperture design has little impact on the overall structural strength of substrate 1. A larger aperture would weaken the mechanical strength of substrate 1, especially under high vibration or high stress environments. The 0.5mm aperture can maximize the integrity and robustness of substrate 1 without affecting heat dissipation.

[0031] Specifically, at least four second heat dissipation holes 221 are provided.

[0032] In this embodiment, a no-drilling area 5 is provided on the substrate 1, which is located between the AC input device area 21 and the DC output device area 22. The substrate 1 includes a surface layer, an inner layer, and a bottom layer, and a first heat dissipation copper foil area 3 and a second heat dissipation copper foil area 4 are provided on the surface layer, the inner layer, and the bottom layer.

[0033] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art, or the orientation or positional relationship that the product is usually placed in during use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0034] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0035] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A PCB structure for improving the heat dissipation effect of rectifier packaged devices, characterized in that, include: The substrate (1) and the rectifier packaging area (2) disposed on the substrate (1) include an AC input device disk area (21) and a DC output device disk area (22). The AC input device disk area (21) is provided with a plurality of first heat dissipation holes (211). In the X-axis direction, the plurality of first heat dissipation holes (211) are arranged in a straight line. In the Y-axis direction, the plurality of first heat dissipation holes (211) are staggered with each other. The DC output device disk area (22) is surrounded by a plurality of second heat dissipation holes (221).

2. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 1, characterized in that: The diameter of the first heat dissipation hole (211) is equal to the diameter of the second heat dissipation hole (221).

3. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 1, characterized in that: A first heat dissipation copper pad area (3) and a second heat dissipation copper pad area (4) are also provided. In the orthogonal projection direction of the substrate (1), the first heat dissipation copper pad area (3) and the AC input device disk area (21) overlap by at least a portion, and the second heat dissipation copper pad area (4) and the DC output device disk area (22) overlap by at least a portion.

4. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 1, characterized in that: The diameter of the first heat dissipation hole (211) and the diameter of the second heat dissipation hole (221) are both 0.5 mm.

5. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 1, characterized in that: The second heat dissipation hole (221) has at least four holes.

6. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 1, characterized in that: The substrate (1) is provided with a non-drilling area (5), which is located between the AC input device disk area (21) and the DC output device disk area (22).

7. The PCB structure for improving the heat dissipation effect of rectifier packaged devices as described in claim 3, characterized in that: The substrate (1) includes a surface layer, an inner layer and a bottom layer, wherein the surface layer, the inner layer and the bottom layer are each provided with a first heat dissipation copper foil area (3) and a second heat dissipation copper foil area (4).

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