Circuit board copper deposition wire glue residue removing device

Abstract

The utility model relates to a circuit board copper deposition wire degumming device which comprises a degumming box. Connecting bodies which are symmetrically arranged are mounted at the bottom of the hoisting equipment arranged above the glue removing box, transverse rods which are transversely arranged are fixedly connected to the bottoms of the connecting bodies, and fixing clamps which are symmetrically arranged are mounted at the bottoms of the transverse rods; a rapping mechanism is fixedly connected to the center of the lower portion of the hoisting equipment, and a transmission plate fixedly connected with the transverse rods on the two sides is arranged below the rapping mechanism; compared with the prior art, the vibrating device has the advantages that the motor is started to drive the rotating shaft to rotate, the rotating sleeve drives the connecting plates on the two sides to rotate, the connecting plates drive the vibrating plate to rotate through the rotating rod, the protective plate on one side of the vibrating plate makes contact with the transmission plate, and the purpose of vibrating the transmission plate is achieved; the acting force is transmitted to the circuit board through the transverse rod and the fixing clamp, vibration of the circuit board is achieved, stable contact between the glue removing liquid and the inner hole wall of the circuit board is achieved, glue removing is achieved, and the subsequent etching quality is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, and in particular to a device for removing adhesive residue from copper plating lines on circuit boards. Background Technology

[0002] "Copper plating line removal" is an important step in the printed circuit board (PCB) manufacturing process. In this process, specific chemicals and equipment are used to remove the adhesive residue left on the copper foil after drilling or machining to ensure that the subsequent copper plating process can proceed smoothly and to ensure good electrical connection.

[0003] The high temperature during drilling melts the epoxy resin, forming insulating residue. This residue adheres to the hole wall, affecting subsequent work. The common method for removing this residue is to use a lifting frame to immerse the circuit board in a descaling solution, causing it to decompose and remove the residue. However, existing lifting frames typically suspend the circuit board vertically into the descaling solution. The aeration equipment causes air bubbles to rise, and the upward path of the bubbles and the placement of the circuit board are both vertical. This results in insufficient contact between the descaling solution and the residue inside the holes of the circuit board, limiting the efficiency of residue removal. Therefore, to address these issues, a device for removing adhesive residue from copper wires on circuit boards is proposed. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the main purpose of this utility model is to provide a device for removing adhesive residue from copper wires on circuit boards. The rapping mechanism rappels the transmission plate, and the force is transmitted to the circuit board through the horizontal rod and the fixing clamp to realize the vibration of the circuit board, so as to achieve stable contact between the adhesive removal liquid and the hole walls inside the circuit board, thereby removing the adhesive and ensuring the quality of subsequent etching.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a device for removing adhesive residue from copper plating lines on circuit boards, comprising an adhesive removal box and a hoisting device;

[0006] The bottom of the hoisting equipment located above the glue removal box is equipped with symmetrically arranged connecting bodies. The bottom of each connecting body is fixedly connected with a horizontally arranged horizontal bar. The bottom of each horizontal bar is equipped with a symmetrically arranged fixing clamp. The bottom of the fixing clamp is equipped with a circuit board.

[0007] A vibrating mechanism is fixedly connected to the center of the lower part of the hoisting equipment, and a transmission plate is fixedly connected to the horizontal bars on both sides below the vibrating mechanism.

[0008] Furthermore, an aeration pipe is installed at the bottom of the descaling tank, with one end of the aeration pipe connected to an aeration device, and multiple aeration nozzles for aeration installed at the top of the aeration pipe.

[0009] The high temperatures during drilling melt epoxy resin, forming insulating residue. This residue adheres to the hole walls, affecting subsequent work. A common method for removing this residue is to immerse the circuit board in a descaling solution using a lifting frame, causing it to decompose and remove the residue. However, existing lifting frames typically suspend the circuit board vertically into the solution. The aeration equipment moves air bubbles upwards, and the path of these bubbles, along with the vertical placement of the circuit board, results in insufficient contact between the descaling solution and the residue inside the hole, limiting the removal efficiency. By activating a rapping mechanism, the transmission plate is vibrated. The force is transmitted to the circuit board through the horizontal bars on both sides and the fixing clamps, causing the circuit board to vibrate. This helps expel air from the hole, allowing the descaling solution to enter and remove the residue from the hole walls, ensuring the quality of subsequent etching.

[0010] Furthermore, the vibration mechanism includes a mounting frame that is fixedly connected to the hoisting equipment, a motor that is installed inside the mounting frame, a rotating shaft that is fixedly connected to the output shaft of the motor, and the other end of the rotating shaft that is rotatably connected to the mounting frame.

[0011] A rotating sleeve is fixedly connected to the outer side of the rotating shaft, and a connecting plate is fixedly connected to the outer side of the rotating sleeve.

[0012] Furthermore, the mounting frame is a rectangular frame, and the bottom of the mounting frame is open.

[0013] Furthermore, there are two sets of connecting plates, and each connecting plate has a rotating rod installed inside its other end, with a vibrating plate rotatably connected to the outside of the rotating rod.

[0014] Furthermore, protective plates are fixedly connected to the outer side of each vibration plate.

[0015] Furthermore, the protective plate is made of rubber material.

[0016] The circuit board is placed into the descaling tank using hoisting equipment. The aeration equipment is activated, and bubbles are discharged through the aeration nozzles. The starting motor drives the rotating shaft to rotate, which in turn causes the rotating sleeve to rotate the connecting plates on both sides. The connecting plates drive the vibrating plate to rotate via the rotating rod. The protective plate on one side of the vibrating plate contacts the transmission plate, achieving the purpose of vibrating the transmission plate. The force is transmitted to the circuit board through the horizontal rod and the fixing clamp, achieving vibration of the circuit board. This ensures that the descaling liquid makes stable contact with the hole walls inside the circuit board, removing the adhesive and ensuring the quality of subsequent etching.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] The circuit board is placed into the descaling tank using hoisting equipment. The aeration equipment is activated, and bubbles are discharged through the aeration nozzles. The starting motor drives the rotating shaft to rotate, which in turn causes the rotating sleeve to rotate the connecting plates on both sides. The connecting plates drive the vibrating plate to rotate via the rotating rod. The protective plate on one side of the vibrating plate contacts the transmission plate, achieving the purpose of vibrating the transmission plate. The force is transmitted to the circuit board through the horizontal rod and the fixing clamp, achieving vibration of the circuit board. This ensures that the descaling liquid makes stable contact with the hole walls inside the circuit board, removing the adhesive and ensuring the quality of subsequent etching. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the vibrating mechanism of this utility model.

[0021] Legend: 1. Degreasing box; 2. Lifting equipment; 3. Vibrating mechanism; 301. Mounting frame; 302. Motor; 303. Rotating shaft; 304. Rotating sleeve; 305. Connecting plate; 306. Rotating rod; 307. Vibrating plate; 308. Protective plate; 4. Connecting body; 5. Horizontal rod; 6. Fixing clamp; 7. Transmission plate; 8. Circuit board; 9. Aeration pipe; 10. Aeration nozzle. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Example

[0023] A device for removing adhesive residue from copper plating lines on circuit boards, such as Figure 1-2 As shown, it includes a glue removal box 1 and a hoisting device 2;

[0024] The bottom of the hoisting equipment 2, which is located above the glue removal box 1, is equipped with symmetrically arranged connecting bodies 4. The bottom of each connecting body 4 is fixedly connected with a horizontally arranged horizontal rod 5. The bottom of each horizontal rod 5 is equipped with a symmetrically arranged fixing clip 6. The bottom of the fixing clip 6 is equipped with a circuit board 8.

[0025] A vibrating mechanism 3 is fixedly connected to the center of the lower part of the hoisting equipment 2, and a transmission plate 7 is fixedly connected to the horizontal bars 5 on both sides below the vibrating mechanism 3.

[0026] An aeration pipe 9 is installed at the bottom of the descaling box 1. One end of the aeration pipe 9 is connected to an aeration device, and multiple aeration nozzles 10 for aeration are installed at the top of the aeration pipe 9.

[0027] The high temperature during drilling melts the epoxy resin, forming insulating residue. This residue adheres to the hole wall, affecting subsequent work. A common method for removing this residue is to immerse the circuit board in a descaling solution using a lifting frame, causing it to decompose and remove the residue. However, existing lifting frames typically suspend the circuit board vertically into the solution. The aeration equipment drives air bubbles upwards through aeration nozzles 10, and the upward path of the bubbles and the placement of the circuit board are both vertical. This results in insufficient contact between the descaling solution and the residue inside the hole, limiting the removal efficiency. By activating the rapping mechanism 3, the transmission plate 7 is vibrated. The force is transmitted to the circuit board 8 through the horizontal bars 5 on both sides and the fixing clamps 6, causing the circuit board 8 to vibrate. This helps to expel air from the hole, allowing the descaling solution to enter and remove the residue from the hole wall, ensuring the quality of subsequent etching.

[0028] The vibration mechanism 3 includes a mounting frame 301 that is fixedly connected to the hoisting equipment 2. A motor 302 is installed inside the mounting frame 301. The output shaft of the motor 302 is fixedly connected to a rotating shaft 303. The other end of the rotating shaft 303 is rotatably connected to the mounting frame 301.

[0029] A rotating sleeve 304 is fixedly connected to the outer side of the rotating shaft 303, and a connecting plate 305 is fixedly connected to the outer side of the rotating sleeve 304.

[0030] The mounting frame 301 is a rectangular frame, and the bottom of the mounting frame 301 is open.

[0031] There are two sets of connecting plates 305, and a rotating rod 306 is installed inside the other end of each connecting plate 305. A vibrating plate 307 is rotatably connected to the outside of each rotating rod 306.

[0032] Protective plates 308 are fixedly connected to the outer side of the vibrating plate 307.

[0033] The protective plate 308 is made of rubber sheet.

[0034] The circuit board 8 is placed into the adhesive removal box 1 by the hoisting equipment 2. The aeration equipment is started and the bubbles are discharged through the aeration nozzle 10. The starting motor 302 drives the rotating shaft 303 to rotate, which in turn causes the rotating sleeve 304 to drive the connecting plates 305 on both sides to rotate. The connecting plates 305 drive the vibrating plate 307 to rotate through the rotating rod 306. The protective plate 308 on one side of the vibrating plate 307 contacts the transmission plate 7 to achieve the purpose of vibrating the transmission plate 7. The force is transmitted to the circuit board 8 through the horizontal rod 5 and the fixing clamp 6 to achieve vibration of the circuit board 8, so that the adhesive removal liquid can stably contact the hole wall inside the circuit board 8, remove the adhesive, and ensure the quality of subsequent etching.

[0035] The vibrating plate 307 is connected to the connecting plate 305 via the rotating rod 306. When it contacts the transmission plate 7, the vibrating plate 307 can rotate, avoiding motion interference that would prevent continuous vibration. At the same time, the protective plate 308 on one side of the vibrating plate 307 can serve as a buffer to prevent it from being damaged by violent collision. The bottom of the mounting frame 301 is open to facilitate the rotation of the vibrating plate 307.

[0036] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A device for removing adhesive residue from copper plating lines on circuit boards, characterized in that: Includes a glue removal box (1) and hoisting equipment (2); The hoisting equipment (2) located above the glue removal box (1) has symmetrically arranged connecting bodies (4) installed at the bottom. The bottom of each connecting body (4) is fixedly connected to a horizontally arranged horizontal rod (5). The bottom of each horizontal rod (5) is equipped with a symmetrically arranged fixing clamp (6). The bottom of the fixing clamp (6) is equipped with a circuit board (8). A vibrating mechanism (3) is fixedly connected to the center of the lower part of the hoisting equipment (2), and a transmission plate (7) is fixedly connected to the transverse bars (5) on both sides below the vibrating mechanism (3).

2. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 1, characterized in that: The bottom of the glue removal box (1) is equipped with an aeration pipe (9), one end of which is connected to an aeration device, and the top of the aeration pipe (9) is equipped with multiple aeration nozzles (10) for aeration.

3. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 1, characterized in that: The vibrating mechanism (3) includes a mounting frame (301) fixedly connected to the hoisting equipment (2). A motor (302) is installed inside the mounting frame (301). The output shaft of the motor (302) is fixedly connected to a rotating shaft (303). The other end of the rotating shaft (303) is rotatably connected to the mounting frame (301). A rotating sleeve (304) is fixedly connected to the outside of the rotating shaft (303), and a connecting plate (305) is fixedly connected to the outside of the rotating sleeve (304).

4. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 3, characterized in that: The mounting frame (301) is a rectangular frame, and the bottom of the mounting frame (301) is open.

5. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 3, characterized in that: There are two sets of connecting plates (305), and a rotating rod (306) is installed inside the other end of each connecting plate (305). A vibrating plate (307) is rotatably connected to the outside of each rotating rod (306).

6. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 5, characterized in that: Protective plates (308) are fixedly connected to the outer side of each vibration plate (307).

7. The device for removing adhesive residue from copper plating lines on circuit boards according to claim 6, characterized in that: The protective plate (308) is made of rubber sheet.

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