Chip packaging body and camera module

Abstract

The chip packaging body comprises a circuit board, a chip and a packaging body, the circuit board is provided with an element installation surface, the chip is arranged on the element installation surface and electrically connected with the circuit board, the chip is provided with a photosensitive area, the packaging body is arranged on the element installation surface and located on the peripheral side of the chip, the packaging body comprises a conductive part and a plastic packaging shell, and the conductive part is electrically connected with the plastic packaging shell. At least part of the conductive part is electrically connected with the circuit board, one side, far away from the circuit board, of the conductive part is provided with an external connection part, the conductive part is embedded in the plastic package shell and can support the plastic package shell, and the plastic package shell is provided with an avoiding notch which is used for exposing the photosensitive area; wherein the external connection part is exposed outside the plastic package shell, so that the circuit board is electrically connected with the lens motor through the conductive piece. In this way, the overall size of the chip packaging body is reduced, miniaturization and integration of products are achieved, use of conduction connecting pieces is reduced, risks of loosening of connecting points, poor contact and the like are reduced, and therefore the production yield of chips is increased.

Description

Technical Field

[0001] This application relates to the field of camera technology, and in particular to a chip package and a camera module. Background Technology

[0002] In the field of chip packaging, the compactness and integration of the packaging structure directly affect product performance and production yield. Current mainstream packaging processes use a package to encapsulate and protect the chip; however, the size of the circuit board on which the chip is mounted is usually larger than the package, creating a redundant structure. Meanwhile, external components such as lens motors need to be electrically connected to the circuit board surrounding the package via conductive connectors. This distributed connection method not only increases the overall size of the packaged chip module but also introduces more process error points due to the complex connection structure, resulting in uneven internal stress distribution, reduced packaging structure stability, and ultimately affecting chip production yield and reliability. Utility Model Content

[0003] This application discloses a chip package and a camera module, which can reduce the overall volume of the chip package, realize the miniaturization and integration of the product, reduce the use of conductive connectors, reduce the risk of loose connection points and poor contact, improve the stability and reliability of the connection, and thus improve the production yield of the chip.

[0004] To achieve the above objectives, this application discloses a chip package for connection to a lens motor, the chip package comprising:

[0005] A circuit board having a component mounting surface;

[0006] A chip, which is disposed on the component mounting surface and electrically connected to the circuit board, and has a photosensitive area;

[0007] A package, disposed on a component mounting surface and located on the periphery of the chip, the package comprising:

[0008] A conductive element, at least a portion of which is electrically connected to the circuit board, wherein the conductive element has an external portion on the side away from the circuit board;

[0009] A plastic casing, in which the conductive element is embedded and supports the plastic casing, the plastic casing having a clearance notch for exposing the photosensitive area; wherein the external portion is exposed on the outside of the plastic casing so that the circuit board is electrically connected to the lens motor via the conductive element.

[0010] In one possible implementation, the conductive element surrounds the outer periphery of the chip, and the external portion includes a plurality of portions arranged at circumferential intervals along the chip.

[0011] In this way, the conductive component, as the supporting structure of the plastic encapsulation, surrounds the chip in the middle, enhancing the overall mechanical strength of the package. It can not only evenly distribute the pressure from the outside and reduce the risk of chip damage due to mechanical stress, but also play a certain role in electromagnetic shielding, reducing the impact of external electromagnetic interference on the chip. Multiple external parts increase the number of electrical connection points with external components such as lens motors. The multiple external parts are arranged at intervals along the circumference of the chip, which helps to optimize the transmission path and quality of electrical signals, improve the efficiency and accuracy of electrical signal transmission, and make the electrical connection more stable and reliable.

[0012] In one possible implementation, the conductive element includes a square frame, the chip is located within the space enclosed by the square frame, and the external portion is provided at each of the four vertices of the square frame away from the circuit board.

[0013] Thus, the conductive components, designed with a square frame, can be tightly encircled around the chip, providing stable and balanced support and enabling a compact package design. The square frame ensures more uniform strength of the package in all directions, better resisting external impacts and vibrations from different directions. Placing external terminals at the four vertices of the square frame, away from the circuit board, allows for more even current distribution, reducing current concentration, resistance loss, and heat generation.

[0014] In one possible implementation, the square frame includes a plurality of supporting beams that enclose the square frame, and the outer portion is disposed on the surface of the supporting beams away from the circuit board.

[0015] Thus, the square frame structure composed of multiple supporting beams increases the contact area between conductive components and the outside environment, which is beneficial for heat dissipation. The external connection is located on the surface of the supporting beams away from the circuit board, making the connection lines between the external connection and external components such as the lens motor more direct and simpler. This reduces the length and complexity of the connection lines, thereby lowering line resistance and inductance, and improving the efficiency and stability of electrical signal transmission.

[0016] In one possible implementation, the external portion is a square protrusion.

[0017] Thus, the external connector is designed as a square protrusion, which provides a relatively large and flat connection surface when connected to external components such as lens motors, thus improving the stability and reliability of the connection. The protrusion design gives the external connector a certain height on the surface of the package, facilitating docking and connection with external components, while also preventing interference with other parts to a certain extent.

[0018] In one possible implementation, the square protrusion has an outer end face away from the circuit board, which protrudes from the outer wall of the plastic casing in a direction perpendicular to the circuit board.

[0019] Thus, the outer end face of the square protrusion protrudes from the outer wall of the plastic casing in a direction perpendicular to the circuit board, making the external part have a noticeable protrusion outside the package. When making electrical connections with external components such as lens motors, operators can more easily access the external part without the need for additional tools or complicated operating procedures to find and connect it. This reduces the difficulty of connection and operation time, improves production efficiency, and also facilitates precise connection operations for automated production equipment, improving the accuracy and consistency of the connection.

[0020] In one possible implementation, the square protrusion has an outer end face away from the circuit board, the outer end face being flush with the outer wall of the plastic encapsulation.

[0021] In this way, the outer end face of the square protrusion is flush with the outer wall of the plastic casing, which means that the outer end face of the external part is on the same plane as the outer surface of the plastic casing in the direction perpendicular to the circuit board. This makes the overall appearance of the package relatively flat, without obvious protrusions, and more compact in spatial layout. It also ensures the stability of the external part in the package structure and its coordination with other parts.

[0022] In one possible implementation, the square frame includes an outer square frame and an inner square frame that are interconnected, and the plurality of supporting beams include a first supporting beam that encloses the outer square frame and a second supporting beam that encloses the inner square frame, with a portion of the second supporting beam extending to and connected to the first supporting beam.

[0023] At least part of the external portion is provided at the connection between the first support beam and the second support beam.

[0024] Thus, the conductive component is composed of an outer square frame and an inner square frame connected to each other. The double-frame structure provides a more stable support system for the chip. The outer square frame is enclosed by the first support beam, which plays a role in supporting and protecting the external contour of the overall package. The inner square frame is enclosed by the second support beam, which is closer to the chip and can provide more direct protection and support for the chip.

[0025] Part of the second support beam extends to and connects with the first support beam. This connection method enhances the structural strength and stability between the inner and outer frames, making the entire conductive component an organic whole. It not only improves the package's resistance to external forces in terms of mechanical structure, but also provides more path options and a more stable conduction channel for the transmission of electrical signals within the conductive component in terms of electrical connection.

[0026] At least some of the external components are located at the connection between the first and second support beams. This connection is a critical node in the inner and outer frame structures, possessing high mechanical strength to withstand the stress generated when the external components connect to external components. Simultaneously, in terms of electrical connections, the concentrated metal structure at this location results in a shorter and more direct electrical signal transmission path, facilitating signal convergence and transmission, reducing resistance and signal attenuation, and ensuring reliable connections with external components such as the lens motor.

[0027] In one possible implementation, the conductive element is soldered to the component mounting surface and electrically connected to the circuit board.

[0028] In this way, the conductive components are fixed to the component mounting surface of the circuit board by soldering, firmly bonding the conductive components to the circuit board and improving the overall mechanical stability of the package. During the use of electronic products, they may be subjected to external forces such as vibration and impact. This robust connection ensures that there is no relative displacement between the conductive components and the circuit board, thereby protecting the internal chips and other components from damage and extending the product's lifespan.

[0029] This application also discloses a camera module, a lens motor and a chip package connected to each other, wherein the chip package is any of the chip packages described above.

[0030] Compared with the prior art, the beneficial effects of this application are as follows:

[0031] In the chip package and camera module provided in this application, the circuit board serves as the basic carrier, having a component mounting surface. The chip is mounted on the component mounting surface and electrically connected to the circuit board. The photosensitive area of ​​the chip must ensure unobstructed light transmission. The conductive component of the package supports the plastic casing and partially connects to the circuit board, establishing an internal electrical path. The external portion of the conductive component away from the circuit board provides an interface for connection with the lens motor. The conductive component is embedded in the plastic casing, allowing the casing to enclose it and protect the internal structure. The clearance notch in the plastic casing provides a light path for the chip's photosensitive area. The external portion is exposed on the outside of the plastic casing, ensuring the feasibility of electrical connection between the conductive component and the lens motor. Thus, the package directly connects to the lens motor via the external portion of the conductive component. Firstly, this reduces redundant connection structures and circuit board extensions, effectively reducing the overall size of the chip package and achieving product miniaturization and integration. Secondly, the conductive component not only provides physical support but also serves as a carrier for electrical connections, directly connecting to the lens motor. Compared to traditional distributed connections, this reduces the use of conductive connectors, lowers the risk of loose connections and poor contact, and improves the stability and reliability of the connection, thereby increasing the chip production yield. Thirdly, since the conductive component is fixed in the plastic casing, there is no need to install additional wires or other conductive connectors, making the manufacturing and assembly of the chip package more convenient. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a chip package provided in an embodiment of the present utility model;

[0034] Figure 2 A top view of a chip package provided in an embodiment of this utility model;

[0035] Figure 3 This is one of the structural schematic diagrams of a chip package display conductive element provided by an embodiment of the present utility model;

[0036] Figure 4 This is a second schematic diagram of the structure of a chip package display conductive element provided in an embodiment of the present utility model;

[0037] Figure 5 A front view of a chip package provided in an embodiment of this utility model;

[0038] Figure 6 for Figure 5 A magnified view of a portion of point P in the middle.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10 - Circuit board; 11 - Component mounting surface;

[0041] 20 - Chip; 21 - Photosensitive area;

[0042] 30 - Package body; 31 - Conductive component; 311 - External part; 3111 - Square protrusion; 31111 - Outer end face; 312 - Square frame; 312a - Outer square frame; 312b - Inner square frame; 3121 - Support beam; 3121a - First support beam; 3121b - Second support beam; 313 - Support part; 32 - Plastic encapsulation; 321 - Clearance notch; 322 - Outer wall. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0046] In the field of chip packaging, the compactness and integration of the packaging structure directly affect product performance and production yield. Current mainstream packaging processes use a package to encapsulate and protect the chip; however, the size of the circuit board on which the chip is mounted is usually larger than the package, creating a redundant structure. Meanwhile, external components such as lens motors need to be electrically connected to the circuit board surrounding the package via conductive connectors. This distributed connection method not only increases the overall size of the packaged chip module but also introduces more process error points due to the complex connection structure, resulting in uneven internal stress distribution, reduced packaging structure stability, and ultimately affecting chip production yield and reliability.

[0047] In view of this, some embodiments of this application provide a chip package and a camera module. The package is supported by a conductive component and exposed to the outside of the plastic shell through an external part. The circuit board is electrically connected to the lens motor through the conductive component, which reduces the overall volume of the chip package, realizes the miniaturization and integration of the product, reduces the use of conductive connectors, reduces the risk of loose connection points and poor contact, improves the stability and reliability of the connection, and thus improves the production yield of the chip.

[0048] The present application will be described in detail below through specific embodiments:

[0049] The chip package of this application embodiment, such as Figures 1-6 As shown, a chip package is used for connection with a lens motor. The chip package includes:

[0050] Circuit board 10, circuit board 10 having component mounting surface 11;

[0051] Chip 20 is disposed on component mounting surface 11 and electrically connected to circuit board 10. Chip 20 has photosensitive area 21.

[0052] Package 30 is disposed on component mounting surface 11 and located around chip 20. Package 30 includes:

[0053] The conductive element 31 is used to support the package 30. At least a portion of the conductive element 31 is electrically connected to the circuit board 10. The side of the conductive element 31 away from the circuit board 10 has an external portion 311.

[0054] A plastic casing 32 is wrapped around a conductive element 31. The plastic casing 32 has a clearance notch 321 for exposing the photosensitive area 21. An external portion 311 is exposed on the outside of the plastic casing 32 so that the circuit board 10 is electrically connected to the lens motor via the conductive element 31.

[0055] In the chip package provided in this application embodiment, the circuit board 10 serves as the basic carrier and has a component mounting surface 11. The chip 20 is disposed on the component mounting surface 11 and electrically connected to the circuit board 10. The photosensitive area 21 of the chip 20 needs to ensure unobstructed light transmission. The conductive element 31 of the package 30 serves to support the plastic shell 32 and is partially electrically connected to the circuit board 10 to construct an internal electrical path. The external portion 311 of the conductive element 31 on the side away from the circuit board 10 provides an interface for connection with the lens motor. The conductive element 31 is embedded in the plastic shell 32, so that the plastic shell 32 covers the conductive element 31, which plays a role in protecting the internal structure. The clearance notch 321 of the plastic shell 32 leaves a light path for the photosensitive area 21 of the chip 20. The external portion 311 is exposed on the outside of the plastic shell 32, ensuring the feasibility of electrical connection between the conductive element 31 and the lens motor.

[0056] Thus, the package 30 is directly electrically connected to the lens motor via the external portion 311 of the conductive element 31. Firstly, this reduces redundant connection structures and extensions of the circuit board 10, effectively miniaturizing the overall size of the package 30 and achieving product miniaturization and integration. Secondly, the conductive element 31 not only provides physical support but also serves as a carrier for electrical connections, directly connecting to the lens motor. Compared to traditional distributed connections, this reduces the use of conductive connectors, lowers the risk of loose connections and poor contact, and improves connection stability and reliability, thereby increasing the production yield of the chip 20. Thirdly, since the conductive element 31 is fixed within the plastic casing 32, there is no need to install additional wires or other conductive connectors, making the manufacturing and assembly of the chip package more convenient.

[0057] In some embodiments, such as Figures 1-2 As shown, the conductive element 31 surrounds the outer periphery of the chip 20, and the external portion 311 includes a plurality of external portions 311, which are arranged at intervals along the circumference of the chip 20.

[0058] The conductive component 31 serves as a supporting structure for the package 30, enclosing the chip 20 in the middle and enhancing the overall mechanical strength of the package 30. It can not only evenly distribute the pressure from the outside, allowing the chip 20 to be better protected when subjected to external impacts or vibrations, reducing the risk of damage to the chip 20 due to mechanical stress, but also play a certain role in electromagnetic shielding, reducing the impact of external electromagnetic interference on the chip 20, improving the reliability of the package 30 in various complex environments, and improving the stability of the chip 20's operation.

[0059] Multiple external parts 311 increase the number of electrical connection points with external components such as lens motors. The multiple external parts 311 are arranged at intervals along the circumference of the chip 20, which helps to optimize the transmission path and quality of electrical signals. Multiple connection points can share the current, reduce the current load of each connection point, reduce resistance heating and signal attenuation, improve the efficiency and accuracy of electrical signal transmission, and make the electrical connection more stable and reliable.

[0060] Specifically, such as Figures 3-4 As shown, the conductive component 31 includes a square frame 312, and the chip 20 is located in the space enclosed by the square frame 312. The four vertices of the square frame 312 that are away from the circuit board 10 are provided with external parts 311.

[0061] The conductive component 31 adopts a square frame 312 design, which is generally well matched to the shape of the chip 20 (the chip 20 is mostly square or rectangular). It can be tightly surrounded by the chip 20, providing stable and balanced support for the chip 20, and can also make full use of the internal space of the package 30 to achieve a compact package design. The square frame 312 makes the strength of the package 30 more uniform in all directions, and can better resist external impacts and vibrations from different directions.

[0062] External connections 311 are positioned at the four vertices of the square frame 312 furthest from the circuit board 10, exhibiting a clear regularity and symmetry. This symmetrical distribution of connection points allows for more even current distribution across the external connections 311, reducing current concentration, resistance loss, and heat generation. The regular layout of the square frame 312 and the external connections 311 at the vertices simplifies the manufacturing process of the package 30. During manufacturing, this structure facilitates mold design and processing, improving production efficiency and precision while reducing production costs.

[0063] In other embodiments, the conductive element 31 may also be designed with other structural types such as polygons or circles.

[0064] In some embodiments, such as Figure 4 As shown, the square frame 312 includes multiple supporting beams 3121, which enclose the square frame 312 to form the square frame 312. The outer part 311 is provided on the surface of the supporting beams 3121 away from the circuit board 10.

[0065] The square frame 312 composed of multiple support beams 3121 can be flexibly adjusted according to the size and shape of the chip 20. By increasing or decreasing the number of support beams 3121, changing the length and width of the beams, it can adapt to the packaging requirements of chips 20 of different specifications, thus improving the versatility and scalability of the package 30.

[0066] The square frame 312 structure composed of multiple supporting beams 3121 increases the contact area between the conductive component 31 and the outside world, which is beneficial for heat dissipation. During the operation of the chip 20, a certain amount of heat is generated. The supporting beams 3121 conduct the heat to the outside of the package 30, which can effectively reduce the operating temperature of the chip 20 and improve the performance and reliability of the chip 20.

[0067] The external connector 311 is positioned on the surface of the support beam 3121 away from the circuit board 10. This allows for a more direct and streamlined connection between the external connector 311 and external components such as the lens motor, reducing the length and complexity of the wiring. Consequently, it lowers line resistance and inductance, improving the efficiency and stability of electrical signal transmission. Simultaneously, the external connector 311's location on the support beam 3121 enables the establishment of a stable electrical connection between the support beam 3121 and the chip 20 and the circuit board 10, ensuring reliable electrical signal transmission.

[0068] In this embodiment, such as Figure 3 and Figure 4 As shown, the outer part 311 is a square protrusion 3111.

[0069] The external connector 311 is designed as a square protrusion 3111, which provides a relatively large and flat connection surface when connected to external components such as the lens motor, thus improving the stability and reliability of the connection. The protrusion design gives the external connector 311 a certain height on the surface of the package 30, facilitating docking and connection with external components, while also preventing interference with other parts to a certain extent.

[0070] The square shape is relatively easy to achieve during the manufacturing process. Whether using stamping, injection molding, or other processing techniques, square protrusions 3111 that meet the size requirements can be manufactured with relatively high precision. The square shape also allows for the reasonable arrangement of multiple external parts 311 on the limited surface of the package 30. Furthermore, due to the regularity of its shape, it can better coordinate with other components in space, avoiding space waste or interference.

[0071] In other embodiments, the external portion 311 may also be other structural types such as a spherical protrusion or a cylindrical protrusion.

[0072] In one possible implementation, such as Figure 5 and Figure 6 As shown, the square protrusion 3111 has an outer end face 31111 on the side away from the circuit board 10. The outer end face 31111 protrudes from the outer wall 322 of the plastic encapsulation shell 32 in a direction perpendicular to the circuit board 10.

[0073] The outer end face 31111 of the square protrusion 31111 protrudes from the outer wall 322 of the plastic shell 32 in a direction perpendicular to the circuit board 10, so that the external part 311 has a significant protrusion on the outside of the package 30. When making electrical connections with external components such as lens motors, operators can more easily access the external part 311 without the need for additional tools or complicated operating steps to find and connect the external part 311, reducing the difficulty of connection and operation time, improving production efficiency, and also facilitating precise connection operations for automated production equipment, improving the accuracy and consistency of the connection.

[0074] In addition, the protruding outer end face 31111 provides more contact space and allowance for the connection, ensuring better tight contact between the outer part 311 and the external component during the connection process and reducing electrical connection failures caused by poor contact. For example, under vibration or external force, the protruding part of the outer end face 31111 can absorb a certain amount of displacement and stress, preventing the connection point from loosening or breaking, thereby improving the reliability of the electrical connection of the entire package 30.

[0075] In another possible implementation, the square protrusion 3111 has an outer end face 31111 on the side away from the circuit board 10, and the outer end face 31111 is flush with the outer wall 322 of the plastic casing 32.

[0076] The outer end face 31111 of the square protrusion 3111 is flush with the outer wall 322 of the plastic encapsulation shell 32, which means that the outer end face 31111 of the external part 311 is on the same plane as the outer surface of the plastic encapsulation shell 32 in the direction perpendicular to the circuit board 10. This makes the overall appearance of the package 30 relatively flat, without obvious protrusions, and more compact in spatial layout. It also ensures the stability of the external part 311 in the structure of the package 30 and its coordination with other parts.

[0077] In some embodiments, such as Figure 4 As shown, the square frame 312 includes an outer square frame 312a and an inner square frame 312b that are connected to each other. The multiple support beams 3121 include a first support beam 3121a that encloses the outer square frame 312a and a second support beam 3121b that encloses the inner square frame 312b. Part of the second support beam 3121b extends to the first support beam 3121a and is connected to the first support beam 3121a.

[0078] like Figure 4 As shown, at least a portion of the external part 311 is provided at the connection between the first support beam 3121a and the second support beam 3121b.

[0079] The conductive component 31 is composed of an outer square frame 312a and an inner square frame 312b connected to each other. The double-layer frame structure provides a more stable support system for the chip 20. The outer square frame 312a is enclosed by the first support beam 3121a, which plays a role in supporting and protecting the external contour of the overall package 30. The inner square frame 312b is enclosed by the second support beam 3121b, which is closer to the chip 20 and can provide more direct protection and support for the chip 20.

[0080] Part of the second support beam 3121b extends to and connects to the first support beam 3121a. This connection method enhances the structural strength and stability between the inner and outer frames, making the entire conductive component 31 an organic whole. It not only improves the mechanical structure of the package 30's resistance to external forces, but also provides more path options and a more stable conduction channel for the transmission of electrical signals in the conductive component 31 in terms of electrical connection.

[0081] At least a portion of the external connection 311 is located at the connection between the first support beam 3121a and the second support beam 3121b. This connection is a critical node in the inner and outer frame structures, possessing high mechanical strength to withstand the stress generated when the external connection 311 connects to external components. Simultaneously, in terms of electrical connection, the concentrated metal structure at this location results in a shorter and more direct electrical signal transmission path, facilitating signal convergence and transmission, reducing resistance and signal attenuation, and ensuring reliable connection to external components such as the lens motor.

[0082] In this embodiment, the conductive element 31 is soldered to the component mounting surface 11 and electrically connected to the circuit board 10.

[0083] The conductive component 31 is fixed to the component mounting surface 11 of the circuit board 10 by welding, so that the conductive component 31 and the circuit board 10 are firmly bonded together, which improves the overall mechanical stability of the package 30. During the use of electronic products, they may be subjected to external forces such as vibration and impact. This firm connection can ensure that there is no relative displacement between the conductive component 31 and the circuit board 10, thereby protecting the internal chip 20 and other components from damage and extending the service life of the product.

[0084] In some embodiments, such as Figure 3 As shown, the conductive component 31 also includes a plurality of support portions 313, which are disposed on the side of the square frame 312 structure facing the circuit board 10, and the support portions 313 are electrically connected to the circuit board 10. Figure 4 As shown, multiple support parts 313 are respectively located at the vertices of the square frame 312 structure.

[0085] Multiple support portions 313 are electrically connected to the circuit board 10, providing good support for the conductive component 31 and multiple paths for the transmission of electrical signals. The electrical signals can continue to be conducted through other support portions 313, ensuring the normal operation of the circuit. Multiple support portions 313 can also distribute the pressure from above more evenly, effectively preventing the square frame 312 structure from deforming or separating from the circuit board 10 under stress.

[0086] This application also discloses a camera module, including a lens motor and a chip 20 package 30 connected to each other. The chip 20 package 30 in this camera module is the chip 20 package 30 described above. Therefore, the camera module in this embodiment has roughly the same technical effect as the chip 20 package 30 described above. Since the technical effect of the chip 20 package 30 has been fully explained, it will not be repeated here.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A chip package for connection to a lens motor, characterized in that, The chip package includes: A circuit board having a component mounting surface; A chip, which is disposed on the component mounting surface and electrically connected to the circuit board, and has a photosensitive area; A package, disposed on a component mounting surface and located on the periphery of the chip, the package comprising: A conductive element, at least a portion of which is electrically connected to the circuit board, wherein the conductive element has an external portion on the side away from the circuit board; A plastic casing, in which the conductive element is embedded and supports the plastic casing, the plastic casing having a clearance notch for exposing the photosensitive area; wherein the external portion is exposed on the outside of the plastic casing so that the circuit board is electrically connected to the lens motor via the conductive element.

2. The chip package according to claim 1, characterized in that, The conductive element is disposed around the outer periphery of the chip, and the external portion includes a plurality of external portions, which are arranged at intervals along the circumference of the chip.

3. The chip package according to claim 2, characterized in that, The conductive component includes a square frame, the chip is located within the space enclosed by the square frame, and the external portion is provided at each of the four vertices of the square frame away from the circuit board.

4. The chip package according to claim 3, characterized in that, The square frame includes multiple supporting beams, which enclose the square frame. The outer part is located on the surface of the supporting beams away from the circuit board.

5. The chip package according to claim 4, characterized in that, The outer part is a square protrusion.

6. The chip package according to claim 5, characterized in that, The square protrusion has an outer end face away from the circuit board, and the outer end face protrudes from the outer wall of the plastic encapsulation in a direction perpendicular to the circuit board.

7. The chip package according to claim 5, characterized in that, The square protrusion has an outer end face away from the circuit board, and the outer end face is flush with the outer wall of the plastic encapsulation.

8. The chip package according to claim 4, characterized in that, The square frame includes an outer square frame and an inner square frame that are connected to each other. The plurality of supporting beams include a first supporting beam that encloses the outer square frame and a second supporting beam that encloses the inner square frame. A portion of the second supporting beam extends to the first supporting beam and is connected to the first supporting beam. At least part of the external portion is provided at the connection between the first support beam and the second support beam.

9. The chip package according to any one of claims 1-8, characterized in that, The conductive element is soldered to the mounting surface of the component and is electrically connected to the circuit board.

10. A camera module, characterized in that, It includes an interconnected lens motor and a chip package, the chip package being the chip package as described in any one of claims 1-9.

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