Semiconductor molding compound weighing and removing device
By using pneumatic grippers to weigh and recycle substandard black glue during the conveying process, the problem of continuous weighing in traditional equipment is solved, thereby improving the efficiency and product quality of semiconductor packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUJINSON (NANTONG) TECH LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-05-22
AI Technical Summary
Traditional semiconductor packaging equipment cannot weigh the material while continuously pushing it, resulting in poor weighing efficiency.
A semiconductor molding compound weighing and rejection device was designed. It uses pneumatic grippers to weigh the compound during the conveying process and processes unqualified black glue by recycling components, thus achieving continuous conveying and weighing.
It improves the conveying efficiency of black glue, avoids product defects and increased production costs caused by insufficient black glue, and realizes continuous weighing and rejection operations.
Smart Images
Figure CN224265839U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor molding compound technology, specifically relating to a semiconductor molding compound weighing and rejection device. Background Technology
[0002] In semiconductor packaging, epoxy resin is typically used to encapsulate and protect semiconductor chips. Before the automatic semiconductor encapsulation equipment loads the epoxy resin, it needs to be weighed to remove any insufficiently weighed resin. This is to prevent poor encapsulation of semiconductor chips due to insufficient epoxy resin, which could lead to product scrap and increased production costs.
[0003] Traditional vinyl packaging weighing mechanisms require pushing the weighed vinyl from the weighing position to the next station and picking up the vinyl to be weighed from the conveyor position to the weighing position to achieve the weighing of the vinyl. However, traditional semiconductor packaging mechanisms cannot perform vinyl weighing while continuously pushing vinyl, resulting in poor pushing efficiency. Utility Model Content
[0004] This application provides a semiconductor molding compound weighing and rejection device to solve the above-mentioned technical problems.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: a semiconductor molding compound weighing and rejection device, including a support frame, a conveying mechanism, and a recycling component. A feeding bracket and a picking bracket are vertically connected to the upper front end of the support frame; the conveying mechanism is provided with multiple pneumatic grippers for holding black glue, and the pneumatic grippers are located above the feeding bracket and the picking bracket; wherein, a weighing unit is provided between the feeding bracket and the picking bracket; and a recycling component is provided between the weighing unit and the picking bracket.
[0006] Furthermore, the conveying mechanism includes a first cylinder and a movable seat. The upper end of the support frame is provided with a first slide rail, and a first slider is movably mounted on the first slide rail. The movable seat is fixedly connected to the first slider. The first cylinder is mounted on the rear end of the support frame via a frame plate. The telescopic rod of the first cylinder is connected to the strip plate on the side end of the movable seat. A lifting cylinder is provided on the movable seat. A lifting plate is connected to the upper end of the lifting cylinder. A T-shaped side plate is connected to the front side of the lifting plate. Pneumatic grippers are provided on both sides of the lower end of the T-shaped side plate.
[0007] Furthermore, the upper end of the feeding bracket is provided with a slide groove, in which a feeding plate with a height lower than the pneumatic gripper is slidably installed; first limit switches are provided on the front and rear sides of the slide groove; a feeding port is provided on the outer side of the feeding bracket; wherein, the side end of the feeding plate is provided with a card interface corresponding to the feeding port.
[0008] Furthermore, a feeding cylinder is provided on the side of the feeding bracket away from the feeding port, and a sliding track is provided on the upper end of the feeding cylinder; an L-shaped connecting plate is connected to the front end of the feeding cylinder, and the bottom of the horizontal plate of the L-shaped connecting plate is slidably connected to the sliding track; the upper end of the horizontal plate is connected to the side extension plate of the feeding plate.
[0009] Furthermore, the upper end of the material picking bracket is provided with a second slide rail, in which a second slider is slidably arranged, and a feeding plate is connected to the second slider; a material holder with a height lower than the pneumatic gripper is fixed to the feeding plate; a second cylinder is provided at the top of the material picking bracket, and the second cylinder is connected to the front end of the feeding plate through a U-shaped plate passing through the material picking bracket.
[0010] Furthermore, a second limit switch is provided at the front end of the material picking bracket, and a third limit switch is provided at the middle side end of the material picking bracket; wherein, a limit block corresponding to the third limit switch is provided at the side end of the feeding plate.
[0011] Furthermore, the weighing unit includes a weighing frame connected to the support frame, a weighing counter is provided above the front end of the weighing frame, and a weighing platform is connected to the upper end of the weighing counter.
[0012] Furthermore, the recycling assembly includes a recycling trough located at the side end of the weighing platform and a recycling bin located away from the support frame; the recycling trough and the recycling bin are connected by a recycling pipe.
[0013] The beneficial effects of this application are: the two pneumatic grippers of the conveying mechanism can perform the weighing operation of black glue at the same time as picking up or feeding the material, without waiting for the weighing step separately, thus improving the conveying efficiency of black glue; at the same time, when the weight of the black glue is detected to be unacceptable, it is thrown into the recycling component for recycling during the conveying process of the pneumatic grippers. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of an embodiment of the semiconductor molding compound weighing and rejection device of this application;
[0015] Figure 2 yes Figure 1 A schematic diagram of the structure of one embodiment of the conveying mechanism;
[0016] Figure 3 yes Figure 1 A schematic diagram of the structure of an embodiment of the feeding bracket;
[0017] Figure 4 yes Figure 1 A schematic diagram of one embodiment of the material handling bracket. Detailed Implementation
[0018] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.
[0019] like Figure 1-4 As shown, this application provides a semiconductor molding compound weighing and rejection device, including a support frame 1, a conveying mechanism 2, and a recycling component 3. A feeding bracket 4 and a picking bracket 5 are vertically connected to the upper front end of the support frame 1. The conveying mechanism 2 is equipped with multiple pneumatic grippers 6 for holding the molding compound, and the pneumatic grippers 6 are located above the feeding bracket 4 and the picking bracket 5. A weighing unit 7 is provided between the feeding bracket 4 and the picking bracket 5. The recycling component 3 is provided between the weighing unit 7 and the picking bracket 5. In the above design, the feeding bracket 4 can receive materials, and the conveying mechanism 2 delivers the received materials to the weighing unit 7 for weighing, and then performs picking or recycling operations on the materials.
[0020] The conveying mechanism 2 includes a first cylinder 21 and a movable seat 22. A first slide rail 23 is provided at the upper end of the support frame 1, and a first slider 24 is movably mounted on the first slide rail 23. The movable seat 22 is fixedly connected to the first slider 24. The first cylinder 21 is mounted at the rear end of the support frame 1 via a frame plate. The extension rod of the first cylinder 21 is connected to a strip plate 25 on the side of the movable seat 22. A lifting cylinder 26 is provided on the movable seat 22. A lifting plate 27 is connected to the upper end of the lifting cylinder 26. A T-shaped side plate 28 is connected to the front side of the lifting plate 27, and pneumatic grippers 6 are provided on both sides of the lower end of the T-shaped side plate 28. In the above design, the extension and retraction of the first cylinder 21 can drive the entire movable plate to move back and forth. Simultaneously, the lifting cylinder 26 can control the height of the lifting plate 27, thereby controlling the lifting and lowering of the pneumatic grippers 6. The pneumatic grippers 6 can be used to grasp the black rubber block and move it. In this embodiment, a tracked moving cable tray is connected to the side end of the lifting cylinder 26 and the top inner side of the support frame 1. Multiple sets of power lines, control lines and compressed air pipes required by the equipment can be arranged through the moving cable tray.
[0021] The upper end of the feeding bracket 4 is provided with a slide groove 41, in which a feeding plate 42, with a height lower than that of the pneumatic gripper 6, is slidably disposed. First limit switches 43 are provided on both the front and rear sides of the slide groove 41. A feeding port 44 is provided on the outer side of the feeding bracket 4. The feeding plate 42 has a corresponding locking interface 421 on its side end. In the above design, the locking interface 421 in the feeding plate 42 can engage the black rubber block input from the feeding port 44, and the black rubber block in the feeding plate 42 is transported to the pneumatic gripper 6 for gripping via the slide groove 41. The first limit switches 43 can position the feeding plate 42 during feeding and gripping.
[0022] A feeding cylinder 45 is provided on the side of the feeding bracket 4 away from the feeding port 44. A sliding rail 451 is provided on the upper end of the feeding cylinder 45. An L-shaped connecting plate 46 is connected to the front end of the feeding cylinder 45. The bottom of the horizontal plate of the L-shaped connecting plate 46 is slidably connected to the sliding rail 451. The upper end of the horizontal plate is connected to the side extension plate of the feeding clamp 42. The extension and retraction of the feeding cylinder 45 in the above design can drive the L-shaped connecting plate 46 and the feeding clamp 42 to move back and forth, thereby facilitating the transportation of black rubber blocks.
[0023] The upper end of the material-retrieving bracket 5 is provided with a second slide rail 51, in which a second slider 52 is slidably disposed. A feeding plate 53 is connected to the second slider 52. A material holder 54 with a height lower than that of the pneumatic gripper 6 is fixedly connected to the feeding plate 53. A second cylinder 55 is provided at the top of the material-retrieving bracket 5. The second cylinder 55 is connected to the front end of the feeding plate 53 through a U-shaped plate 56 passing through the material-retrieving bracket 5. In the above design, the second cylinder 55 drives the feeding plate 53 to move back and forth through the U-shaped plate 56, which facilitates the conveying of the black rubber block on the material holder 54 to the area below the external material-retrieving component.
[0024] The material handling bracket 5 has a second limit switch 57 at its front end and a third limit switch 58 at its middle side end; the feeding plate 53 has a limit block 59 at its side end corresponding to the third limit switch 58. The second limit switch 57 ensures that the feeding plate 53 can advance to the material handling position. The third switch 58 ensures that the feeding plate 53 can move to the position of the pneumatic gripper 6, facilitating the pneumatic gripper 6 to place the black glue into the material holder 54 for transportation.
[0025] The weighing unit 7 includes a weighing frame 71 connected to the support frame 1. A weighing counter 72 is located above the front end of the weighing frame 71, and a weighing platform 73 is connected to the upper end of the weighing counter 72. The weighing counter 72 in the above design contains a weighing sensor that can sense the specific weight of the black rubber on the weighing platform 73. If the weight is within a preset range, a non-compliance signal is sent to the control terminal. After the pneumatic gripper 6 picks up the black rubber block, it releases the gripper when it moves to the position of the recycling component 3, allowing the non-compliance black rubber block to enter the recycling component 3.
[0026] The recycling component 3 includes a recycling trough 31 located at the side end of the weighing platform 73 and a recycling box 32 located away from the support frame 1; the recycling trough 31 and the recycling box 32 are connected by a recycling pipe 33. In the above design, the recycling trough 31 can receive the unqualified black rubber blocks thrown by the pneumatic gripper 6, and enter the recycling box 32 through the recycling pipe 33 for later recycling.
[0027] The specific working method is as follows: An external device feeds a black rubber block from the feeding port 44 into the clamping interface 421 of the feeding clamp 42. Then, the feeding cylinder 45 is activated, causing the feeding clamp 42 to move along the slide groove 41, so that the black rubber block in the clamping interface 421 is positioned below one of the pneumatic grippers 6. The pneumatic gripper 6 opens, and the lifting cylinder 26 controls the lifting plate 27 and the pneumatic gripper 6 to descend. When the pneumatic gripper 6 reaches its lowest position, it closes, thus gripping the black rubber block. Then, the lifting cylinder 26 rises to disengage the black rubber block from the clamping interface 421, and the first cylinder 21 is activated to move the moving plate, causing the black rubber block gripped by the pneumatic gripper 6 to move accordingly. When the pneumatic gripper 6 reaches the weighing frame 71, the other pneumatic gripper 6 is positioned at the feeding bracket 4. At this time, the lifting cylinder 26 lowers and the starting claw releases, allowing the black rubber block to be placed on the weighing platform 73 for weighing. At the same time, the pneumatic gripper 6 on the other side repeats the previous process of gripping the material.
[0028] If the weight of the black rubber block does not meet the preset range, the pneumatic gripper 6 will grab it again and move it above the recycling tank 31. The gripper will then release, allowing the defective black rubber block to fall into the recycling tank 31 and enter the recycling bin 32 for recycling. If the weight of the black rubber block meets the preset range, the pneumatic gripper 6 will grab it again and move it onto the feeding bracket 4. The pneumatic gripper 6 will then descend, allowing the black rubber block to fall into the material holder 54. The second cylinder 55 will then be activated to move the feeding plate 53, transporting the black rubber block to below the other gripping components on the upper side. Simultaneously, the process is the same as the above steps. During material handling, the black rubber block in the gripper on the other side is weighed, and this cycle is repeated to weigh and transport the black rubber block.
[0029] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A semiconductor molding compound weighing and rejection device, characterized in that, include: The assembly includes a support frame, a conveying mechanism, and a recycling component. The upper front end of the support frame is vertically connected to a feeding bracket and a picking bracket. The conveying mechanism is equipped with multiple pneumatic grippers for holding black glue, and the pneumatic grippers are located above the feeding bracket and the picking bracket. A weighing unit is provided between the feeding bracket and the picking bracket. The recycling component is provided between the weighing unit and the picking bracket.
2. The semiconductor molding compound weighing and rejection device according to claim 1, characterized in that, The conveying mechanism includes a first cylinder and a movable seat. The upper end of the support frame is provided with a first slide rail, and a first slider is movably arranged on the first slide rail. The movable seat is fixed to the first slider. The first cylinder is arranged at the rear end of the support frame through a frame plate. The telescopic rod of the first cylinder is connected to the strip plate at the side end of the movable seat. The movable seat is provided with a lifting cylinder. The upper end of the lifting cylinder is connected to a lifting plate. The front side of the lifting plate is connected to a T-shaped side plate. The pneumatic grippers are provided on both sides of the lower end of the T-shaped side plate.
3. The semiconductor molding compound weighing and rejection device according to claim 2, characterized in that, The upper end of the feeding bracket is provided with a slide groove, and a feeding plate with a height lower than the pneumatic gripper is slidably disposed in the slide groove; a first limit switch is provided on the front and rear sides of the slide groove; a feeding port is provided on the outer side of the feeding bracket; wherein, the side end of the feeding plate is provided with a card interface corresponding to the feeding port.
4. The semiconductor molding compound weighing and rejection device according to claim 3, characterized in that, A feeding cylinder is provided on the side of the feeding bracket away from the feeding port, and a sliding track is provided on the upper end of the feeding cylinder; an L-shaped connecting plate is connected to the front end of the feeding cylinder, and the bottom of the horizontal plate of the L-shaped connecting plate is slidably connected to the sliding track; the upper end of the horizontal plate is connected to the side extension plate of the feeding plate.
5. The semiconductor molding compound weighing and rejection device according to claim 2, characterized in that, The upper end of the material picking bracket is provided with a second slide rail, in which a second slider is slidably arranged, and a feeding plate is connected to the second slider; a material holder with a height lower than the pneumatic gripper is fixed to the feeding plate; a second cylinder is provided at the top of the material picking bracket, and the second cylinder is connected to the front end of the feeding plate through a U-shaped plate passing through the material picking bracket.
6. The semiconductor molding compound weighing and rejection device according to claim 5, characterized in that, The material receiving bracket is provided with a second limit switch at its front end and a third limit switch at its middle side end; wherein, the feeding plate is provided with a limit block corresponding to the third limit switch at its side end.
7. The semiconductor molding compound weighing and rejection device according to claim 1, characterized in that, The weighing unit includes a weighing frame connected to the support frame, a weighing counter is provided above the front end of the weighing frame, and a weighing platform is connected to the upper end of the weighing counter.
8. The semiconductor molding compound weighing and rejection device according to claim 7, characterized in that, The recycling assembly includes a recycling trough located at the side end of the weighing platform and a recycling bin located away from the support frame; the recycling trough and the recycling bin are connected by a recycling pipe.