Server heat dissipation framework

Abstract

The utility model discloses a server heat dissipation framework, which relates to the technical field of servers and comprises a box body and a cover body arranged on the box body, and the box body is sequentially provided with a hard disk installation area, a fan installation area, a mainboard installation area and a functional module installation area from front to back. Independent air ducts are arranged on the two sides of the hard disk installation area and extend from the front end of the box body to the rear end of the box body; and a power supply mounting area is arranged in the front section of the independent air duct. According to the utility model, the power supply mounting area is arranged by arranging the independent air duct, so that heat generated by the power supply can be effectively eliminated, and heat accumulation in the server can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of server technology, and specifically to a server heat dissipation architecture. Background Technology

[0002] Currently, some servers adopt a front-mounted power supply design, which has the following advantages: When maintaining servers in a rack, technicians can directly replace the server's power supply from the front of the rack without having to drag the entire server out, saving time and operating space; the input power cable is connected from the front of the server, separated from the network and storage cables at the back, reducing cable tangling and improving rack neatness; the rear of the server is usually used for cable management and expansion card installation, and a front-mounted power supply avoids competing for space with rear components, making it suitable for compact rack designs. However, a front-mounted power supply design causes the heat generated by the power supply to directly enter the server's interior, mixing with the airflow from the CPU, memory, and other core components, which can easily lead to heat buildup inside the server. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a server heat dissipation architecture. By setting up an independent air duct to house the power supply installation area, the heat generated by the power supply can be effectively dissipated, which helps to reduce heat accumulation inside the server.

[0004] This utility model provides a server heat dissipation architecture, including a chassis and a cover disposed on the chassis. The chassis is provided with a hard drive installation area, a fan installation area, a motherboard installation area and a functional module installation area from front to back. Independent air ducts are provided on both sides of the hard drive installation area, and the independent air ducts extend from the front end to the rear end of the chassis. A power supply installation area is provided in the front section of the independent air duct.

[0005] Specifically, the independent air duct includes a front ventilation duct and a rear ventilation duct that are interconnected. The cross-section of the front ventilation duct is at least 4 times larger than the cross-section of the rear ventilation duct, and the power supply installation area is located in the front ventilation duct.

[0006] The front ventilation duct extends from the front end of the enclosure to the motherboard mounting area, and the rear ventilation duct extends from the motherboard mounting area to the rear end of the enclosure.

[0007] Specifically, the front ventilation duct and the rear ventilation duct are connected by a guide connecting cover, the guide connecting cover having a transition plate perpendicular to the cover body, the transition plate being inclined from the front ventilation duct to the rear ventilation duct.

[0008] Specifically, a wind guide is provided protruding on the cover; when the cover is installed on the housing, the wind guide is located above the motherboard mounting area.

[0009] Specifically, a first inclined plate is provided on the side of the air guide shroud near the fan mounting area, and the first inclined plate is inclined from the upper front of the housing to the lower rear of the housing;

[0010] A second inclined plate is provided on the side of the air guide shroud near the functional module installation area, and the second inclined plate is inclined from the lower front of the box to the upper rear of the box;

[0011] The first inclined plate and the second inclined plate are connected based on a parallel plate, which is parallel to the bottom of the box.

[0012] Specifically, the front end of the enclosure is provided with a front panel, which is connected to the hard drive installation area;

[0013] The rear end of the housing is provided with a rear panel, which is connected to the functional module installation area.

[0014] Specifically, the hard drive installation area is provided with several hard drive installation boxes at intervals.

[0015] Specifically, the bottom of the enclosure corresponding to the fan mounting area has several fan clips protruding from it, and each of the fan clips corresponds to one of the hard drive mounting boxes, with a fan slot formed between the corresponding fan clip and the hard drive mounting box.

[0016] Specifically, each of the aforementioned hard drive mounting boxes is provided with a clamping plate, one end of which is rotatably mounted on the top of the hard drive mounting box based on a torsion spring, and the other end of which is suspended in the air.

[0017] Specifically, the top of both sides of the box body is formed with slots, and the bottom of the slots is provided with several holes; the sides of the cover body are formed with strips, and the lower edge of the strips is formed with several hooks, and the hooks and the holes correspond one-to-one.

[0018] When the cover is installed on the box, the locking strip is inserted into the locking slot and the locking hook is inserted into the locking hole.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] The server heat dissipation architecture of this utility model has independent air ducts set on both sides of the hard drive installation area, and the power supply installation area is placed at the front of the independent air duct. Since the independent air duct extends from the front end of the chassis to the rear end, crossing the motherboard installation area, etc., the heat generated by the power supply can be directly discharged from the server, so that the heat generated by the power supply is effectively removed, avoiding the heat generated by the power supply from mixing with the heat dissipation airflow of core components such as CPU and memory, which helps to reduce the heat accumulation inside the server. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a first exploded structural diagram of the server heat dissipation architecture in an embodiment of this utility model;

[0023] Figure 2 This is a schematic diagram of the structure of the guide connecting cover in an embodiment of this utility model;

[0024] Figure 3 This is a second exploded view of the server heat dissipation architecture in an embodiment of this utility model;

[0025] Figure 4 This is a schematic diagram showing the position of the air guide cover in the housing in an embodiment of this utility model;

[0026] Figure 5 This is a schematic diagram of the structure of the air guide cover in an embodiment of this utility model;

[0027] Figure 6 This is a schematic diagram showing the positions of the front panel and rear panel on the housing in an embodiment of this utility model;

[0028] Figure 7 This is a schematic diagram of the fan clip structure in an embodiment of this utility model;

[0029] Figure 8 This is a schematic diagram of the hard disk mounting box in an embodiment of this utility model;

[0030] Figure 9 This is a schematic diagram of the card slot and card strip in an embodiment of this utility model.

[0031] In the attached diagram: 1. Housing; 11. Slot; 2. Cover; 21. Clip; 100. Hard drive mounting area; 110. Hard drive mounting box; 111. Clamping plate; 112. Torsion spring; 200. Fan mounting area; 210. Fan clip; 300. Motherboard mounting area; 400. Functional module mounting area; 500. Independent air duct; 510. Front ventilation duct; 520. Rear ventilation duct; 530. Guide connecting cover; 531. Transition plate; 600. Air guide cover; 610. First inclined plate; 620. Second inclined plate; 630. Parallel plate; 700. Front panel; 800. Rear panel. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0033] This utility model provides a server heat dissipation architecture. Figure 1 The diagram shows a first exploded view of the server heat dissipation architecture in an embodiment of the present invention. The server heat dissipation architecture includes a housing 1 and a cover 2 disposed on the housing 1. The housing 1 is provided with a hard disk mounting area 100, a fan mounting area 200, a motherboard mounting area 300 and a functional module mounting area 400 in sequence from front to back. Independent air ducts 500 are provided on both sides of the hard disk mounting area 100, and the independent air ducts 500 extend from the front end to the rear end of the housing 1. A power supply mounting area is provided in the front section of the independent air duct 500.

[0034] The server heat dissipation architecture of this utility model has independent air ducts 500 set on both sides of the hard disk installation area 100, and the power supply installation area is placed at the front of the independent air ducts 500. Since the independent air ducts 500 extend from the front end of the chassis 1 to the rear end, crossing the motherboard installation area 300, etc., the heat generated by the power supply can be directly discharged from the server, so that the heat generated by the power supply is effectively removed, avoiding the heat generated by the power supply from mixing with the heat dissipation airflow of core components such as CPU and memory, which helps to reduce the heat accumulation inside the server.

[0035] In addition, there are two independent air ducts 500 on both sides of the hard drive installation area 100, so there are also two power supply installation areas, which facilitates the installation of multiple redundant power supply modules and supports the expansion of power capacity as needed.

[0036] In some specific embodiments, please refer to Figure 1The independent air duct 500 includes a front ventilation duct 510 and a rear ventilation duct 520 that are interconnected. The cross-section of the front ventilation duct 510 is at least four times larger than that of the rear ventilation duct 520. The power supply mounting area is located in the front ventilation duct 510. The front ventilation duct 510 extends from the front end of the enclosure 1 to the motherboard mounting area 300, and the rear ventilation duct 520 extends from the motherboard mounting area 300 to the rear end of the enclosure 1. The large cross-section of the front ventilation duct 510, extending from the front end of the enclosure 1 to the motherboard mounting area 300, ensures sufficient installation space for the power supply and its related components. The small cross-section of the rear ventilation duct 520, extending from the motherboard mounting area 300 to the rear end of the enclosure 1, helps to avoid competing for space with rear components and facilitates the direct dissipation of heat generated by the power supply to the server.

[0037] Figure 2 A schematic diagram of the guide connecting cover in an embodiment of this utility model is shown. The front ventilation duct 510 and the rear ventilation duct 520 are connected by the guide connecting cover 530. The guide connecting cover 530 has a transition plate 531 perpendicular to the cover body 2. The transition plate 531 slopes from the front ventilation duct 510 to the rear ventilation duct 520. The transition plate 531 can guide the airflow smoothly into the rear ventilation duct 520, avoiding airflow turbulence that affects the heat dissipation effect.

[0038] Furthermore, a cable passage is formed between the side wall of the front ventilation duct 510 and the side wall of the housing 1, which can hide some cables.

[0039] Figure 3 The diagram shows a second exploded view of the server heat dissipation architecture in an embodiment of the present invention, wherein a wind guide 600 is protruding from the cover 2; Figure 4 The diagram shows the position of the air guide shroud within the housing in an embodiment of this invention. When the cover 2 is installed on the housing 1, the air guide shroud 600 is located above the motherboard mounting area 300. The air guide shroud 600 can reduce the cross-sectional area of ​​the airflow channel above the motherboard mounting area 300, thereby increasing the airflow velocity when passing through the motherboard mounting area 300, and thus improving the heat exchange efficiency of core components such as the CPU and memory.

[0040] Figure 5A schematic diagram of the air guide shroud in this embodiment of the present invention is shown. A first inclined plate 610 is provided on the side of the air guide shroud 600 near the fan mounting area 200, and the first inclined plate 610 slopes from the upper front of the housing 1 towards the lower rear. A second inclined plate 620 is provided on the side of the air guide shroud 600 near the functional module mounting area 400, and the second inclined plate 620 slopes from the lower front of the housing 1 towards the upper rear. The first inclined plate 610 and the second inclined plate 620 are connected based on a parallel plate 630, which is parallel to the bottom of the housing 1. The first inclined plate 610, in conjunction with the bottom of the housing 1, can form a contraction channel, reducing the airflow cross-sectional area and increasing the airflow velocity through the Venturi effect. The narrow horizontal channel formed by the parallel plate 630 maintains high-speed airflow, improving the heat exchange efficiency of core components such as the CPU and memory. The second inclined plate 620, in conjunction with the first inclined plate 610, forms a low-pressure acceleration zone in the area of ​​the parallel plate 630, reducing airflow resistance and improving overall flow uniformity.

[0041] Figure 6 This diagram illustrates the positions of the front and rear panels on the chassis in an embodiment of the present invention. A front panel 700 is located at the front end of the chassis 1, and the front panel 700 is connected to the hard drive mounting area 100. A rear panel 800 is located at the rear end of the chassis 1, and the rear panel 800 is connected to the functional module mounting area 400. The front panel 700 and rear panel 800 not only define the physical boundaries of the chassis but also play a crucial role in functional partitioning, hardware installation, and maintenance.

[0042] In some specific embodiments, please refer to Figure 6 The hard drive installation area 100 is provided with several hard drive mounting boxes 110 at intervals, which can accommodate multiple hard drives; the gaps between the hard drive mounting boxes 110 can be used to run cables. In addition, there is also a gap between the hard drive mounting boxes 110 and the independent air duct 500, which can reduce the impact of heat generated by the power supply on the hard drives.

[0043] Figure 7 The diagram shows a schematic of the fan clip structure in an embodiment of the present invention. The bottom of the housing 1 corresponding to the fan mounting area 200 is formed with a plurality of fan clips 210 protruding out. The plurality of fan clips 210 correspond one-to-one with the plurality of hard disk mounting boxes 110. A fan slot is formed between the corresponding fan clips 210 and the hard disk mounting boxes 110. That is, the fan can be clipped together by using the fan clips 210 and the hard disk mounting boxes 110, which reduces the difficulty of fan installation.

[0044] Figure 8A schematic diagram of the hard drive mounting box in an embodiment of this utility model is shown. Each of the hard drive mounting boxes 110 is provided with a clamping plate 111. One end of the clamping plate 111 is rotatably mounted on the top of the hard drive mounting box 110 based on a torsion spring 112, while the other end of the clamping plate 111 is suspended. Under the action of the torsion spring 112, the clamping plate 111 can apply pressure to the hard drive inserted into the hard drive mounting box 110, ensuring the stability of the hard drive installation while facilitating the removal of the hard drive.

[0045] In some specific embodiments, the motherboard mounting area 300 is provided with an insulating pad. The back of the motherboard typically has exposed solder joints and conductive lines. The insulating pad can isolate the motherboard from the enclosure 1, avoiding the risk of short circuits. The insulating pad can also reduce the probability of static electricity being conducted to the motherboard through the enclosure 1, preventing electrostatic discharge from damaging sensitive electronic components.

[0046] Figure 9 The diagram shows a schematic of the slots and strips in an embodiment of the present invention. The top of both sides of the box 1 are formed with slots 11, and the bottom of the slots 11 is provided with several holes. The sides of the cover 2 are formed with strips 21, and the lower edge of the strips 21 is formed with several hooks. The hooks and the holes correspond one-to-one. When the cover 2 is installed on the box 1, the strips 21 are inserted into the slots 11, and the hooks are inserted into the holes, which facilitates the installation and removal of the cover 2.

[0047] This utility model's server cooling architecture features independent air ducts 500 on both sides of the hard drive mounting area 100. The power supply mounting area is positioned at the front of the independent air ducts 500. Since the independent air ducts 500 extend from the front to the rear of the chassis 1, spanning the motherboard mounting area 300, they can directly dissipate the heat generated by the power supply to the server, effectively removing the heat and preventing it from mixing with the airflow from core components such as the CPU and memory, thus reducing heat buildup inside the server. Furthermore, since there are two independent air ducts 500 on both sides of the hard drive mounting area 100, there are also two power supply mounting areas, facilitating the installation of multiple redundant power supply modules and supporting on-demand expansion of power capacity.

[0048] Furthermore, the independent air duct 500 includes a front ventilation duct 510 with a large cross-section and a rear ventilation duct 520 with a small cross-section, which not only ensures sufficient installation space for the power supply and its related components, but also avoids competing for space with the rear components; a cable passage is formed between the side wall of the front ventilation duct 510 and the side wall of the housing 1, which can hide some cables.

[0049] Furthermore, a guide shroud 600 protrudes from the cover 2, which can reduce the cross-sectional area of ​​the airflow channel above the motherboard mounting area 300, thereby increasing the airflow velocity when passing through the motherboard mounting area 300, and thus improving the heat exchange efficiency of core components such as CPU and memory.

[0050] In addition, this utility model forms a fan mounting position through the fan clip 210 and the hard drive mounting box 110, and realizes the combination of the cabinet 1 and the cover 2 through the slot 11 with the clip strip 21 and the clip hole with the clip hook, and realizes the fixation of the hard drive through the clamp plate 111 with the torsion spring 112, making the server heat dissipation architecture easy to maintain.

[0051] The above provides a detailed description of a server heat dissipation architecture provided by the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A server heat dissipation architecture, comprising a chassis and a cover disposed on the chassis, characterized in that, The enclosure is provided with a hard drive installation area, a fan installation area, a motherboard installation area, and a functional module installation area from front to back; independent air ducts are provided on both sides of the hard drive installation area, and the independent air ducts extend from the front end to the rear end of the enclosure; the power supply installation area is provided in the front section of the independent air ducts.

2. The server heat dissipation architecture as described in claim 1, characterized in that, The independent air duct includes a front ventilation duct and a rear ventilation duct that are interconnected. The cross-section of the front ventilation duct is at least 4 times larger than the cross-section of the rear ventilation duct. The power supply installation area is located in the front ventilation duct. The front ventilation duct extends from the front end of the enclosure to the motherboard mounting area, and the rear ventilation duct extends from the motherboard mounting area to the rear end of the enclosure.

3. The server heat dissipation architecture as described in claim 2, characterized in that, The front ventilation duct and the rear ventilation duct are connected by a guide connecting cover, which has a transition plate perpendicular to the cover body. The transition plate slopes from the front ventilation duct to the rear ventilation duct.

4. The server heat dissipation architecture as described in claim 1, characterized in that, A draft hood protrudes from the cover; when the cover is installed on the housing, the draft hood is located above the motherboard mounting area.

5. The server heat dissipation architecture as described in claim 4, characterized in that, A first inclined plate is provided on the side of the air guide shroud near the fan mounting area, and the first inclined plate is inclined from the upper front of the housing to the lower rear of the housing; A second inclined plate is provided on the side of the air guide shroud near the functional module installation area, and the second inclined plate is inclined from the lower front of the box to the upper rear of the box; The first inclined plate and the second inclined plate are connected based on a parallel plate, which is parallel to the bottom of the box.

6. The server heat dissipation architecture as described in claim 1, characterized in that, The front end of the enclosure is provided with a front panel, which is connected to the hard drive installation area; The rear end of the housing is provided with a rear panel, which is connected to the functional module installation area.

7. The server heat dissipation architecture as described in claim 1, characterized in that, The hard drive installation area is provided with several hard drive installation boxes at intervals.

8. The server heat dissipation architecture as described in claim 7, characterized in that, The bottom of the enclosure corresponding to the fan mounting area has several fan clips protruding from it. Each of the fan clips corresponds to one of the hard drive mounting boxes, and a fan slot is formed between the corresponding fan clip and the hard drive mounting box.

9. The server heat dissipation architecture as described in claim 8, characterized in that, Each of the aforementioned hard drive mounting enclosures is provided with a clamping plate, one end of which is rotatably mounted on the top of the hard drive mounting enclosure based on a torsion spring, and the other end of which is suspended in the air.

10. The server heat dissipation architecture as described in claim 1, characterized in that, The top of both sides of the box body is formed with slots, and the bottom of the slots is provided with several holes; the sides of the cover body are formed with strips, and the lower edge of the strips is formed with several hooks, and the hooks and the holes correspond one-to-one. When the cover is installed on the box, the locking strip is inserted into the locking slot and the locking hook is inserted into the locking hole.

Images