Rapid cooling device for SMT (Surface Mount Technology) patch

Abstract

The utility model discloses an SMT patch rapid cooling device, and relates to the technical field of SMT manufacturing. The cooling device comprises a placing table and further comprises a groove formed in the upper surface of the placing table, a cooling plate is connected into the groove, sliding grooves are formed in the two sides of the placing table, a fixing plate is fixedly connected to the upper surface of the placing table, and a supporting plate is connected to one side of the placing table. Through the arrangement of the sliding plate, the first spring, the connecting plate, the limiting block, the limiting rod and the second spring, the air pump and the air tank are started to push the push rod to move downwards, the upper surface of the base plate is limited, the pull plate is pulled, the limiting block moves rightwards, meanwhile, the second spring is compressed, and the limiting block makes contact with one side of the sliding plate after moving by a certain distance; and meanwhile, the sliding plate can compress the first spring, and the number of ventilation openings for ventilation in the surface of the cooling plate is increased along with movement of the sliding plate, so that the cooling frame can be adjusted according to the substrates of different sizes, and the substrates are limited.

Description

Technical Field

[0001] This utility model belongs to the field of SMT (Surface Mount Technology) manufacturing technology, and in particular relates to a rapid cooling device for SMT components. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). SMT is a popular technology and process in the electronics assembly industry. The manufacturing process of SMT involves soldering circuits onto the surface of a printed circuit board or other substrates using methods such as reflow soldering or dip soldering.

[0003] During the SMT assembly process, a lot of heat is concentrated on the surface of the circuit board, so it is necessary to cool it down. Currently, the existing technology for SMT assembly cooling usually adopts air cooling, which involves placing the substrate on a corresponding cooling rack and fixing it. However, since the size of the cooling rack is mostly fixed, when different sizes of substrates need to be cooled, the cooling rack cannot be adjusted to fit the size of the substrate, resulting in poor cooling effect. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a rapid cooling device for SMT components, which can effectively solve the problems of the existing technology.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is an SMT rapid cooling device, including a placement platform, and further comprising: a groove formed on the upper surface of the placement platform, a cooling plate connected inside the groove, sliding grooves formed on both sides of the placement platform, a fixing plate fixedly connected to the upper surface of the placement platform, and a support plate connected to one side of the placement platform.

[0007] Furthermore, an air pump is installed on the upper surface of the support plate, the air pump's inflation port is connected to a hose, one end of the hose is connected to an air tank, the lower end of the air tank is connected to a push rod, and the push rod passes through the upper surface of the fixed plate.

[0008] Furthermore, a sliding plate is provided above the placement platform, and the two sides of the sliding plate are slidably engaged inside the sliding groove. A first spring is provided at one end of the sliding groove, and one end of the first spring is connected to the side of the sliding plate.

[0009] Furthermore, a connecting plate is connected to the upper surface of the slide plate, and a rectangular groove is formed inside the connecting plate. A limiting block is slidably engaged inside the rectangular groove. A limiting rod is connected to the side of the limiting block, and the limiting rod is set inside the rectangular groove. A second spring is wrapped around the surface of the limiting rod. A limiting plate is connected to the other end of the limiting rod, and a pull plate is connected to the front end of the limiting rod.

[0010] Furthermore, rubber pads are provided on the lower surfaces of both the push rod and the limiting block.

[0011] Furthermore, the fixing plate is provided in three sets, and the surface of each of the three sets of fixing plates is provided with through holes. The push rod is provided inside the through holes, and the rectangular groove is provided in three sets, with each groove having a limit block slidably engaged inside.

[0012] This utility model has the following beneficial effects:

[0013] This invention, through the design of a sliding plate, a first spring, a connecting plate, a limiting block, a limiting rod, and a second spring, can fix substrates of different sizes. Activating the air pump causes the air tank to push the push rod downwards, limiting the upper surface of the substrate. Pulling the pull plate moves the limiting block to the right, simultaneously compressing the second spring. After moving a certain distance, the limiting block contacts one side of the sliding plate, causing it to move to the right along with the plate. Simultaneously, the sliding plate compresses the first spring. As the sliding plate moves, the number of ventilation openings on the cooling plate surface increases, allowing the cooling rack to be adjusted according to substrates of different sizes and to limit the substrate, resulting in better cooling performance. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a right-side view of the SMT rapid cooling device of this utility model;

[0016] Figure 2 This is a left-side view of the SMT rapid cooling device of this utility model;

[0017] Figure 3 This is a three-dimensional structural diagram of the placement platform of this utility model;

[0018] Figure 4 This is a schematic diagram of the internal three-dimensional structure of the connecting plate of this utility model.

[0019] The components represented by each number in the attached diagram are listed below: 1. Placement platform; 101. Groove; 102. Slide groove; 103. Fixing plate; 2. Cooling plate; 3. Support plate; 301. Air pump; 302. Hose; 303. Air tank; 304. Push rod; 4. Slide plate; 5. First spring; 6. Connecting plate; 7. Limiting block; 701. Second spring; 702. Limiting rod; 703. Limiting plate; 704. Pull plate. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0021] Please see Figure 1-4 As shown, this utility model is an SMT rapid cooling device, including a placement platform 1, and further including: a groove 101 is formed on the upper surface of the placement platform 1, a cooling plate 2 is connected inside the groove 101, sliding grooves 102 are formed on both sides of the placement platform 1, a fixing plate 103 is fixedly connected to the upper surface of the placement platform 1, a support plate 3 is connected to one side of the placement platform 1, multiple sets of ventilation holes are formed on the surface of the cooling plate 2, and cold air is blown out from the bottom of the cooling plate 2 to cool the substrate, the sliding grooves 102 are symmetrically formed on both sides of the placement platform 1, and one end of the first spring 5 is connected to the inside of the sliding groove 102, and the other end of the first spring 5 is connected to the side of the slide plate 4, and three sets of fixing plates 103 are provided on one side of the upper surface of the placement platform 1, and a push rod 304 is connected to the bottom of the fixing plate 103 to limit the surface of the substrate.

[0022] An air pump 301 is mounted on the upper surface of the support plate 3. The air pump 301 has an air inlet connected to a hose 302. One end of the hose 302 is connected to an air tank 303. The lower end of the air tank 303 is connected to a push rod 304, which passes through the upper surface of the fixing plate 103. Three sets of hoses 302 are connected to the air outlet of the air pump 301. The air pump 301 pumps gas from the hoses 302 into the air tank 303, thereby pushing the push rod 304. Pushing downwards, each of the three sets of fixing plates 103 has an air tank 303 on its upper surface, and each air tank 303 is connected to a push rod 304 at its lower end. When the air pump 301 is working, the three sets of air tanks 303 simultaneously push the push rod 304 downwards until it contacts the surface of the substrate. The lower surface of the push rod 304 is covered with a rubber pad to prevent the push rod 304 from directly contacting the substrate and causing damage to the substrate. The rubber pad can better protect the substrate and prevent damage to the surface of the substrate within a certain time.

[0023] A slide plate 4 is provided above the placement platform 1, and the two sides of the slide plate 4 are slidably engaged inside the slide groove 102. A first spring 5 is provided at one end of the slide groove 102, and one end of the first spring 5 is connected to the side of the slide plate 4. A hydraulic rod is provided inside the first spring 5 to limit the first spring 5 and prevent the first spring 5 from bending due to excessive deformation. The cross-section of the slide plate 4 is C-shaped, and both ends are slidably engaged inside the slide groove 102. One end of the first spring 5 is connected to the inner wall of the slide groove 102, and the other end is connected to the side of the slide plate 4. The first spring 5 is always in a compressed state, always giving the slide plate 4 a leftward elastic force. The slide plate 4 can block the ventilation openings on the surface of the cooling plate 2 when cooling substrates of different sizes. When cooling substrates of different sizes, the slide plate 4 moves to the right to increase the number of ventilation openings.

[0024] The upper surface of the slide plate 4 is connected to a connecting plate 6, and a rectangular groove is formed inside the connecting plate 6. A limiting block 7 is slidably engaged inside the rectangular groove. A limiting rod 702 is connected to the side of the limiting block 7, and the limiting rod 702 is disposed inside the rectangular groove. A second spring 701 is wrapped around the surface of the limiting rod 702. The other end of the limiting rod 702 is connected to a limiting plate 703. A pull plate 704 is connected to the front end of the limiting rod 702. A horizontal plate is provided at the upper end of the side of the limiting block 7 to limit the surface of the substrate, and the side of the limiting block 7 can limit one side of the substrate. The rectangular groove penetrates the connecting plate 6, and the connecting plate... Three sets of limiting blocks 7 are provided on one side near the fixed plate 103. The cross-section of the limiting block 7 is an "L" shaped structure. One end of the limiting block 7 is slidably engaged inside the rectangular groove. When the pull plate 704 is pulled, the limiting rod 702 moves the limiting block 7 to the right. At the same time, the second spring 701 is compressed. The limiting plate 703 limits the second spring 701, allowing the second spring 701 to be compressed. When the limiting block 7 moves a certain distance to the right, the side of the limiting block 7 contacts the side of the slide plate 4. At this time, if the pull plate 704 is pulled again, the slide plate 4 and the limiting block 7 move to the right at the same time. The limiting block 7 limits one side of the substrate.

[0025] The lower surfaces of the push rod 304 and the limiting block 7 are both provided with rubber pads. The rubber pads can effectively prevent damage to the surface of the substrate when the push rod 304 and the limiting block 7 come into direct contact with the substrate, thus protecting the substrate.

[0026] The fixing plate 103 is provided in three sets, and the surface of each of the three sets of fixing plates 103 is provided with through holes. The push rod 304 is provided with through holes inside. The rectangular groove is provided in three sets, and each of the three sets of grooves is slidably engaged with a limiting block 7. The provision of multiple sets of fixing plates 103 and multiple sets of limiting blocks 7 enables the cooling rack to cool multiple substrates simultaneously, thereby increasing the cooling efficiency of the substrates.

[0027] Working principle: When using this device, first place the substrate to be cooled on the cooling plate 2, start the air pump 301, the air pump 301 will send gas into the air tank 303 through the hose 302, the three air tanks 303 will push the push rod 304 down until it contacts the surface of the substrate, thereby limiting the surface of the substrate. Then pull the pull plate 704, the limiting rod 702 moves to the right with the limiting block 7, and the second spring 701 is compressed at the same time. The limiting plate 703 limits the second spring 701, so that the second spring 701 can be compressed. When the limiting block 7 moves a certain distance to the right, the side of the limiting block 7 contacts the side of the sliding plate 4. The sliding plate 4 further compresses the first spring 5. After moving a certain distance, when the substrate can be completely placed on the cooling plate 2, release the pull plate 704, and the limiting block 7 limits one side of the substrate.

[0028] The above are merely preferred embodiments of the present utility model and do not limit the present utility model. Any modifications, equivalent substitutions, or improvements made to the technical solutions described in the foregoing embodiments, or to some of the technical features, shall fall within the protection scope of the present utility model.

Claims

1. A rapid cooling device for SMT (Surface Mount Technology) components, comprising a placement stage (1), characterized in that, Also includes: The upper surface of the placement platform (1) is provided with a groove (101), and a cooling plate (2) is connected inside the groove (101). Slide grooves (102) are provided on both sides of the placement platform (1). A fixing plate (103) is fixedly connected to the upper surface of the placement platform (1), and a support plate (3) is connected to one side of the placement platform (1).

2. The SMT rapid cooling device according to claim 1, characterized in that, An air pump (301) is installed on the upper surface of the support plate (3). The air pump (301) is connected to a hose (302) at its inflation port. One end of the hose (302) is connected to an air tank (303). The lower end of the air tank (303) is connected to a push rod (304), and the push rod (304) passes through the upper surface of the fixing plate (103).

3. The SMT rapid cooling device according to claim 2, characterized in that, A slide plate (4) is provided above the placement platform (1), and the two sides of the slide plate (4) are slidably engaged inside the slide groove (102). A first spring (5) is provided at one end of the slide groove (102), and one end of the first spring (5) is connected to the side of the slide plate (4).

4. The SMT rapid cooling device according to claim 3, characterized in that, The upper surface of the slide plate (4) is connected to a connecting plate (6), and a rectangular groove is provided inside the connecting plate (6). A limiting block (7) is slidably engaged inside the rectangular groove. A limiting rod (702) is connected to the side of the limiting block (7), and the limiting rod (702) is located inside the rectangular groove. A second spring (701) surrounds the surface of the limiting rod (702). The other end of the limiting rod (702) is connected to a limiting plate (703), and the front end of the limiting rod (702) is connected to a pull plate (704).

5. The SMT rapid cooling device according to claim 4, characterized in that, The lower surfaces of the push rod (304) and the limiting block (7) are both provided with rubber pads.

6. The SMT rapid cooling device according to claim 5, characterized in that, The fixing plate (103) is provided in three sets, and the surface of the three sets of fixing plates (103) is provided with through holes. The push rod (304) is provided with through holes inside. The rectangular groove is provided in three sets, and the limit block (7) is slidably engaged inside each groove.

Images