Inserting and dismounting sheet module, feeding and discharging system and photovoltaic material processing equipment
By optimizing the structural design of the wafer insertion and unloading module, the problem of low silicon wafer transfer efficiency was solved, and efficient transfer of silicon wafers between the basket and the carrier boat was achieved, thus improving the loading and unloading efficiency of photovoltaic material processing equipment.
CN224267240UActive Publication Date: 2026-05-22LAPLACE (WUXI) SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LAPLACE (WUXI) SEMICON TECH CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-05-22
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Figure CN224267240U_ABST
Abstract
The application discloses a wafer inserting and dismounting module, a feeding and discharging system and a photovoltaic material processing device. The wafer inserting and dismounting module comprises a flower basket conveying unit, two carrier boat conveying units and two wafer inserting and dismounting mechanisms. Each flower basket conveying unit comprises a first carrying area and two first wafer inserting and dismounting areas, and the first carrying area is used for acquiring or releasing the flower basket by an external material moving device. At least part of each carrier boat conveying unit is aligned with a first wafer inserting and dismounting area in a first direction. The two wafer inserting and dismounting mechanisms are arranged in a second direction. Two flower baskets are respectively transferred to the first wafer inserting and dismounting areas by the flower basket conveying unit, so that the two wafer inserting and dismounting mechanisms respectively transfer silicon wafers to the two carrier boat conveying units, which helps to improve the transfer efficiency of the silicon wafers between the flower baskets and the carrier boats, thereby meeting the needs of continuously transferring the carrier boats carrying the silicon wafers by external devices.
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