Gold bump structure and driving chip packaging structure

Abstract

The embodiment of the utility model provides a gold convex block structure and a driving chip packaging structure, the gold convex block structure comprises a gold convex block body, a fixing body and a seed layer, the gold convex block structure is used for being arranged on a functional surface of a driving chip, one side, deviating from the driving chip, of the gold convex block body is provided with a sunken structure, and the sunken structure is used for placing a bonding pin; the fixing body is arranged on the outer side of the gold bump body in a surrounding manner; the seed layer is sandwiched between the fixing body and the gold bump body and between the driving chip and the gold bump body. By arranging the sunken structure, the gold consumption is reduced, and the cost can be reduced by more than 50%; by arranging the fixing body surrounding the outer side of the gold bump body, the gold bump body is supported and fixed, and the reliability of the gold bump structure is improved.

Description

Technical Field

[0001] This disclosure pertains to the field of semiconductor integrated circuit manufacturing technology, specifically relating to a gold bump structure and a driver chip packaging structure. Background Technology

[0002] In the field of display panel driver chips, the mainstream approach currently uses gold bump structures for subsequent panel encapsulation. In recent years, the high price of gold has negatively impacted chip manufacturing costs.

[0003] Regarding the current problems caused by the soaring price of gold bump materials, one solution is to find alternative materials to gold, which need to be cheaper and have basically the same electrical / thermal / stability properties; another solution is to optimize the structure of gold bumps to reduce the amount of gold used.

[0004] To address the aforementioned issues, it is necessary to propose a reasonably designed gold bump structure and driver chip packaging structure that can effectively improve these problems. Utility Model Content

[0005] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a gold bump structure and a driver chip.

[0006] This disclosure provides a gold bump structure for mounting on a driver chip, the gold bump structure comprising:

[0007] A gold bump body is provided on the functional surface of the driver chip. The gold bump body has a recessed structure on the side opposite to the driver chip. The recessed structure is used to place bonding pins.

[0008] A fixing body is provided around the outside of the gold protrusion body;

[0009] The seed layer is sandwiched between the fixing body and the gold bump body, and between the driving chip and the gold bump body.

[0010] Optionally, the width of the gold bump body facing the driver chip is smaller than the width of the gold bump body facing away from the driver chip.

[0011] Optionally, the width of the gold bump body gradually increases from the end facing the driver chip to the end facing away from the driver chip.

[0012] Optionally, the longitudinal cross-sectional dimensions of the recessed structure gradually increase from the end facing the driving chip to the end facing away from the driving chip.

[0013] Optionally, the thickness of the gold bump body ranges from 0.5 μm to 6 μm.

[0014] Optionally, the height of the gold bump body is flush with the height of the fixing body.

[0015] Optionally, the fixation body is made of PI material.

[0016] Another aspect of this disclosure provides a driver chip packaging structure, including:

[0017] Driver chip;

[0018] Multiple gold bump structures are disposed on the functional surface of the driver chip, wherein the gold bump structures adopt the gold bump structures described above;

[0019] A bonding pin is disposed in a recessed structure of the gold bump body so that the bonding pin is electrically connected to the gold bump structure.

[0020] Optionally, the width of the recessed structure opposite to the end of the driver chip does not exceed the width of the bonding pin.

[0021] Optionally, the width of the gold bump body facing the driver chip is not less than the width of the bonding pin.

[0022] The gold bump structure and driver chip packaging structure of this disclosure include a gold bump structure, a fixing body, and a seed layer. The gold bump structure has a recessed structure on the side away from the driver chip. The recessed structure is used to place bonding pins. By setting the recessed structure, the amount of gold used can be reduced, and the cost can be reduced by more than 50%. By setting the fixing body around the outside of the gold bump body, the gold bump body is supported and fixed, thereby improving the reliability of the gold bump structure. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a gold bump structure according to one embodiment of the present disclosure;

[0024] Figures 2 to 10 This is a schematic diagram of the process for forming a gold bump structure in another embodiment of this disclosure;

[0025] Figure 11 This is a schematic diagram of a driver chip packaging structure according to another embodiment of the present disclosure;

[0026] Figure 12 This is a schematic diagram showing the matching of the dimensions of the recessed structure and the bonding pin dimensions in another embodiment of this disclosure;

[0027] Figure 13This is a schematic diagram showing the matching of the dimensions of the gold bump body and the bonding pins in another embodiment of this disclosure. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] like Figure 1 As shown, one aspect of this disclosure provides a gold bump structure 100 for being disposed on a driver chip 200. The gold bump structure 100 includes a gold bump body 110, a fixing body 120, and a seed layer 130.

[0030] The gold bump body 110 is used to be disposed on the functional surface of the driver chip 210. The gold bump body 110 has a recessed structure 140 on the side opposite to the driver chip 200. The recessed structure 140 is used to place the bonding pin 300 so that the gold bump body 110 is electrically connected to the bonding pin 300.

[0031] Specifically, such as Figure 1 As shown, the functional surface of the driver chip 200 is provided with pads 210 and passivation layer 220, and the gold bump body 110 is electrically connected to the pads 210 through the seed layer 130.

[0032] The fixing body 120 is arranged around the outside of the gold bump body 110, and plays a role in fixing and supporting the gold bump body 110.

[0033] The seed layer 130 is sandwiched between the fixing body 120 and the gold bump body 110, and between the driving chip 200 and the gold bump body 110.

[0034] The gold bump structure of this embodiment has a recessed structure on the side away from the driver chip. The recessed structure is used to place the bonding pins. By setting the recessed structure, the amount of gold used can be reduced, and the cost can be reduced by more than 50%. By setting a fixing body around the outside of the gold bump body, the gold bump body is supported and fixed, thereby improving the reliability of the gold bump structure.

[0035] For example, such as Figure 1 As shown, the width of the gold bump body 110 facing the driver chip 200 is smaller than the width of the gold bump body 110 facing away from the driver chip 200.

[0036] like Figure 1As shown, taking the end of the gold bump body 110 facing the driver chip 200 as the bottom of the gold bump body 110 as an example, the bottom wall width of the gold bump body 110 is smaller than the top wall width. Specifically, in this embodiment, the bottom wall width of the gold bump body 110 is 10 μm, the top wall width is 17 μm, and the length of the gold bump body 110 is 30 μm.

[0037] For example, such as Figure 1 As shown, the width of the gold bump body 110 gradually increases from the end facing the driver chip 200 to the end facing away from the driver chip 200. That is, the outer wall of the gold bump body 110 is an inclined surface from top to bottom, where the inclined surface can be either curved or planar. Figure 1 As shown, in this embodiment, the outer wall of the gold bump body 110 is curved.

[0038] In this embodiment, the width of the gold bump body facing the driver chip is smaller than the width of the gold bump body facing away from the driver chip. Compared with the prior art where the overall width of the gold bump is the same, the width setting of the gold bump body in this embodiment further reduces the amount of gold used and further saves costs.

[0039] For example, such as Figure 1 As shown, the longitudinal cross-sectional dimension of the recessed structure 140 gradually increases from the end facing the driver chip 200 to the end facing away from the driver chip 200. That is, by providing the recessed structure 140 on the gold bump body 110, a concave gold bump structure is formed, reducing the amount of gold used. Specifically, in this embodiment, the longitudinal section of the recessed structure 140 is a trapezoidal shape that is wider at the top and narrower at the bottom.

[0040] For example, in this embodiment, the thickness of the concave gold bump body 110 ranges from 0.5 μm to 6 μm. Specifically, in this embodiment, the thickness of the concave gold bump body 110 is 2.5 μm. Based on volume conversion, the concave gold bump body of this embodiment can save 61% of gold compared to a conventional gold bump structure.

[0041] For example, in this embodiment, such as Figure 1 As shown, the height of the gold bump body 110 is flush with the height of the fixing body 120, so that the fixing body 120 can better fix and support the gold bump body 110 and improve the reliability of the gold bump structure.

[0042] For example, in this embodiment, the fixation body 120 is made of PI material. That is, the fixation body 120 is made of polyimide-based material. It should be noted that this embodiment does not limit the material of the fixation body 120, and it can be selected according to actual needs.

[0043] In this embodiment, the process for forming the gold bump structure can be as follows:

[0044] like Figure 2 As shown, a driver chip 200 is provided, wherein the functional surface of the driver chip 200 is disposed on the pad 210 and the passivation layer 220.

[0045] like Figure 3 As shown, a first photoresist layer 150 is coated and formed on the functional surface of the driver chip 200, wherein the photoresist layer 150 can be a PI material layer. The first photoresist layer 150 is exposed and developed to form a first opening 151 at the corresponding pad 210. The first photoresist layer 150 is cured to form a fixture 120, and the formed first opening 151 is shaped as wider at the top and narrower at the bottom.

[0046] like Figure 6 As shown, a seed layer 130 is formed on the inner wall of the first opening 151 and the top wall of the fixture 120 by a sputtering process.

[0047] like Figure 7 As shown, a second photoresist layer 160 is formed on the surface of the seed layer 130 and at the first opening 151.

[0048] like Figure 8 As shown, the second photoresist layer 160 is exposed and developed at the first opening 151 to form the second opening 161.

[0049] like Figure 9 As shown, a gold bump body 110 is formed by electroplating in the second opening 161, wherein a recessed structure 140 is provided on the top of the gold bump body 110.

[0050] like Figure 10 As shown, the residual second photoresist layer 160 is removed, and the seed layer 130 on top of the fixture 120 is removed by an etching process to obtain the gold bump structure 100 of this embodiment.

[0051] like Figure 11 As shown, another aspect of the present disclosure provides a driver chip packaging structure, including a driver chip 200, a plurality of gold bump structures 100 and bonding pins 300.

[0052] Multiple gold bump structures 100 are disposed on the functional surface of the driver chip 200, wherein the gold bump structure 100 adopts the gold bump structure 100 described above. The specific structural features of this gold bump structure 100 have been described in detail above and will not be repeated here.

[0053] The bonding pin 300 is disposed in the recessed structure 140 of the gold bump body 110 so that the bonding pin 300 is electrically connected to the gold bump structure 110.

[0054] The driver chip packaging structure in this embodiment includes the gold bump structure described above, which reduces the amount of gold used and lowers the cost.

[0055] For example, such as Figure 12 As shown, the width of the recessed structure 140 at the end opposite to the driver chip 200 does not exceed the width of the bonding pin 300. In other words, the top width of the recessed structure 140 does not exceed the width of the bonding pin 300.

[0056] For example, such as Figure 13 As shown, the width of the end of the gold bump body 110 facing the driver chip 200 is not less than the width of the bonding pin 300. That is, the minimum width of the metal coverage at the bottom of the gold bump body 110 is not less than the width of the bonding pin 300.

[0057] In this embodiment, the size of the gold bump structure is set to match the width of the bonding pin, which can better achieve the electrical connection between the bonding pin and the gold bump structure.

[0058] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A gold bump structure for mounting on a driver chip, characterized in that, The gold bump structure includes: A gold bump body is provided on the functional surface of the driver chip. The gold bump body has a recessed structure on the side opposite to the driver chip. The recessed structure is used to place bonding pins. A fixing body is provided around the outside of the gold protrusion body; The seed layer is sandwiched between the fixing body and the gold bump body, and between the driving chip and the gold bump body.

2. The gold bump structure according to claim 1, characterized in that, The width of the gold bump body facing the driver chip is smaller than the width of the gold bump body facing away from the driver chip.

3. The gold bump structure according to claim 2, characterized in that, The width of the gold bump body gradually increases from the end facing the driver chip to the end away from the driver chip.

4. The gold bump structure according to any one of claims 1 to 3, characterized in that, The longitudinal cross-sectional dimensions of the recessed structure gradually increase from the end facing the driver chip to the end away from the driver chip.

5. The gold bump structure according to any one of claims 1 to 3, characterized in that, The thickness of the gold bump body ranges from 0.5 μm to 6 μm.

6. The gold bump structure according to any one of claims 1 to 3, characterized in that, The height of the gold bump body is flush with the height of the fixing body.

7. The gold bump structure according to any one of claims 1 to 3, characterized in that, The fixation body is made of PI material.

8. A driver chip packaging structure, characterized in that, include; Driver chip; Multiple gold bump structures are disposed on the functional surface of the driver chip, wherein the gold bump structures adopt the gold bump structures according to any one of claims 1 to 7; A bonding pin is disposed in a recessed structure of the gold bump body so that the bonding pin is electrically connected to the gold bump structure.

9. The driver chip packaging structure according to claim 8, characterized in that, The width of the recessed structure at the end opposite to the driver chip does not exceed the width of the bonding pin.

10. The driver chip packaging structure according to claim 8, characterized in that, The width of the gold bump body facing the driver chip is not less than the width of the bonding pin.

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