External cooling device and chef machine

Abstract

The utility model provides an external cooling device and a chef machine, and belongs to the technical field of kitchen electric appliances, the external cooling device comprises a base plate, a hanging assembly and a cooling structure, one side of the base plate is provided with an abutting surface, and the abutting surface abuts against an object to be cooled. The hanging assembly is detachably arranged on the base plate, the hanging assembly is used for detachably hanging the base plate on an object to be cooled, the cooling structure is arranged on the base plate, the cooling structure comprises a cooling part, and the cooling part is connected with the base plate. By means of the external design, the device can effectively cool the stirring kettle of the chef machine, and the quality of dough is guaranteed; and the use is convenient, the universality is high, and the production cost of the chef machine can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of kitchen appliance technology, and in particular to an external cooling device and a food processor. Background Technology

[0002] In the baking process, stand mixers are commonly used mixing equipment, using the rotation of the mixing paddle to mix and knead dough. However, during prolonged continuous mixing, the friction between the paddle and the dough, along with the operation of the mixing motor, generates a significant amount of heat, causing the mixing bowl temperature to rise continuously. Higher temperatures can negatively impact the dough's fermentation process and the quality of the final product. For example, excessively high dough temperatures can accelerate yeast fermentation, leading to over-fermentation, damaging the dough's structure, and affecting the bread's texture and flavor. Simultaneously, high temperatures can denature the gluten proteins in the dough, reducing its elasticity and extensibility, which is detrimental to subsequent shaping operations.

[0003] Currently, existing food processors mainly address the temperature rise of the mixing pot during the mixing process in the following ways: (1) Some food processors increase the heat dissipation area of ​​the mixing pot, such as increasing the wall thickness of the mixing pot or setting heat dissipation fins on its surface. However, this method has limited heat dissipation efficiency and is difficult to meet the needs of long-term high-intensity mixing; (2) Some food processors install heat dissipation devices such as fans and coolers inside the machine body to cool the mixing pot. However, this cooling method has poor versatility and will increase the manufacturing cost of the food processor.

[0004] Therefore, it is necessary to improve the cooling methods of existing food processors to overcome the shortcomings of the existing technology. Utility Model Content

[0005] To overcome the problems existing in the related technologies, one of the objectives of this utility model is to provide an external cooling device. This external cooling device can effectively cool the mixing pot of the stand mixer, ensuring the quality of the dough; it is also convenient to use, highly versatile, and can reduce the production cost of the stand mixer.

[0006] An external cooling device, comprising:

[0007] A substrate, wherein a contact surface is provided on one side of the substrate, and the contact surface contacts the object to be cooled;

[0008] A mounting assembly is detachably mounted on the substrate and is used to detachably mount the substrate onto the object to be cooled.

[0009] A cooling structure is disposed on the substrate, the cooling structure includes a cooling section, and the cooling section is in contact with the substrate.

[0010] In a preferred embodiment of this invention, the cooling structure includes a semiconductor refrigeration chip, which includes a cooling section and a heat dissipation section. The cooling section abuts against the substrate, and the heat dissipation section is disposed away from the substrate.

[0011] In a preferred embodiment of this invention, a mounting groove is provided on the side of the substrate facing away from the contact surface, and the cooling structure is disposed in the mounting groove.

[0012] A heat insulation plate is also provided between the cooling part and the heat dissipation part of the cooling structure, and the outer side wall of the heat insulation plate abuts against the side wall of the mounting groove.

[0013] In a preferred embodiment of this invention, a mounting plate is further provided on one side of the substrate, and the mounting plate abuts against the heat dissipation portion of the semiconductor cooling chip.

[0014] The mounting plate is provided with multiple heat dissipation fins, which are arranged in a ring on the mounting plate.

[0015] The mounting plate is also equipped with a cooling fan, which is located at the center of the heat dissipation fins.

[0016] In a preferred embodiment of this utility model, a protective cover is further provided on the substrate. The protective cover includes a side cover and a cover plate. The side cover is arranged in a ring around the cooling structure, and a first ventilation hole is provided on the side cover.

[0017] The cover plate is detachably mounted on the side cover, and the cover plate is provided with a second ventilation hole.

[0018] In a preferred embodiment of this invention, the mounting assembly includes a plurality of elastic hooks, which are disposed on the top of the substrate.

[0019] In a preferred embodiment of this invention, the mounting assembly further includes a surrounding strap, which is detachably disposed in the middle of the substrate.

[0020] The second objective of this utility model is to provide a food processor, which includes a mixing bowl and an external cooling device as described above. The external cooling device is detachably mounted on the outer wall of the mixing bowl, and the contact surface of the substrate is in contact with the outer wall of the mixing bowl.

[0021] The beneficial effects of this utility model are as follows:

[0022] This utility model provides an external cooling device, which includes a base plate, a hanging assembly, and a cooling structure. One side of the base plate has an abutment surface that contacts the object to be cooled. The hanging assembly is detachably mounted on the base plate and is used to detachably hang the base plate onto the object to be cooled. The cooling structure is mounted on the base plate and includes a cooling section that contacts the base plate. In use, the base plate is hung on the edge of the mixing bowl using the hanging assembly, ensuring the abutment surface of the base plate is tightly fitted to the outer surface of the mixing bowl. The cooling structure is then activated to cool the mixing bowl, ensuring the dough inside is mixed at a suitable temperature. This avoids problems such as over-fermentation and gluten denaturation caused by excessively high temperatures, thus guaranteeing the quality of the dough and the final taste and flavor of the baked goods. The external cooling device has high versatility, expanding the product's application range. Furthermore, the external design eliminates the need for a complex built-in cooling system in the stand mixer, simplifying its structure and reducing the difficulty and cost of the production process.

[0023] This application also provides a stand mixer including the aforementioned external cooling device. This stand mixer is easy to use and can ensure the quality of the dough and the taste and flavor of the final baked goods through the aforementioned cooling device. It also reduces the manufacturing cost of the stand mixer and improves its market competitiveness. Attached Figure Description

[0024] Figure 1 This is a perspective view of an external cooling device provided in an embodiment of the present invention;

[0025] Figure 2 This is a perspective view of an external cooling device excluding the cover plate provided in an embodiment of this utility model;

[0026] Figure 3 This is a perspective view of the external cooling device provided in the embodiment of this utility model installed on the mixing pot of a food processor;

[0027] Figure 4 This is a perspective view of an external cooling device installed on a food processor, as provided in an embodiment of this utility model.

[0028] Figure 5 yes Figure 4 The main view of the structure;

[0029] Figure 6 yes Figure 4 A side view of the structure;

[0030] Figure 7 This is a perspective view of an external cooling device, excluding the cover plate, installed on a food processor according to an embodiment of the present invention.

[0031] Figure 8 This is a cross-sectional view of the food processor provided in an embodiment of this utility model;

[0032] Figure 9 yes Figure 8 A magnified view of a portion of point A in the middle.

[0033] Figure label:

[0034] 1. Substrate; 11. Mounting groove; 2. Protective cover; 21. Side cover; 211. First ventilation hole; 22. Cover plate; 221. Second ventilation hole; 3. Hanging assembly; 31. Enclosure strap; 32. Elastic hook; 4. Cooling fan; 5. Mounting plate; 51. Heat dissipation fins; 6. Heat insulation plate; 7. Semiconductor cooling chip; 100. Stirring vessel. Detailed Implementation

[0035] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0036] Example 1

[0037] like Figures 1-9 As shown, this embodiment provides an external cooling device, comprising:

[0038] A substrate 1, wherein a contact surface is provided on one side of the substrate 1, and the contact surface contacts the object to be cooled;

[0039] The mounting component 3 is detachably mounted on the substrate 1 and is used to detachably mount the substrate 1 onto the object to be cooled.

[0040] A cooling structure is disposed on the substrate 1, and the cooling structure includes a cooling section that is connected to the substrate 1.

[0041] Specifically, the base plate 1 is the fundamental component of the entire cooling device, made of a metal material with good thermal conductivity (such as aluminum alloy) to ensure rapid and efficient heat transfer. In one embodiment, the cooling device can be used to cool the mixing bowl of a food processor. One side of the base plate 1 has an abutment surface, which is specially curved to fit the outer surface of the mixing bowl. When the device is installed on the mixing bowl, the abutment surface can fit tightly against the outer surface of the mixing bowl, increasing the contact area and improving heat transfer efficiency.

[0042] In one embodiment, the cooling structure can employ liquid cooling, where the substrate 1 is cooled by a liquid cooling plate, and then the mixing bowl of the food processor is cooled by the substrate 1, thereby reducing the temperature rise of the mixing bowl.

[0043] In addition to cooling the mixing bowl of a food processor, the external cooling device of this application can also cool various items that require cooling. Specifically, the shape of the contact surface of the substrate 1 can be specifically designed according to the surface shape of the item to be cooled, so that the cooling structure can effectively cool the corresponding product.

[0044] The aforementioned external cooling device, in use, hangs the base plate 1 on the edge of the mixing pot via the hanging component 3, ensuring the contact surface of the base plate 1 is tightly pressed against the outer surface of the mixing pot. Then, the cooling structure is activated to lower the temperature of the mixing pot, ensuring the dough inside is mixed at a suitable temperature. This avoids problems such as over-fermentation and gluten denaturation caused by excessively high temperatures, thus guaranteeing the quality of the dough and the final taste and flavor of the baked goods. The external cooling device offers high versatility, expanding the product's application range. Furthermore, the external design eliminates the need for a complex built-in cooling system in the stand mixer, simplifying its structure and reducing the difficulty and cost of the production process.

[0045] More preferably, the cooling structure includes a semiconductor refrigeration chip 7, which includes a cooling section and a heat dissipation section. The cooling section abuts against the substrate 1, and the heat dissipation section is disposed away from the substrate 1.

[0046] In this embodiment, the cooling structure uses a thermoelectric cooler 7 as its core component, which includes a cooling section and a heat dissipation section. The cooling section is in close contact with the substrate 1, and a layer of thermally conductive silicone grease is applied between the contact surfaces of the cooling section and the substrate 1 to ensure good heat conduction. When the thermoelectric cooler 7 is powered on, the cooling section quickly absorbs the heat transferred from the substrate 1, thereby reducing the temperature of the mixing bowl that is in contact with the substrate 1. The heat dissipation section is positioned away from the substrate 1, allowing it to quickly dissipate heat into the air, thus ensuring the cooling of the mixing bowl of the food processor.

[0047] Furthermore, a mounting groove 11 is provided on the side of the substrate 1 opposite to the contact surface, and the cooling structure is disposed in the mounting groove 11;

[0048] A heat insulation plate 6 is also provided between the cooling part and the heat dissipation part of the cooling structure, and the outer side wall of the heat insulation plate 6 abuts against the side wall of the mounting groove 11.

[0049] Specifically, the mounting groove 11 on the substrate 1 allows the cooling structure to be tightly integrated with the substrate 1, and the cooling section contacts the bottom of the mounting groove 11 via thermally conductive silicone grease, greatly improving heat transfer efficiency. This allows the heat from the stirring vessel 100 to be transferred to the cooling section more quickly, effectively reducing the temperature of the stirring vessel. The heat insulation plate 6, placed between the cooling section and the heat dissipation section, forms a good heat insulation barrier, reducing the impact of heat from the heat dissipation section on the cooling section. This ensures that the cooling section can better absorb the heat from the stirring vessel, improving the cooling efficiency of the semiconductor cooling chip 7 and further enhancing the overall cooling effect. The cooling structure is installed within the mounting groove 11, and the sidewall of the mounting groove 11 provides a certain degree of fixation and support for the cooling structure, preventing it from shaking or shifting during use and ensuring the stability of the device. Simultaneously, the outer sidewall of the heat insulation plate 6 abuts against the sidewall of the mounting groove 11, further enhancing the stability of the structure and enabling the device to operate reliably for a long period.

[0050] Furthermore, a mounting plate 5 is also provided on one side of the substrate 1, and the mounting plate 5 abuts against the heat dissipation part of the semiconductor cooling chip 7;

[0051] The mounting plate 5 is provided with a plurality of heat dissipation fins 51, which are arranged in a ring on the mounting plate 5.

[0052] The mounting plate 5 is also provided with a cooling fan 4, which is located at the center of the heat dissipation fins 51.

[0053] The mounting plate 5 is equipped with heat sink fins 51 and a cooling fan 4. The heat sink fins 51 are made of copper, which has good thermal conductivity and can increase the heat dissipation area. The cooling fan 4 is installed on one side of the heat sink fins 51. When the thermoelectric cooler 7 is working, the cooling fan 4 starts, accelerates the airflow, and quickly dissipates the heat on the heat sink fins 51 to the surrounding environment.

[0054] More preferably, the cooling structure is also equipped with a temperature sensor and a controller. The temperature sensor is mounted on the contact surface of the substrate 1 to monitor the temperature of the stirred tank in real time. The controller is connected to the temperature sensor, the thermoelectric cooler 7, and the cooling fan 4. Based on the temperature signal fed back by the temperature sensor, it automatically adjusts the operating current of the thermoelectric cooler 7 and the speed of the cooling fan 4 to achieve precise temperature control.

[0055] When cooling the mixing bowl of the food processor is required, first clip the mounting assembly 3 onto the edge of the mixing bowl, then adjust the contact position between the base plate 1 and the surface of the mixing bowl to ensure a tight fit between the contact surface of the base plate 1 and the outer surface of the mixing bowl. After power is connected, the thermoelectric cooler 7 starts working, with the cooling section absorbing heat from the mixing bowl and the heat dissipation section dissipating the heat. A temperature sensor monitors the temperature of the mixing bowl in real time, and the controller automatically adjusts the operating status of the thermoelectric cooler 7 and the cooling fan 4 according to temperature changes to ensure that the temperature inside the mixing bowl is maintained within a suitable range.

[0056] Furthermore, a protective cover 2 is also provided on the substrate 1. The protective cover 2 includes a side cover 21 and a cover plate 22. The side cover 21 is arranged in a ring around the cooling structure. A first ventilation hole 211 is provided on the side cover 21.

[0057] The cover plate 22 is detachably mounted on the side cover 21, and the cover plate 22 is provided with a second ventilation hole 221.

[0058] The side shields 21 and cover plate 22 of the protective cover 2 enclose the cooling structure internally, effectively protecting it, extending its service life, and improving the reliability and stability of the device. The arrangement of the first ventilation hole 211 and the second ventilation hole 221 forms a good air convection channel. When the cooling fan 4 is running, air can smoothly enter and exit the protective cover 2, promptly carrying away the heat from the heat dissipation fins and enhancing heat dissipation efficiency. Moreover, the reasonable ventilation hole design can guide air to flow along a specific path, making heat dissipation more uniform and further improving the heat dissipation performance of the cooling structure. The detachable design of the cover plate 22 allows users to easily open the cover plate 22 when maintenance, cleaning, or replacement of parts of the cooling structure is required, making the operation simple and quick.

[0059] Specifically, this application also provides a specific embodiment of the mounting component 3. The mounting component 3 includes a plurality of elastic hooks 32, which are disposed on the top of the substrate 1.

[0060] Furthermore, the mounting assembly 3 also includes a shroud 31, which is detachably disposed in the middle of the substrate 1.

[0061] The flexible design of the elastic hooks 32 allows the device to be quickly attached to the mixing vessel, making operation simple and convenient. Multiple elastic hooks 32 are distributed on the top of the base plate 1, providing uniform tension and ensuring a tight connection between the contact surface of the base plate 1 and the mixing vessel. The surrounding strap 31 is located in the middle of the base plate 1, further enhancing the connection stability between the device and the mixing vessel, preventing the device from shaking or slipping during use, and ensuring the stability of the cooling effect.

[0062] The surrounding strap 31 is detachably disposed in the middle of the substrate 1. One end of the surrounding strap 31 is fixed to one side of the substrate 1, and the other end is connected to the other side of the substrate 1 by Velcro or buckle. The length of the surrounding strap 31 can be adjusted according to the circumference of the mixing vessel to ensure that it can tightly wrap around the mixing vessel.

[0063] The flexible hook 32 can be easily pried open and removed, and the sash 31 is connected by Velcro or buckles, making disassembly convenient. When maintenance, cleaning, or replacement of parts is required, the device can be quickly removed from the mixing vessel, improving maintenance efficiency and reducing maintenance costs.

[0064] Example 2

[0065] like Figures 1-9 As shown, this embodiment provides a food processor, which includes a mixing bowl 100 and an external cooling device as described above. The external cooling device is detachably hung on the outer wall of the mixing bowl, and the contact surface of the base plate 1 is in contact with the outer wall of the mixing bowl.

[0066] During operation, the friction between the mixing blades and the dough in the stand mixer generates heat, causing the mixing bowl temperature to rise rapidly. At this point, the external cooling device mounted on the outer wall of the mixing bowl comes into play. A temperature sensor monitors the mixing bowl temperature in real time and transmits the data to the controller. When the temperature exceeds a preset threshold, the controller activates the thermoelectric cooler 7 and the cooling fan 4. The cooling section of the thermoelectric cooler 7 absorbs the heat transferred from the substrate 1, reducing the mixing bowl temperature; the heat from the cooling section is dissipated into the surrounding environment through the heat dissipation fins and the cooling fan 4. As the mixing process continues, the temperature sensor continuously provides temperature information, and the controller automatically adjusts the operating current of the thermoelectric cooler 7 and the speed of the cooling fan 4 based on the actual temperature, achieving precise temperature control. This ensures that the dough inside the mixing bowl remains within a suitable temperature range, preventing over-fermentation and gluten denaturation due to excessive heat, thus improving dough quality and laying the foundation for producing high-quality baked goods. When the cooling function is not needed, the user can easily remove the external cooling device; the stand mixer can still perform mixing and other operations normally without affecting its basic functionality.

[0067] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings. In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0068] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0069] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. For those skilled in the art, this utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. An external cooling device, characterized in that, include: A substrate, wherein a contact surface is provided on one side of the substrate, and the contact surface contacts the object to be cooled; A mounting assembly is detachably mounted on the substrate and is used to detachably mount the substrate onto the object to be cooled. A cooling structure is disposed on the substrate, the cooling structure includes a cooling section, and the cooling section is in contact with the substrate.

2. The external cooling device according to claim 1, characterized in that: The cooling structure includes a semiconductor refrigeration chip, which includes a cooling section and a heat dissipation section. The cooling section abuts against the substrate, and the heat dissipation section is disposed away from the substrate.

3. The external cooling device according to claim 2, characterized in that: A mounting groove is provided on the side of the substrate opposite to the contact surface, and the cooling structure is disposed in the mounting groove; A heat insulation plate is also provided between the cooling part and the heat dissipation part of the cooling structure, and the outer side wall of the heat insulation plate abuts against the side wall of the mounting groove.

4. The external cooling device according to claim 2, characterized in that: A mounting plate is also provided on one side of the substrate, and the mounting plate abuts against the heat dissipation part of the semiconductor cooling chip; The mounting plate is provided with multiple heat dissipation fins, which are arranged in a ring on the mounting plate. The mounting plate is also equipped with a cooling fan, which is located at the center of the heat dissipation fins.

5. The external cooling device according to any one of claims 1-4, characterized in that: The substrate is also provided with a protective cover, which includes a side cover and a cover plate. The side cover is arranged in a ring around the cooling structure and has a first ventilation hole. The cover plate is detachably mounted on the side cover, and the cover plate is provided with a second ventilation hole.

6. The external cooling device according to claim 1, characterized in that: The mounting assembly includes several elastic hooks, which are disposed on the top of the substrate.

7. The external cooling device according to claim 6, characterized in that: The mounting assembly also includes a shroud, which is detachably disposed in the middle of the substrate.

8. A food processor, characterized in that: The system includes a mixing vessel and an external cooling device as described in any one of claims 1-7, wherein the external cooling device is detachably mounted on the outer wall of the mixing vessel, and the contact surface of the substrate is in contact with the outer wall of the mixing vessel.

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