Welding tool

Abstract

The utility model relates to a welding tool, and belongs to the technical field of welding tools, the welding tool is used for a semiconductor module, and the semiconductor module comprises a semiconductor device and a heat dissipation piece. The welding tool comprises an isolation piece and a positioning piece, the isolation piece is arranged between the heat dissipation piece and the semiconductor device, the isolation piece is provided with an avoiding channel, and at least part of a connecting part of the heat dissipation piece penetrates through the avoiding channel. The positioning piece comprises a pressing plate and a positioning part which are connected, and the pressing plate is arranged on the side, away from the heat dissipation piece, of the semiconductor device and attached to the semiconductor device; and the positioning part is connected with the heat dissipation piece. According to the technical scheme, the welding tool is used for the semiconductor module, the isolation piece is arranged on the heat dissipation piece, tin beads can be effectively prevented from splashing to the heat dissipation piece when the semiconductor device and the heat dissipation piece are welded, the situation that the safety distance between the semiconductor device and the heat dissipation piece is shortened due to the fact that the tin beads are difficult to remove is avoided, and the design requirement is met; meanwhile, the technical problem that the overall structure is complex is solved, and cost is reduced.

Description

Technical Field

[0001] This application relates to the field of welding tooling technology, and more particularly to a welding tooling. Background Technology

[0002] Currently, semiconductor modules consist of semiconductor devices, insulating plates, and heat dissipation substrates. Each semiconductor module requires an insulating plate, which makes the overall structure complex and increases the difficulty of manufacturing, assembly, and maintenance. Utility Model Content

[0003] The welding fixture provided in this application embodiment can ensure isolation while overcoming the technical problem of complex overall structure.

[0004] To achieve the above objectives, according to a first aspect of this application, a welding fixture is provided for a semiconductor module, the semiconductor module including a semiconductor device and a heat sink disposed on one side of the semiconductor device, the welding fixture comprising:

[0005] An isolation element is disposed between the heat sink and the semiconductor device. The isolation element has a clearance channel, and the connecting portion of the heat sink at least partially passes through the clearance channel.

[0006] The positioning component includes a pressure plate and a positioning part connected to each other. The pressure plate is disposed on the side of the semiconductor device away from the heat sink and is in contact with the semiconductor device. The positioning part is connected to the heat sink.

[0007] Optionally, the isolation member includes a plurality of isolation portions spaced apart along a second direction, with adjacent isolation portions forming the avoidance channel.

[0008] Optionally, it also includes a support member disposed on the side of the isolation member opposite to the pressure plate;

[0009] The support member is provided with a receiving groove, and the heat dissipation member is housed in the receiving groove.

[0010] Optionally, the carrier is further provided with a limiting groove that communicates with the receiving groove;

[0011] The isolation member also includes a base connected to the plurality of isolation portions, the base being disposed in the limiting groove.

[0012] Optionally, a hand-held portion is provided on the side of the base opposite to the isolation portion.

[0013] Optionally, in a first direction intersecting the second direction, the receiving groove has a first groove depth H1, and the limiting groove has a second groove depth H2, wherein the first groove depth H1 is greater than the second groove depth H2.

[0014] Optionally, there are at least two isolators, with at least one isolator positioned opposite the other in a third-party orientation.

[0015] Optionally, in the second direction, the isolator can form a first distance W1 with the connection portion, which is less than or equal to 2.7 mm; the isolator can form a second distance W2 with the semiconductor device, which is less than or equal to 2.7 mm.

[0016] Optionally, in the third direction, the isolator can form a third distance W3 with the connection portion, which is less than or equal to 2.7 mm; the isolator can form a fourth distance W4 with the semiconductor device, which is less than or equal to 2.7 mm.

[0017] Optionally, the positioning member further includes a plurality of first limiting portions connected to the pressure plate, and at least two of the first limiting portions are used to abut against the same semiconductor device.

[0018] Optionally, the positioning member further includes a second limiting part connected to the pressure plate, wherein the orthographic projection of the second limiting part in the first direction X is located on the isolation member.

[0019] Optionally, the material of the isolation element is metal.

[0020] In the welding fixture of this application embodiment, the above technical solution is used for a semiconductor module, which includes a semiconductor device and a heat sink. An isolation member is disposed on the heat sink, and the isolation member has a clearance channel that exposes the connection portion of the heat sink. A positioning member includes a connected pressure plate and a positioning part. The pressure plate presses the semiconductor device onto the connection portion, and the positioning part cooperates with the heat sink for positioning. In other words, the welding fixture is used for the semiconductor module, and the isolation member disposed on the heat sink effectively prevents solder balls from splashing onto the heat sink during welding of the semiconductor device and the heat sink. This avoids shortening the safety distance between the semiconductor device and the heat sink due to the difficulty in removing solder balls, thus meeting design requirements. Simultaneously, it replaces the original insulating board, which is prone to structural complexity, high cost, and safety hazards, reducing the amount of insulating board used, simplifying the overall structure, and lowering costs, while avoiding the risk of solder balls getting stuck in gaps and causing safety compliance issues.

[0021] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0024] Figure 1 This is a schematic diagram of the welding fixture structure in an exemplary embodiment of this invention;

[0025] Figure 2 This is an exploded view of the welding fixture structure in an exemplary embodiment of this invention;

[0026] Figure 3 This is a schematic diagram showing the positional relationship between the isolation plate and the semiconductor device in an exemplary embodiment of this invention;

[0027] Figure 4 This is a schematic diagram of the overall structure of the positioning component in an exemplary embodiment of this invention;

[0028] Figure 5 This is a schematic diagram of the overall structure of the welding fixture in an exemplary embodiment of this invention;

[0029] Figure 6 This is an exploded view of the overall structure of the welding fixture in an exemplary embodiment of this invention;

[0030] Figure 7 This is a schematic diagram showing the positional relationship between the isolation plate and the support member in an exemplary embodiment of this invention;

[0031] Figure 8 This is a schematic diagram of the overall structure of the carrier in an exemplary embodiment of this invention;

[0032] Figure 9 This is a side view of the carrier in an exemplary embodiment of this invention;

[0033] Figure 10 yes Figure 9 CC cross-section;

[0034] Figure 11 yes Figure 10 A magnified view of a section at point C;

[0035] Figure 12 This is a side view of the welding fixture structure from one angle in an exemplary embodiment of this example.

[0036] Figure 13 yes Figure 12 Cross-sectional view at point AA;

[0037] Figure 14 yes Figure 13 A magnified view of a section at point A in the middle;

[0038] Figure 15 This is a side view of the welding fixture structure from another angle in an exemplary embodiment of this invention;

[0039] Figure 16 yes Figure 15 Cross-sectional view at point BB;

[0040] Figure 17 yes Figure 16 A magnified view of a section at point B.

[0041] Explanation of reference numerals in the attached figures:

[0042] X - First direction; Y - Second direction; Z - Third direction;

[0043] 100 - Semiconductor module; 110 - Semiconductor device; 120 - Heat sink; 121 - Connector;

[0044] 200 - Isolation component; 210 - Clearance passage; 220 - Isolation section; 221 - First side; 222 - Second side; 223 - Third side; 230 - Base; 231 - Fourth side; 232 - Fifth side; 233 - Sixth side; 240 - Handheld part;

[0045] 300 - Positioning component; 310 - Pressure plate; 320 - Positioning part; 330 - First limiting part; 340 - Second limiting part;

[0046] 400 - Supporting component; 410 - Receiving groove; 420 - Limiting groove. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0048] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, they should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0049] In the accompanying drawings of the embodiments of this application, arrows labeled X represent the first direction X, arrows labeled Y represent the second direction Y, and arrows labeled Z represent the third direction Z. The description of this application introduces the first direction X, the second direction Y, and the third direction Z to more clearly illustrate the structure and relative positional relationships of the welding fixture. In practical applications, the first direction X, the second direction Y, and the third direction Z can point to any direction in space. For ease of understanding, this application uses the first direction X as the thickness direction of the welding fixture, which is also the assembly direction of the components in the welding fixture, the second direction Y as the width direction of the welding fixture, and the third direction Z as the length direction of the welding fixture as an example for explanation. In practical applications, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0050] Currently, the semiconductor module 100 welding fixture consists of a positioning fixture and a covering fixture. The semiconductor module 100 includes a semiconductor device 110, an insulating plate, and a heat dissipation substrate. The insulating plate is located between the heat dissipation substrate and the semiconductor device 110 and is fixed to the heat dissipation substrate by means of screws for fixing the heat dissipation substrate, or additional screws.

[0051] During the soldering process between the semiconductor device 110 and the heat sink substrate, solder ball splattering may occur. Once solder balls splatter onto the heat sink substrate, they are difficult to remove, which will shorten the safety distance between the semiconductor device 110 and the heat sink substrate, failing to meet design requirements.

[0052] However, this structure has many drawbacks. Each semiconductor module 100 requires an insulating plate, which not only complicates the overall structure but also increases the amount of insulating plates used, significantly raising costs. Furthermore, during the cleaning process, solder balls are highly likely to get stuck in the gap between the insulating plate and the heat sink substrate, and are difficult to detect. If these solder balls fall off later, it may cause the module or the entire device to fail safety regulations, posing a serious safety hazard. In addition, the screws securing the insulating plate have a significantly reduced torque, posing a risk of loosening and falling off, further affecting the stability and safety of the semiconductor module 100.

[0053] According to the first aspect of this application, referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 This embodiment provides a welding fixture for a semiconductor module 100, which includes a semiconductor device 110 and a heat sink 120 disposed on one side of the semiconductor device 110. The welding fixture includes an isolation member 200 and a positioning member 300. The isolation member 200 is disposed between the heat sink 120 and the semiconductor device 110, and has a clearance channel 210. The connecting portion 121 of the heat sink 120 at least partially passes through the clearance channel 210. The positioning member 300 includes a pressure plate 310 and a positioning portion 320 connected to each other. The pressure plate 310 is disposed on the side of the semiconductor device 110 facing away from the heat sink 120 and is in contact with the semiconductor device 110; the positioning portion 320 is connected to the heat sink 120. Specifically, the pressure plate 310 is used to press the semiconductor device 110 onto the connecting portion 121, and the positioning portion 320 is used to cooperate with the heat sink 120 for positioning.

[0054] It should be noted that the semiconductor module 100 can be understood as a reasonable combination and packaging of multiple semiconductor devices 110 (such as chips) and related auxiliary components (such as insulating materials, heat dissipation components, etc.) to form an integrated module with specific functions, which can be used in power electronics and related fields to realize functions such as power conversion and control. In this embodiment, the semiconductor module 100 can be an IGBT (Insulated Gate Bipolar Transistor) module, and the semiconductor devices 110 in the semiconductor module 100 can be IGBT modules. An IGBT module is a composite fully controllable voltage-driven power semiconductor device 110 composed of a bipolar transistor (BJT) and an insulated gate field-effect transistor (MOSFET).

[0055] It should be noted that the heat sink 120 in the semiconductor module 100 is a heat dissipation substrate. The heat dissipation substrate dissipates the heat generated by the IGBT module during operation in a timely manner, ensuring that the IGBT module can operate stably within a suitable temperature range and preventing problems such as performance degradation, shortened lifespan, or even damage due to overheating. The heat sink 120 is provided with a connecting portion 121. The surface of the connecting portion 121 is flat and has good conductivity and solderability. The size and shape of the connecting portion 121 are adapted to the semiconductor device 110 for soldering the semiconductor device 110. By soldering, the semiconductor device 110 is firmly connected to the connecting portion 121, ensuring that the current can be stably transmitted between the two, while ensuring that the solder joint has good thermal conductivity so that heat can be smoothly transferred from the semiconductor device 110 through the connecting portion 121 to the heat sink 120 and finally dissipated.

[0056] It should be noted that, as Figure 3 As shown, the isolation member 200 is disposed between the heat sink 120 and the semiconductor device 110. Specifically, the isolation member 200 is in contact with the heat sink 120, and the isolation member 200 is stably supported by the heat sink 120. The isolation member 200 is provided with a clearance channel 210, which exposes the connection portion 121 of the heat sink 120. It can be understood that the isolation member 200 can surround the connection portion 121. That is, on the one hand, the isolation member 200 can be stably disposed on the heat sink 120, using the support provided by the heat sink 120 to maintain its own positional stability; on the other hand, while ensuring effective isolation between the semiconductor device 110 and other areas of the heat sink 120, it provides the necessary space for the welding operation between the semiconductor device 110 and the connection portion 121, ensuring that the welding process can be carried out smoothly. It also enables the semiconductor device 110 to form a good electrical and thermal conduction path with the heat sink 120 through the connection portion 121 after welding with the connection portion 121, which helps the entire semiconductor module 100 to operate stably.

[0057] In the soldering fixture used for semiconductor module 100 (taking IGBT module as an example), the isolator 200 can effectively prevent solder balls from splashing onto the heat sink 120 during the soldering of semiconductor device 110 and heat sink 120. This avoids the problem of shortened safety distance between semiconductor device 110 and heat sink 120 due to the difficulty in removing solder balls after they splash onto the heat sink 120, thus meeting design requirements. The isolator 200 can also replace the insulating board in the original semiconductor module 100, which is prone to problems such as complex structure, high cost and safety hazards. This reduces the amount of insulating board used, simplifies the overall structure and reduces costs. At the same time, it can prevent solder balls from getting stuck in the gap between the insulating board and the heat sink substrate, which is not easily detected and may later fall off, causing the semiconductor module 100 or the whole machine to fail safety regulations, thus reducing safety risks.

[0058] It should be noted that, as Figure 4As shown, the positioning component 300 ensures the welding accuracy and stability of the semiconductor module 100. The pressure plate 310, acting directly on the semiconductor device 110, is used to fix the position of the semiconductor device 110 during welding. The pressure plate 310 has sufficient rigidity and suitable dimensions to tightly and evenly press the semiconductor device 110 onto the connection portion 121 of the heat sink 120. By applying stable pressure, the pressure plate 310 ensures tight contact between the semiconductor device 110 and the connection portion 121 during welding, avoiding poor welding due to displacement or loosening, thereby ensuring the quality of the weld surface and the reliability of the electrical connection. In one example, during the welding of a high-power IGBT module, the pressure plate 310 ensures stable contact between the IGBT chip and the connection portion 121 of the heat sink substrate, allowing the welding current to pass through evenly and improving the electrical performance of the IGBT module.

[0059] The shape and structure of the positioning part 320 are adapted to the shape and structural features of the heat sink 120, or the shape and structure of the positioning part 320 are adapted to the shape and structural features of a certain component on the heat sink 120. It cooperates with the heat sink 120 through specific geometric shapes, slots, protrusions, or other structures. This embodiment does not impose specific limitations. In actual operation, the positioning part 320 and the corresponding positioning structure on the heat sink 120 interlock, quickly determining the position of the positioning component 300 on the heat sink 120. This not only allows the semiconductor device 110 to quickly find its corresponding position with the connecting part 121 during installation, but also prevents the positioning component 300 from shifting during the soldering process, thereby ensuring the relative positional accuracy between the semiconductor device 110 and the connecting part 121. In one example, the positioning part 320, by cooperating with a specific groove or protrusion on the heat sink substrate, can position the semiconductor device 110 in the optimal soldering position, ensuring the consistency and stability of the entire module.

[0060] It should be noted that the pressure plate 310 also has multiple through holes. Some of these through holes facilitate installation and welding, some allow for avoidance of other structures, and some allow copper sheets on the semiconductor device 110 to pass through. The specific number and location of these through holes are adapted to the actual product type, and this embodiment does not impose specific limitations.

[0061] In some examples, such as Figure 2 and Figure 3As shown, there are multiple connection portions 121 arranged in a matrix, with each connection portion 121 corresponding to a semiconductor device 110. From an electrical connection perspective, each connection portion 121 corresponds to one semiconductor device 110, providing an independent and stable electrical connection path for each semiconductor device 110, thereby enhancing the stability and reliability of the electrical connection of the entire semiconductor module 100. In practical applications, when the semiconductor device 110 needs to transmit large currents or process complex electrical signals, the independent connection path can avoid signal interference between devices. Simultaneously, each connection portion 121 can share the current load of its corresponding semiconductor device 110, reducing the pressure on a single connection portion 121 and lowering the risk of the entire semiconductor module 100 failing due to a connection portion 121 malfunction. Regarding heat dissipation, since each semiconductor device 110 has its own dedicated connection portion 121, heat can be transferred more directly and efficiently to the heat sink 120 through the corresponding connection portion 121. When the connectors 121 are arranged in a matrix, the heat distribution on the heat sink 120 is more uniform, avoiding localized overheating and improving the operational stability and lifespan of the semiconductor device 110. The close fit between each connector 121 and the semiconductor device 110 ensures a smoother heat conduction path, guaranteeing stable operation of the semiconductor device 110 within a suitable temperature range. Furthermore, this design, with one connector 121 corresponding to one semiconductor device 110, greatly facilitates the installation and positioning of the semiconductor device 110. During the soldering process, the pressure plate 310 of the positioning component 300 can more accurately press each semiconductor device 110 onto its corresponding connector 121, and the positioning component 320 can more easily cooperate with the positioning structure on the heat sink 120, ensuring precise docking of each semiconductor device 110 with its corresponding connector 121, improving soldering efficiency and quality. This precise installation and positioning method also helps improve the consistency and stability of the entire semiconductor module 100.

[0062] Through the above technical solution, the welding fixture is used for the semiconductor module 100 (such as an IGBT module). The isolation component 200 is set between the heat sink 120 and the semiconductor device 110, which can effectively prevent solder balls from splashing onto the heat sink 120 when the semiconductor device 110 is welded to the heat sink 120. This avoids the shortening of the safety distance between the semiconductor device 110 and the heat sink 120 due to the difficulty in removing solder balls, thus meeting the design requirements. At the same time, it replaces the original insulating board, which is prone to structural complexity, high cost and safety hazards, reducing the amount of insulating board used, simplifying the overall structure and reducing costs. It also avoids the risk of solder balls getting stuck in the gaps and failing to meet safety regulations. In addition, the isolation component 200 is provided with a clearance channel 210 to expose the connection part 121, providing space for the welding operation. After the semiconductor device 110 is welded, it can form a good electrical and thermal conduction path with the heat sink 120 through the connection part 121. The heat sink 120 dissipates the heat generated by the semiconductor device 110 in a timely manner, ensuring that it works stably within a suitable temperature range, preventing performance degradation, shortened lifespan or even damage, and helping the entire semiconductor module 100 to operate stably. In addition, the positioning part 320 of the positioning member 300 cooperates with the heat sink 120 to quickly determine the position of the positioning member 300 on the heat sink 120, ensuring that the semiconductor device 110 can quickly find the corresponding position with the connecting part 121 during installation and preventing the positioning member 300 from shifting during the welding process, thus ensuring the relative positional accuracy of the semiconductor device 110 and the connecting part 121. The pressure plate 310 presses the semiconductor device 110 tightly and evenly onto the connecting part 121 to fix its position, preventing displacement or loosening, ensuring the quality of the welding surface and the reliability of the electrical connection, and improving the electrical performance of the semiconductor module 100.

[0063] In some embodiments, such as Figure 2 and Figure 3 As shown, the isolation member 200 includes a plurality of isolation portions 220 spaced apart along the second direction Y, with adjacent isolation portions 220 forming a clearance channel 210. It should be noted that, in order to meet the functional requirements of the semiconductor module 100, the number of isolation portions 220 is at least two, and the arrangement of the isolation portions 220 has a certain degree of flexibility.

[0064] When two isolation sections 220 are provided, the two isolation sections 220 form a clearance channel 210, which encloses all the connecting sections 121. In this configuration, to prevent interference between the semiconductor devices 110, the spacing between adjacent connecting sections 121 in the second direction Y and the third direction Z needs to be precisely calculated and rationally designed. This spacing must meet the electrical performance requirements for signal isolation, avoiding crosstalk between electromagnetic signals generated by different semiconductor devices 110 during operation due to insufficient spacing, which would affect the normal operation of the entire semiconductor module 100; it must also meet heat dissipation requirements, ensuring that heat is evenly dissipated between each connecting section 121 and the connected semiconductor devices 110, preventing localized overheating due to unreasonable spacing. Simultaneously, the feasibility of the welding process must be considered, ensuring that operators have sufficient space to operate during welding, and that the welding equipment can accurately apply force to the welding points between the connecting section 121 and the semiconductor device 110, ensuring welding quality.

[0065] When there are more than two isolation units 220, there are two common configuration scenarios:

[0066] Firstly, the isolation part 220 extends along the third direction Z and is located on both sides of its adjacent connecting part 121 in the second direction Y. This layout means that in the second direction Y, the distance between adjacent connecting parts 121 must be greater than the size of the isolation part 220 in the second direction Y. However, in the third direction Z, since there is no isolation element 200 between adjacent connecting parts 121 in this direction, the distance between adjacent connecting parts 121 must be precisely calculated and rationally designed to ensure electrical safety, heat dissipation, and smooth implementation of the welding process, and this distance must be greater than the safety standard size. This design ensures that the isolation part 220 effectively isolates adjacent connecting parts 121 in the second direction Y, while also taking into account the various performance requirements between connecting parts 121 in the third direction Z.

[0067] Secondly, the isolation portion 220 extends along the second direction Y and is located on both sides of the adjacent connecting portion 121 in the third direction Z. That is, in the third direction Z, the distance between adjacent connecting portions 121 is greater than the size of the isolation portion 220 in the third direction Z. In the second direction Y, since no isolation member 200 is provided between adjacent connecting portions 121 in this direction, the distance between adjacent connecting portions 121 also needs to be accurately calculated and reasonably designed, and must be greater than the safety specification size. This arrangement reasonably plans the distance between connecting portions 121 and the position of isolation portion 220 in different directions, comprehensively ensuring the electrical performance, heat dissipation performance and welding process of the semiconductor module 100, and effectively improving the stability and reliability of the entire semiconductor module 100.

[0068] Through the above technical solution, the isolation section 220 forms a clearance channel 210 for exposing the connection section 121 by being spaced apart from adjacent isolation sections 220. This provides exposure space for the connection section 121 to facilitate the welding of the semiconductor device 110. Working together with the clearance channel 210, it effectively isolates the semiconductor device 110 from other areas of the heat sink 120. When there are two isolation sections 220, the clearance channel 210 can surround all the connection sections 121. With the reasonable design of the spacing between adjacent connection sections 121, it blocks the path of electromagnetic signal interference, ensures uniform heat dissipation, and provides operating space for welding. When there are more than two isolation sections 220, clearance channels 210 of different shapes and sizes are formed under different configurations. They provide isolation and operating space for adjacent connection sections 121 in different directions. Working together with the spacing between the connection sections 121, they ensure heat dissipation and electrical safety, and comprehensively ensure the stable operation of the semiconductor module 100.

[0069] In some embodiments, such as Figure 5 , Figure 6 , Figure 7As shown, the welding fixture also includes a support member 400, further optimizing the functionality and practicality of the entire welding fixture. The support member 400 is located on the side of the isolation member 200 away from the pressure plate 310; the support member 400 has a receiving groove 410, the size and shape of which are adapted to the heat sink 120 and specifically used to receive the heat sink 120. It should be noted that when performing welding operations on the semiconductor module 100, the heat sink 120 can be securely placed in the receiving groove 410. The presence of the support member 400 not only provides a stable and reliable support platform for the heat sink 120, effectively preventing displacement, shaking, and other instability of the heat sink 120 during welding, thus ensuring the accuracy and stability of the entire welding process, but also, the coordinated cooperation between the support member 400 and the isolation member 200 further enhances the positioning and protection functions of the welding fixture for the various components of the semiconductor module 100. Since the carrier 400 is located on the side of the isolation member 200 away from the pressure plate 310, the carrier 400, the isolation member 200, and the positioning member 300 together form a complete positioning and protection system. On the one hand, the carrier 400 firmly fixes the heat sink 120 through the receiving groove 410, providing a stable support foundation for the isolation member 200, enabling the isolation member 200 to better perform its function of isolating the semiconductor device 110 and other areas of the heat sink 120, as well as defining the welding operation space. On the other hand, the carrier 400 and the positioning member 300 complement each other, jointly ensuring the relative positional accuracy of the connection portion 121 on the semiconductor device 110 and the heat sink 120, providing a solid guarantee for the smooth implementation of the welding process. For example, in the actual welding process, the operator can first accurately place the heat sink 120 into the receiving groove 410 of the carrier 400, then install the isolator 200, and use the isolation part 220 and the clearance channel 210 of the isolator 200 to position and isolate the connecting part 121. Finally, the semiconductor device 110 is precisely pressed onto the connecting part 121 by the positioning part 300 for welding. This orderly operation process, with the synergistic effect of the carrier 400, the isolator 200 and the positioning part 300, greatly improves the efficiency and quality of welding, effectively reduces the risk of welding defects caused by inaccurate or unstable component positioning, and provides strong support for the production and manufacturing of high-quality semiconductor modules 100.

[0070] It should be noted that the support component 400 also has multiple through holes. Some of these through holes facilitate installation and welding, some allow for avoidance of other structures, and some facilitate mechanical connections. The specific number and location of these through holes are adapted to the actual product type, and this embodiment does not impose specific limitations.

[0071] Through the above technical solution, the carrier 400 is disposed on the side of the isolation component 200 away from the pressure plate 310. The receiving groove 410 on it is adapted to the heat sink 120, which can stably support the heat sink 120, prevent the heat sink 120 from shifting and shaking during welding, and ensure accurate and stable welding. It works with the isolation component 200 to strengthen the positioning protection of the semiconductor module 100 components, provide support for the isolation component 200, and help it perform its function of isolating and defining the welding space. It echoes the positioning component 300 to ensure the relative positional accuracy of the semiconductor device 110 and the connecting part 121, provide protection for the welding process, optimize the operation process, improve welding efficiency and quality, reduce the risk of welding defects, and strongly support the production of high-quality semiconductor module 100.

[0072] In some embodiments, such as Figure 5 , Figure 6 , Figure 7 As shown, the carrier 400 also has a limiting groove 420. The isolator 200 also includes a base 230 connected to the plurality of isolators 220, and the base 230 can be disposed in the limiting groove 420. It is understood that the ends of the plurality of isolators 220 on the same side are connected through a base 230. This design enhances the integrity and stability of the isolator 200 structure, making it more reliable when performing its function.

[0073] It should be noted that the limiting groove 420 is located on the support member 400 in the area corresponding to the base 230 of the isolator 200. Since the support member 400 is located on the side of the isolator 200 away from the pressure plate 310, the limiting groove 420 comes into play when the base 230 of the isolator 200 needs to be installed onto the support member 400. Its position is determined to ensure that the base 230 of the isolator 200 can be accurately embedded. Specifically, the limiting groove 420 is set along the edge of the support member 400 near the placement of the base 230 of the isolator 200 or at a specific location. The limiting groove 420 can communicate with the receiving groove 410, forming a continuous structure in space. In this way, when the heat sink 120 is placed in the receiving groove 410, the base 230 of the isolator 200 can be installed in the limiting groove 420. This arrangement creates a close and orderly cooperation between the support member 400, the isolator 200, and the heat sink 120. The limiting groove 420 not only provides stable support and positioning for the base 230 of the isolation component 200, but also works in conjunction with the receiving groove 410 to ensure the stability of the welding fixture in the overall structure. This ensures that each component can maintain the correct relative position during the welding process of the semiconductor module 100, thereby providing a strong guarantee for the smooth progress of the welding process and the reliable performance of the semiconductor module 100.

[0074] Through the above technical solution, the limiting groove 420 is set in the corresponding area of ​​the base 230 of the carrier 400 and the isolation component 200, which can accurately position the base 230 of the isolation component 200, so that the carrier 400, the isolation component 200 and the heat dissipation component 120 can cooperate closely and orderly, ensuring the overall structural stability of the welding fixture and ensuring that each component maintains the correct relative position during welding.

[0075] In some embodiments, to further improve the ease of operation and practicality of the welding fixture, a handhold 240 is added to the base 230 of the isolator 200 on the side opposite to the isolator 220. The handhold 240 adopts an ergonomic design and has an anti-slip surface, which can effectively improve the comfort and stability of the operator when holding it.

[0076] It should be noted that after the semiconductor module 100 has completed the soldering process, the operator can easily remove the entire isolation component 200 from between the semiconductor device 110 and the heat sink 120 using the handheld part 240. This design not only greatly simplifies the disassembly process of the isolation component 200 and shortens the operation time, but also avoids the risk of component damage or contamination that may occur due to direct contact with other parts of the isolation component 200. At the same time, the handheld part 240 allows the operator to more accurately control the force and direction of removing the isolation component 200, effectively preventing accidental collisions or pulling of the soldered semiconductor device 110 and heat sink 120 during the removal process, thereby ensuring the finished product quality and integrity of the semiconductor module 100 and significantly improving the convenience and reliability of the soldering fixture in actual use.

[0077] In some embodiments, such as Figure 8 , Figure 9 , Figure 10 , Figure 11In the first direction X, the receiving groove 410 has a first groove depth H1, and the limiting groove 420 has a second groove depth H2, where the first groove depth H1 is greater than the second groove depth H2. It should be noted that, from the perspective of supporting and fixing the heat sink 120, the deeper receiving groove 410 provides sufficient space for the heat sink 120, making the heat sink 120 more stable on the supporting member 400. During the welding process, this stable support effectively prevents the heat sink 120 from shifting or shaking due to external forces or vibrations, ensuring the accuracy of the heat sink 120's position during welding. This provides a fundamental guarantee for the precise welding of the connecting part 121 and the semiconductor device 110, thereby improving the welding quality. Regarding the installation and positioning of the isolator 200, the limiting groove 420 is shallower. When the base 230 of the isolator 200 is positioned within the limiting groove 420, this depth difference ensures that the installation height of the isolator 200 on the supporting member 400 is reasonable. On the one hand, the isolation component 200 will not have its isolation portion 220 positioned too low due to an excessively deep limiting groove 420, thus affecting the isolation effect on other areas of the semiconductor device 110 and the heat sink 120, as well as defining the welding operation space. On the other hand, it also avoids the situation where the isolation component 200 is unstable due to an excessively shallow limiting groove 420. The appropriate height allows the isolation portion 220 of the isolation component 200 to accurately mate with the connecting portion 121 and the semiconductor device 110, ensuring that the clearance channel 210 is accurately exposed above the connecting portion 121, providing ideal space for the welding operation, and also facilitating the smooth transfer of heat from the connecting portion 121 to the heat sink 120, optimizing heat dissipation performance. Considering the overall ease of assembly of the welding fixture, this groove depth difference design allows operators to quickly and intuitively distinguish the installation positions of different components when installing the heat sink 120 and the isolation component 200. First, the heat sink 120 is placed into the receiving slot 410 of the deep groove, and then the base 230 of the isolator 200 is embedded into the limiting slot 420 of the shallow groove. The installation process is clear and straightforward, reducing time wastage caused by unclear installation, significantly improving the assembly efficiency of the welding fixture, and thus enhancing the production efficiency of the semiconductor module 100. In addition, the stable installation structure and clear installation method can also reduce the scrap rate caused by component installation deviation or instability, providing strong support for the large-scale production of high-quality semiconductor modules 100 and enhancing the reliability and stability of the entire production process.

[0078] Through the above technical solution, the difference in groove depth (the first groove depth H1 is greater than the second groove depth H2) helps to stabilize the heat sink 120, prevent its displacement and shaking, and improve the welding quality; ensures that the installation height of the isolation component 200 is reasonable, optimizes the isolation effect and welding operation space, and helps heat transfer; facilitates operators to quickly identify the installation position, improves the assembly efficiency of welding fixtures and production efficiency, reduces the scrap rate, and enhances the reliability and stability of the production process.

[0079] In some embodiments, such as Figure 2 and Figure 6 As shown, due to the structural characteristics of the isolator 200 and the external forces it is subjected to, it is prone to warping. To solve this problem, at least two isolators 200 are provided in this embodiment, with at least one isolator 200 and another isolator 200 positioned opposite each other in the third direction Z. It should be noted that the isolator 200 in this embodiment structurally includes two bases 230 and at least two isolating portions 220. "Relatively positioned" means that the two isolators 200 are spatially oriented towards each other. Specifically, in this embodiment, the isolating portions 220 of both are aligned to form at least one clearance channel 210.

[0080] The following detailed explanation focuses on the case of two isolators 200, symmetrically arranged along the second direction Y. The ends of multiple isolating portions 220 on the same side of each isolator 200 are connected by a base 230. This structural design greatly enhances the integrity and stability of each individual isolator 200. When the two isolators 200 are symmetrically placed along the second direction Y, compared to a single isolator 200, the size of each isolator 200 is significantly reduced in the third direction Z. From a mechanical perspective, the smaller size significantly shortens the lever arm of the external force acting on the isolator 200 in the third direction Z. According to the torque calculation formula, under the same external force, a shorter lever arm results in a smaller tilting torque, thus effectively mitigating the tilting phenomenon.

[0081] It is understood that at least one clearance channel 210 is formed between the isolation portion 220 and the base 230. The number, shape, and size of this clearance channel 210 formed by the isolation portion 220 and the base 230 vary significantly depending on the number, distribution, and orientation of the isolation portions 220. When the two isolation members 200 are symmetrically arranged along the second direction Y, the clearance channel 210 formed by the isolation portion 220 and its respective base 230 exhibits a symmetrical distribution along the second direction Y. In terms of isolation function, the symmetrically arranged clearance channel 210 can more evenly isolate and protect the connecting portion 121 and the semiconductor device 110, effectively blocking interference paths of electromagnetic signals between different semiconductor devices 110, ensuring independent and stable operation of each device. In terms of heat dissipation, the symmetrical clearance channel 210 layout helps to evenly dissipate heat between the connecting portion 121 and the connected semiconductor device 110, avoiding localized overheating problems caused by unreasonable isolation member 200 layout. For the welding process, the symmetrical and reasonable arrangement of the clearance channels 210 provides a more precise and stable spatial definition for the welding operation, making it easier for operators to accurately weld the semiconductor device 110 to the connector 121, thereby improving welding quality and efficiency. Whether two isolation sections 220 form a clearance channel 210, or multiple isolation sections 220 form multiple clearance channels 210 under different configurations, they all play an indispensable and crucial role in the welding process between the connector 121 and the semiconductor device 110, creating favorable conditions for the welding process, while effectively isolating the semiconductor device 110 from other areas of the heat sink 120, ensuring the stable operation of the semiconductor module 100 in all aspects.

[0082] Furthermore, the two isolators 200 can be pulled out from between the heat sink 120 and the semiconductor device 110 along the third direction Z, moving away from each other. During the manufacturing process of the semiconductor module 100, after the soldering process is completed, the operator can easily pull out the two isolators 200 along the third direction Z, moving away from each other, greatly improving the efficiency of tooling disassembly and facilitating subsequent quality inspection of the soldered semiconductor module 100 and its entry into the next production process. It is understood that during the extraction of the isolators 200, the positioning member 300 and the supporting member 400 have already disengaged from the semiconductor module 100.

[0083] It should be noted that using two symmetrically arranged isolation components 200 as a group of isolation components offers great flexibility and scalability in practical applications, allowing for the simultaneous use of multiple groups of isolation components. In large semiconductor modules 100 or applications with extremely stringent requirements for electrical and heat dissipation performance, multiple groups of isolation components can be strategically positioned according to the complex distribution of the connection parts 121 and the density of the semiconductor devices 110. By rationally setting up multiple groups of isolation components, multiple precisely matched avoidance channels 210 can be formed simultaneously in different areas, further enhancing the isolation effect between the semiconductor devices 110 and other areas of the heat sink 120.

[0084] Through the above technical solution, at least two symmetrical isolation members 200 along the second direction Y are set to reduce their size in the third direction Z, thereby improving the warping phenomenon based on mechanical principles; the avoidance channel 210 formed by the isolation part 220 and the base 230 has significant advantages in isolation, heat dissipation and welding process; the two isolation members 200 can be pulled out away from each other along the third direction Z, improving the tooling disassembly efficiency, and the positioning part 300 and the bearing part 400 are separated when pulled out; the isolation assembly with two symmetrical isolation members 200 as a group has strong flexibility and expandability in practical applications, and multiple groups of isolation assemblies can be used to strengthen the isolation effect for complex distribution layouts.

[0085] In some embodiments, such as Figure 12 , Figure 13 , Figure 14 The isolation portion 220 is provided with a step for adapting to the semiconductor device 110, the step having a first surface 221, a second surface 222, and a third surface 223 connected in sequence. In order to meet safety requirements, in the second direction Y, the isolation member 200 can form a first gap W1 with the connecting portion 121, which is less than or equal to 2.7 mm; the first gap W1 refers to the distance between the first surface 221 and the connecting portion 121.

[0086] The isolator 200 forms a second gap W2 with the semiconductor device 110, which is less than or equal to 2.7 mm. The second gap W2 refers to the distance between the third surface 223 and the semiconductor device 110. It should be noted that within this gap range, stray electromagnetic fields between the semiconductor device 110 and the isolator 200 can be effectively isolated, preventing abnormal operation of the semiconductor device 110 due to electromagnetic interference, such as signal distortion and data transmission errors. Furthermore, a suitable gap can also assist in heat dissipation to a certain extent, ensuring that the heat generated by the semiconductor device 110 during operation can be evenly dissipated, avoiding localized overheating and extending the service life of the semiconductor device 110.

[0087] The distance between the second surface 222 and the side of the semiconductor device 110 facing the connection portion 121 is the fifth distance W5, which is less than or equal to 2.7 mm. It should be noted that this distance range further refines the spatial relationship between the isolation portion 220 and the semiconductor device 110. A reasonable distance between the second surface 222 and a specific side of the semiconductor device 110 helps optimize the electric field distribution inside the semiconductor device 110, reduce electric field distortion, and improve the insulation performance of the semiconductor device 110.

[0088] Through the above technical solutions, by controlling these three spacings (W1, W2, W5) in the actual production and manufacturing process, the yield of semiconductor module 100 can be effectively improved, the risk of product failure due to non-compliance with safety regulations can be reduced, and a solid guarantee can be provided for the stable operation of semiconductor module 100 in various complex environments.

[0089] In some embodiments, such as Figure 15 , Figure 16 , Figure 17 The base 230 is provided with a step for fitting with the semiconductor device 110, the step having a fourth surface 231, a fifth surface 232, and a sixth surface 233 connected in sequence. In the third direction Z, the spacer 200 can form a third gap W3 with the connecting part 121, which is less than or equal to 2.7 mm; the third gap W3 refers to the gap between the fourth surface 231 and the connecting part 121.

[0090] The isolator 200 forms a fourth gap W4 with the semiconductor device 110, which is less than or equal to 2.7 mm. The fourth gap W4 refers to the distance between the sixth surface 233 and the semiconductor device 110. Within this gap range, it can effectively resist the mutual interference of stray electromagnetic fields between the semiconductor device 110 and the base 230 of the isolator 200, preventing abnormal operating conditions such as signal distortion and data transmission disorder caused by electromagnetic interference. In addition, a reasonable fourth gap W4 helps to optimize the heat dissipation path of the semiconductor device 110, ensuring that the heat generated during device operation can be dissipated evenly and efficiently, avoiding accelerated device aging due to local overheating, extending the actual service life of the semiconductor device 110, and ensuring its stability under long-term, high-load operation.

[0091] The distance between the fifth surface 232 and the side of the semiconductor device 110 facing the connection portion 121 is the sixth distance W6, which is less than or equal to 2.7 mm. This precise setting of the distance range further refines the spatial layout between the base 230 of the isolator 200 and the semiconductor device 110. Maintaining a reasonable distance between the fifth surface 232 and a specific side of the semiconductor device 110 optimizes the electric field distribution inside the semiconductor device 110, effectively reduces electric field distortion, enhances the insulation performance of the semiconductor device 110, and enables it to operate stably in complex electromagnetic environments, greatly improving the reliability and stability of the semiconductor module 100 under various operating conditions.

[0092] Through the above technical solution, in the actual production and manufacturing process, by controlling these three spacings (W3, W4, W6) and working in conjunction with the relevant spacings (W1, W2, W5) of the control isolation section 220, the yield of the semiconductor module 100 can be significantly improved, the risk of product failure caused by non-compliance with safety regulations can be greatly reduced, and a comprehensive and solid guarantee can be provided for the stable and efficient operation of the semiconductor module 100 in various complex and harsh environments.

[0093] In some embodiments, such as Figure 4 As shown, the positioning component 300 plays a crucial role in the assembly process of the semiconductor module 100, and its structural design directly affects the accuracy and stability of the positioning of the semiconductor device 110. In addition to its basic structure, the positioning component 300 includes multiple first limiting portions 330 that are tightly connected to the pressure plate 310. At least two of the first limiting portions 330 are specifically designed to abut against the same semiconductor device 110. Specifically, each semiconductor device 110 is cleverly positioned between at least two first limiting portions 330 on both sides in the third direction Z. In actual operation, when the semiconductor device 110 is placed on the connecting portion 121, the operator installs the pressure plate 310 into place, at which point the first limiting portions 330 connected to the pressure plate 310 come into play. Because the positions of the first limiting portions 330 are precisely designed and adjusted, they can accurately fit the two sides of the semiconductor device 110 in the third direction Z. This is based on in-depth consideration of the size, shape, and overall layout of the semiconductor device 110. Through this precise fit, the first limiting part 330 can provide stable and reliable lateral constraint for the semiconductor device 110.

[0094] From a mechanical perspective, the forces exerted by the two first limiting parts 330 on the semiconductor device 110 in the third direction Z are mutually balanced, effectively preventing displacement of the semiconductor device 110 in this direction. This not only ensures the accuracy of the semiconductor device 110's position in the module but also lays a solid foundation for subsequent processes such as soldering and electrical connection. For example, during soldering, stable positioning can avoid soldering defects caused by the shaking or displacement of the semiconductor device 110, such as cold solder joints or short circuits, thereby greatly improving the production quality and yield of the semiconductor module 100. Furthermore, in terms of electrical connection, the precisely positioned semiconductor device 110 ensures more stable and reliable electrical connections with other components, reducing interference and loss during signal transmission and improving the overall electrical performance of the semiconductor module 100. Through the precise positioning of the semiconductor device 110 in the third direction Z by the first limiting parts 330, the overall accuracy and stability of the semiconductor module 100 during assembly are further guaranteed, contributing to the efficient and high-quality production of the semiconductor module 100.

[0095] Through the above technical solution, the positioning component 300 precisely fits with both sides of the semiconductor device 110 in the third direction Z by at least two first limiting parts 330, providing stable lateral constraints, preventing device displacement based on mechanical balance, laying the foundation for processes such as welding and electrical connection, avoiding poor welding, improving electrical connection stability, reducing signal interference loss, ensuring the assembly accuracy and stability of the semiconductor module 100, and helping to achieve efficient and high-quality production.

[0096] In some embodiments, such as Figure 4 As shown, the positioning member 300, in addition to including a first limiting part 330 tightly connected to the pressure plate 310 to achieve precise positioning of the semiconductor device 110 in the third direction Z, also has a second limiting part 340 connected to the pressure plate 310. The orthogonal projection of the second limiting part 340 in the first direction X falls on the isolator 200. In the actual operating environment of the semiconductor module 100, due to the structural characteristics of the isolator 200 itself and the external forces it is subjected to, there is a risk of it tilting. When the isolator 220 shows a tendency to tilt, the second limiting part 340 immediately plays its key role. From a physical principle perspective, when the isolator 220 tilts, its movement trajectory will gradually approach the second limiting part 340. Once the two come into contact, the second limiting part 340 can provide a reverse resistance to the tilted isolator 220 by virtue of its rigid connection structure with the pressure plate 310. The magnitude and direction of this resistance are carefully designed to effectively counteract the force generated by the warping of the isolation part 220, thereby preventing the isolation part 220 from warping excessively and preventing the warping from hitting the semiconductor device 110, which would affect the welding effect.

[0097] Through the above technical solution, the second limiting part 340 in the positioning member 300, which is connected to the pressure plate 310, has its orthogonal projection in the first direction X located on the isolation member 200. This provides reverse resistance when the isolation part 220 is tilted up, counteracting the tilting force and preventing excessive tilting. This avoids the isolation part 220 tilting up excessively and hitting the semiconductor device 110, which would affect the welding effect.

[0098] In some embodiments, the isolator 200 is made of metal, with aluminum being a common and high-quality choice. Aluminum, as a lightweight metal, possesses excellent overall performance. Its relatively low density effectively reduces the weight of the entire welding fixture and semiconductor module 100 while meeting usage requirements. From a stiffness perspective, the aluminum isolator 200 exhibits considerable rigidity. This rigidity plays a crucial role when the isolator 200 faces various external forces that may occur in the complex working environment of the semiconductor module 100. For example, under the thermal stress generated by the operation of the semiconductor device 110, an ordinary isolator 200 may deform due to thermal expansion and contraction, leading to the warping of the isolator portion 220. However, the aluminum isolator 200, due to its rigidity, can effectively resist the deformation trend caused by thermal stress, maintaining its shape stability and ensuring that the isolator portion 220 does not warp. Similarly, when the semiconductor module 100 is affected by mechanical external forces such as vibration, the rigidity of the aluminum isolator 200 allows it to withstand a certain degree of impact, preventing the isolator portion 220 from warping due to vibration and impact. Through the above technical solution, the aluminum isolation component 200 can reduce weight due to its low density, and its good rigidity can resist deformation caused by thermal stress and mechanical external force, thus preventing the isolation part 220 from warping.

[0099] According to a second aspect of this embodiment, a welding apparatus is provided, which includes at least one of the above-described welding fixtures. This welding apparatus possesses all the beneficial effects of the above-described welding fixtures, which will not be elaborated further in this embodiment.

[0100] This embodiment exemplarily describes the working process of the welding fixture:

[0101] During the preparation stage, the carrier 400 is first placed on a stable working platform. The carrier 400 is pre-set with a receiving groove 410 that is compatible with the heat sink 120. At this time, the heat sink 120 can be accurately embedded into the receiving groove 410.

[0102] Next, the isolator 200 is installed. The isolator 200 includes multiple isolating parts 220 and a base 230 connected to the isolating parts 220. The base 230 is disposed on the support member 400 at a position corresponding to the limiting groove 420. The limiting groove 420 is connected to the receiving groove 410. The clearance channel 210 formed by the multiple isolating parts 220 can accurately expose the connecting part 121. The isolating parts 220 with different settings can be flexibly adjusted according to the layout requirements of the connecting part 121, leaving sufficient space for the subsequent welding operation of the semiconductor device 110 and the connecting part 121.

[0103] After the isolator 200 is installed and the connector 121 is precisely exposed, an important step is to apply solder paste to the connector 121. Professional operators use high-precision solder paste printing equipment or specialized application tools to evenly apply solder paste to the surface of the connector 121. The thickness, uniformity, and coverage of the solder paste application are subject to strict process standards. The thickness must be precisely controlled; too thin a layer may result in insufficient solder strength and a cold solder joint; too thick a layer may cause solder ball splattering during soldering, leading to short circuits. Uniformity ensures a consistent soldering effect across all areas of the connector 121, while coverage ensures that all solder joints on the connector 121 are completely covered with solder paste, providing good soldering conditions for subsequent soldering processes and enabling a reliable electrical and mechanical connection between the semiconductor device 110 and the connector 121.

[0104] The positioning member 300 has a first limiting part 330 and a second limiting part 340 connected to the pressure plate 310. When placing the semiconductor device 110, the operator places the semiconductor device 110 on the connecting part 121 and then installs the pressure plate 310 of the positioning member 300. At this time, multiple first limiting parts 330 come into play, with at least two first limiting parts 330 tightly abutting against both sides of the same semiconductor device 110 in the third direction Z, providing stable lateral constraints for the semiconductor device 110 from a mechanical perspective, effectively preventing its displacement in the third direction Z, and ensuring the positional accuracy of the semiconductor device 110 in the semiconductor module 100. The orthogonal projection of the second limiting part 340 in the first direction X is located on the isolator 200. Once the isolator 220 tilts due to its own structural characteristics or external forces, the second limiting part 340 can provide reverse resistance to the tilted isolator 220 in a timely manner, preventing it from tilting excessively and avoiding damage to the electrical isolation environment and heat dissipation path inside the semiconductor module 100 due to excessive tilting.

[0105] Once all components are in place and the semiconductor device 110, connector 121, and isolator 200 are precisely positioned, the welding process can begin. The welding equipment performs precise welding operations on the welding points between the semiconductor device 110 and connector 121 according to pre-set parameters. Due to the precise positioning of the semiconductor device 110 by the positioning component 300 and the effective isolation of the welding area by the isolator 200, the probability of welding defects such as cold solder joints and short circuits is greatly reduced, ensuring welding quality and improving the yield rate of the semiconductor module 100. After welding, the isolator 200 can be easily pulled out from between the heat sink 120 and the semiconductor device 110 along the Z-axis in a mutually distancing direction. Then, the positioning component 300 and the carrier component 400 are removed sequentially, completing the welding fixture operation process for the semiconductor module 100 and preparing for subsequent quality inspection and performance testing. Through this complete and precise welding fixture process, high-quality semiconductor modules 100 can be produced efficiently and stably to meet complex market demands.

[0106] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0107] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0108] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A welding fixture, characterized in that, For a semiconductor module (100), the semiconductor module (100) includes a semiconductor device (110) and a heat sink (120) disposed on one side of the semiconductor device (110), the welding fixture includes: An isolation member (200) is disposed between the heat sink (120) and the semiconductor device (110). The isolation member (200) is provided with a clearance channel (210). The connecting portion (121) of the heat sink (120) passes through the clearance channel (210) at least partially. The positioning component (300) includes a pressure plate (310) and a positioning part (320) connected to each other. The pressure plate (310) is disposed on the side of the semiconductor device (110) away from the heat sink (120) and is in contact with the semiconductor device (110). The positioning part (320) is connected to the heat sink (120).

2. The welding fixture according to claim 1, characterized in that, The isolation member (200) includes a plurality of isolation sections (220) spaced apart along a second direction (Y), with the avoidance channel (210) formed between adjacent isolation sections (220).

3. The welding fixture according to claim 2, characterized in that, It also includes a support member (400), which is disposed on the side of the isolation member (200) opposite to the pressure plate (310); The support member (400) is provided with a receiving groove (410), and the heat dissipation member (120) is housed in the receiving groove (410).

4. The welding fixture according to claim 3, characterized in that, The support member (400) is also provided with a limiting groove (420); The isolation member (200) further includes a base (230) connected to the plurality of isolation portions (220), the base (230) being disposed in the limiting groove (420).

5. The welding fixture according to claim 4, characterized in that, A hand-held part (240) is provided on the side of the base (230) opposite to the isolation part (220).

6. The welding fixture according to claim 4, characterized in that, In a first direction (X) intersecting the second direction (Y), the receiving groove (410) has a first groove depth H1, and the limiting groove (420) has a second groove depth H2, wherein the first groove depth H1 is greater than the second groove depth H2.

7. The welding fixture according to claim 1, characterized in that, There are at least two isolation members (200), and at least one of the isolation members (200) is disposed opposite to the other isolation member (200) in a third direction (Z).

8. The welding fixture according to claim 1, characterized in that, In the second direction (Y), the spacer (200) can form a first gap W1 with the connecting portion (121), which is less than or equal to 2.7 mm; the spacer (200) can form a second gap W2 with the semiconductor device (110), which is less than or equal to 2.7 mm.

9. The welding fixture according to claim 1, characterized in that, In the third direction (Z), the isolator (200) can form a third distance W3 with the connection portion (121), which is less than or equal to 2.7 mm; the isolator (200) can form a fourth distance W4 with the semiconductor device (110), which is less than or equal to 2.7 mm.

10. The welding fixture according to claim 1, characterized in that, The positioning member (300) further includes a plurality of first limiting portions (330) connected to the pressure plate (310), at least two of the first limiting portions (330) being used to abut against the same semiconductor device (110).

11. The welding fixture according to claim 1, characterized in that, The positioning member (300) further includes a second limiting part (340) connected to the pressure plate (310), and the orthographic projection of the second limiting part (340) in the first direction (X) is located on the isolation member (200).

12. The welding fixture according to claim 1, characterized in that, The material of the isolation component (200) is metal.

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