Support fixture for wafer thinning devices

Abstract

This application provides a support fixture for a wafer thinning apparatus. The wafer thinning apparatus has a central connection hole. The wafer thinning apparatus includes an annular body and a polishing layer. The annular body surrounds the connection hole. The annular body also includes a first annular surface and a second annular surface. Both the first and second annular surfaces surround the connection hole, and the second annular surface protrudes from the first annular surface in a direction away from the connection hole and is provided with a polishing layer. The support fixture includes a support surface for supporting the first annular surface. The support surface of the support fixture can support the first annular surface to hold the wafer thinning apparatus in place, thereby improving the safety of operators directly contacting the wafer thinning apparatus. Furthermore, since the second annular surface protrudes from the first annular surface in a direction away from the connection hole and is provided with a polishing layer, the risk of operators and the support fixture directly contacting the polishing layer can be reduced, further improving the safety of replacing the wafer thinning apparatus.

Description

Technical Field

[0001] This application relates to the field of semiconductor tooling technology, and more particularly to a support fixture for a wafer thinning apparatus. Background Technology

[0002] In advanced semiconductor packaging processes, wafer thinning is a critical step in ensuring device reliability. Currently, the mainstream thinning equipment uses grinding wheels with a diameter of 200±5mm, whose lifespan is typically 2000 to 3000 wafers processed. When the grinding wheel reaches the processing capacity corresponding to its lifespan, it needs to be replaced with a new one. However, when replacing the grinding wheel, the probability of hand contact with the new grinding wheel's teeth increases, leading to a greater risk of damage to the new grinding wheel's teeth or hand injury. Utility Model Content

[0003] This application provides a support fixture for a wafer thinning device, which improves the safety of replacing the wafer thinning device and at least partially solves the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, a support fixture for a wafer thinning apparatus is provided. The wafer thinning apparatus has a central connection hole. The wafer thinning apparatus includes an annular body and a polishing layer. The annular body surrounds the connection hole. The annular body also includes a first annular surface and a second annular surface. Both the first and second annular surfaces surround the connection hole, and the second annular surface protrudes beyond the first annular surface in a direction opposite to the connection hole and is provided with the polishing layer. The support fixture includes a support surface for supporting the first annular surface.

[0005] Optionally, the support surface includes an annular support surface.

[0006] Optionally, the supporting fixture includes an annular portion and a supporting portion, the annular portion being connected to the supporting portion, and the annular portion including the annular support surface.

[0007] Optionally, the support portion includes a plastic disc.

[0008] Optionally, the annular portion and the supporting portion are integrally formed; and / or,

[0009] The annular portion is disposed along the edge of the supporting portion, or the annular portion is disposed around the supporting portion.

[0010] Optionally, the support portion is provided with a through hole, the through hole extending through the support portion along the thickness direction of the support portion, and at least one of the through holes is provided in the central region of the support portion.

[0011] Optionally, the support fixture further includes a gripping portion disposed on the surface of the support portion away from the annular support surface.

[0012] Optionally, the supporting fixture further includes an anti-slip layer disposed on the supporting surface.

[0013] Optionally, the thickness of the anti-slip layer is 2 mm to 4 mm.

[0014] Optionally, the anti-slip layer includes a silicone layer.

[0015] In the wafer thinning apparatus support fixture of this application embodiment, the support surface of the support fixture can support the first annular surface to hold the wafer thinning apparatus in place, thereby improving the safety issues caused by the operator's direct contact with the wafer thinning apparatus. Furthermore, since the second annular surface protrudes from the first annular surface in the direction opposite to the connecting hole and is provided with a polishing layer, the risk of the operator and the support fixture directly contacting the polishing layer can be reduced, further improving the safety of replacing the wafer thinning apparatus. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the wafer thinning apparatus provided in an exemplary embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the overall structure of the support fixture for the wafer thinning apparatus provided in an exemplary embodiment of this application from one perspective;

[0018] Figure 3 This is a schematic diagram of the overall structure of the support fixture for the wafer thinning apparatus provided in an exemplary embodiment of this application from another perspective;

[0019] Figure 4 This is a schematic diagram of the overall structure of the support fixture for the wafer thinning apparatus provided in an exemplary embodiment of this application from another perspective;

[0020] Figure 5 This is a schematic diagram of a support fixture for a wafer thinning apparatus provided in an exemplary embodiment of this application, which supports the wafer thinning apparatus.

[0021] Explanation of reference numerals in the attached figures:

[0022] 100. Wafer thinning device;

[0023] 10. Connecting holes;

[0024] 11. Annular body; 111. First annular surface; 112. Second annular surface; 113. Connecting inclined surface; 114. Hole;

[0025] 12. Abrasive layer; 121. Grinding teeth;

[0026] 200. Supporting fixture;

[0027] 21. Annular portion; 211. Support surface; 212. Annular support surface;

[0028] 22. Supporting part; 221. Plastic round plate;

[0029] 23. Through hole;

[0030] 24. Anti-slip layer; 241. Silicone layer;

[0031] 25. Grip part; 251. Protrusion. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] Figure 1 This is a schematic diagram of the overall structure of the wafer thinning apparatus provided in an exemplary embodiment of this application.

[0034] Please see Figure 1 The wafer thinning device 100 has a central connection hole 10 that penetrates the device. When installing the wafer thinning device 100, the drive shaft of the drive unit must pass through the connection hole 10, allowing the wafer thinning device 100 to be fitted onto the drive shaft. The drive shaft can then move the wafer thinning device 100 to perform the wafer thinning operation.

[0035] The wafer thinning apparatus 100 includes an annular body 11 and a polishing layer 12. The annular body 11 surrounds a connection hole 10. The annular body 11 includes a first annular surface 111 and a second annular surface 112. Both the first annular surface 111 and the second annular surface 112 are disposed around the connection hole 10. The second annular surface 112 surrounds the first annular surface 111, protrudes from the first annular surface 111 in a direction away from the connection hole 10, and the polishing layer 12 is disposed on the second annular surface 112. Thus, during wafer thinning, basically only the polishing layer 12 on the second annular surface 112 contacts the wafer, and the recessed first annular surface 111 does not contact the wafer, reducing the risk of damage to the wafer caused by contact between other parts of the wafer thinning apparatus 100, excluding the polishing layer 12.

[0036] In some embodiments, the annular body 11 and the polishing layer 12 are integrally formed to simplify the fabrication process of the wafer thinning apparatus 100. Both the annular body 11 and the polishing layer 12 comprise a metallic material, such as steel.

[0037] In some embodiments, the annular body 11 is circular. The outer diameter of the annular body 11 can be 195 mm to 205 mm.

[0038] In some embodiments, the grinding layer 12 includes a plurality of grinding teeth 121, which are arranged in a ring along the second annular surface 112, and there are gaps between adjacent grinding teeth 121. Debris or grinding fluid generated during the grinding process can be discharged through the gaps. The height of the grinding teeth 121 can be 5 mm to 7 mm.

[0039] In some embodiments, the annular body 11 is further provided with a hole 114, which penetrates the first annular surface 111. When a large amount of debris or grinding fluid is generated during the grinding process and flows to the first annular surface 111, it can flow out from the hole 114.

[0040] In some embodiments, the annular body 11 is further provided with a connecting inclined surface 113, which is connected between the first annular surface 111 and the second annular surface 112.

[0041] Figure 2 This is a schematic diagram of the overall structure of the support fixture for a wafer thinning apparatus provided in an exemplary embodiment of this application. Figure 3 This is a schematic diagram of the overall structure of the support fixture for the wafer thinning apparatus provided in an exemplary embodiment of this application, from another perspective. Figure 4 This is a schematic diagram of the overall structure of the support fixture for the wafer thinning apparatus provided in an exemplary embodiment of this application, from another perspective. Figure 5 This is a schematic diagram of a support fixture for a wafer thinning apparatus provided in an exemplary embodiment of this application, which supports the wafer thinning apparatus.

[0042] Please see Figures 2 to 4 The support fixture 200 includes a support surface 211. The support surface 211 is used to support the first annular surface 111, such as... Figure 5 As shown. Thus, the first annular surface 111 can be supported by the support surface 211 of the support fixture 200, allowing the wafer thinning device 100 to be held in place by the support fixture 200, thereby improving the safety of operators directly contacting the wafer thinning device 100. Furthermore, since the second annular surface 112 protrudes from the first annular surface 111 in the direction opposite to the connection hole 10 and is provided with a polishing layer 12, the risk of operators and the support fixture 200 directly contacting the polishing layer 12 can be reduced, further improving the safety of replacing the wafer thinning device 100.

[0043] In some embodiments, please refer to Figure 2 The support surface 211 includes an annular support surface 212. The shape of the annular support surface 212 matches the shape of the first annular surface 111, and can support the first annular surface 111 while reducing the contact area between the support fixture 200 and the wafer thinning device 100.

[0044] In some embodiments, the annular support surface 212 is circular.

[0045] In some embodiments, the outer diameter of the annular support surface 212 is greater than the inner diameter of the first annular surface 111 and less than or equal to the outer diameter of the first annular surface 111, so as to ensure that the annular support surface 212 can support the first annular surface 111.

[0046] In some embodiments, the outer diameter of the annular support surface 212 can be 165 mm to 170 mm.

[0047] In some embodiments, the inner diameter of the annular support surface 212 may be smaller than the inner diameter of the first annular surface 111, which is beneficial to increase the area of ​​the annular support surface 212 and at the same time reduce the direct contact area between the annular support surface 212 and the first annular surface 111.

[0048] In some embodiments, the inner diameter of the annular support surface 212 may be greater than or equal to the inner diameter of the first annular surface 111, which is beneficial to reduce the direct contact area between the annular support surface 212 and the first annular surface 111.

[0049] In some embodiments, please refer to Figures 2 to 4 The support fixture 200 includes an annular portion 21 and a support portion 22, with the annular portion 21 connected to the support portion 22. The annular portion 21 includes an annular support surface 212. When replacing the wafer thinning device 100, the operator can hold the support portion 22, and in conjunction with the supporting effect of the annular portion 21 on the wafer thinning device 100, hold the wafer thinning device 100 and replace it.

[0050] In some embodiments, please refer to Figures 2 to 4 The support portion 22 includes a plastic circular plate 221 to facilitate connection between the annular portion 21 and the support portion 22. The support portion 22 also provides a large area, making it easier for operators to hold onto it. Furthermore, the plastic circular plate 221 is lightweight, reducing the overall weight of the support fixture 200.

[0051] In some embodiments, the plastic disc 221 includes, but is not limited to, rigid plastics such as polypropylene and polycarbonate.

[0052] In some embodiments, the plastic disc 221 is transparent so that the operator can observe the position on the plastic disc 221 and adjust the position of contact with the plastic disc 221 if the position is not suitable.

[0053] In some embodiments, the thickness d1 of the plastic disc 221 can be 4 mm to 6 mm to ensure that the supporting fixture 200 is lightweight, while ensuring that the plastic disc 221 has sufficient mechanical strength to reduce the risk of breakage of the plastic disc 221 when the supporting fixture 200 holds the wafer thinning device 100.

[0054] In some embodiments, the annular portion 21 and the supporting portion 22 are integrally formed to simplify the manufacturing process of the supporting fixture 200. In some embodiments, the annular portion 21 and the supporting portion 22 can be formed by injection molding.

[0055] In some embodiments, the material of the annular portion 21 is the same as the material of the supporting portion 22, so that the annular portion 21 and the supporting portion 22 can be integrally molded. In some embodiments, the annular portion 21 includes, but is not limited to, rigid plastics such as polypropylene and polycarbonate.

[0056] In some embodiments, please refer to Figures 2 to 4 The annular portion 21 can be provided along the edge of the supporting portion 22, which can simplify the forming process of the supporting fixture 200.

[0057] In other embodiments, the annular portion 21 may be disposed around the support portion 22, and the annular portion 21 is connected to the annular side surface of the support portion 22.

[0058] In some embodiments, the height h1 of the annular portion 21 can be 16 mm to 20 mm, and the thickness d2 of the annular portion 21 can be 4 mm to 6 mm.

[0059] In some embodiments, please refer to Figures 2 to 4 The support portion 22 is provided with a through hole 23, which extends through the support portion 22 along its thickness direction, and at least one through hole 23 is located in the central region of the support portion 22. When the operator holds the support portion 22 and places their fingers in the through hole 23 in the central region, this prevents relative slippage between the support portion 22 and the operator's hand, ensuring that the operator holds the support fixture 200 securely and comfortably.

[0060] In some embodiments, please refer to Figures 2 to 3 Multiple through holes 23 can be arranged in a matrix in the central area of ​​the support part 22, which simplifies the forming process of multiple through holes 23 and makes it easier for operators to select through holes 23 more flexibly.

[0061] In some embodiments, at least two through holes 23 may have different diameters to accommodate different operators gripping the support portion 22.

[0062] In some embodiments, the diameter of the through hole 23 can be 8 mm to 12 micrometers, so that the size of the through hole 23 is smaller than the diameter of a normal operator's finger. The through hole 23 serves to prevent relative sliding between the support part 22 and the operator's hand, and at the same time avoids the problem of fingers passing through the through hole 23 and being difficult to pull out.

[0063] In some embodiments, please refer to Figure 4 and Figure 5 The support fixture 200 also includes an anti-slip layer 24, which is disposed on the support surface 211. During the replacement of the wafer thinning device 100, especially when the installation space for the wafer thinning device 100 is limited and it needs to be tilted to accommodate the installation angle, the anti-slip layer 24 helps prevent slippage between the support fixture 200 and the wafer thinning device 100, or even damage to the wafer thinning device 100 due to slippage. In other words, even in confined spaces, the posture and movement path of the support fixture 200 and the wafer thinning device can be precisely controlled, further improving the stability and accuracy of the replacement operation.

[0064] In some embodiments, the thickness of the anti-slip layer 24 is 2 mm to 4 mm to ensure that the anti-slip layer 24 has a suitable thickness and that the anti-slip layer 24 plays an anti-slip role.

[0065] In some embodiments, the anti-slip layer 24 has an annular bonding surface, which is annular and the same as the annular support surface 212, so as to ensure that there is a sufficiently large contact area between the anti-slip layer 24 and the annular support surface 212, thereby reducing the risk of the anti-slip layer 24 peeling off from the annular support surface 212.

[0066] In some embodiments, the anti-slip layer 24 is adhesive and can be directly adhered to the annular support surface 212.

[0067] In some embodiments, the annular support surface 212 may also be provided with a groove, and the anti-slip layer 24 is filled in the groove, further increasing the contact area between the annular support surface 212 and the anti-slip layer 24, and reducing the risk of the anti-slip layer 24 peeling off from the annular support surface 212.

[0068] In some embodiments, the anti-slip layer 24 includes a silicone layer 241, which provides sufficient static friction to significantly reduce the risk of accidental slippage or even drop of the wafer thinning device 100, thereby greatly reducing edge impact damage to the wafer thinning device 100. In some embodiments, the silicone layer 241 may have a high coefficient of friction to improve its anti-slip performance.

[0069] In some embodiments, please refer to Figure 3 and Figure 4 The support fixture 200 may also include a gripping part 25, which is disposed on the surface of the support part 22 away from the annular support surface 212. By grasping the gripping part 25, the support fixture 200 can be held in place, ensuring that the operator can hold the support fixture 200 securely and comfortably.

[0070] In some embodiments, the grip portion 25 may be integrally formed with the support portion 22.

[0071] In some embodiments, the grip portion 25 may include a protrusion 251 that protrudes away from the annular support surface 212.

[0072] In some embodiments, the protrusion 251 may be strip-shaped to facilitate the operator's gripping of the protrusion 251.

[0073] In some embodiments, the protrusion 251 may extend radially along the support portion 22. In this way, when the operator grasps the protrusion 251, it can be better supported by the support fixture 200 onto the wafer thinning apparatus 100.

[0074] In some embodiments, the plurality of protrusions 251 may be arranged in a ring to improve the operator’s flexibility in grasping the gripping part 25.

[0075] In some embodiments, a plurality of protrusions 251 may be arranged around a plurality of through holes 23. Thus, after grasping a protrusion 251, the finger can move toward the central region of the support portion 22, so that the finger is located at the through hole 23.

[0076] In some embodiments, the number of protrusions 251 may be less than the number of through holes 23 to reduce the weight of the support fixture 200.

[0077] In summary, the support fixture for the wafer thinning apparatus in this application embodiment can support the first annular surface through the support surface of the support fixture, thereby holding the wafer thinning apparatus in place and improving the safety issues caused by the operator's direct contact with the wafer thinning apparatus. Furthermore, since the second annular surface protrudes from the first annular surface in the direction opposite to the connecting hole and is provided with a polishing layer, the risk of the operator and the support fixture directly contacting the polishing layer can be reduced, further improving the safety of replacing the wafer thinning apparatus.

[0078] The above description of the embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application; those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A support fixture for a wafer thinning apparatus, characterized in that, The wafer thinning device has a connection hole at its center. The wafer thinning device includes an annular body and a polishing layer. The annular body surrounds the connection hole. The annular body also includes a first annular surface and a second annular surface. The first annular surface and the second annular surface both surround the connection hole. The second annular surface protrudes from the first annular surface in a direction away from the connection hole and is provided with the polishing layer. The supporting fixture includes a support surface for supporting the first annular surface.

2. The support fixture according to claim 1, characterized in that, The support surface includes an annular support surface.

3. The support fixture according to claim 2, characterized in that, The supporting fixture includes an annular portion and a supporting portion, the annular portion being connected to the supporting portion, and the annular portion including the annular support surface.

4. The support fixture according to claim 3, characterized in that, The supporting part includes a plastic circular plate.

5. The support fixture according to claim 3, characterized in that, The annular portion is integrally formed with the supporting portion; and / or The annular portion is disposed along the edge of the support portion, or the annular portion is disposed around the support portion and connected to the annular side surface of the support portion.

6. The support fixture according to claim 3, characterized in that, The support portion is provided with a through hole, which penetrates the support portion along the thickness direction, and at least one of the through holes is provided in the central region of the support portion.

7. The support fixture according to claim 3, characterized in that, The support fixture further includes a gripping part disposed on the surface of the support part away from the annular support surface.

8. The support fixture according to claim 1, characterized in that, The supporting fixture also includes an anti-slip layer, which is disposed on the supporting surface.

9. The support fixture according to claim 8, characterized in that, The thickness of the anti-slip layer is 2 mm to 4 mm.

10. The support fixture according to claim 8, characterized in that, The anti-slip layer includes a silicone layer.

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