An electronic component handling and testing device
By employing a multi-axis robotic arm and a hollowed-out transport suction cup frame in the semiconductor component testing device, the condensation problem during electronic component handling is solved, achieving heat preservation during handling and sealing protection, thereby improving the reliability and accuracy of testing.
CN224278915UActive Publication Date: 2026-05-26HON PRECISION TECH (SUZHOU) LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HON PRECISION TECH (SUZHOU) LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-26
Smart Images
Figure CN224278915U_ABST
Abstract
This utility model relates to an electronic component handling and testing device, including a machine base and several trays, cooling tables, testing tables, and temporary storage tables located on the machine base; the first, second, and third handling mechanisms each include a handling lifting cylinder mounted on a multi-axis robotic arm, and the drive end of the bottom of the handling lifting cylinder is connected to a handling suction cup below through a handling lifting rod; the second handling mechanism also includes a handling cover located outside the handling lifting cylinder and a handling suction cup frame located outside the handling suction cup. This utility model uses the handling cover on the second handling mechanism to keep the electronic components warm during handling, and the handling suction cup frame outside the handling suction cup allows the handling suction cup to freely enter and exit the inlet and outlet at the bottom of the handling cover, facilitating the gripping of electronic components and avoiding any impact on them.
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