LED continuous spectrum lighting device

Abstract

The LED continuous spectrum lighting device comprises a heat dissipation mechanism, a negative suction mechanism and a temperature difference mechanism, the heat dissipation mechanism comprises a device body, an air inlet channel penetrating through one side wall of the device body, a heat dissipation opening formed in the top of the device body, and the negative suction mechanism; the negative suction mechanism comprises a first shell connected with the top of the device body. According to the utility model, when a large amount of heat is accumulated in the device main body, the bending cavity I is far away from the device main body, and the internal temperature is lower than that of the device main body, so that a high-pressure area is formed, correspondingly, the bending cavity II is close to the device main body, and the internal temperature is higher than that of the bending cavity I through heat conduction, so that a low-pressure area is formed; and the heat in the device main body quickly flows through the heat dissipation opening, the bending cavity I and the bending cavity II and is finally discharged from the upper part of the shell II, so that quick cooling is realized.

Description

Technical Field

[0001] This utility model relates to the field of lighting device technology, specifically to an LED continuous spectrum lighting device. Background Technology

[0002] Since the development of humankind, lighting sources have evolved from firelight, oil lamps, incandescent lamps, fluorescent lamps, to the current (LED) semiconductor lighting.

[0003] During continuous operation, spectral lighting devices accumulate internal heat, leading to an increased failure rate. To improve heat dissipation, fans are typically used to accelerate airflow within the device. However, the airflow from the fan is diffused, resulting in poor heat dissipation for lighting devices where heat is concentrated. Utility Model Content

[0004] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0005] Therefore, the technical solution adopted by this utility model is as follows:

[0006] An LED continuous spectrum lighting device includes a heat dissipation mechanism, a negative suction mechanism, and a temperature difference mechanism. The heat dissipation mechanism includes a device body, an air inlet channel penetrating one side wall of the device body, and a heat dissipation vent at the top of the device body. The negative suction mechanism includes a housing first connected to the top of the device body, a housing second fastened to one side of the housing first, a bending cavity first disposed inside the housing first, and a bending cavity second disposed inside the housing second. The interior of the device body communicates with the interior of the housing first through the heat dissipation vent. The temperature difference mechanism includes a cooling plate penetrating the top of the housing first, a metal plate connecting the housing first and the housing second, a heat transfer pipe disposed at the top of the device body, and a fan disposed in front of the cooling plate and fixedly connected to the top of the housing first.

[0007] By adopting the above technical solution, when a large amount of heat accumulates inside the main body of the device, the internal temperature of the first bending cavity is lower than that of the main body of the device due to its distance from the main body, thus forming a high-pressure zone. Correspondingly, the second bending cavity is close to the main body of the device, and its internal temperature is higher than that of the first bending cavity through heat conduction, thus forming a low-pressure zone. The "chimney effect" formed by this temperature difference causes the heat inside the main body of the device to flow quickly through the heat dissipation port, the first bending cavity and the second bending cavity, and finally be discharged from the top of the second shell, thus achieving rapid cooling.

[0008] In a preferred embodiment, the present invention can be further configured such that: the bending cavity is located away from the top of the device body, the cooling surface of the cooling chip is located inside the bending cavity, and the hot surface of the cooling chip is located at the top of the housing.

[0009] In a preferred embodiment, the present invention can be further configured such that: the second bending cavity is located near the top of the main body of the device, and the metal sheet is disposed inside the second bending cavity.

[0010] In a preferred embodiment, the present invention can be further configured such that the heat transfer tube consists of a tube body and two square covers, the two square covers being respectively fitted onto both ends of the tube body, and the two square covers being respectively located on the rear side of the hot surface of the cooling plate and the rear side of the metal plate.

[0011] In a preferred embodiment, the present invention can be further configured such that: two sleeves are fitted on the outer side of the tube body, the two sleeves are symmetrical about the horizontal center plane of the tube body, and the sleeves are connected between shell one and shell two.

[0012] In a preferred embodiment, the present invention can be further configured such that the device body, the cooling chip, and the fan are connected in series, and the device body is electrically connected to an external power supply.

[0013] In a preferred embodiment, the present invention can be further configured such that a filter element is embedded on one side of the air intake channel.

[0014] By adopting the above technical solution, the beneficial effects achieved by this utility model are as follows:

[0015] 1. In this utility model, when a large amount of heat accumulates inside the main body of the device, since the first bending cavity is far away from the main body of the device, its internal temperature is lower than that of the main body of the device, thus forming a high-pressure zone. Correspondingly, the second bending cavity is close to the main body of the device, and through heat conduction, its internal temperature is higher than that of the first bending cavity, thus forming a low-pressure zone. The "chimney effect" formed by this temperature difference causes the heat inside the main body of the device to flow quickly through the heat dissipation port, the first bending cavity and the second bending cavity, and finally be discharged from the top of the second shell, thus achieving rapid cooling.

[0016] 2. In this utility model, during the heat dissipation process, the cooling surface of the cooling chip further enhances the low-temperature effect in the bending cavity one through the metal sheet. At the same time, the fan blows the high-temperature airflow from the hot surface of the cooling chip into the heat transfer tube. This high-temperature airflow heats the metal sheet, causing the metal sheet to heat up and heat the bending cavity two. This further strengthens the temperature difference between the bending cavity two and the bending cavity one, enhances the low-pressure effect, and thus effectively improves the suction force of hot air in the main body of the device, significantly improving the overall heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is a perspective view of the overall structure of this utility model;

[0018] Figure 2 This is a rear view of the overall structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the heat dissipation mechanism of this utility model;

[0020] Figure 4 This is a schematic diagram of the negative suction mechanism of this utility model;

[0021] Figure 5 This is a top view of the disassembled shell 1 and shell 2 of this utility model;

[0022] Figure 6 This is a schematic diagram of the temperature difference mechanism of this utility model;

[0023] Figure 7 This is a schematic diagram showing the connection relationship between the heat transfer tube and the sleeve of this utility model.

[0024] Figure label:

[0025] 100. Heat dissipation mechanism; 110. Main body of the device; 120. Air intake channel; 130. Heat dissipation vent;

[0026] 200. Negative suction mechanism; 210. Housing 1; 220. Housing 2; 230. Bending cavity 1; 240. Bending cavity 2;

[0027] 300. Temperature difference mechanism; 310. Cooling element; 320. Metal sheet; 330. Heat transfer tube; 331. Tube body; 332. Square cover; 340. Fan;

[0028] 400. Hoop;

[0029] 500, filter element. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0031] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0032] The following describes, with reference to the accompanying drawings, some embodiments of an LED continuous spectrum lighting device provided by this utility model.

[0033] Example 1:

[0034] Combination Figure 1-7 As shown, the present invention provides an LED continuous spectrum lighting device, including a heat dissipation mechanism 100, a negative suction mechanism 200 and a temperature difference mechanism 300. The heat dissipation mechanism 100 includes a device body 110, an air inlet channel 120 penetrating through one side wall of the device body 110, and a heat dissipation port 130 opened at the top of the device body 110.

[0035] The negative suction mechanism 200 includes a housing 210 connected to the top of the main body 110 of the device, a housing 220 fastened to one side of the housing 210, a bending cavity 230 disposed inside the housing 210, and a bending cavity 240 disposed inside the housing 220. The interior of the main body 110 is connected to the interior of the housing 210 through a heat dissipation vent 130.

[0036] The temperature difference mechanism 300 includes a cooling chip 310 passing through the top of the housing 1 210, a metal sheet 320 connecting the housing 1 210 and the housing 2 220, a heat transfer pipe 330 disposed on the top of the device body 110, and a fan 340 disposed on the front side of the cooling chip 310 and fixed to the top of the housing 1 210.

[0037] Furthermore, the bending cavity 230 is located away from the top of the main body 110, the cooling surface of the cooling chip 310 is located inside the bending cavity 230, and the hot surface of the cooling chip 310 is located at the top of the housing 210. The positional design of the bending cavity 230 can reduce the influence of the internal temperature of the main body 110 on the bending cavity 230 under heat conduction, ensuring that a significant low temperature is formed inside the bending cavity 230, so that the high-pressure environment can be successfully formed.

[0038] Furthermore, the second bending cavity 240 is located near the top of the main body 110 of the device, and the metal sheet 320 is located inside the second bending cavity 240. The position design of the second bending cavity 240 can fully receive the heat transferred from the main body 110 of the device, making its temperature much higher than the temperature inside the first bending cavity 230, thereby forming a low-pressure environment.

[0039] Furthermore, the main body 110, the cooling chip 310, and the fan 340 are connected in series, and the main body 110 is electrically connected to an external power supply. This series connection method makes the device more convenient to use.

[0040] Furthermore, a filter element 500 is embedded on one side of the air intake channel 120. The filter element 500 can filter the air entering the air intake channel 120, prevent dust from adhering to the inside of the device body 110, and maintain the illumination of the device body 110.

[0041] Example 2:

[0042] Combination Figure 1 , 2 and Figure 6As shown, based on Embodiment 1, the heat transfer tube 330 is composed of a tube body 331 and two square covers 332. The two square covers 332 are respectively sleeved on both ends of the tube body 331. The two square covers 332 are respectively located on the rear side of the hot surface of the cooling chip 310 and the rear side of the metal sheet 320. The structural design of the heat transfer tube 330 can improve the temperature absorption rate of the hot surface of the cooling chip 310, and at the same time, it can evenly apply the absorbed heat to the metal sheet 320, so that the metal sheet 320 can be heated up quickly and then the bending cavity 240 is heated.

[0043] Example 3:

[0044] Combination Figure 2 and Figure 6 As shown, in the above embodiment, two sleeves 400 are sleeved on the outside of the tube body 331. The two sleeves 400 are symmetrical about the horizontal center plane of the tube body 331. The sleeves 400 are connected between the first shell 210 and the second shell 220. The sleeves 400 can strengthen the heat transfer tube 330 on the one hand, and improve the connection between the first shell 210 and the second shell 220 on the other hand.

[0045] Working principle and usage process of this utility model:

[0046] When the main body 110 of the device is started, the cooling chip 310 and the fan 340 work synchronously. Due to the heat generated by the LED beads, a large amount of heat will accumulate inside the main body 110. Since the bending cavity 1 230 is far away from the main body 110, its internal temperature is lower than that of the main body 110, thus forming a high-pressure zone. Correspondingly, the bending cavity 240 is close to the main body 110, and through heat conduction, its internal temperature is higher than that of the bending cavity 1 230, forming a low-pressure zone. This temperature difference creates a "chimney effect", which causes the heat inside the main body 110 to flow quickly through the heat dissipation port 130, the bending cavity 1 230 and the bending cavity 240, and finally be discharged from the top of the casing 220, achieving rapid cooling.

[0047] During the heat dissipation process, the cooling surface of the cooling chip 310 further enhances the low-temperature effect within the bending cavity 230 through the metal sheet 320. Simultaneously, the fan 340 blows the high-temperature airflow from the hot surface of the cooling chip 310 into the heat transfer tube 330. This high-temperature airflow heats the metal sheet 320, causing it to heat up and then heat the bending cavity 240. This further strengthens the temperature difference between the bending cavity 240 and the bending cavity 230, enhancing the low-pressure effect and effectively increasing the suction force of hot air within the main body 110 of the device, thus significantly improving the overall heat dissipation effect.

[0048] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An LED continuous spectrum lighting device, characterized in that, include: The heat dissipation mechanism (100) includes a device body (110), an air inlet channel (120) penetrating through one side wall of the device body (110), and a heat dissipation port (130) opened at the top of the device body (110). The negative suction mechanism (200) includes a housing 1 (210) connected to the top of the device body (110), a housing 2 (220) fastened to one side of the housing 1 (210), a bending cavity 1 (230) disposed inside the housing 1 (210), and a bending cavity 2 (240) disposed inside the housing 2 (220). The inside of the device body (110) is connected to the inside of the housing 1 (210) through a heat dissipation vent (130). The temperature difference mechanism (300) includes a cooling plate (310) penetrating the top of the first housing (210), a metal plate (320) connecting the first housing (210) and the second housing (220), a heat transfer tube (330) disposed on the top of the main body (110) of the device, and a fan (340) disposed on the front side of the cooling plate (310) and fixed to the top of the first housing (210).

2. The LED continuous spectrum lighting device according to claim 1, characterized in that, The bending cavity (230) is located away from the top of the main body (110), the cooling surface of the cooling chip (310) is located inside the bending cavity (230), and the hot surface of the cooling chip (310) is located at the top of the housing (210).

3. The LED continuous spectrum lighting device according to claim 1, characterized in that, The second bending cavity (240) is located near the top of the main body (110) of the device, and the metal sheet (320) is located inside the second bending cavity (240).

4. The LED continuous spectrum lighting device according to claim 1, characterized in that, The heat transfer tube (330) consists of a tube body (331) and two square covers (332). The two square covers (332) are respectively fitted onto both ends of the tube body (331) and are respectively located on the rear side of the hot surface of the cooling plate (310) and the rear side of the metal plate (320).

5. The LED continuous spectrum lighting device according to claim 4, characterized in that, Two sleeves (400) are fitted on the outside of the tube body (331). The two sleeves (400) are symmetrical about the horizontal center plane of the tube body (331). The sleeves (400) are connected between the first shell (210) and the second shell (220).

6. The LED continuous spectrum lighting device according to claim 1, characterized in that, The device body (110), the cooling chip (310), and the fan (340) are connected in series, and the device body (110) is electrically connected to an external power supply.

7. The LED continuous spectrum lighting device according to claim 1, characterized in that, A filter element (500) is embedded on one side of the air intake channel (120).

Images