A heat dissipation device for hot melt adhesive coating
By designing an adjustable cooling fan position on the hot melt adhesive coating device, the problem of uneven heat dissipation was solved, enabling the hot melt adhesive to be coated within a suitable temperature range, thus improving coating quality and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LI SHIZHEN GREAT HEALTH TECH (QICHUN) CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-05-26
AI Technical Summary
The existing heat dissipation device cannot adjust the position of the cooling fan according to the specific location of the product and the coating situation, resulting in insufficient heat dissipation in some areas and affecting the coating quality.
A device comprising a support plate, a guide frame, a mounting plate, and a cooling fan was designed. The position of the cooling fan is adjusted by connecting frame and guide plate. A 3×3 matrix layout is adopted to distribute airflow evenly and ensure optimal heat dissipation.
It enables flexible adjustment of the cooling fan position according to the product location and coating conditions, ensuring that the hot melt adhesive is coated within the appropriate temperature range, thereby improving coating quality and equipment stability.
Smart Images

Figure CN224285120U_ABST