An ultra-thin VC heat spreader

Abstract

This invention provides an ultra-thin vapor chamber (VC) heat exchanger, comprising a lower VC cover and an upper VC cover disposed on the lower VC cover. The upper VC cover is zigzag-shaped, and several spaced-apart vapor chambers are provided between the upper and lower VC covers. The key feature is the presence of a metal foil capillary structure between the upper and lower VC covers. The lower part of the metal foil capillary structure is attached to the lower VC cover, and the upper part is attached to a portion of the upper VC cover. The metal foil capillary structure includes a metal foil and through-holes and arrayed evaporation reflux holes on the metal foil. A perforated support structure is provided on the metal foil, and the perforated support structure and evaporation reflux holes are alternately arranged. This invention utilizes a metal foil capillary structure, which is thinner than a copper mesh, facilitating the development of ultra-thin VCs. Furthermore, the metal foil capillary structure exhibits better capillary force than traditional copper mesh, enabling the VC to achieve greater heat dissipation power. Simultaneously, the metal foil capillary structure is less expensive than traditional copper mesh.

Description

Technical Field

[0001] This utility model belongs to the technical field of heat exchange plates, specifically relating to an ultra-thin VC heat exchange plate. Background Technology

[0002] A vapor chamber, typically made of copper, is a steam chamber with a finely structured inner wall. When heat is conducted from the heat source to the evaporation zone, the coolant in the chamber begins to vaporize in the low-vacuum environment. At this point, it absorbs heat energy and expands rapidly, quickly filling the entire chamber with the gaseous cooling medium. When the gaseous working fluid comes into contact with a relatively cool area, condensation occurs, releasing the heat accumulated during evaporation. The condensed coolant then returns to the evaporation heat source through the capillary channels of the microstructure. This process repeats continuously within the chamber.

[0003] For existing heat spreaders, the result is... Figure 1 As shown, it specifically includes a lower VC cover 1 and an upper VC cover 2 set on the lower VC cover 1. The upper VC cover 2 is zigzag-shaped, and a copper mesh 3 is provided between the upper VC cover 2 and the lower VC cover 1. Several spaced steam chambers 4 are provided between the lower VC cover 1 and the upper VC cover 2. The capillary return water performance is achieved through the copper mesh 3. However, since the existing technology generally uses copper mesh of 150 mesh to 400 mesh, the thickness of the copper mesh is generally 50um, which occupies a relatively large air chamber space, thus affecting the steam transmission performance. Furthermore, due to the warp and weft weave structure of the copper mesh, there is a U-shaped opening, resulting in a large hydraulic radius and relatively poor capillary performance, which affects the return water of the VC and thus affects the maximum heat dissipation power of the VC. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides an ultra-thin VC heat spreader plate to solve the problems in the background art.

[0005] This utility model provides the following technical solution: an ultra-thin VC heat spreader, the ultra-thin VC heat spreader including a VC lower cover and a VC upper cover disposed on the VC lower cover, the VC upper cover being zigzagly disposed and a plurality of spaced vapor chambers being provided between the VC upper cover and the VC lower cover, a metal foil capillary structure being provided between the VC upper cover and the VC lower cover, the lower part of the metal foil capillary structure being attached to the VC lower cover, the upper part of the metal foil capillary structure being attached to a portion of the VC upper cover, the metal foil capillary structure including a metal foil and evaporation reflux holes that are through and arrayed on the metal foil, a hollow support structure being provided on the metal foil, the hollow support structure being staggered with the evaporation reflux holes.

[0006] Compared with the prior art, the beneficial effects of this application are as follows: This application adopts a metal foil capillary structure, which is thinner than copper mesh, making it easier to develop ultra-thin VCs. Moreover, the metal foil capillary structure has better capillary force than traditional copper mesh, which is conducive to the VC to achieve greater heat dissipation power. At the same time, the metal foil capillary structure is less expensive than traditional copper mesh.

[0007] Preferably, the metal foil is one or more of copper foil, stainless steel foil, and titanium alloy foil.

[0008] Preferably, the thickness of the metal foil is 5µm-40µm.

[0009] Preferably, the diameter of the evaporation reflux orifice is 5um-100um, and the orifice spacing is 50um-1mm.

[0010] Preferably, the hollow support structure is a column point, and the column point is staggered with the evaporation reflux hole.

[0011] Preferably, the height of the support point is 3um-35um, and the spacing between the support points is 50um-1mm.

[0012] Preferably, the hollow support structure is a microgroove, with adjacent microgrooves staggered and the microgrooves staggered with the evaporation reflux holes.

[0013] Preferably, microgrooves are provided between the microgrooves.

[0014] Preferably, the depth of the microgroove is 3um-35um, and the width of the microgroove is 10um-1mm. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural diagram of a VC heat spreader provided in the prior art;

[0017] Figure 2 A structural diagram of the ultra-thin VC heat spreader provided in an embodiment of this utility model;

[0018] Figure 3 A structural diagram of the capillary structure of the metal foil provided in this embodiment of the utility model;

[0019] Figure 4A cross-sectional view of the capillary structure of the metal foil provided in an embodiment of this utility model;

[0020] Figure 5 A structural diagram of the capillary structure of the metal foil provided in another embodiment of this utility model;

[0021] Figure 6 A cross-sectional view of the capillary structure of the metal foil provided in another embodiment of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023]

[0024] The present invention will be further described below with reference to the accompanying drawings and description. Detailed Implementation

[0025] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0026] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0029] In one embodiment of this utility model, such as Figure 2 As shown, an ultra-thin VC heat spreader includes a VC lower cover 1 and a VC upper cover 2 disposed on the VC lower cover 1. The VC upper cover 2 is zigzag-shaped, and a plurality of spaced-apart vapor chambers 4 are provided between the VC upper cover 2 and the VC lower cover 1. A metal foil capillary structure 5 is provided between the VC upper cover 2 and the VC lower cover 1. The lower part of the metal foil capillary structure 5 is attached to the VC lower cover 1, and the upper part of the metal foil capillary structure 5 is attached to a portion of the VC upper cover 2. The metal foil capillary structure 5 includes a metal foil 51 and evaporation reflux holes 52 that are through and arrayed on the metal foil 51. A hollow support structure is provided on the metal foil 51, and the hollow support structure and the evaporation reflux holes 52 are staggered.

[0030] Specifically, in this application, the lower cover 1 of VC, the upper cover 2 of VC, and the steam chamber 4 are all common configurations of heat spreaders in the prior art, and therefore will not be described in detail.

[0031] Meanwhile, this application uses a metal foil capillary structure 5 to replace the copper mesh 3 in the traditional heat spreader. Since the VC upper cover 2 is zigzag, the metal foil capillary structure 5 located between the VC upper cover 2 and the VC lower cover 1 is attached to the VC lower cover 1 at the bottom and to a portion of the VC upper cover 2 at the top. The metal foil capillary structure 5 includes a metal foil 51 and evaporation reflux holes 52 disposed on the metal foil 51. The evaporation reflux holes 52 are arrayed on the metal foil 51, and their arrangement can be square or triangular. The evaporation reflux holes 52 can be prepared by etching. The evaporation reflux holes 52 serve as the inlet and outlet for water evaporation and condensation. Furthermore, a hollow support structure is provided on the metal foil 51. The hollow support structure is staggered with the evaporation reflux holes 52, which can improve capillary performance and occupy less gas cavity.

[0032] In this embodiment, the metal foil 51 is one or more of copper foil, stainless steel foil, and titanium alloy foil;

[0033] Specifically, in another embodiment of the present invention, hydrophilic treatment can be performed on the surface of the metal foil to further increase capillary force. The hydrophilic treatment methods include chemical or physical roughening treatment, deposition of hydrophilic particles, and plating of a hydrophilic layer.

[0034] In this embodiment, the thickness of the metal foil 51 is 5um-40um.

[0035] In this embodiment, the diameter of the evaporation reflux hole 52 is 5um-100um, and the hole spacing of the evaporation reflux hole 52 is 50um-1mm.

[0036] like Figure 3 , 4 As shown, in this embodiment, the hollow support structure is a column point 53, and the column point 53 and the evaporation reflux hole 52 are staggered.

[0037] Specifically, the pillar points 53 can be prepared by a semi-etching method, thereby forming a number of pillar points 53 in an array on the side of the metal foil 51 near the VC lower cover 1. The pillar points 53 can improve capillary performance, reduce the hydraulic radius and enhance capillary force, while making the capillary structure of the metal foil thinner and occupying a smaller air cavity.

[0038] In this embodiment, the height of the pillar point 53 is 3um-35um, and the spacing between the pillar points 53 is 50um-1mm.

[0039] like Figure 5 , 6 As shown, in another embodiment of the present invention, the hollow support structure is a microgroove 54, and two adjacent microgrooves 54 are staggered, and the microgrooves 54 are staggered with the evaporation reflux holes 52;

[0040] Specifically, the microgrooves 54 can be prepared by a semi-etching method, and the microgrooves 54 can further reduce the hydraulic radius and enhance capillary force.

[0041] In another embodiment of the present invention, microgroove breakpoints 55 are provided between the microgrooves 54;

[0042] Specifically, the micro-groove breakpoint 55 is designed to separate the micro-grooves 54, thereby facilitating the exchange of waterways between the grooves. At the same time, the micro-grooves 54 are also staggered, so that the micro-groove breakpoints 55 are also staggered, which can improve the exchange capacity of the waterways within the grooves.

[0043] In another embodiment of the present invention, the depth of the microgroove 54 is 3um-35um, and the width of the microgroove 54 is 10um-1mm.

[0044] In summary, the ultra-thin VC heat spreader in the above embodiments of this utility model adopts a metal foil capillary structure 5, which is thinner than copper mesh, making it easier to develop ultra-thin VC. Moreover, the metal foil capillary structure 5 has better capillary force than the traditional copper mesh 3, which is conducive to the VC achieving greater heat dissipation power. At the same time, the metal foil capillary structure 5 is less expensive than the traditional copper mesh.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An ultra-thin VC heat spreader, the ultra-thin VC heat spreader comprising a VC lower cover and a VC upper cover disposed on the VC lower cover, the VC upper cover being zigzag-shaped and a plurality of spaced-apart steam chambers being provided between the zigzag-shaped VC upper cover and the VC lower cover, characterized in that, A metal foil capillary structure is provided between the upper VC cover and the lower VC cover. The lower part of the metal foil capillary structure is attached to the lower VC cover, and the upper part of the metal foil capillary structure is attached to a portion of the upper VC cover. The metal foil capillary structure includes a metal foil and evaporation reflux holes that are distributed in an array on the metal foil. A hollow support structure is provided on the metal foil, and the hollow support structure and the evaporation reflux holes are arranged alternately.

2. The ultra-thin VC heat spreader according to claim 1, characterized in that, The metal foil is one or more of copper foil, stainless steel foil, and titanium alloy foil.

3. The ultra-thin VC heat spreader according to claim 1, characterized in that, The thickness of the metal foil is 5um-40um.

4. The ultra-thin VC heat spreader according to claim 1, characterized in that, The diameter of the evaporation reflux orifice is 5um-100um, and the orifice spacing is 50um-1mm.

5. The ultra-thin VC heat spreader according to claim 1, characterized in that, The hollow support structure serves as a column point, and the column points are staggered with the evaporation reflux holes.

6. The ultra-thin VC heat spreader according to claim 5, characterized in that, The height of the support point is 3um-35um, and the spacing between the support points is 50um-1mm.

7. The ultra-thin VC heat spreader according to claim 1, characterized in that, The hollow support structure is a microgroove, with adjacent microgrooves staggered and the microgrooves staggered with the evaporation reflux holes.

8. The ultra-thin VC heat spreader according to claim 7, characterized in that, Microgrooves are provided between the microgrooves.

9. The ultra-thin VC heat spreader according to claim 7, characterized in that, The depth of the microgroove is 3um-35um, and the width of the microgroove is 10um-1mm.

Images