membrane

Abstract

This utility model discloses a diaphragm, comprising: a flattened region and a thinned region connected together. The flattened region includes a first adhesive layer, a first support layer, a second adhesive layer, a second support layer, and a third adhesive layer arranged in sequence. The thinned region includes a fourth adhesive layer, a third support layer, a fifth adhesive layer, a fourth support layer, and a sixth adhesive layer arranged in sequence. The fourth adhesive layer, the third support layer, the fifth adhesive layer, the fourth support layer, and the sixth adhesive layer are respectively connected to the first adhesive layer, the first support layer, the second adhesive layer, the second support layer, and the third adhesive layer. The thickness of the fifth adhesive layer is less than that of the second adhesive layer, resulting in the thickness of the thinned region being less than that of the flattened region. By reducing the thickness of the fifth adhesive layer, it is made to be less than the thickness of the second adhesive layer connected to it, thereby making the thickness of the thinned region less than that of the flattened region after the diaphragm is formed. In use, the thinned region corresponds to the fingerprint area of ​​a mobile phone, which can reduce conduction resistance and make conduction faster and more sensitive.

Description

Technical Field

[0001] This utility model relates to the field of membrane technology, specifically to a membrane sheet. Background Technology

[0002] Screen protectors are used in many electronic products, such as mobile phones. They are applied to the surface of the phone to protect it. Current mobile phones can be unlocked by fingerprint, such as optical fingerprint unlock and ultrasonic fingerprint unlock. When a regular screen protector is applied to the phone screen, it will cover the fingerprint recognition area. If the thickness of the screen protector is too large, it will cause the fingerprint recognition to be insensitive. Utility Model Content

[0003] In view of the shortcomings of the existing technology, this utility model provides a diaphragm.

[0004] The present invention discloses a diaphragm comprising: a flattening region and a thinning region connected together; the flattening region comprising a first adhesive layer, a first support layer, a second adhesive layer, a second support layer and a third adhesive layer arranged in sequence; the thinning region comprising a fourth adhesive layer, a third support layer, a fifth adhesive layer, a fourth support layer and a sixth adhesive layer arranged in sequence, the fourth adhesive layer, the third support layer, the fifth adhesive layer, the fourth support layer and the sixth adhesive layer being respectively connected to the first adhesive layer, the first support layer, the second adhesive layer, the second support layer and the third adhesive layer; wherein, the thickness of the fifth adhesive layer is less than that of the second adhesive layer, such that the thickness of the thinning region is less than that of the flattening region.

[0005] According to one embodiment of the present invention, the thickness of the first adhesive layer and / or the fourth adhesive layer is 50-75 μm.

[0006] According to one embodiment of the present invention, the thickness of the first support layer and / or the third support layer is 25-36 μm.

[0007] According to one embodiment of the present invention, the thickness of the second adhesive layer is 200-250 μm, and the thickness of the fifth adhesive layer is 100-150 μm.

[0008] According to one embodiment of the present invention, the thickness of the second support layer and / or the fourth support layer is 25-36 μm.

[0009] According to one embodiment of the present invention, the thickness of the third adhesive layer and / or the sixth adhesive layer is 25-40 μm.

[0010] According to one embodiment of the present invention, the first adhesive layer, the second adhesive layer, the third adhesive layer, the fourth adhesive layer, the fifth adhesive layer and the sixth adhesive layer are all made of pressure-sensitive adhesive material.

[0011] According to one embodiment of the present invention, the first support layer, the second support layer, the third support layer and the fourth support layer are all made of PET, PMMA, TAC, PC, PI, PP or PS materials.

[0012] According to one embodiment of the present invention, it further includes a first protective layer, which is disposed on one side of the first adhesive layer and the fourth adhesive layer, or the first protective layer is disposed on one side of the third adhesive layer and the sixth adhesive layer.

[0013] According to one embodiment of the present invention, a second protective layer is further included, wherein one of the first protective layer or the second protective layer is disposed on one side of the first adhesive layer and the fourth adhesive layer, and the other of the first protective layer or the second protective layer is disposed on one side of the third adhesive layer and the sixth adhesive layer.

[0014] The beneficial effect of this invention is that by reducing the thickness of the fifth adhesive layer, the thickness of the fifth adhesive layer is less than the thickness of the second adhesive layer connected to it, thereby making the thickness of the thinned area less than that of the flat area after the film is formed; in use, the thinned area corresponds to the fingerprint area of ​​the mobile phone, which can reduce the conduction resistance and make the conduction faster and more sensitive. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a front view of the diaphragm;

[0017] Figure 2 This is a schematic cross-sectional view of the diaphragm;

[0018] Figure 3 This is another schematic cross-sectional view of the diaphragm.

[0019] Explanation of reference numerals in the attached figures

[0020] 1. Leveling area; 11. First adhesive layer; 12. First support layer; 13. Second adhesive layer; 14. Second support layer; 15. Third adhesive layer;

[0021] 2. Thinning zone; 21. Fourth adhesive layer; 22. Third support layer; 23. Fifth adhesive layer; 24. Fourth support layer; 25. Sixth adhesive layer;

[0022] 3. First protective layer;

[0023] 4. Second protective layer. Detailed Implementation

[0024] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0025] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0026] Example 1

[0027] like Figures 1-3 As shown, Figure 1 This is a front view of the diaphragm; Figure 2 This is a schematic cross-sectional view of the diaphragm; Figure 3 This is another cross-sectional view of the membrane. The membrane includes a flattening area 1 and a thinning area 2, which are connected. Taking a mobile phone as an example, when in use, the flattening area 1 is located on the surface of the phone screen, and the thinning area 2 is located on the surface of the fingerprint unlocking area of ​​the phone. The user presses the position of the thinning area 2, which is simultaneously sensed by the fingerprint unlocking area of ​​the phone, thereby unlocking the phone.

[0028] The flattening area 1 includes a first adhesive layer 11, a first support layer 12, a second adhesive layer 13, a second support layer 14, and a third adhesive layer 15. The first adhesive layer 11, the first support layer 12, the second adhesive layer 13, the second support layer 14, and the third adhesive layer 15 are stacked in sequence. The first support layer 12 and the second support layer 14 both serve a supporting function so that the first adhesive layer 11, the second adhesive layer 13, and the third adhesive layer 15 can better adhere and form.

[0029] Specifically, the thickness of the first adhesive layer 11 is 50-75 μm. The first adhesive layer 11 is made of existing pressure-sensitive adhesive materials, such as materials with model numbers KN7050 or KN7075 produced by Jia Yun New Materials Co., Ltd.

[0030] The thickness of the first support layer 12 is 25-36 μm. The first support layer 12 is made of existing materials such as PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), TAC (cellulose triacetate), PC (polycarbonate), PI (polyimide), PP (polypropylene) or PS (polystyrene).

[0031] The thickness of the second adhesive layer 13 is 200-250μm; the second adhesive layer 13 is made of existing pressure-sensitive adhesive materials, such as the material of model KNGD produced by Jia Yun New Materials Co., Ltd.

[0032] The thickness of the second support layer 14 is 25-36 μm, and the first support layer 12 is made of existing PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), TAC (cellulose triacetate), PC (polycarbonate), PI (polyimide), PP (polypropylene) or PS (polystyrene) materials.

[0033] The thickness of the third adhesive layer 15 is 25-40μm. The third adhesive layer 15 is made of existing pressure-sensitive adhesive materials, such as the material with model number KNOM produced by Jia Yun New Materials Co., Ltd.

[0034] In this embodiment, the thickness of the first adhesive layer 11 is 50 μm, the thickness of the first support layer 12 is 25 μm, the thickness of the second adhesive layer 13 is 200 μm, the thickness of the second support layer 14 is 25 μm, and the thickness of the third adhesive layer 15 is 25 μm.

[0035] The thinning zone 2 includes a fourth adhesive layer 21, a third support layer 22, a fifth adhesive layer 23, a fourth support layer 24, and a sixth adhesive layer 25. The fourth adhesive layer 21, the third support layer 22, the fifth adhesive layer 23, the fourth support layer 24, and the sixth adhesive layer 25 are stacked sequentially. The fourth adhesive layer 21 is connected to the first adhesive layer 11, the third support layer 22 is connected to the first support layer 12, the fifth adhesive layer 23 is connected to the second adhesive layer 13, the fourth support layer 24 is connected to the second support layer 14, and the sixth adhesive layer 25 is connected to the third adhesive layer 15. The thickness of the fifth adhesive layer 23 is less than the thickness of the third adhesive layer 15, thereby achieving the effect that the overall thickness of the thinning zone 2 is less than that of the flattening zone 1.

[0036] Specifically, the thickness and material of the fourth adhesive layer 21 are the same as those of the first adhesive layer 11; the thickness and material of the third support layer 22 are the same as those of the first support layer 12; the material of the fifth adhesive layer 23 is the same as that of the third adhesive layer 15; the thickness of the fifth adhesive layer 23 is 100-150 μm; in this embodiment, the thickness of the fifth adhesive layer 23 is 100 μm; the thickness and material of the fourth support layer 24 are the same as those of the second support layer 14; and the thickness and material of the sixth adhesive layer 25 are the same as those of the third adhesive layer 15.

[0037] During production, the first adhesive layer 11 and the fourth adhesive layer 21 are integrally molded, the first support layer 12 and the third support layer 22 are integrally molded, the second support layer 14 and the fourth support layer 24 are integrally molded, and the third adhesive layer 15 and the sixth adhesive layer 25 are integrally molded. The second adhesive layer 13 and the fifth adhesive layer 23 can also be integrally molded, but since the fifth adhesive layer 23 needs to be thinned, additional thinning treatment is required for the fifth adhesive layer 23 within the thinning area 2; of course, other existing manufacturing methods can also be used, as long as the thickness of the fifth adhesive layer 23 is less than the thickness of the second adhesive layer 13.

[0038] Furthermore, the film also includes a first protective layer 3, which is disposed on the side of the first adhesive layer 11 away from the first support layer 12. Simultaneously, the first protective layer 3 is also located on the side of the fourth adhesive layer 21 away from the third support layer 22. The first protective layer 3 protects both the first adhesive layer 11 and the fourth adhesive layer 21. Specifically, the first protective layer 3 is a standard release film product, requiring it to be peeled off before use.

[0039] Furthermore, the film also includes a second protective layer 4, which is disposed on the side of the third adhesive layer 15 away from the second support layer 14. Simultaneously, the second protective layer 4 is also located on the side of the sixth adhesive layer 25 away from the fourth support layer 24. The second protective layer 4 protects both the third adhesive layer 15 and the sixth adhesive layer 25. Specifically, the second protective layer 4 is a standard release film product, and it needs to be peeled off during use.

[0040] In practical applications, the positions of the first protective layer 3 and the second protective layer 4 can be interchanged without changing the function of the two layers.

[0041] In summary, by reducing the thickness of the fifth adhesive layer 23, the thickness of the fifth adhesive layer 23 is made smaller than the thickness of the second adhesive layer 13 connected to it, thereby making the thickness of the thinned area 2 after the film is formed smaller than that of the flat area 1. In use, the thinned area 2 corresponds to the fingerprint area of ​​the mobile phone, which can reduce the conduction resistance and make the conduction faster and more sensitive.

[0042] Example 2

[0043] The difference between this embodiment and Embodiment 1 is that the thickness of the first adhesive layer 11 is 60 μm, the thickness of the first support layer 12 is 30 μm, the thickness of the second adhesive layer 13 is 220 μm, the thickness of the second support layer 14 is 30 μm, the thickness of the third adhesive layer 15 is 30 μm, and the thickness of the fifth adhesive layer 23 is 110 μm.

[0044] Example 3

[0045] The difference between this embodiment and Embodiment 1 is that the thickness of the first adhesive layer 11 is 70 μm, the thickness of the first support layer 12 is 33 μm, the thickness of the second adhesive layer 13 is 230 μm, the thickness of the second support layer 14 is 33 μm, the thickness of the third adhesive layer 15 is 35 μm, and the thickness of the fifth adhesive layer 23 is 130 μm.

[0046] Example 4

[0047] The difference between this embodiment and Embodiment 1 is that the thickness of the first adhesive layer 11 is 75 μm, the thickness of the first support layer 12 is 36 μm, the thickness of the second adhesive layer 13 is 250 μm, the thickness of the second support layer 14 is 36 μm, the thickness of the third adhesive layer 15 is 40 μm, and the thickness of the fifth adhesive layer 23 is 150 μm.

[0048] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A diaphragm, characterized in that, include: The flattening area (1) and the thinning area (2) are connected. The flattening area (1) includes a first adhesive layer (11), a first support layer (12), a second adhesive layer (13), a second support layer (14), and a third adhesive layer (15) arranged in sequence. The thinning area (2) includes a fourth adhesive layer (21), a third support layer (22), a fifth adhesive layer (23), a fourth support layer (24), and a sixth adhesive layer (25) arranged in sequence. The fourth adhesive layer (21), the third support layer (22), the fifth adhesive layer (23), the fourth support layer (24), and the sixth adhesive layer (25) are connected to the first adhesive layer (11), the first support layer (12), the second adhesive layer (13), the second support layer (14), and the third adhesive layer (15), respectively. The thickness of the fifth adhesive layer (23) is less than that of the second adhesive layer (13), so that the thickness of the thinning area (2) is less than that of the flattening area (1).

2. The diaphragm according to claim 1, characterized in that, The thickness of the first adhesive layer (11) and / or the fourth adhesive layer (21) is 50-75 μm.

3. The diaphragm according to claim 1, characterized in that, The thickness of the first support layer (12) and / or the third support layer (22) is 25-36 μm.

4. The diaphragm according to claim 1, characterized in that, The thickness of the second adhesive layer (13) is 200-250 μm, and the thickness of the fifth adhesive layer (23) is 100-150 μm.

5. The diaphragm according to claim 1, characterized in that, The thickness of the second support layer (14) and / or the fourth support layer (24) is 25-36 μm.

6. The diaphragm according to claim 1, characterized in that, The thickness of the third adhesive layer (15) and / or the sixth adhesive layer (25) is 25-40 μm.

7. The diaphragm according to any one of claims 1-6, characterized in that, The first adhesive layer (11), the second adhesive layer (13), the third adhesive layer (15), the fourth adhesive layer (21), the fifth adhesive layer (23) and the sixth adhesive layer (25) are all made of pressure-sensitive adhesive material.

8. The diaphragm according to any one of claims 1-6, characterized in that, The first support layer (12), the second support layer (14), the third support layer (22) and the fourth support layer (24) are all made of PET, PMMA, TAC, PC, PI, PP or PS materials.

9. The diaphragm according to any one of claims 1-6, characterized in that, It also includes a first protective layer (3), which is disposed on one side of the first adhesive layer (11) and the fourth adhesive layer (21), or the first protective layer (3) is disposed on one side of the third adhesive layer (15) and the sixth adhesive layer (25).

10. The diaphragm according to claim 9, characterized in that, It also includes a second protective layer (4), one of the first protective layer (3) or the second protective layer (4) is disposed on one side of the first adhesive layer (11) and the fourth adhesive layer (21), and the other of the first protective layer (3) or the second protective layer (4) is disposed on one side of the third adhesive layer (15) and the sixth adhesive layer (25).

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