A thermal resistance testing system for electronic packaged devices

Abstract

This utility model relates to a thermal resistance testing system for electronic packaged devices, including an optical platform with a stage on the platform. An adjustable probe assembly, an imaging system, and a fixing mechanism are arranged around the stage. The adjustable probe assembly consists of a position adjustment mechanism and probe stages. The position adjustment mechanism includes symmetrically arranged longitudinal slide rails, a transverse guide plate sliding on the longitudinal slide rails, and a transverse slide plate sliding on the transverse guide plate. Two sets of probe stages are mounted on the transverse slide plate. The imaging system includes a microscope adjustment frame, on which a CCD camera assembly and a display screen are mounted. This utility model enables circuit connections for electronic packaged devices of different packaging forms and sizes, especially for electronic packaged devices with a small number of pins, avoiding multiple soldering of the device pins and improving both testing efficiency and thermal resistance testing efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of electronic packaging device technology, and relates to an electronic packaging device thermal resistance testing system. Background Technology

[0002] The heat dissipation performance of electronically packaged devices is a crucial aspect of the thermal reliability design of electronic products. To ensure better thermal management at the user end, accurate measurement of the thermal characteristics of electronically packaged devices is necessary. For typical electronically packaged devices, thermal performance is primarily evaluated through thermal resistance. Based on standards such as GJB548B and JEDEC JESD51 series thermal testing standards, the thermal resistance of commonly used electronically packaged devices is typically defined as R_JX=(T_j-T_x) / P, where R_JX is the junction thermal resistance of the device to a specific environment (unit: °C / W); T_j is the steady-state junction temperature of the device (unit: °C); T_x is the temperature at a specific reference point (unit: °C); and P is the chip power consumption (unit: W). However, traditional thermocouple thermal resistance testing methods require measuring the case temperature of the packaged device, which often makes it difficult to guarantee the accuracy and repeatability of the test results.

[0003] However, this electrical testing method is not suitable for packaged devices with a small number of pins and small pin size, where traditional manual soldering operations cannot meet the testing requirements. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal resistance testing system for electronic packaging devices, which can solve the above-mentioned problems and improve the efficiency of thermal resistance testing.

[0005] According to the technical solution provided by this utility model: a thermal resistance testing system for electronic packaging devices includes an optical platform, a stage on the optical platform, and adjustable probe assemblies, an imaging system, and a fixing mechanism around the stage; the adjustable probe assembly consists of a position adjustment mechanism and probe stations; the position adjustment mechanism includes symmetrically arranged longitudinal slide rails, a transverse guide plate sliding on the longitudinal slide rails, a transverse slide plate sliding on the transverse guide plate, and two sets of probe stations mounted on the transverse slide plate; the imaging system includes a microscope adjustment frame, on which a CCD camera assembly and a display screen are mounted.

[0006] As a further improvement of this utility model, the middle part of the longitudinal slide rail is a longitudinal slide rod, and the two ends of the longitudinal slide rod are installed in the slide rod seat; the optical platform is provided with adjustment screw holes, and the slide rod seat is provided with through holes, which can be used with bolts to adjust the position of the longitudinal slide rail.

[0007] As a further improvement of this utility model, a longitudinal locking bolt is installed on the transverse guide plate, and the longitudinal locking bolt is located above the longitudinal slide bar.

[0008] As a further improvement of this utility model, a transverse locking bolt is installed on the transverse slide plate, and the transverse locking bolt is located above the transverse guide plate.

[0009] As a further improvement of this utility model, limiting blocks are installed at both ends of the transverse guide plate.

[0010] As a further improvement of this utility model, the probe station is a manually adjustable probe station.

[0011] As a further improvement of this utility model, the microscope adjustment frame includes a vertical rod, a display screen is installed on the upper part of the vertical rod, one end of a horizontal rod is connected to the middle of the vertical rod, and a rotating rod is hinged to the other end of the horizontal rod. A CCD camera is installed on the rotating rod, and the CCD camera faces the stage.

[0012] As a further improvement of this utility model, the fixing mechanism adopts a magnetic base, and a pressure block is installed on the moving end of the magnetic base.

[0013] As a further improvement of this invention, the optical platform is magnetic.

[0014] As a further improvement of this utility model, the stage is located at the center of the optical platform.

[0015] The positive and progressive effects of this application are as follows:

[0016] This invention enables circuit connection of electronic packaged devices with different packaging forms and sizes. In particular, it avoids multiple soldering of device pins for electronic packaged devices with a small number of pins, thereby improving testing efficiency and thermal resistance testing efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model.

[0018] Figure 2 This is a top view of the present invention.

[0019] Figure 3 This is a side view of the present invention. Detailed Implementation

[0020] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this utility model described herein. Furthermore, terms such as "comprising" and "having" mean that in addition to those already listed in "comprising" and "having," other unlisted contents may also be included; for example, a process, method, system, product, or device may include a series of steps or units, not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0023] Due to the angle of the drawing, some parts may not be drawn, but their positions and connections can be understood from the text descriptions.

[0024] like Figure 1-2 As shown, this utility model is a thermal resistance testing system for electronic packaging devices, including an optical platform 1, a stage 10 on the optical platform 1, and adjustable probe components, an imaging system, and a fixing mechanism around the stage 10.

[0025] The adjustable probe assembly consists of a position adjustment mechanism and a probe station 3. The position adjustment mechanism includes a symmetrically arranged longitudinal slide rail 2-1, a transverse guide plate 2-2 that slides on the longitudinal slide rail, a transverse slide plate 2-3 that slides on the transverse guide plate 2-2, and two sets of probe stations 3 mounted on the transverse slide plate 2-3.

[0026] The longitudinal slide rail 2-1 has a longitudinal slide rod 2-11 in the middle, and the two ends of the longitudinal slide rod 2-11 are installed in the slide rod seat 2-12. The optical platform 1 is provided with an adjustment screw hole 1-1, and the slide rod seat 2-12 is provided with a through hole. The position of the longitudinal slide rail 2-1 can be adjusted by using bolts.

[0027] In other embodiments, the position adjustment mechanism includes symmetrically arranged longitudinal slide rods 2-11 and longitudinal lead screws, with the outer circumference of the longitudinal lead screws threadedly connected to a threaded seat; one side of the transverse guide plate 2-2 is fixedly connected to the threaded seat, and the other side of the transverse guide plate 2-2 is slidably connected to the longitudinal slide rods 2-11; both ends of the longitudinal slide rods 2-11 and the longitudinal lead screw are installed in slide rod seats 2-12. Rotating the longitudinal lead screw can adjust the position of the transverse guide plate 2-2.

[0028] A longitudinal locking bolt 2-4 is installed on the transverse guide plate 2-2. The longitudinal locking bolt 2-4 is located above the longitudinal slide bar 2-11. Rotating the longitudinal locking bolt 2-4 will cause it to abut against the longitudinal slide bar 2-11, thus locking the transverse guide plate 2-2 to the longitudinal slide bar 2-11. A transverse locking bolt 2-5 is installed on the transverse slide plate 2-3. The transverse locking bolt 2-5 is located above the transverse guide plate 2-2. Rotating the transverse locking bolt 2-5 will cause it to abut against the transverse guide plate 2-2, thus locking the transverse slide plate 2-3 to the transverse guide plate 2-2.

[0029] To prevent the transverse slide plate 2-3 from sliding off the transverse guide plate 2-2, limit blocks 9 are installed at both ends of the transverse guide plate 2-2.

[0030] Probe station 3 is a manually adjustable probe station, which allows manual operation to adjust the position of the probes to achieve electrical connection of the electronic packaged device under test.

[0031] The imaging system includes a microscope adjustment frame 6, on which a CCD camera 7 and a display screen 8 are mounted. Specifically, the microscope adjustment frame 6 includes a vertical rod 6-1, with the display screen 8 mounted on its upper part. A horizontal rod 6-2 is connected to one end of the vertical rod 6-1, and a rotating rod 6-3 is hinged to the other end of the horizontal rod 6-2. The CCD camera 7 is mounted on the rotating rod 6-3, facing the stage 10. The CCD camera 7 can acquire images of the electronic packaged device under test, and the display screen 8 can display these images to assist the probe station 3 in inserting probes into the electronic packaged device under test.

[0032] The microscope adjustment frame 6 is used to adjust the imaging position of the CCD camera 7.

[0033] It should be noted that the microscope adjustment mechanism 6, CCD camera 7 and display 8 form an imaging system, which is suitable for smaller electronic packaging devices and can be used in conjunction with the probe station 3.

[0034] The fixing mechanism is designed to prevent the lightweight electronic device under test (DUT) from slipping during probe station 3 adjustment. It restricts the movement of the DUT. For example... Figure 3As shown, the fixing mechanism uses a magnetic base 5, and a pressure block 4 is installed on the moving end of the magnetic base 5. The optical platform 1 is magnetic. The stage 10 is located at the center of the optical platform 1.

[0035] It should be noted that, in order to improve testing efficiency, the probe station 3 does not require soldering when inserting the probe. Therefore, the electronic packaged device under test needs to be pressed onto the stage 10, and the pressure block 4 is moved by adjusting the magnetic base 5 to fix the electronic packaged device under test on the stage 10.

[0036] Specifically, the probe station 3 is adjusted by the position adjustment mechanism, and with the assistance of the imaging system, the probe station 3 can accurately perform pin-down testing on the external pins of the electronic packaged device under test on the stage 10, enabling multi-station testing.

[0037] In practical use, it is necessary to ensure that the probe station 3 on the position adjustment mechanism is moved to the stage 10 on which the electronic packaged device under test is placed, and use the pressure block 4 to fix the electronic packaged device under test on the stage 10. Then, in conjunction with the imaging system composed of the microscope adjustment mechanism 6, CCD camera 7 and display 8, the probe station 3 can be used to accurately probe the electronic packaged device under test on the stage 10 to ensure the accuracy and precision of the test.

[0038] The working principle of the electronic packaged device thermal resistance testing system provided by this utility model is as follows:

[0039] The probe station 3 is precisely moved to the vicinity of the stage 10 using the position adjustment mechanism located on the optical platform 1, and the electronic packaged device under test on the stage 10 is fixed by the pressure block 4. For smaller packaged devices, an imaging system consisting of a microscope adjustment mechanism 6, a CCD camera 7, and a display 8 is used to accurately probe the electronic packaged device under test on the stage 10 using the probe station 3. Since the electronic packaged device under test is in direct contact with the stage 10, the transient thermal characteristic curves of the electronic packaged device under test in both dry and hot states can be measured. Then, the electronic packaged device under test on the stage 10 is clamped and fixed using the magnetic base 5, and the probe station 3 is used to probe the clamped electronic packaged device under test to measure the temperature-voltage characteristic curve of the electronic packaged device under test. Finally, the junction thermal resistance of the electronic packaged device under test is calculated based on the transient thermal characteristic curves and temperature-voltage characteristic curves in both dry and hot states.

[0040] In this embodiment, the position adjustment mechanism and probe station 3 enable circuit connections for electronic packaged devices with different packaging forms and sizes. Especially for electronic packaged devices with a small number of pins, this thermal resistance testing system is suitable for K-factor testing, junction environment thermal resistance testing, and junction-to-case thermal resistance testing of various electronic packaged devices. It avoids multiple soldering operations on the device pins, improving both testing efficiency and thermal resistance testing efficiency. The position adjustment mechanism ensures that the electronic packaged device can undergo thermal resistance testing on different platforms, while the probe station 3 ensures that the probes can be accurately aligned with the pins of the electronic packaged device, guaranteeing the stability of the circuit connection.

[0041] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A thermal resistance testing system for electronic packaged devices, comprising an optical platform (1), characterized in that, An optical platform (1) is provided with a stage (10), and an adjustable probe assembly, an imaging system, and a fixing mechanism are provided around the stage (10). The adjustable probe assembly consists of a position adjustment mechanism and a probe station (3). The position adjustment mechanism includes a symmetrically arranged longitudinal slide rail (2-1), a transverse guide plate (2-2) is slidably arranged on the longitudinal slide rail, a transverse slide plate (2-3) is slidably arranged on the transverse guide plate (2-2), and two sets of probe stations (3) are installed on the transverse slide plate (2-3). The imaging system includes a microscope adjustment frame (6), and a CCD camera group (7) and a display screen (8) are installed on the microscope adjustment frame (6).

2. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The longitudinal slide rail (2-1) has a longitudinal slide rod (2-11) in the middle, and the two ends of the longitudinal slide rod (2-11) are installed in the slide rod seat (2-12); the optical platform (1) is provided with an adjustment screw hole (1-1), and the slide rod seat (2-12) is provided with a through hole, and the position of the longitudinal slide rail (2-1) can be adjusted by using bolts.

3. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, A longitudinal locking bolt (2-4) is installed on the transverse guide plate (2-2), and the longitudinal locking bolt (2-4) is located above the longitudinal slide bar (2-11).

4. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, A transverse locking bolt (2-5) is installed on the transverse slide plate (2-3), and the transverse locking bolt (2-5) is located above the transverse guide plate (2-2).

5. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, Limiting blocks (9) are installed at both ends of the transverse guide plate (2-2).

6. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The probe station (3) is a manually adjustable probe station.

7. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The microscope adjustment frame (6) includes a vertical rod (6-1), a display screen (8) is installed on the upper part of the vertical rod (6-1), one end of a horizontal rod (6-2) is connected to the middle of the vertical rod (6-1), and a rotating rod (6-3) is hinged to the other end of the horizontal rod (6-2). A CCD camera (7) is installed on the rotating rod (6-3), and the CCD camera (7) faces the stage (10).

8. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The fixing mechanism adopts a magnetic base (5), and the moving end of the magnetic base (5) is equipped with a pressure block (4).

9. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The optical platform (1) is magnetic.

10. The electronic packaged device thermal resistance testing system as described in claim 1, characterized in that, The platform (10) is located at the center of the optical platform (1).

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