A memory core box

Abstract

This application relates to the field of memory technology and discloses a memory core box, including: a circuit board assembly, a box assembly, and a cushioning assembly. The circuit board assembly has a data cable harness; the box assembly has a storage cavity, and an opening is formed on the side wall of the box assembly, communicating with the storage cavity; the cushioning assembly wraps around the circuit board assembly so that the circuit board assembly is placed inside the storage cavity, and the cushioning assembly can undergo elastic deformation; wherein, the data cable harness passes through the cushioning assembly and the opening in sequence and extends to the outside of the box assembly. By wrapping the circuit board assembly with the cushioning assembly, the circuit board assembly is separated from the box assembly, so as to cushion the circuit board assembly and improve the protection performance of the memory core box for the storage circuit board assembly.

Description

Technical Field

[0001] This utility model relates to the field of memory technology, specifically to a memory core box. Background Technology

[0002] Storage enclosures are crucial components of hard drive storage devices. They provide waterproofing, high-temperature resistance, and shock and drop protection for the storage circuit board assemblies housed within, preventing data loss and facilitating subsequent data retrieval. Currently, most storage enclosures on the market have a central support frame that connects to the enclosure's outer shell, allowing the storage circuit board assemblies to be mounted.

[0003] However, the current structure that uses brackets to fix the storage circuit board assembly has poor buffering between the bracket and the memory box shell because the bracket is rigidly connected to the memory box shell. This makes the storage circuit board assembly susceptible to data loss, affecting the protection performance of the memory box. Furthermore, the production cost of this rigidly connected shell is higher. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this application is to provide a memory core box that can better buffer circuit board components, improve the protection performance of the memory core box, and reduce the production cost of the memory core box.

[0005] A memory core box includes: a circuit board assembly, a box assembly, and a pad assembly. The circuit board assembly has a data cable harness. The box assembly has a storage cavity inside, and an opening is formed on the side wall of the box assembly, which communicates with the storage cavity. The pad assembly wraps around the circuit board assembly so that the circuit board assembly is placed inside the storage cavity, and the pad assembly can undergo elastic deformation. The data cable harness passes through the pad assembly and the opening in sequence and extends to the outside of the box assembly.

[0006] Furthermore, a placement cavity is formed in the middle of the padding assembly, and the circuit board assembly is located in the placement cavity.

[0007] Furthermore, the padding assembly includes a buffer layer and a placement layer, wherein a placement groove is formed within the placement layer, and the placement groove has at least one placement opening; the buffer layer surrounds the periphery of the placement layer and extends at least partially to the placement opening, such that one end face of the buffer layer and the inner wall of the placement groove enclose a placement cavity.

[0008] Furthermore, the housing assembly is provided with a pressure relief area.

[0009] Furthermore, the cushioning assembly contains adsorbed phase change liquid.

[0010] Furthermore, a sealing step surface is formed inside the opening, and the sealing step surface is positioned perpendicular to the opening.

[0011] Furthermore, the housing assembly includes a seal that is installed inside the opening, and the data cable harness extends out of the housing assembly after passing through the seal.

[0012] Furthermore, the box assembly includes a box body and an end cap, the end cap being installed on the box body and sealed to the box body.

[0013] Furthermore, reinforcing ribs are formed on the inner wall of the end cap facing the storage cavity.

[0014] Furthermore, the circuit board assembly includes a circuit board, a data harness, and a potting compound layer. The potting compound layer wraps around the circuit board, the data harness is connected to the circuit board, and the data harness extends beyond the potting compound layer.

[0015] By wrapping the circuit board assembly with a cushioning layer, the circuit board assembly is separated from the housing assembly. This cushioning provides better protection for the memory core housing and reduces its production cost. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the memory core box in this embodiment.

[0017] Figure 2 yes Figure 1 Cross-sectional view of the memory core box.

[0018] Figure 3 yes Figure 1 A schematic diagram of the padding assembly of the memory core box.

[0019] Figure 4 yes Figure 1 A schematic diagram of the internal structure of the memory core box.

[0020] Figure 5 yes Figure 1 A schematic diagram of the end cap structure of the memory core box.

[0021] Figure 6 yes Figure 5 A schematic diagram of the structure after the middle end cap has been rotated to a certain angle.

[0022] Reference numerals: Circuit board assembly 1, data cable harness 1-1, circuit board 1-2, potting layer 1-3, housing assembly 2, storage cavity 2-1, opening 2-2, sealing step surface 2-3, sealant 2-4, housing 2-5, end cap 2-6, sealing groove 2-7, sealant 2-8, reinforcing rib 2-9, mounting step 2-10, pressure relief area 2-11, padding assembly 3, placement cavity 3-1, buffer layer 3-2, placement layer 3-3, placement groove 3-4, placement opening 3-5. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0024] like Figure 1 and Figure 2 As shown, the memory core box disclosed in this embodiment includes a circuit board assembly 1, a box assembly 2, and a cushioning assembly 3. The circuit board assembly 1 is a data storage module used to store data. The cushioning assembly 3 wraps around the circuit board assembly 1, and the circuit board assembly 1 is placed inside the box assembly 2 after being wrapped with the cushioning assembly 3. The cushioning assembly 3 can undergo elastic deformation. When the memory core box is impacted, the cushioning assembly 3 can undergo a certain amount of elastic deformation to cushion the circuit board assembly 1, thereby preventing the circuit board assembly 1 from shaking violently with the box assembly 2, improving the protection performance of the memory core box for the circuit board assembly 1, and reducing the production cost of the memory core box.

[0025] To facilitate a clear explanation of the technical solution of this application, this application also defines the following: Figure 1 The upper and lower dimensions are shown. In this application, the height direction of the housing assembly 2 refers to... Figure 1 The up and down directions in the middle.

[0026] Specifically, the circuit board assembly 1 has a data harness 1-1, which is used to input or output electrical signals to the outside of the circuit board assembly 1.

[0027] The housing assembly 2 has a storage cavity 2-1 inside, and an opening 2-2 is formed on the side wall of the housing assembly 2, which communicates with the storage cavity 2-1. The storage cavity 2-1 is used to house the circuit board assembly 1 after the padding assembly 3 is wrapped inside the housing assembly 2. The data cable harness 1-1 of the circuit board assembly 1 passes through the padding assembly 3 and the opening 2-2 in sequence and extends to the outside of the housing assembly 2, so that the circuit board assembly 1 can transmit signals with external devices through the data cable harness 1-1.

[0028] As one implementation method, such as Figure 3As shown, a placement cavity 3-1 is formed in the middle of the padding assembly 3, and the circuit board assembly 1 is located in the placement cavity 3-1. By providing the placement cavity 3-1 in the middle of the padding assembly 3, the circuit board assembly 1 placed in the placement cavity 3-1 is completely wrapped by the padding assembly 3, thereby buffering the forces acting in all directions through the padding assembly 3 and improving the protection performance of the circuit board assembly 1.

[0029] In one implementation, the size of the cushioning component 3 is greater than or equal to the size of the storage cavity 2-1 (the length, width, and height of the cushioning component 3 are all greater than or equal to the length, width, and height of the storage cavity 2-1). Simultaneously, the size (length, width, and height) of the placement cavity 3-1 can be greater than or equal to the size (length, width, and height) of the circuit board assembly 1. During the installation of the cushioning component 3, it is compressed, thereby reducing the size of the placement cavity 3-1. This allows the inner wall of the placement cavity 3-1 to abut against the outer edge of the circuit board assembly 1, thus fixing the circuit board assembly 1 in place. By appropriately increasing the size of the placement cavity 3-1, it is easier to place the circuit board assembly 1 within it, improving the installation efficiency of the circuit board assembly 1. It should be noted that when the length, width, and height of the cushioning component 3 are all equal to the length, width, and height of the storage cavity 2-1, the cushioning component 3 is not compressed after installation. Furthermore, the size of the cushioning component 2 can be adjusted according to actual installation requirements; this implementation does not impose any limitations on the size of the cushioning component 2.

[0030] In one implementation, the padding assembly 3 includes a buffer layer 3-2 and a placement layer 3-3. A placement groove 3-4 is formed within the placement layer 3-3, and the placement groove 3-4 has at least one placement opening 3-5 for placing the circuit board assembly 1 within the placement layer 3-3. The buffer layer 3-2 surrounds the placement layer 3-3 and at least partially or completely covers the placement opening 3-5, such that one end face of the buffer layer 3-2 and the inner wall of the placement groove 3-4 form a placement cavity 3-1. By dividing the padding assembly 3 into a buffer layer 3-2 and a placement layer 3-3, the processing of the padding assembly 3 is facilitated, improving the production efficiency of the padding assembly 3.

[0031] In this implementation, the padding component 3 includes two buffer layers 3-2 and a placement layer 3-3. A placement groove 3-4 is formed in the middle of the placement layer 3-3. The placement groove 3-4 has two placement openings 3-5. That is, the placement layer 3-3 has a ring structure. The two buffer layers 3-2 are respectively arranged at the upper and lower ends of the placement layer 3-3. The placement cavity 3-1 is formed by splicing the end faces of the two buffer layers 3-2 with the two placement openings 3-5.

[0032] In this implementation, the height of layer 3-3 is slightly higher than the height of circuit board assembly 1, and the heights of the two buffer layers 3-2 are the same.

[0033] As another implementation, the padding assembly 3 includes a buffer layer 3-2 and a placement layer 3-3. A placement groove 3-4 is formed in the placement layer 3-3. The depth of the placement groove 3-4 is less than the height of the placement layer 3-3, so that the placement groove 3-4 located in the placement layer 3-3 has an upward or downward placement opening 3-5. The buffer layer 3-2 is stacked on the placement layer 3-3, and the buffer layer 3-2 blocks the placement opening 3-5 of the placement groove 3-4, thereby forming a placement cavity 3-1 for placing the circuit board assembly 1.

[0034] In this implementation, the height of the placement layer 3-3 is at least twice the height of the circuit board assembly 1, so as to form a placement groove 3-4 with an opening on one side on the placement layer 3-3.

[0035] It should be noted that the length and width of the buffer layer 3-2 and the placement layer 3-3 are the same, while the height of the buffer layer 3-2 and the placement layer 3-3 may be the same or different.

[0036] It should be further noted that in this application, the padding component 3 is a structure of stacked upper and lower layers. In other embodiments, the padding component 3 can be a structure of stacked front and back or left and right layers.

[0037] Both the buffer layer 3-2 and the placement layer 3-3 are porous elastic materials, such as ceramic fiber paper. The phase change liquid is adsorbed through the pores in the material, so that the pad assembly 3 is filled with the phase change liquid, and the circuit board assembly 1 is wrapped with the phase change liquid.

[0038] As one implementation, along the height direction of the housing assembly 2, the height of the placement port 3-5 is consistent with the height of the opening 2-2, so that after the memory core box is assembled, the data cable harness 1-1 is laid along the end face of the placement layer 3-3 with the placement port 3-5, reducing the deformation of the placement layer 3-3 or the buffer layer 3-2, which can improve the wrapping of the padding assembly 3 on the main body of the circuit board assembly 1, thereby improving the buffering capacity of the padding assembly 3 on the circuit board assembly 1. At the same time, reducing the deformation of the placement layer 3-3 or the buffer layer 3-2 can increase the adsorption amount of the phase change liquid.

[0039] Alternatively, along the height direction of the housing assembly 2, the height of the placement opening 3-5 is inconsistent with the height of the opening 2-2. The placement layer 3-3 is deformed so that the data cable harness 1-1 passes through the opening 2-2 and extends out of the housing assembly 2.

[0040] As one implementation method, such as Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the box assembly 2 includes a box body 2-5 and an end cap 2-6. The end cap 2-6 is installed on the top of the box body 2-5 and is sealed to the box body 2-5.

[0041] Specifically, a sealing groove 2-7 is formed at the connection between the end cap 2-6 and the box body 2-5. The sealing groove 2-7 is filled with sealant 2-8. By setting the sealing groove 2-7, the contact area between the sealant 2-8 and the box body 2-5 and the end cap 2-6 is increased, thereby improving the sealing performance at the connection between the box body 2-5 and the end cap 2-6.

[0042] In some alternative embodiments, the housing 2-5 and the end cap 2-6 can be fixedly connected by ultrasonic welding.

[0043] As one implementation method, such as Figure 4 As shown, a mounting step 2-10 is formed on the top of the box body 2-5, and the end cover 2-6 is mounted on the top of the box body 2-5 through the mounting step 2-10, which improves the assembly convenience of the box body assembly 2 and thus improves the installation efficiency of the box body assembly 2.

[0044] As one implementation method, such as Figure 5 and Figure 6 As shown, a reinforcing rib 2-9 is formed on the inner wall of the end cap 2-6 facing the storage cavity 2-1. The reinforcing rib 2-9 increases the strength of the end cap 2-6, thereby improving the strength of the housing assembly 2.

[0045] As one implementation method, the reinforcing ribs 2-9 are distributed in a grid pattern, and the outer edge of the outermost reinforcing ribs 2-9 abuts against the inner wall of the box body 2-5, thereby further positioning and assembling the box body 2-5 and the end cap 2-6, and further improving the assembly convenience of the box body component 2.

[0046] As one implementation, the opening 2-2 is formed on the side wall of the box 2-5, and a sealing step surface 2-3 is formed inside the opening 2-2. The sealing step surface 2-3 is set perpendicular to the orientation of the opening 2-2, that is, along the orientation of the opening 2-2, the cross section of the opening 2-2 is stepped.

[0047] As one implementation method, such as Figure 2 , Figure 4 As shown, the housing assembly 2 includes a seal 2-4, which is installed inside the opening 2-2. The data cable harness 1-1 passes through the seal 2-4 and extends out of the housing assembly 2. The seal 2-4 seals the connection between the opening 2-2 and the data cable harness 1-1, preventing the phase change liquid from flowing out of the opening 2-2 under normal use. Along the orientation of the opening 2-2, the cross-sectional shape of the seal 2-4 is consistent with the cross-sectional shape of the opening 2-2.

[0048] The seal 2-4 can be a rubber component or a sealant. When the seal 2-4 is a rubber component, it is first assembled onto the data cable harness 1-1 and then assembled into the opening 2-2. When the seal 2-4 is a sealant, the data cable harness 1-1 is first assembled into the opening 2-2, and then sealant is injected into the opening 2-2, thereby forming the seal 2-4 between the data cable harness 1-1 and the opening 2-2.

[0049] As one implementation, the area of ​​the opening 2-2 on the side away from the storage cavity 2-1 is larger than the area of ​​the opening 2-2 on the side close to the storage cavity 2-1. Correspondingly, the area of ​​the seal 2-4 on the side away from the storage cavity 2-1 is also larger than the area of ​​the seal 2-4 on the side close to the storage cavity 2-1.

[0050] In this implementation, the seal 2-4 can be installed into the opening 2-2 outside the housing assembly 2, which improves the ease of installation of the seal 2-4 and thus improves the assembly efficiency of the memory core box.

[0051] As another implementation, the area of ​​the opening 2-2 away from the storage cavity 2-1 is smaller than the area of ​​the opening 2-2 near the storage cavity 2-1. Correspondingly, the area of ​​the seal 2-4 away from the storage cavity 2-1 is also smaller than the area of ​​the seal 2-4 near the storage cavity 2-1.

[0052] In this implementation, the seal 2-4 needs to be installed inside the opening 2-2 within the housing assembly 2. During the process of pulling the data cable harness 1-1 out of the housing assembly 2, the seal 2-4 will move toward the side of the opening 2-2 away from the storage cavity 2-1, thereby improving the sealing performance between the seal 2-4 and the opening 2-2.

[0053] As one implementation method, the housing assembly 2 is provided with a pressure relief zone 2-11. When the pressure inside the housing assembly 2 is too high, the pressure relief zone 2-11 ruptures, so that the gas formed after the phase change liquid vaporizes can flow out from the pressure relief zone 2-11, preventing the circuit board assembly 1 from being damaged when the pressure inside the housing assembly 2 is too high, thereby further improving the protection performance of the housing assembly 2 for the circuit board assembly 1.

[0054] Specifically, the pressure relief area 2-11 is a weak area on the box body 2-5 or the end cover 2-6, that is, the thickness of the pressure relief area 2-11 is less than the wall thickness of other areas of the box body 2-5 or the end cover 2-6.

[0055] As one implementation, the wall thickness of the pressure relief zone 2-11 is 0.2 to 0.6 mm, so that the pressure relief zone 2-11 will rupture when the pressure inside the box assembly 2 increases.

[0056] As one implementation method, the pressure relief hole can also serve as a form of pressure relief zone 2-11. To ensure the pressure relief hole is sealed, it can be sealed externally with tape or low-melting-point adhesive.

[0057] As one implementation method, such as Figure 2 As shown, the circuit board assembly 1 includes a circuit board 1-2, a data harness 1-1, and a potting compound layer 1-3. The potting compound layer 1-3 wraps around the circuit board 1-2, and the data harness 1-1 is connected to the circuit board 1-2 and extends beyond the potting compound layer 1-3. The potting compound layer 1-3 further encapsulates the circuit board assembly 1, thereby further improving the protection performance of the storage core box for the circuit board 1-2. In other embodiments, the potting compound layer 1-3 can also be replaced with a plastic shell for wrapping.

[0058] Specifically, circuit board assembly 1 is a prefabricated component, and the prefabrication process is as follows: After the circuit board 1-2 and the data cable harness 1-1 are soldered together, a soldering assembly is formed. The soldering assembly is placed in a container, and then adhesive is applied to form an adhesive layer 1-3 on the outside of the soldering assembly. The adhesive layer 1-3 is then separated from the container to form circuit board assembly 1. In addition, circuit board 1-2 and data cable harness 1-1 in circuit board assembly 1 can also be integrally formed.

[0059] Finally, it should be noted that the above are only some preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A memory core box, characterized in that, include: A circuit board assembly (1) having a data harness (1-1); A housing assembly (2) has a storage cavity (2-1) inside, and an opening (2-2) is formed on the side wall of the housing assembly (2), which communicates with the storage cavity (2-1); A cushioning assembly (3) is wrapped around the circuit board assembly (1) so that the circuit board assembly (1) is placed inside the storage cavity (2-1), and the cushioning assembly (3) is capable of elastic deformation. The data cable harness (1-1) passes through the padding assembly (3) and the opening (2-2) in sequence and extends to the outside of the housing assembly (2).

2. A memory core box according to claim 1, characterized in that, The padding assembly (3) has a placement cavity (3-1) formed in the middle, and the circuit board assembly (1) is located in the placement cavity (3-1).

3. A memory core box according to claim 1 or 2, characterized in that, The padding assembly (3) includes a buffer layer (3-2) and a placement layer (3-3), wherein a placement groove (3-4) is formed in the placement layer (3-3), and the placement groove (3-4) has at least one placement opening (3-5); The buffer layer (3-2) wraps around the placement layer (3-3) and extends at least partially to the placement opening (3-5) so that one end face of the buffer layer (3-2) and the inner wall of the placement groove (3-4) form a placement cavity (3-1).

4. A memory core box according to claim 3, characterized in that, The housing assembly (2) is provided with a pressure relief area (2-11).

5. A memory core box according to claim 1, characterized in that, The cushion layer assembly (3) contains a phase change liquid.

6. A memory core box according to claim 1, characterized in that, A sealing step surface (2-3) is formed inside the opening (2-2), and the sealing step surface (2-3) is arranged perpendicular to the opening (2-2).

7. A memory core box according to claim 1 or 6, characterized in that, The housing assembly (2) includes a seal (2-4), which is installed inside the opening (2-2), and the data cable harness (1-1) extends out of the housing assembly (2) after passing through the seal (2-4).

8. A memory core box according to claim 1, characterized in that, The box assembly (2) includes a box body (2-5) and an end cap (2-6), the end cap (2-6) being installed on the box body (2-5) and sealed to the box body (2-5).

9. A memory core box according to claim 8, characterized in that, The end cap (2-6) has reinforcing ribs (2-9) formed on the inner wall facing the storage cavity (2-1).

10. A memory core box according to claim 1, characterized in that, The circuit board assembly (1) includes a circuit board (1-2), a data harness (1-1), and a potting compound layer (1-3). The potting compound layer (1-3) is wrapped around the circuit board (1-2), the data harness (1-1) is connected to the circuit board (1-2), and the data harness (1-1) extends to the outside of the potting compound layer (1-3).

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