A memory stick testing device

Abstract

This utility model provides a memory module testing device, comprising: a motherboard base with multiple memory module slots for installing memory modules under test; a temperature control mechanism integrating heating and heat dissipation elements, forming an adjustable temperature-controlled enclosed testing space with the memory module slots on the motherboard base; and a moving mechanism including a driving component and synchronously driven first and second transmission components, the first and second transmission components being connected to asymmetrical positions on opposite sides of the temperature control mechanism, converting the rotational motion of the driving component into the lifting and horizontal movement of the temperature control mechanism, thereby detaching the temperature control mechanism from the motherboard base. This device achieves rapid separation and reconnection of the temperature control mechanism from the motherboard base through automated control. This design not only improves the efficiency of memory module replacement but also reduces errors caused by human operation, ensuring the accuracy and stability of the test.

Description

Technical Field

[0001] This utility model relates to the field of memory module testing technology, and in particular to a memory module testing device. Background Technology

[0002] In current memory testing, to ensure memory modules maintain the required constant temperature during testing, the common practice is to place the memory modules and their slots in a separate, enclosed space, using auxiliary heating or cooling devices to regulate the temperature. However, when replacing memory modules with the next batch after testing a batch, this enclosed space often needs to be manually opened. This manual operation has several drawbacks: firstly, the process is cumbersome and prone to human error, affecting the accuracy of subsequent tests; secondly, with frequent memory module replacements, manual operation consumes a significant amount of time, thus substantially reducing testing efficiency. Utility Model Content

[0003] To address all or part of the problems in the existing technology, this utility model provides a memory module testing device. This device utilizes an automated control system and a moving mechanism to rapidly lift and horizontally move the temperature control mechanism, thereby achieving rapid separation and engagement between the temperature control mechanism and the motherboard base. This design not only improves the efficiency of memory module replacement but also reduces errors caused by human operation, ensuring the accuracy and stability of the test.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A memory module testing device, comprising:

[0006] The motherboard base has multiple memory slots for installing the memory modules to be tested;

[0007] The temperature control mechanism integrates heating and heat dissipation elements, forming an adjustable temperature-controlled closed testing space between itself and the memory slots of the motherboard base.

[0008] The moving mechanism includes a driving component and a first transmission component and a second transmission component that drive synchronously. The first transmission component and the second transmission component are respectively connected to asymmetrical positions on the outer side of the temperature control mechanism, converting the rotational motion of the driving component into the lifting and horizontal movement of the temperature control mechanism, so that the temperature control mechanism is detached from the motherboard base.

[0009] The driving component includes a power source, a first gear set, and a synchronous shaft. The power source drives the synchronous shaft to rotate through the first gear set. Second gear sets are respectively installed at both ends of the synchronous shaft, which respectively drive the first transmission component and the second transmission component to move.

[0010] Both the first transmission component and the second transmission component include a base plate. The base plate is provided with a first driven wheel, a second driven wheel, a drive wheel, and a closed-loop transmission assembly. The first driven wheel is located at the starting end of the lifting motion, the second driven wheel is located at the starting end of the horizontal movement, and the drive wheel is located at the end of the horizontal movement and is coaxially connected to the second gear set.

[0011] Guide shafts are fixed to the outer sides of the two diagonally opposite corners of the temperature control mechanism. When the temperature control mechanism is in its initial position before the lifting movement, the guide shafts are fixedly connected to the corresponding parts of the transmission assembly.

[0012] A rack portion is provided at the position corresponding to the guide shaft and the conveying component, and a tooth segment is provided at the corresponding position of the conveying component. The rack portion is meshed with the rack.

[0013] The substrate is also provided with a lifting track groove, which is composed of a first inclined section and a second horizontal section that are interconnected. The angle between the first inclined section and the horizontal plane is 15°-75°. The second horizontal section is smoothly connected to the end of the first inclined section. The outer end of the guide shaft passes through the track groove and slides along the track groove.

[0014] The length of the second horizontal section of the first transmission component is L1, and the length of the second horizontal section of the second transmission component is L2. L1 is greater than L2, and the difference between the two is the vertical distance between the two guide shafts on the temperature control mechanism.

[0015] The substrate is also provided with a plurality of positioning posts, so that the closed-loop path of the conveying component is arranged around the outside of the track groove, and the bottom surface of the track groove is located above the support surface of the conveying component.

[0016] It also includes a controller connected to the drive component, which controls the drive component to drive the first transmission component and the second transmission component to move in the forward or reverse direction.

[0017] It also includes a position sensor, which is located on the side of the synchronous shaft of the drive component facing the temperature control mechanism and corresponds to the position where the temperature control mechanism stops lifting and horizontal movement. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a memory module testing device according to an embodiment of the present invention.

[0020] Figure 2 This is a top view of a memory module testing device according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of a memory module testing device in the initial position before the lifting motion, according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of the lifting and horizontal movement termination position of the temperature control mechanism in a memory module testing device according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the substrate structure in a memory module testing device according to an embodiment of the present invention.

[0024] Reference numerals in the attached figures: 1. Motherboard base; 101. Memory module under test; 2. Temperature control mechanism; 3. Drive component; 301. Power source; 302. First gear set; 303. Synchronous shaft; 4. First transmission component; 5. Second transmission component; 6. Base plate; 601. First driven wheel; 602. Second driven wheel; 603. Drive wheel; 604. Transmission assembly; 605. Lifting track groove; 606. Positioning column; 7. Position sensor. Detailed Implementation

[0025] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0027] In this embodiment of the utility model, in conjunction with reference to the reference Figures 1 to 5As shown, a memory module testing device is provided. The device mainly consists of the following parts: a motherboard base 1, a temperature control mechanism 2, and a moving mechanism. The motherboard base 1 has multiple memory module slots for installing the memory module 101 under test, providing stable physical support and electrical connection for the memory module. The temperature control mechanism 2 integrates heating and heat dissipation elements, enabling precise temperature adjustment according to testing requirements. It forms an adjustable temperature-controlled closed testing space with the memory module slots on the motherboard base 1, ensuring the memory module remains in the required constant temperature environment during testing. The moving mechanism includes a driving component 3 and a first transmission component 4 and a second transmission component 5 driven synchronously thereafter. The first transmission component 4 and the second transmission component 5 are respectively connected to asymmetrical positions on opposite sides of the temperature control mechanism 2. This connection method effectively converts the rotational motion generated by the driving component 3 into the lifting action and horizontal movement action of the temperature control mechanism 2, thereby achieving rapid separation and connection between the temperature control mechanism 2 and the motherboard base 1, greatly improving the efficiency of memory module replacement and testing convenience.

[0028] The driving component 3 mainly includes a power source 301, a first gear set 302, and a synchronous shaft 303. The power source 301 drives the synchronous shaft 303 via the first gear set 302, thereby causing the synchronous shaft 303 to rotate. Second gear sets are installed at both ends of the synchronous shaft 303, and these two second gear sets are used to drive the first transmission component 4 and the second transmission component 5 to move. Here, the first transmission component 4 and the second transmission component 5 have basically the same structure; both include a base plate 6, on which a first driven wheel 601, a second driven wheel 602, a driving wheel 603, and a closed-loop transmission assembly 604 are disposed. The first driven wheel 601 is positioned at the starting end of the lifting motion of the temperature control mechanism 2, playing an initial guiding role when the lifting action begins; the second driven wheel 602 is positioned at the starting end of the horizontal movement, providing the initial transmission connection for the horizontal movement; and the drive wheel 603 is located at the end of the horizontal movement and is coaxially connected to the second gear set, thereby transmitting power to the transmission assembly 604 to drive the connected components.

[0029] Guide shafts are fixedly installed on the two diagonally opposite outer sides of the temperature control mechanism 2. When the temperature control mechanism 2 is in its initial position before the lifting movement, the guide shafts are fixedly connected to the corresponding parts on the transmission assembly 604. This connection provides guidance and positioning for the subsequent movement of the temperature control mechanism 2, ensuring the stability and accuracy of the entire device during operation. In this embodiment, the guide shaft has a rack portion at the position corresponding to the transmission assembly 604, and the transmission assembly 604 also has a toothed segment at the position corresponding to the guide shaft. The rack portion and the toothed segment can achieve a tight and smooth meshing connection. When the transmission assembly 604 moves, through this tight and smooth meshing connection, power can be efficiently and stably transmitted to the guide shaft, thereby causing the temperature control mechanism 2 to move synchronously with the movement of the transmission assembly 604.

[0030] The substrate 6 is also specially provided with a lifting track groove 605, which plays a key role in guiding the movement of the entire device. Specifically, this track groove is cleverly composed of a first inclined section and a second horizontal section that are interconnected. The first inclined section forms a specific angle with the horizontal plane, which is set between 15° and 75°. This angle design is carefully considered to ensure the stability of the temperature control mechanism 2 during the lifting process, while also taking into account the rationality of the spatial layout of the entire device. The second horizontal section is smoothly connected to the end of the first inclined section. This smooth transition design can effectively avoid problems such as jamming or collision of the temperature control mechanism 2 during movement, ensuring its continuity and stability. As an important guiding component for the movement of the temperature control mechanism 2, the guide shaft passes through the aforementioned track groove at its outer end and can slide smoothly along the track groove. This sliding connection method strictly limits the movement trajectory of the guide shaft within the path specified by the track groove, thereby providing a reliable guarantee for the precise movement of the temperature control mechanism 2.

[0031] Furthermore, the first transmission component 4 and the second transmission component 5 differ in their structural design. Specifically, the length of the second horizontal segment of the first transmission component 4 is set to L1, and the length of the second horizontal segment of the second transmission component 5 is set to L2, with L1 being greater than L2, and the difference between them being exactly equal to the vertical distance between the two guide shafts on the temperature control mechanism 2. This design allows the temperature control mechanism 2 to achieve stable and accurate lifting and horizontal movement during operation through the coordinated action of the first transmission component 4 and the second transmission component 5, ensuring the accuracy and reliability of the entire device's operation. In addition, the base plate 6 is provided with multiple positioning posts 606. The presence of these positioning posts 606 allows the closed-loop path of the transmission component 604 to be arranged around the outside of the track groove. This arrangement not only optimizes the space utilization efficiency of the device but also effectively avoids interference between the transmission component 604 and other components. Simultaneously, the bottom surface of the track groove is located above the supporting surface of the transmission component 604, with a certain distance between them, to ensure accurate meshing between the rack portion on the guide shaft and the toothed segments on the transmission component 604.

[0032] The testing device also includes a controller electrically connected to the drive component 3. The controller can precisely control the operating state of the drive component 3 according to preset test procedures and instructions, thereby driving the first transmission component 4 and the second transmission component 5 to achieve forward or reverse movement. In this way, the controller can accurately control the lifting, horizontal movement, and resetting actions of the temperature control mechanism 2, ensuring the automated operation of the entire testing device and improving testing efficiency and accuracy.

[0033] It also includes a position sensor 7, which is located on the side of the synchronous shaft 303 of the drive component 3 facing the temperature control mechanism 2, and corresponds to the position where the temperature control mechanism 2 stops lifting and horizontal movement. When the temperature control mechanism 2 moves to the end position after disengaging from the motherboard base 1, the temperature control mechanism 2 will touch the switch of the position sensor 7, and the position sensor 7 will then send a stop signal to the drive component 3, causing the drive component 3 to stop moving. In addition, the position sensor 7 also has a physical limit function. In the event of a fault, if the temperature control mechanism 2 continues to move backward due to an abnormality, the position sensor 7 can physically block the temperature control mechanism 2, preventing it from continuing to move backward and colliding with the synchronous shaft 303, the first gear set 302, and the power source 301 behind it, thereby protecting the internal structure of the device and avoiding further damage caused by the fault.

[0034] In this embodiment, the temperature control mechanism 2 is designed as a memory module cover, and its specific operating mechanism is as follows:

[0035] The controller sends control signals to the moving mechanism according to a preset test procedure, and the moving mechanism controls the forward and reverse rotation of the drive component 3 accordingly. The power source 301 of the drive component 3 drives the synchronous shaft 303 to rotate through the first gear set 302, and the second gear sets at both ends of the synchronous shaft 303 mesh and rotate synchronously. The second gear sets drive the first transmission component 4 and the second transmission component 5 to move respectively.

[0036] During the opening process, the transmission assembly 604 of the first transmission component 4 and the second transmission component 5 begins to move under the drive of the drive wheel 603. The toothed segment on the transmission assembly 604 meshes tightly with the rack portion of the guide shaft on the temperature control mechanism 2 (memory module cover), causing the guide shaft to slide along the lifting track groove 605 on the substrate 6. The track groove consists of a first inclined section and a second horizontal section. The guide shaft first slides along the first inclined section to achieve the lifting action of the memory module cover, and then slides along the second horizontal section to complete the horizontal movement of the memory module cover, ultimately achieving the opening action.

[0037] The closing process is the opposite of the opening process. The controller controls the drive component 3 to reverse, driving the transmission components 604 of the first transmission component 4 and the second transmission component 5 to move in the opposite direction. The guide shaft slides along the opposite direction of the track groove, so that the memory module cover first moves horizontally, then completes the descent action, and finally returns to the closed position.

[0038] To ensure the accuracy of each opening and closing of the cover and reduce errors caused by improper manual operation, a position sensor 7 is specially installed in the testing device. It is installed on the side of the synchronous shaft 303 of the drive component 3 facing the temperature control mechanism 2. It is used to accurately control the moving end position of the temperature control mechanism 2 and to play a limit protection role in case of failure, preventing the temperature control mechanism 2 from moving excessively and causing equipment damage.

[0039] This invention features a single-degree-of-freedom motion design, requiring only one driving component 3. The forward and reverse rotation of the driving component 3 achieves two motion states. This design avoids deviations that may occur due to manual operation, ensuring precise opening and closing of the cover each time. This is crucial for guaranteeing the accuracy and stability of memory testing, effectively reducing the risk of test failures caused by cover opening and closing errors. The entire testing device has a compact structure, is easy to integrate with existing memory testing equipment, and possesses good scalability. In subsequent development, the driving component 3 can be easily optimized and upgraded according to different testing needs and equipment specifications, further improving equipment performance and laying a solid foundation for building an automated memory module testing production line.

[0040] It should be noted that, for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A memory stick testing apparatus, characterized by, include: The motherboard base (1) is provided with multiple memory slots for installing the memory module (101) to be tested; The temperature control mechanism (2) integrates heating and heat dissipation elements, forming an adjustable temperature closed test space between itself and the memory slot of the motherboard base (1). The moving mechanism includes a driving component (3) and a first transmission component (4) and a second transmission component (5) driven synchronously. The first transmission component (4) and the second transmission component (5) are respectively connected to the asymmetrical positions on the outer side of the temperature control mechanism (2), converting the rotational motion of the driving component (3) into the lifting and horizontal movement of the temperature control mechanism (2), so that the temperature control mechanism (2) is disengaged from the motherboard base (1). The driving component (3) includes a power source (301), a first gear set (302) and a synchronous shaft (303). The power source (301) drives the synchronous shaft (303) to rotate through the first gear set (302). The two ends of the synchronous shaft (303) are respectively equipped with second gear sets, which drive the first transmission component (4) and the second transmission component (5) to move respectively.

2. The apparatus of claim 1, wherein, Both the first transmission component (4) and the second transmission component (5) include a base plate (6). The base plate (6) is provided with a first driven wheel (601), a second driven wheel (602), a drive wheel (603), and a closed-loop transmission assembly (604). The first driven wheel (601) is located at the starting end of the lifting movement, the second driven wheel (602) is located at the starting end of the horizontal movement, and the drive wheel (603) is located at the end of the horizontal movement and is coaxially connected with the second gear set.

3. The apparatus of claim 2, wherein, The temperature control mechanism (2) has guide shafts fixed to its two diagonally opposite outer sides. When the temperature control mechanism (2) is in its initial position before the lifting movement, the guide shafts are fixedly connected to the corresponding parts of the transmission assembly (604).

4. The apparatus of claim 3, wherein, A rack portion is provided at the position corresponding to the guide shaft and the transmission component (604), and a tooth segment is provided at the position corresponding to the transmission component (604). The rack portion and the tooth segment are meshed and connected.

5. The apparatus of claim 3, wherein, The substrate (6) is also provided with a lifting track groove (605). The track groove is composed of a first inclined section and a second horizontal section that are interconnected. The angle between the first inclined section and the horizontal plane is 15°-75°. The second horizontal section is smoothly connected to the end of the first inclined section. The outer end of the guide shaft passes through the track groove and slides along the track groove.

6. The apparatus of claim 5, wherein, The length of the second horizontal section of the first transmission component (4) is L1, and the length of the second horizontal section of the second transmission component (5) is L2. L1 is greater than L2, and the difference between the two is the vertical distance between the two guide shafts on the temperature control mechanism (2).

7. The apparatus of claim 5, wherein, The substrate (6) is also provided with a plurality of positioning posts (606) so that the closed-loop path of the conveying component (604) is arranged around the outside of the track groove, and the bottom surface of the track groove is located above the support surface of the conveying component (604).

8. The apparatus of claim 1, wherein, It also includes a controller connected to the drive component (3) to control the drive component (3) to drive the first transmission component (4) and the second transmission component (5) to move forward or backward.

9. The apparatus of claim 1, wherein, It also includes a position sensor (7), which is disposed on the side of the synchronous shaft (303) of the drive component (3) facing the temperature control mechanism (2) and corresponds to the position where the temperature control mechanism (2) is lifted and the horizontal movement ends.

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