A multilayer chip common mode inductor

Abstract

This utility model discloses a multilayer chip common-mode inductor, relating to the field of electronic devices. It includes a protective housing with electrode terminals inserted into its left and right sides. Multiple first ceramic plates are installed between a pair of upper and lower protective housings, and second ceramic plates are positioned between the first ceramic plates. After the multiple first ceramic plates are stacked, protrusions are inserted into corresponding positioning slots. Arc protrusions at corresponding heights engage with anti-detachment slots on the positioning ceramic plates, preventing the multiple first ceramic plates from detaching. Multiple C-shaped coil traces are installed in mounting slots, and connecting posts are installed in clearance holes, maintaining the multiple C-shaped coil traces in a staggered, symmetrical stack, saving space and preventing interference between them. After sintering, the multiple first and second ceramic plates form a single unit, jointly protecting the internal C-shaped coil traces. This design prevents misalignment during pre-sintering movement, which could affect the quality of the common-mode inductor.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment, and in particular to a multilayer chip common mode inductor. Background Technology

[0002] Common-mode inductors, also known as common-mode chokes, are commonly used in computer switching power supplies to filter common-mode electromagnetic interference signals. In circuit board design, common-mode inductors also serve as EMI filters, used to suppress the outward radiation of electromagnetic waves generated by high-speed signal lines.

[0003] Existing multilayer common mode inductors require sintering during manufacturing. Before sintering, the multilayer ceramic or ferrite structure is easily disrupted during movement and transfer. The misaligned sintering of the common mode inductor will affect its performance. Therefore, a multilayer common mode inductor is needed. Utility Model Content

[0004] The purpose of this invention is to provide a multilayer chip common-mode inductor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer chip common mode inductor, comprising a protective shell, electrode terminals inserted into the left and right sides of the protective shell, a plurality of first ceramic plates installed between a pair of upper and lower protective shells, a second ceramic plate disposed between the first ceramic plates, a mounting groove formed on the surface of the first ceramic plate, a clearance hole formed on the inner bottom wall of the mounting groove, a C-shaped coil trace installed on the inner wall of the mounting groove, a connecting post fixedly connected to the surface of the C-shaped coil trace, the connecting post being installed inside the clearance hole, and a positioning anti-detachment mechanism fixedly connected to the surface of the second ceramic plate.

[0006] Preferably, the positioning and anti-detachment mechanism includes a positioning ceramic plate fixedly connected to the surface of the second ceramic sheet, and the surface of the first ceramic sheet has a groove.

[0007] Preferably, a pair of arc-shaped protrusions are fixedly connected to the inner wall of the groove, and multiple pairs of anti-detachment grooves are formed on the surface of the positioning ceramic plate, with the height of each pair of anti-detachment grooves corresponding to the height of the arc-shaped protrusions.

[0008] Preferably, a positioning groove is formed on the upper surface of the first ceramic sheet, and a protrusion is fixedly connected to the lower surface of the first ceramic sheet. The position of the protrusion corresponds to that of the positioning groove, and the protrusion is adapted to the positioning groove.

[0009] Preferably, a first conductive end is fixedly connected to the surface of the upper C-shaped coil trace, and a second conductive end is fixedly connected to the surface of the lower C-shaped coil trace. The first and second conductive ends extend and are respectively installed inside a pair of electrode terminals.

[0010] Preferably, the second ceramic sheet is installed in the middle of a pair of upper and lower protective shells, and the multiple C-shaped coil traces are staggered and symmetrically stacked.

[0011] In summary, the technical effects and advantages of this utility model are as follows:

[0012] In this invention, after multiple first ceramic sheets are stacked, protrusions are inserted into corresponding positioning slots. The arc protrusions at corresponding heights are engaged with the anti-detachment slots on the positioning ceramic plate to prevent the multiple first ceramic sheets from detaching. Multiple C-shaped coil traces are installed in the mounting slots, and connecting posts are installed in the clearance holes. This maintains the multiple C-shaped coil traces being stacked symmetrically and alternately, saving space and preventing interference between them. After sintering, the multiple first ceramic sheets and second ceramic sheets form a whole, jointly protecting the internal C-shaped coil traces. The advantage of this is that it prevents misalignment during movement before sintering, which would affect the quality of the common mode inductor. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0015] Figure 2 This is a three-dimensional structural diagram of the C-shaped coil trace in an embodiment of the present invention;

[0016] Figure 3 This is a cross-sectional view of the first ceramic sheet in an embodiment of the present invention;

[0017] Figure 4 This is a schematic diagram of the planar structure of the positioning ceramic plate in an embodiment of this utility model;

[0018] Figure 5 This is an embodiment of the present utility model. Figure 4 Enlarged structural diagram at point A;

[0019] Figure 6 This is a three-dimensional structural diagram of the protrusion in an embodiment of this utility model.

[0020] In the diagram: 1. Protective shell; 2. Electrode end; 3. First ceramic plate; 4. First conductive end; 5. Second conductive end; 6. C-shaped coil trace; 7. Connecting post; 8. Mounting groove; 9. Groove; 10. Arc protrusion; 11. Positioning ceramic plate; 12. Clearance hole; 13. Anti-detachment groove; 14. Protrusion; 15. Positioning groove; 16. Second ceramic plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example: Reference Figures 1-6 The illustrated multilayer common-mode inductor includes a protective shell 1, with electrode terminals 2 inserted into the left and right sides of the protective shell 1. Multiple first ceramic plates 3 are installed between a pair of upper and lower protective shells 1, and second ceramic plates 16 are disposed between the first ceramic plates 3. The surface of the first ceramic plates 3 has a mounting groove 8, and the inner bottom wall of the mounting groove 8 has a clearance hole 12. A C-shaped coil trace 6 is installed on the inner wall of the mounting groove 8, and a connecting post 7 is fixedly connected to the surface of the C-shaped coil trace 6. The connecting post 7 is installed inside the clearance hole 12, and a positioning anti-detachment mechanism is fixedly connected to the surface of the second ceramic plate 16.

[0023] With the above structure, the multiple first ceramic plates 3 and second ceramic plates 16 placed in a pair of electrode terminals 2 are protected by setting electrode terminals 2. The first ceramic plates 3 are provided with installation space by setting mounting groove 8. The connecting post 7 is provided with installation space by setting clearance hole 12. The C-shaped coil trace 6 is mainly used to suppress common mode interference. The connecting post 7 is used to ensure the line connection between the multiple C-shaped coil traces 6.

[0024] Preferably, the positioning and anti-detachment mechanism includes a positioning ceramic plate 11 fixedly connected to the surface of the second ceramic plate 16, and a groove 9 is formed on the surface of the first ceramic plate 3.

[0025] By setting a positioning ceramic plate 11, which blocks multiple first ceramic pieces 3 on one side to maintain stability, and by setting a groove 9, a pair of arc protrusions 10 are provided with installation space.

[0026] Preferably, a pair of arc protrusions 10 are fixedly connected to the inner wall of the groove 9, and multiple pairs of anti-detachment grooves 13 are opened on the surface of the positioning ceramic plate 11, with the height of the pair of anti-detachment grooves 13 corresponding to the height of the arc protrusions 10.

[0027] By setting multiple pairs of anti-detachment grooves 13, the arc protrusion 10 remains stably positioned after being placed in the anti-detachment groove 13, thus achieving the anti-detachment effect.

[0028] Preferably, a positioning groove 15 is provided on the upper surface of the first ceramic sheet 3, and a protrusion 14 is fixedly connected to the lower surface of the first ceramic sheet 3. The protrusion 14 corresponds to the positioning groove 15 and the protrusion 14 is adapted to the positioning groove 15.

[0029] By setting the protrusion 14, which cooperates with the positioning groove 15, the positioning of the multiple first ceramic pieces 3 is kept stable.

[0030] Preferably, a first conductive end 4 is fixedly connected to the surface of the upper C-shaped coil trace 6, and a second conductive end 5 is fixedly connected to the surface of the lower C-shaped coil trace 6. The first conductive end 4 and the second conductive end 5 extend and are respectively installed inside a pair of electrode terminals 2.

[0031] By setting the first conductive terminal 4 and the second conductive terminal 5, the power supply between the two ends of the electrode 2 is ensured.

[0032] Preferably, the second ceramic sheet 16 is installed in the middle of the upper and lower protective shells 1, and multiple C-shaped coil traces 6 are stacked symmetrically in an alternating manner.

[0033] By setting up multiple C-shaped coil traces 6 staggered and symmetrically stacked, space is saved and they do not interfere with each other.

[0034] The working principle of this utility model is as follows: In the production of a multilayer chip common mode inductor, multiple first ceramic sheets 3 are stacked and placed, and protrusions 14 are inserted into corresponding positioning slots 15 to keep the positioning of the multiple first ceramic sheets 3 stable. The arc protrusions 10 at the corresponding height are engaged in the anti-detachment slots 13 on the positioning ceramic plate 11 to prevent the multiple first ceramic sheets 3 from detaching. Multiple C-shaped coil traces 6 are installed in the mounting slots 8, and connecting posts 7 are installed in the clearance holes 12 to keep the multiple C-shaped coil traces 6 staggered and symmetrically stacked, saving space and preventing interference between them. After sintering, the multiple first ceramic sheets 3 and the second ceramic sheet 16 form a whole to jointly protect the internal C-shaped coil traces 6. Multilayer chip common mode inductors are usually used with other components, such as capacitors and resistors, to form a complete filter circuit.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multilayer chip common-mode inductor, comprising a protective housing (1), characterized in that: Electric terminals (2) are inserted into the left and right sides of the protective shell (1). Multiple first ceramic plates (3) are installed between the upper and lower pairs of the protective shells (1). A second ceramic plate (16) is provided between the first ceramic plates (3). An installation groove (8) is opened on the surface of the first ceramic plate (3). A clearance hole (12) is opened on the inner bottom wall of the installation groove (8). A C-shaped coil wire (6) is installed on the inner wall of the installation groove (8). A connecting post (7) is fixedly connected to the surface of the C-shaped coil wire (6). The connecting post (7) is installed inside the clearance hole (12). A positioning and anti-detachment mechanism is fixedly connected to the surface of the second ceramic plate (16).

2. The multilayer chip common-mode inductor according to claim 1, characterized in that: The positioning and anti-detachment mechanism includes a positioning ceramic plate (11) fixedly connected to the surface of the second ceramic plate (16), and a groove (9) is provided on the surface of the first ceramic plate (3).

3. A multilayer chip common-mode inductor according to claim 2, characterized in that: The inner wall of the groove (9) is fixedly connected with a pair of arc protrusions (10), and the surface of the positioning ceramic plate (11) is provided with multiple pairs of anti-detachment grooves (13), and the height of a pair of anti-detachment grooves (13) corresponds to that of the arc protrusions (10).

4. A multilayer chip common-mode inductor according to claim 1, characterized in that: The upper surface of the first ceramic sheet (3) is provided with a positioning groove (15), and the lower surface of the first ceramic sheet (3) is fixedly connected with a protrusion (14). The protrusion (14) corresponds to the positioning groove (15) and the protrusion (14) is adapted to the positioning groove (15).

5. A multilayer chip common-mode inductor according to claim 1, characterized in that: The surface of the upper C-shaped coil trace (6) is fixedly connected to a first conductive end (4), and the surface of the lower C-shaped coil trace (6) is fixedly connected to a second conductive end (5). The first conductive end (4) and the second conductive end (5) extend and are respectively installed inside a pair of electrode terminals (2).

6. A multilayer chip common-mode inductor according to claim 1, characterized in that: The second ceramic sheet (16) is installed in the middle of the upper and lower protective shells (1), and the multiple C-shaped coil traces (6) are stacked symmetrically in an alternating manner.

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