A multilayer inductor coil assembly

Abstract

This invention provides a multilayer inductor assembly for use in the field of inductors. The assembly includes a coil group wound around the outside of a magnetic core. A heat-conducting sleeve is sandwiched between the coil group and the magnetic core. A lower end cover and an upper end cover are fixed to both ends of the magnetic core, respectively. A base is provided at the bottom of the lower end cover and is mounted on a circuit board. When the multilayer inductor assembly is in operation, the heat generated by the coil group rises along the spiral outer air groove, enters the upper mounting groove of the upper end cover, and is dissipated to the outside through the gaps in the vortex heat sink. This forms a continuous air circulation cooling process, effectively solving the problems of poor heat dissipation and inconvenient installation of existing inductors, and improving the performance and reliability of the inductor assembly.

Description

Technical Field

[0001] This application relates to the field of inductors, and more particularly to a multilayer inductor assembly. Background Technology

[0002] In electronic devices, inductors are crucial components widely used in circuits for filtering, energy storage, and oscillation. As electronic devices evolve towards miniaturization and higher performance, the performance requirements for inductor assemblies are also increasing. Traditional inductors generate significant heat during operation; if this heat is not dissipated effectively, it can cause changes in inductance, affecting circuit operation and potentially damaging the inductor itself. Furthermore, existing inductors are not conveniently installed on circuit boards, and the stability and conductivity of the connection need improvement. Therefore, developing a multilayer inductor assembly with excellent heat dissipation and ease of installation is of significant practical importance. Utility Model Content

[0003] The purpose of this application is to solve the technical problems of poor heat dissipation and inconvenient installation of existing inductor coils. Compared with the prior art, it provides a multilayer inductor coil assembly, including a coil group, the coil group is wound around the outside of a magnetic core, and a heat-conducting sleeve is clamped between the coil group and the magnetic core. A lower end cover and an upper end cover are fixed at both ends of the magnetic core, and a base is provided at the bottom of the lower end cover. The base is mounted on a circuit board.

[0004] Furthermore, the heat-conducting sleeve is a heat-conducting silicone structure, and the heat-conducting sleeve has a number of spiral inner liquid chambers evenly distributed at equal angles. The spiral inner liquid chambers are filled with heat-conducting liquid, and a spiral outer air groove is provided between the adjacent sides of two sets of spiral inner liquid chambers. The spiral outer air groove is located on the outside of the heat-conducting sleeve.

[0005] Furthermore, the bottom of the upper end cover is provided with an upper mounting groove that matches the top of the magnetic core, and the top of the upper end cover is provided with a plurality of vortex heat sinks. The gap between adjacent vortex heat sinks is connected to the upper mounting groove, and the top of the spiral outer air groove extends into the upper mounting groove.

[0006] Furthermore, the top of the lower end cover is provided with a lower mounting groove that matches the bottom of the magnetic core, and the lower end cover is also provided with a through hole. The lower mounting groove is provided with a number of airflow channels that are evenly distributed at equal angles. The bottom end of the spiral outer air groove is connected to the through hole through the airflow channels.

[0007] Furthermore, a slot is provided on one side of the outer wall of the lower end cover, and a conductive contact is provided between adjacent slots. The wiring terminals of the coil group are electrically connected to the conductive contact. Four sets of limiting blocks are also fixed at the bottom of the lower end cover.

[0008] The base has four sets of pins evenly distributed at equal angles at its bottom. The base also has a card block that matches the card slot. The top of the pin extends to the space between adjacent card blocks and is fixed with a conductive ball head. The conductive ball head cooperates with the conductive contact. The base also has a limiting groove corresponding to the limiting block at its bottom.

[0009] Furthermore, the coil group is composed of multiple layers of coil windings, with the starting positions of the windings of adjacent layers of coil windings staggered by 60 degrees, and the winding pitch in the middle of each layer of coil windings being smaller than the winding pitch at both ends.

[0010] Compared to existing technologies, the advantages of this application are:

[0011] By using an upper cover with vortex heat sinks, a lower cover with airflow channels, and a heat-conducting sleeve with a spiral inner liquid chamber and a spiral outer air groove, when the multi-layer inductor coil assembly is working, the heat generated by the coil group is first transferred to the heat-conducting sleeve. The heat-conducting liquid in the spiral inner liquid chamber of the heat-conducting sleeve quickly absorbs the heat and transfers it to the air in the spiral outer air groove. The hot air rises along the spiral outer air groove, enters the upper mounting groove of the upper cover, and is dissipated to the outside through the gaps in the vortex heat sinks. At the same time, outside cold air enters the airflow channel through the through-hole of the lower cover, and then enters the spiral outer air groove to cool the heat-conducting sleeve, forming a continuous air circulation heat dissipation process. This effectively solves the problems of poor heat dissipation and inconvenient installation of existing inductor coils, and improves the performance and reliability of the inductor coil assembly. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the front structure of this application;

[0013] Figure 2 This is a schematic diagram of the bottom structure of this application;

[0014] Figure 3 This is a schematic diagram of the exploded structure of this application;

[0015] Figure 4 This is a schematic diagram of the structure of the heat-conducting sleeve proposed in this application;

[0016] Figure 5 This is a schematic diagram of the top structure of the upper end cap proposed in this application;

[0017] Figure 6 This is a schematic diagram of the bottom structure of the upper end cap proposed in this application;

[0018] Figure 7 This is a schematic diagram of the structure of the lower end cap proposed in this application;

[0019] Figure 8 This is a schematic diagram of the bottom structure of the base proposed in this application;

[0020] Figure 9 This is a schematic diagram of the coil assembly proposed in this application;

[0021] Figure 10 This is a cross-sectional structural diagram of this application.

[0022] Explanation of the labels in the diagram:

[0023] 1. Base; 11. Pin; 111. Conductive ball head; 12. Limiting groove; 13. Locking block; 2. Coil assembly; 3. Upper end cover; 31. Swirl heat sink; 32. Upper assembly groove; 4. Lower end cover; 41. Locking groove; 42. Conductive contact; 43. Lower assembly groove; 44. Through hole; 45. Airflow channel; 46. Limiting block; 5. Heat-conducting sleeve; 51. Spiral inner liquid chamber; 52. Spiral outer air groove; 6. Magnetic core. Detailed Implementation

[0024] The embodiments will be described clearly and completely with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application. Example

[0025] This utility model provides a multilayer inductor coil assembly. Please refer to [link / reference]. Figure 1 - Figure 10 The device includes a coil assembly 2, which is wound around the outside of the magnetic core 6. A heat-conducting sleeve 5 is sandwiched between the coil assembly 2 and the magnetic core 6. A lower end cover 4 and an upper end cover 3 are fixed to both ends of the magnetic core 6, respectively. A base 1 is provided at the bottom of the lower end cover 4, which is used to mount the device on the circuit board.

[0026] The heat-conducting sleeve 5 adopts a thermally conductive silicone structure, and its interior has several evenly spaced spiral inner liquid chambers 51, each filled with a heat-conducting liquid. A spiral outer air groove 52 is located between adjacent sides of two sets of spiral inner liquid chambers 51, and is positioned on the outer side of the heat-conducting sleeve 5. This design utilizes the excellent thermal conductivity of the heat-conducting liquid to quickly transfer the heat generated by the coil assembly 2, while the spiral outer air groove 52 provides a channel for air circulation, further enhancing the heat dissipation effect.

[0027] The bottom of the upper end cover 3 is provided with an upper mounting groove 32 that matches the top of the magnetic core 6, and the top of the upper end cover 3 is provided with several vortex heat sinks 31. The gaps between adjacent vortex heat sinks 31 are connected to the upper mounting groove 32, and the top of the spiral outer air groove 52 extends into the upper mounting groove 32. When the coil group 2 generates heat, the heat is transferred to the air in the spiral outer air groove 52 through the heat-conducting sleeve 5. The hot air rises into the upper mounting groove 32 and is dissipated to the outside through the gaps between adjacent vortex heat sinks 31. The vortex heat sinks 31 increase the heat dissipation area and improve the heat dissipation efficiency.

[0028] The lower end cover 4 has a lower mounting groove 43 on its top that matches the bottom of the magnetic core 6, and a through hole 44 on its lower end cover 4. The lower mounting groove 43 contains several airflow channels 45 evenly distributed at equal angles. The bottom end of the spiral outer air groove 52 is connected to the through hole 44 via the airflow channels 45. Outside cold air can enter the airflow channels 45 through the through hole 44, and then enter the spiral outer air groove 52 to cool the heat-conducting sleeve 5, forming a complete air circulation heat dissipation system.

[0029] A slot 41 is provided on one side of the outer wall of the lower end cover 4, and a conductive contact 42 is provided between adjacent slots 41. The wiring terminals of the coil group 2 are electrically connected to the conductive contact 42. Four sets of equally spaced limiting blocks 46 are also fixed at the bottom of the lower end cover 4. Four sets of equally spaced pins 11 are provided at the bottom of the base 1. The base 1 has a locking block 13 that matches the slot 41. The top of the pin 11 extends to the space between adjacent locking blocks 13 and a conductive ball head 111 is fixed thereon. The conductive ball head 111 cooperates with the conductive contact 42. The bottom of the base 1 also has a limiting groove 12 corresponding to the limiting block 46. This connection structure makes it easy to install the lower end cover 4 and the base 1. When the component is damaged, it can be quickly disassembled and replaced, while ensuring good conductivity and connection stability.

[0030] Coil group 2 is composed of multiple layers of coil windings. The starting positions of the windings of adjacent layers are staggered by 60 degrees, and the winding pitch in the middle of each layer is smaller than the winding pitch at both ends. This winding method can optimize the electromagnetic performance of the inductor coil and improve the stability of the inductance value.

[0031] In the actual assembly of the multilayer inductor coil assembly, firstly, the heat-conducting sleeve 5 is placed on the magnetic core 6, and then the coil group 2 is wound around the outside of the heat-conducting sleeve 5. Next, the upper end cover 3 is installed on the top of the magnetic core 6 through the upper mounting groove 32, and the lower end cover 4 is installed on the bottom of the magnetic core 6 through the lower mounting groove 43. After that, the locking block 13 of the base 1 is aligned with the locking groove 41 of the lower end cover 4 for installation, so that the conductive ball head 111 makes good contact with the conductive contact 42, and at the same time, the limiting block 46 is locked into the limiting groove 12, completing the installation of the entire assembly.

[0032] When the multilayer inductor coil assembly is working, the heat generated by coil group 2 is first transferred to the heat-conducting sleeve 5. The heat-conducting liquid in the spiral inner liquid chamber 51 inside the heat-conducting sleeve 5 quickly absorbs the heat and transfers it to the air in the spiral outer air groove 52. The hot air rises along the spiral outer air groove 52, enters the upper mounting groove 32 of the upper end cover 3, and is dissipated to the outside through the gaps in the vortex heat sink 31. At the same time, outside cold air enters the airflow channel 45 through the through hole 44 of the lower end cover 4, and then enters the spiral outer air groove 52 to cool the heat-conducting sleeve 5, forming a continuous air circulation heat dissipation process.

[0033] In terms of circuit connection, the terminals of coil group 2 are electrically connected to the conductive contacts 42 on the lower end cover 4, and the pins 11 of the base 1 are electrically connected to the conductive contacts 42 through the conductive ball head 111, thereby connecting the multilayer inductor coil assembly into the circuit board to realize its function in the circuit. At the same time, when the coil group 2 is damaged, there is no need to remove the base 1 and pins 11 from the circuit board, and the components can be quickly replaced, improving the convenience of maintenance.

[0034] Through the above structural design and implementation method, the multilayer inductor coil assembly of this utility model effectively solves the problems of poor heat dissipation and inconvenient installation of existing inductor coils, and improves the performance and reliability of the inductor coil assembly.

[0035] The above description is only the best implementation method adopted in this application in combination with current practical needs, but the scope of protection of this application is not limited thereto.

Claims

1. A multilayer inductor coil assembly, comprising a coil group (2), characterized in that, The coil group (2) is wound around the outside of the magnetic core (6). A heat-conducting sleeve (5) is also sandwiched between the coil group (2) and the magnetic core (6). The two ends of the magnetic core (6) are respectively fixed with a lower end cover (4) and an upper end cover (3). The bottom of the lower end cover (4) is also provided with a base (1). The base (1) is installed on the circuit board. The heat-conducting sleeve (5) is a heat-conducting silicone structure. The heat-conducting sleeve (5) is provided with a number of spiral inner liquid chambers (51) evenly distributed at equal angles. The spiral inner liquid chambers (51) are filled with heat-conducting liquid. A spiral outer air groove (52) is provided between the adjacent sides of the two sets of spiral inner liquid chambers (51). The spiral outer air groove (52) is located on the outside of the heat-conducting sleeve (5).

2. A multi-layer inductor coil assembly according to claim 1, wherein, The bottom of the upper end cover (3) is provided with an upper mounting groove (32) that matches the top of the magnetic core (6). The top of the upper end cover (3) is provided with a plurality of vortex heat sinks (31). The gap between adjacent vortex heat sinks (31) is connected to the upper mounting groove (32). The top of the spiral external air groove (52) extends into the upper mounting groove (32).

3. A multi-layer inductor coil assembly according to claim 1, wherein The top of the lower end cover (4) is provided with a lower mounting groove (43) that matches the bottom of the magnetic core (6). The lower end cover (4) is also provided with a through hole (44). The lower mounting groove (43) is provided with several airflow channels (45) evenly distributed at equal angles. The bottom end of the spiral outer air groove (52) is connected to the through hole (44) through the airflow channel (45).

4. A multi-layer inductor coil assembly according to claim 3, wherein, The lower end cover (4) is also provided with a slot (41) on one side of its outer wall. A conductive contact (42) is provided between adjacent slots (41). The wiring terminals of the coil group (2) are electrically connected to the conductive contact (42). Four sets of limiting blocks (46) are also fixed at the bottom of the lower end cover (4). The base (1) has four sets of pins (11) evenly distributed at equal angles at the bottom. The base (1) also has a card block (13) that matches the card slot (41). The top of the pin (11) extends to the adjacent card block (13) and is fixed with a conductive ball head (111). The conductive ball head (111) cooperates with the conductive contact (42). The base (1) also has a limiting groove (12) corresponding to the limiting block (46) at the bottom.

5. A multi-layer inductor coil assembly according to claim 1, wherein The coil group (2) is composed of multiple layers of coil windings. The starting positions of the windings of two adjacent layers of coil windings are staggered by 60 degrees. The winding pitch in the middle of each layer of coil windings is smaller than the winding pitch at both ends.

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