A transformer heat dissipation installation structure
By combining a heat dissipation shell, PCB board, container cover and heat-conducting sheet, and using thermally conductive potting compound and thermally conductive metal materials, the problems of high heat dissipation cost and dust accumulation in transformers are solved, achieving efficient heat dissipation and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HONTECH WINS ELECTRONICS CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-05-26
AI Technical Summary
Existing transformer heat dissipation methods suffer from high costs, complex manufacturing processes, and a tendency to accumulate dust.
It adopts a combination structure of heat dissipation shell, PCB board, container cover and heat conduction sheet, and uses thermally conductive potting compound to fill the gaps and cure them into one piece to form an efficient heat conduction path, combined with thermally conductive metal material and heat dissipation fin design.
This improved the transformer's heat dissipation efficiency, reduced its operating temperature, ensured performance stability and service life, and lowered costs.
Smart Images
Figure CN224287941U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of transformer heat dissipation technology, and specifically to a transformer heat dissipation installation structure. Background Technology
[0002] Transformers are typically made of multiple layers of enameled wire and insulation material wound on a transformer frame. When energized, they generate a lot of heat. The internal enameled wire is usually tens of degrees Celsius hotter than the surface enameled wire. Transformers are major heat-generating components in electronic products. Manufacturers usually try to cool the components by adding fans (to increase airflow) or large heat sinks. However, adding fans can lead to dust accumulation inside the product, increasing the failure rate, while adding large heat sinks increases product costs and complicates the manufacturing process.
[0003] Therefore, a transformer heat dissipation mounting structure is needed to solve the above problems. Utility Model Content
[0004] To overcome the shortcomings of existing technologies, this utility model provides a transformer heat dissipation installation structure that is simple in structure and low in cost, greatly improves the heat dissipation efficiency of the transformer, effectively reduces the operating temperature of the transformer, ensures the stable performance and service life of the transformer, and has high stability.
[0005] The technical solution adopted by this utility model to solve its technical problem is:
[0006] A transformer heat dissipation mounting structure includes: a heat dissipation shell, a PCB board, a container cover, and a heat-conducting sheet. The PCB board is fixed inside the heat dissipation shell and is used to fix and connect the transformer. The container cover is disposed outside the transformer, and thermally conductive potting compound is filled between the container cover and the transformer. The heat-conducting sheet is connected between the container cover and the heat dissipation shell.
[0007] As a further improvement to the above technical solution, the heat dissipation shell includes a bottom groove, a top cover, and side plates. The bottom of the bottom groove is provided with multiple mounting posts, the PCB board is fixedly connected to the mounting posts, the top cover is connected to the upper end of the bottom groove, the heat-conducting sheet is connected to the inner wall of the top cover, and the side plates are connected to both ends of the bottom groove.
[0008] As a further improvement to the above technical solution, the outer walls of the bottom groove and the top cover are provided with multiple heat dissipation fins.
[0009] As a further improvement to the above technical solution, a number of heat dissipation holes are provided on the side plate.
[0010] As a further improvement to the above technical solution, a bending plate is provided on one side end of the side plate, and mounting holes are provided on the bending plate.
[0011] As a further improvement to the above technical solution, the container cover is made of thermally conductive metal.
[0012] As a further improvement to the above technical solution, the heat-conducting sheet is set as heat-dissipating silicone putty.
[0013] As a further improvement to the above technical solution, the thermally conductive potting compound is set as AB thermally conductive adhesive.
[0014] The beneficial effects of this utility model are:
[0015] This invention places the transformer inside a metal container, filling the gaps between the transformer and the container with a fluid thermally conductive potting compound. After the potting compound cures, the transformer, the potting compound, and the container become a single transformer assembly. This allows the transformer's heat to be dissipated to the external environment sequentially through the thermally conductive potting compound, the container, and the heat dissipation shell, forming a highly efficient heat conduction path. This significantly improves the transformer's heat dissipation efficiency, effectively reduces the transformer's operating temperature, and ensures stable performance and extended service life. Attached Figure Description
[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0017] Figure 1 This is an assembly diagram of the transformer heat dissipation installation structure of this utility model;
[0018] Figure 2 This is an exploded view of the transformer heat dissipation installation structure of this utility model;
[0019] Figure 3 This is a schematic diagram of the structure of the heat dissipation shell of this utility model.
[0020] Reference numerals: 1. Heat sink housing; 11. Bottom groove; 12. Top cover; 13. Side plate; 14. Mounting post; 15. Heat sink fins; 16. Heat dissipation holes; 17. Bending plate; 18. Mounting holes; 2. PCB board; 3. Transformer; 4. Container cover; 5. Thermal conductive sheet; 6. Thermally conductive potting compound. Detailed Implementation
[0021] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.
[0022] Reference Figures 1 to 3 A transformer heat dissipation mounting structure includes a heat dissipation shell 1, a PCB board 2, a container cover 4, and heat-conducting sheets 5. The PCB board 2, serving as the basic platform for the electrical connection and installation of various components in the electronic product, is securely mounted inside the heat dissipation shell 1 to ensure that it does not loosen due to vibration or other factors during operation, thereby ensuring the stability of the electrical connection of the entire electronic product. The transformer 3, as the main heat-generating component in the electronic product, is precisely fixed to the PCB board 2 through welding or other reliable electrical connection methods according to the product's electrical design requirements. Furthermore, the shape and size of the container cover 4 are determined according to… Customized according to the appearance and size of transformer 3, it is set outside transformer 3 to form a relatively independent and sealed space. This space between the container cover 4 and transformer 3 is filled with a thermally conductive potting compound 6 with good thermal conductivity and flowability. During the filling process, the thermally conductive potting compound 6 can fully penetrate into all the gaps of transformer 3. After curing, it tightly bonds transformer 3 and container cover 4 together to form an integral structure. This not only enhances heat conduction efficiency but also provides a certain degree of protection for transformer 3, such as moisture and dust prevention. Furthermore, the heat-conducting plate 5 connects container cover 4 and heat dissipation shell 1. The function of heat-conducting plate 5 is to further reduce thermal resistance, allowing the heat accumulated on container cover 4 to be transferred to heat dissipation shell 1 more quickly and effectively.
[0023] Reference Figure 1 , Figure 3In this embodiment of the utility model, the heat dissipation housing 1 includes a bottom groove 11, a top cover 12, and side plates 13. The bottom of the bottom groove 11 is provided with multiple mounting posts 14. The position and spacing of the mounting posts 14 are determined according to the size of the PCB board 2 and the installation requirements. The PCB board 2 is securely fixed to the mounting posts 14 using reliable fastening methods such as screws or snap-fit connections. This design not only ensures the stability of the PCB board 2 during operation and prevents electrical connections from loosening due to vibration, but also maintains a certain gap between the PCB board 2 and the bottom groove 11, which facilitates airflow and aids in heat dissipation. The top cover 12 is connected to the upper end of the bottom groove 11, forming a relatively enclosed space together with the bottom groove 11, protecting the internal electronic components. The heat-conducting sheet 5 is connected to the inner wall of the top cover 12, ensuring that the heat from the container cover 4 can be smoothly transferred to the top cover 12. Both ends of the bottom groove 11 are connected to the side plates 13, further enclosing and protecting the internal components, while also playing an important role in heat dissipation.
[0024] Specifically, to enhance heat dissipation and improve heat dissipation efficiency, the outer walls of the bottom groove 11 and the top cover 12 are provided with multiple heat dissipation fins 15. These heat dissipation fins 15 are arranged in a regular pattern, which greatly increases the contact area between the heat dissipation shell 1 and the outside air, allowing heat to be dissipated into the surrounding environment more quickly. The shape and size of the heat dissipation fins 15 have been optimized to maximize heat dissipation performance while ensuring structural strength.
[0025] Specifically, the side plate 13 is provided with a number of heat dissipation holes 16, which can ensure that the air forms effective convection inside the heat dissipation shell 1 to accelerate the dissipation of heat, and can also prevent a large amount of dust and other impurities from entering the interior and affecting the normal operation of electronic components.
[0026] Specifically, in order to facilitate the installation of the entire electronic product onto other equipment or racks, a bending plate 17 is provided on one side of the side plate 13, and a mounting hole 18 is provided on the bending plate 17. The position and size of the mounting hole 18 are designed according to the installation standards and actual installation requirements. By passing screws or other connecting parts through the mounting hole 18, the electronic product can be firmly fixed in the target position.
[0027] Reference Figure 2In this embodiment of the invention, to ensure that the heat generated by the transformer can be efficiently conducted away and achieve good heat dissipation, the container cover 4 is made of a metal material with excellent thermal conductivity. This thermally conductive metal material typically has a high thermal conductivity coefficient, such as copper or aluminum. Copper has excellent thermal conductivity and can quickly transfer heat from inside the transformer, but its cost is relatively high; aluminum, on the other hand, has a moderate cost, meets certain thermal conductivity requirements, and is relatively lightweight, which is beneficial for the overall lightweight design of the product. Considering factors such as cost, thermal conductivity, and overall product design requirements, a suitable thermally conductive metal material is selected to manufacture the container cover 4, so that it can protect the transformer while also serving as an important intermediate medium for heat transfer.
[0028] Reference Figure 2 In this embodiment of the invention, the heat-conducting sheet 5 plays a crucial role as a heat transfer bridge in the entire heat dissipation structure. After repeated experiments and selection, the heat-conducting sheet 5 was chosen as heat-dissipating silicone putty. Heat-dissipating silicone putty has good flexibility and plasticity, allowing it to easily fill the irregular gaps between the container cover 4 and the heat dissipation shell 1, ensuring a tight fit between the two and significantly reducing thermal resistance. Furthermore, the heat-dissipating silicone putty also possesses excellent thermal conductivity, enabling it to quickly and stably conduct heat from the container cover 4 to the heat dissipation shell, further improving heat dissipation efficiency. Simultaneously, it also has certain insulating properties, preventing short circuits and other safety issues caused by electrical contact while conducting heat, thus ensuring the electrical safety of the product.
[0029] Reference Figure 2 In this embodiment of the invention, the thermally conductive potting compound 6 is an AB thermally conductive adhesive. AB thermally conductive adhesive is a two-component addition-type silicone potting compound with characteristics such as low viscosity, high thermal conductivity, good insulation, and weather resistance. In use, agents A and B are mixed in a precise ratio, then thoroughly stirred to allow a chemical reaction and gradual curing. Before curing, this AB thermally conductive adhesive has good fluidity, easily penetrating into the minute gaps of the transformer 3, completely encapsulating it. After curing, it forms a robust colloid that not only tightly fixes the transformer 3, preventing loosening due to vibration during operation, but also provides excellent heat conduction channels, rapidly transferring heat generated inside the transformer to the container cover 4. Furthermore, the AB thermally conductive adhesive also possesses excellent insulation properties, weather resistance, and chemical stability, enabling long-term stable operation under various environmental conditions, providing reliable protection and heat dissipation support for the transformer.
[0030] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A transformer heat dissipation mounting structure, characterized in that, The device includes a heat dissipation shell, a PCB board, a container cover, and a thermally conductive sheet. The PCB board is fixed inside the heat dissipation shell and is used to fix and connect the transformer. The container cover is disposed outside the transformer, and thermally conductive potting compound is filled between the container cover and the transformer. The thermally conductive sheet is connected between the container cover and the heat dissipation shell.
2. The transformer heat dissipation mounting structure according to claim 1, characterized in that: The heat dissipation housing includes a bottom groove, a top cover, and side plates. The bottom of the bottom groove is provided with multiple mounting posts, and the PCB board is fixedly connected to the mounting posts. The top cover is connected to the upper end of the bottom groove, and the heat-conducting sheet is connected to the inner wall of the top cover. The side plates are connected to both ends of the bottom groove.
3. The transformer heat dissipation mounting structure according to claim 2, characterized in that: The outer walls of the bottom groove and the top cover are provided with multiple heat dissipation fins.
4. The transformer heat dissipation mounting structure according to claim 2, characterized in that: The side plate is provided with several heat dissipation holes.
5. The transformer heat dissipation mounting structure according to claim 2, characterized in that: A bending plate is provided on one side end of the side plate, and mounting holes are provided on the bending plate.
6. The transformer heat dissipation mounting structure according to claim 1, characterized in that: The container cover is made of thermally conductive metal.
7. The transformer heat dissipation mounting structure according to claim 1, characterized in that: The heat-conducting sheet is made of heat-dissipating silicone putty.
8. The transformer heat dissipation mounting structure according to claim 1, characterized in that: The thermally conductive potting compound is set as AB thermally conductive adhesive.