A solid-state laser semiconductor saturable absorber packaging device

Abstract

This utility model relates to the field of semiconductor saturable absorber protection technology, specifically to a solid-state laser semiconductor saturable absorber packaging device, including a base, a SESAM body, a lens barrel, and a dustproof lens; one end of the lens barrel is sleeved on the outside of the dustproof lens, and the other end of the lens barrel is connected to the base; the SESAM body is disposed inside the lens barrel, and the SESAM body is connected to the upper end face of the base; by adding a lens barrel and a dustproof lens, the SESAM body is encapsulated and protected, isolated from the external environment, avoiding frictional contact between the SESAM body and external dust particles, preventing external environmental pollution, ensuring the service life of the SESAM body, and meeting practical application requirements.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor saturable absorber protection technology, specifically to a solid-state laser semiconductor saturable absorber packaging device. Background Technology

[0002] The packaging of SESAM is crucial to the development of ultrafast lasers, as it relates to the laser's mode-locking properties, stability, and reliability.

[0003] Currently, in solid-state laser applications, SESAMs are generally simply pasted onto a base. For example, Chinese invention patent application CN112864788A provides a SESAM packaging structure in which the SESAM is placed on a base and inside the base and adapter after installation. However, the SESAM is in contact with the external environment at this time, which makes it easy for fine particles such as dust in the external environment to damage the SESAM and reduce its service life. Utility Model Content

[0004] The purpose of this invention is to provide a packaging device for a solid-state laser semiconductor saturable absorber, thereby solving the technical problem of the low service life of current solid-state laser semiconductor saturable absorbers.

[0005] The solution of this utility model to the above-mentioned technical problems is as follows:

[0006] A solid-state laser semiconductor saturable absorber packaging device includes a base, a SESAM body, a lens barrel, and a dustproof lens;

[0007] One end of the lens tube is fitted onto the outside of the dustproof lens, and the other end of the lens tube is connected to the base. The SESAM body is placed inside the lens tube, and the SESAM body is connected to the upper surface of the base.

[0008] Further specified, the lens barrel and the base are coaxially arranged, and the SESAM body is coaxially arranged with the base.

[0009] Furthermore, the upper end face of the dustproof lens is parallel to the lower end face of the dustproof lens, and the upper end face of the dustproof lens is inclined about the axis of the lens tube.

[0010] Further specified, the angle between the upper end face of the dustproof lens and the lens barrel is 5°~15°, and both the upper end face and the lower end face of the dustproof lens are coated with an anti-reflective film.

[0011] Furthermore, the lens barrel is rotatably connected to the base.

[0012] Further specified, a limiting frustum is provided on the inner wall of the lens barrel, the upper end face of the limiting frustum mates with the lower end face of the dustproof lens, and the inner diameter of the limiting frustum is larger than the outer diameter of the SESAM body.

[0013] The solid-state laser semiconductor saturable absorber packaging device further includes a front-end fixing cylinder, one end of which is sleeved on the outside of the front-end fixing cylinder connecting end. The connecting end of the front-end fixing cylinder is movably connected to one end of the lens cylinder, and the dustproof lens is disposed between the limiting frustum and the front-end fixing cylinder connecting end.

[0014] Further specified, the front fixing cylinder is threadedly connected to the lens barrel, and a gasket is provided at the connecting end of the front fixing cylinder. The gasket is placed between the dustproof lens and the connecting end of the front fixing cylinder, and the bottom end face of the gasket mates with the upper end face of the dustproof lens.

[0015] Furthermore, the solid-state laser semiconductor saturable absorber packaging device also includes a connecting cylinder, one end of which is sleeved on the outside of the other end of the mirror tube, and the other end of which is threadedly connected to the base. The connecting cylinder is coaxially arranged with the mirror tube and the base respectively.

[0016] Further specified, the connecting cylinder is provided with a limiting bolt, the tail end of the limiting bolt is located outside the connecting cylinder, and the head end of the limiting bolt passes through the connecting cylinder along the axial direction of the connecting cylinder and contacts the outer wall of the lens barrel.

[0017] Further specifying, the base is provided with a heat dissipation medium plate, and the SESAM body is connected to the base through the heat dissipation medium plate.

[0018] The beneficial effects of this utility model are as follows:

[0019] 1. This utility model encapsulates and protects the SESAM body by adding a lens barrel and a dustproof lens, isolating it from the external environment, preventing the SESAM body from rubbing against and coming into contact with dust particles in the external environment, avoiding pollution from the external environment, ensuring the service life of the SESAM body, and meeting actual use needs.

[0020] 2. This utility model features an inclined dustproof lens. By rotating the lens barrel, the laser irradiation point on the SESAM body can be adjusted. When the irradiation point on the SESAM body is damaged, rotating the dustproof lens allows for easy replacement of the irradiation point, avoiding frequent disassembly and assembly of the SESAM body, thus extending its service life and reducing costs. Furthermore, the use of limiting bolts to fix the rotation angle makes operation convenient and simple, improving work efficiency.

[0021] 3. This utility model also provides a heat dissipation medium plate on the base to increase the heat dissipation effect of the SESAM body, further increase the service life of the SESAM body, and meet the actual use requirements. Attached Figure Description

[0022] Figure 1 This is a structural diagram of the solid-state laser semiconductor saturable absorber packaging device of this utility model;

[0023] Figure 2 This is a cross-sectional view of the solid-state laser semiconductor saturable absorber packaging device of this utility model;

[0024] Figure 3 This is a schematic diagram of the dustproof mirror structure of this utility model;

[0025] Figure 4 This is a schematic diagram of the base structure of this utility model.

[0026] In the diagram, 10-base; 11-heat dissipation medium plate; 20-SESAM body; 30-lens; 31-limiting frustum; 40-dustproof lens; 50-front fixing cylinder; 51-gasket; 60-connecting cylinder; 61-limiting bolt. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of the embodiments of this utility model, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0031] Example 1

[0032] refer to Figure 1 This invention provides a solid-state laser semiconductor saturable absorber (SESAM) packaging device, including a base 10, a SESAM body 20, a lens barrel 30, and a dustproof mirror 40. One end of the lens barrel 30 is sleeved on the outside of the dustproof mirror 40, and the other end of the lens barrel 30 is connected to the base 10. The SESAM body 20 is disposed inside the lens barrel 30 and connected to the upper end face of the base 10, thereby encapsulating the SESAM body 20 in the internal structure composed of the lens barrel 30, the base 10, and the dustproof mirror 40, isolating the external environment from contamination of the SESAM body 20, improving the service life of the SESAM body 20, and ensuring stable and reliable use.

[0033] To further explain, the lens barrel 30 is coaxially arranged with the base 10, the SESAM body 20 is coaxially arranged with the base 10, and the dustproof lens 40 and the lens barrel 30 can be connected by snap-fit ​​or tight connection.

[0034] Preferably, a limiting frustum 31 is provided on the inner wall of the lens barrel 30. The limiting frustum 31 is a ring structure, and the inner diameter of the limiting frustum 31 is slightly smaller than the inner diameter of the lens barrel 30, which is used to engage the edge of the dustproof lens 40.

[0035] Further optimization, reference Figure 2 and Figure 3 The upper end face of the dustproof lens 40 is parallel to the lower end face of the dustproof lens 40. The angle between the upper end face of the dustproof lens 40 and the axis of the lens barrel 30 is not equal to 90°, that is, the dustproof lens 40 is tilted. The periphery of the dustproof lens 40 is in contact with the inner wall of the lens barrel 30. At this time, the lower end face of the limiting frustum 31 is perpendicular to the axis of the lens barrel 30, and the upper end face of the limiting frustum 31 is in contact with the lower end face of the dustproof lens 40.

[0036] By tilting the dustproof mirror 40, multi-beam interference is disrupted, the etalon effect is reduced, and the etalon effect generated when the dustproof mirror 40 is perpendicular to the axis of the mirror tube 30 is reduced. This mitigates the intensification of longitudinal mode competition caused by the frequency selectivity of multi-beam interference, which would otherwise damage the wavelength stability and mode-locking performance of the laser.

[0037] The angle between the upper end face of the dustproof lens 40 and the axis of the lens barrel 30 is an acute angle, preferably 5°~15°, and more preferably 10°; at the same time, in order to improve the transmittance of the dustproof lens 40 and reduce the reflectance of the dustproof lens 40, an anti-reflection coating is applied to both the upper and lower end faces of the dustproof lens 40.

[0038] To ensure the stable and reliable connection between the dustproof lens 40 and the lens barrel 30, it is preferable to provide a front fixing cylinder 50 on the lens barrel 30. The connecting end of the front fixing cylinder 50 extends through the end of the lens barrel 30 to contact the upper end surface of the dustproof lens 40, so as to stabilize the dustproof lens 40 between the front fixing cylinder 50 and the limiting frustum 31.

[0039] At this time, the inner diameter of the limiting frustum 31 needs to be larger than the outer diameter of the SESAM body 20 to avoid interfering with the operation of the SESAM body 20.

[0040] Preferably, in order to avoid damage to the surface of the dustproof lens 40 by the front fixing cylinder 50, a gasket 51 is provided at the connecting end of the front fixing cylinder 50. The inner diameter of the gasket 51 is smaller than the inner diameter of the front fixing cylinder 50, and the gasket 51 is disposed between the front fixing cylinder 50 and the upper surface of the dustproof lens 40.

[0041] By utilizing the stable connection between the front fixing cylinder 50 and the lens barrel 30, the dustproof lens 40 and the limiting frustum 31 can be stably connected by the gasket 51 to prevent shaking and ensure the seal of the lens barrel 30; the front fixing cylinder 50 and the lens barrel 30 can be connected by a thread.

[0042] To further explain, the solid-state laser semiconductor saturable absorber packaging device also includes a connecting cylinder 60. One end of the connecting cylinder 60 is sleeved on the outside of the other end of the mirror barrel 30, and the other end of the connecting cylinder 60 is threadedly connected to the base 10. The connecting cylinder 60 is coaxially arranged with the mirror barrel 30 and the base 10 respectively.

[0043] By setting the connecting tube 60, the connection position between the lens tube 30 and the base 10 can be protected, further ensuring the reliable isolation of the SESAM body 20 from the external environment.

[0044] Preferably, the connecting cylinder 60 is movably connected to the lens barrel 30, and the lens barrel 30 can rotate around its own axis, thereby driving the dustproof lens 40 to rotate. This allows the refraction of the dustproof lens 40 to change the irradiation point of the incident laser on the SESAM body 20, thereby adjusting the position of the laser point on the SESAM body 20. This ensures that if the quality of the irradiation point of the continuously working SESAM body 20 decreases or is damaged during long-term use, the position of the irradiation point on the SESAM body 20 can be adjusted by rotating the lens barrel 30, avoiding the need for disassembly and replacement of the SESAM body 20, reducing costs, and increasing the service life of the SESAM body 20.

[0045] To prevent the connection between the scope tube 30 and the connecting tube 60 from becoming unstable and loose, thus causing instability of the irradiation point on the SESAM body 20, a limiting bolt 61 is installed on the connecting tube 60. The tail end of the limiting bolt 61 is located on the outside of the connecting tube 60, and the head end of the limiting bolt 61 passes through the connecting tube 60 along the axial direction of the connecting tube 60 and contacts the outer wall of the scope tube 30.

[0046] When rotating the lens barrel 30, loosen the limiting bolt 61. After the lens barrel 30 has rotated, tighten the limiting bolt 61 through the tail end to limit the lens barrel 30 and ensure higher reliability in use.

[0047] For further explanation, please refer to Figure 4 The base 10 is provided with a heat dissipation medium plate 11. The SESAM body 20 is connected to the base 10 through the heat dissipation medium plate 11. The base 10 can be made of copper, and the heat dissipation medium plate 11 can be made of diamond sheet, which improves the heat dissipation effect of the SESAM body 20 and further improves the service life of the SESAM body 20.

[0048] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is only for illustrating the technical concept of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications made to the technical solutions based on the technical concept proposed by this utility model shall fall within the scope of protection of the claims of this utility model.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A packaging device for a solid-state laser semiconductor saturable absorber, characterized in that, Includes base (10), SESAM body (20), lens barrel (30) and dustproof lens (40); One end of the lens tube (30) is fitted onto the outside of the dustproof lens (40), and the other end of the lens tube (30) is connected to the base (10). The SESAM body (20) is set inside the lens tube (30), and the SESAM body (20) is connected to the upper surface of the base (10).

2. The solid-state laser semiconductor saturable absorber packaging device according to claim 1, characterized in that, The lens tube (30) is coaxially arranged with the base (10), and the SESAM body (20) is coaxially arranged with the base (10).

3. The solid-state laser semiconductor saturable absorber packaging device according to claim 2, characterized in that, The upper end face of the dustproof mirror (40) is parallel to the lower end face of the dustproof mirror (40), and the upper end face of the dustproof mirror (40) is inclined about the axis of the mirror tube (30).

4. The solid-state laser semiconductor saturable absorber packaging device according to claim 3, characterized in that, The angle between the upper end face of the dustproof mirror (40) and the mirror tube (30) is 5°~15°, and both the upper end face and the lower end face of the dustproof mirror (40) are coated with an anti-reflective film.

5. The solid-state laser semiconductor saturable absorber packaging device according to claim 3, characterized in that, The lens tube (30) is rotatably connected to the base (10).

6. The solid-state laser semiconductor saturable absorber packaging device according to claim 5, characterized in that, A limiting frustum (31) is provided on the inner wall of the lens tube (30). The upper end face of the limiting frustum (31) is engaged with the lower end face of the dustproof lens (40). The inner diameter of the limiting frustum (31) is larger than the outer diameter of the SESAM body (20). The solid-state laser semiconductor saturable absorber packaging device further includes a front-end fixing cylinder (50), one end of the lens cylinder (30) is sleeved on the outside of the connecting end of the front-end fixing cylinder (50), the connecting end of the front-end fixing cylinder (50) is movably connected to one end of the lens cylinder (30), and the dustproof lens (40) is disposed between the limiting frustum (31) and the connecting end of the front-end fixing cylinder (50).

7. The solid-state laser semiconductor saturable absorber packaging device according to claim 6, characterized in that, The front fixing cylinder (50) is threadedly connected to the lens barrel (30). A gasket (51) is provided at the connection end of the front fixing cylinder (50). The gasket (51) is provided between the dustproof lens (40) and the connection end of the front fixing cylinder (50). The bottom end face of the gasket (51) is engaged with the upper end face of the dustproof lens (40).

8. The solid-state laser semiconductor saturable absorber packaging device according to claim 7, characterized in that, The solid-state laser semiconductor saturable absorber packaging device further includes a connecting cylinder (60), one end of which is sleeved on the outside of the other end of the mirror tube (30), and the other end of which is threadedly connected to the base (10). The connecting cylinder (60) is coaxially arranged with the mirror tube (30) and the base (10) respectively.

9. The solid-state laser semiconductor saturable absorber packaging device according to claim 8, characterized in that, The connecting cylinder (60) is provided with a limiting bolt (61). The tail end of the limiting bolt (61) is located outside the connecting cylinder (60), and the head end of the limiting bolt (61) passes through the connecting cylinder (60) along the axial direction of the connecting cylinder (60) and contacts the outer wall of the lens barrel (30).

10. The solid-state laser semiconductor saturable absorber packaging device according to any one of claims 1 to 9, characterized in that, The base (10) is provided with a heat dissipation medium plate (11), and the SESAM body (20) is connected to the base (10) through the heat dissipation medium plate (11).

Images