A lightweight semiconductor laser housing

Abstract

This application relates to a lightweight semiconductor laser housing, belonging to the field of semiconductor laser technology. It includes a detachable base plate and a surrounding plate. A cover plate is mounted on the surrounding plate, and a mounting panel is integrally formed on the base plate. The outer side wall shape of the mounting panel matches the inner side wall shape of the surrounding plate. The base plate has multiple mounting holes, each containing a fixing bolt threaded to the bottom surface of the surrounding plate. An annular groove filled with adhesive is also present on the base plate. This application features an assembly-type design between the surrounding plate and the base plate, facilitating the installation of components on the base plate before installing the surrounding plate. The use of bolts connecting the aluminum alloy cover plate and the surrounding plate reduces the amount of copper used, lowering cost and weight. Compared to copper brazing designs, this design eliminates the need for complex copper brazing processes. The adhesive-filled annular groove design ensures both the strength and dust and water resistance of the housing.

Description

Technical Field

[0001] This application relates to the field of semiconductor laser technology, and in particular to a lightweight semiconductor laser housing. Background Technology

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as their working medium. The chips, optical components, and other parts of a semiconductor laser are installed in a housing. The housing protects and positions the components, and can be further mounted onto the surface of an object.

[0003] A utility model patent with publication number CN202817487U discloses a high-power fiber-coupled semiconductor laser for night vision illumination, which includes a housing, a cover plate, a laser assembly, and an output fiber. The cover plate is mounted on the housing. The laser assembly includes three single-tube lasers connected in series. The three single-tube lasers are fixed in the housing after being packaged in a packaging box. The primary output fiber of the three single-tube lasers is coupled to a secondary output fiber. External electrodes electrically connected to each single-tube laser are provided on the side wall of the housing.

[0004] Regarding the aforementioned technologies, the inventors believe that the aforementioned box is an integrated structure, and when installing chips, optical components, and other parts inside the box, it is difficult to install them due to the influence of the height of the surrounding panels, which needs to be improved. Utility Model Content

[0005] This application provides a lightweight semiconductor laser housing with an assembly design between the enclosure and the base plate, which facilitates the installation of components on the base plate before installing the enclosure, thus simplifying installation and reducing weight.

[0006] This application provides a lightweight semiconductor laser housing, which adopts the following technical solution:

[0007] A lightweight semiconductor laser housing includes a detachable base plate and a surrounding plate. A cover plate is mounted on the surrounding plate. The base plate is made of copper, and the surrounding plate is made of aluminum alloy. A mounting panel is integrally formed on the base plate. The outer side wall shape of the mounting panel matches the inner side wall shape of the surrounding plate. The base plate has multiple mounting holes, and a fixing bolt passes through each mounting hole. The fixing bolt is threaded to the bottom surface of the surrounding plate. An annular groove is formed on the base plate, and the annular groove is filled with adhesive, which contacts the bottom surface of the surrounding plate.

[0008] By adopting the above technical solution, the enclosure and base plate are designed for assembly, making it easy to install the enclosure after the parts are mounted on the base plate, thus simplifying installation. The structure design using ring grooves filled with adhesive ensures both the strength of the box and its dustproof and waterproof functions.

[0009] Optionally, the cover plate has multiple mounting holes, and a fixing bolt passes through each mounting hole. The fixing bolt is threaded to the top surface of the cover plate.

[0010] By adopting the above technical solution, the enclosure and the cover plate are fixed together by two fixing bolts.

[0011] Optionally, the enclosure includes multiple integrally formed protrusions, and the parts where the fixing bolts one and two are threaded into the enclosure are both located on the protrusions.

[0012] By adopting the above technical solution, the protrusion provides sufficient solid space for the opening of the threaded hole.

[0013] Optionally, the protrusions are located at the four corners of the inner wall of the enclosure and at the middle of its length.

[0014] By adopting the above technical solution, the corners and middle parts of the enclosure are locally reinforced by the protrusions, thereby improving the strength of the enclosure and its resistance to deformation.

[0015] Optionally, a positioning groove is provided on the inner side of the top surface of the enclosure, and the shape of the positioning groove corresponds to that of the cover plate.

[0016] By adopting the above technical solution, the enclosure panel is positioned and installed on the cover plate through the positioning groove, so that the cover plate and the enclosure panel can be quickly aligned.

[0017] Optionally, the base plate is integrally fixed with multiple ear plates, and the ear plates are provided with fixing holes.

[0018] By adopting the above technical solution, the fixing holes are used to insert bolts or screws, thereby fixing the base plate to the equipment.

[0019] Optionally, an aluminum alloy sheet is placed between the cover plate and the enclosure plate, the second fixing bolt passes through the aluminum alloy sheet, and the second mounting hole extends into the side wall of the enclosure plate to the nearest side wall of the enclosure plate.

[0020] By adopting the above technical solution, the shape of mounting hole two facilitates the insertion and positioning of fixing bolt two. The double-layer design of the aluminum alloy sheet and cover plate reduces the surface temperature of the cover plate, preventing burns, and the aluminum alloy sheet's ability to absorb most stray light protects the chip inside the housing.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. The enclosure and base plate are designed for assembly, which makes it easy to install the enclosure after the parts are installed on the base plate, thus facilitating installation;

[0023] 2. The structure uses bolts to connect the cover plate and the surrounding plate made of aluminum alloy. Aluminum alloy is lighter than copper, which reduces the amount of copper used compared to a box made entirely of copper, thus reducing cost and weight.

[0024] 3. Compared to copper brazing, this design eliminates the need for complex brazing processes, reducing costs and preventing performance degradation caused by the high temperatures of welding. The ring groove-filled adhesive design ensures both box strength and dust and water resistance. Attached Figure Description

[0025] Figure 1 This is a perspective view of a lightweight semiconductor laser housing according to Embodiment 1;

[0026] Figure 2 This is an exploded view of Example 1;

[0027] Figure 3 This is an exploded view of Example 2.

[0028] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. Enclosure plate; 3. Cover plate; 11. Mounting panel; 12. Mounting hole one; 13. Fixing bolt one; 14. Annular groove; 31. Mounting hole two; 32. Fixing bolt two; 21. Positioning groove; 22. Protrusion; 15. Ear plate; 16. Fixing hole; 4. Aluminum alloy sheet. Detailed Implementation

[0029] The present application will be further described in detail below with reference to the accompanying drawings.

[0030] Example 1:

[0031] Reference Figure 1 This embodiment discloses a lightweight semiconductor laser housing, including a detachable base plate 1 and a surrounding plate 2. The base plate 1 is made of copper, and the surrounding plate 2 is made of aluminum alloy. The surrounding plate 2 is square-shaped, and an aluminum cover plate 3 is installed on the surrounding plate 2. In this embodiment, the cover plate 3 is made of aluminum alloy.

[0032] Reference Figure 1 and Figure 2 The base plate 1 has an integrally formed mounting panel 11. The shape of the outer side wall of the mounting panel 11 matches the shape of the inner side wall of the enclosure 2. The mounting panel 11 is used to mount heat sinks, chips, optical components and other parts. The mounting panel 11 positions and installs the enclosure 2 through the outer side wall, so that the enclosure 2 and the base plate 1 can be quickly aligned.

[0033] The base plate 1 has multiple mounting holes 12, and fixing bolts 13 are inserted into the mounting holes 12. The fixing bolts 13 are threaded to the bottom surface of the surrounding plate 2. The fixing bolts 13 are installed from bottom to top. The surrounding plate 2 and the base plate 1 are fixed together by the fixing bolts 13. The base plate 1 has an annular groove 14, which is located on the outside of the mounting panel 11. The annular groove 14 is filled with glue, which contacts the bottom surface of the surrounding plate 2. The glue enhances the seal between the base plate 1 and the surrounding plate 2, improves dust and water resistance, and also serves to bond and fix the parts.

[0034] The cover plate 3 has multiple mounting holes 31, and fixing bolts 32 are inserted into the mounting holes 31. The fixing bolts 32 are threaded to the top surface of the surrounding plate 2 and are installed from top to bottom. The inner side of the top surface of the surrounding plate 2 has a positioning groove 21, the shape of which corresponds to that of the cover plate 3. The surrounding plate 2 positions and installs the cover plate 3 through the positioning groove 21, so that the cover plate 3 and the surrounding plate 2 can be quickly aligned.

[0035] The enclosure 2 includes multiple integrally formed protrusions 22. The fixing bolts 13 and 32 are threaded onto the enclosure 2 at locations on the protrusions 22. The bottom surface of each protrusion 22 has a threaded hole for the fixing bolt 13, and the top surface has a threaded hole for the fixing bolt 32. The protrusions 22 provide sufficient solid space for these threaded holes. Furthermore, the protrusions 22 are located at the four corners of the inner wall of the enclosure 2 and at the center of its length. These protrusions 22 provide localized reinforcement at the corners and center of the enclosure 2, increasing its strength and resistance to deformation. The remaining parts of the enclosure 2 are relatively thin, combining the advantages of light weight and high strength.

[0036] Reference Figure 1 The base plate 1 is integrally fixed with multiple ear plates 15. The ear plates 15 are provided with fixing holes 16 for bolts or screws to be inserted, thereby fixing the base plate 1 to the equipment.

[0037] The implementation principle of a lightweight semiconductor laser housing according to an embodiment of this application is as follows: the enclosure 2 and the base plate 1 are designed for assembly, which facilitates the installation of components on the base plate 1 before installing the enclosure 2, thus simplifying installation. The structure uses bolts to connect the aluminum alloy cover plate 3 and the enclosure 2. Aluminum alloy is lighter than copper, reducing the amount of copper used compared to a housing made entirely of copper, thereby lowering cost and weight.

[0038] Compared to copper brazing, this design eliminates the need for complex brazing processes, reducing costs and preventing performance degradation caused by the high temperatures of welding. The adhesive-filled annular groove design ensures both box strength and dust and water resistance.

[0039] Example 2:

[0040] Reference Figure 3 A lightweight semiconductor laser housing is described. Embodiment Two differs from Embodiment One in that: the cover plate 3 is an aluminum plate, and an aluminum alloy sheet 4 with a thickness of 0.5-1mm is placed between the cover plate 3 and the surrounding plate 2. Fixing bolts 32 pass through the aluminum alloy sheet 4, and mounting holes 31 extend into the nearest sidewall of the surrounding plate 2. Specifically, the mounting holes 31 on the left extend to the left of the surrounding plate 2, and the mounting holes 31 on the right extend to the right. The shape of the mounting holes 31 facilitates the positioning of the fixing bolts 32. The double-layer arrangement of the aluminum alloy sheet 4 and the cover plate 3 reduces the surface temperature of the cover plate 3, preventing burns.

[0041] In laser modules, stray light refers to all unwanted transmitted or reflected light rays that may interfere with the normal optical path of the laser, reduce the stability of the signal light, or even damage sensitive components (such as chips). The main sources of stray light are reflection and scattering from optical components and the surface of the housing, and light leakage caused by optical path coupling deviations. The aluminum alloy sheet 3 absorbs most of the stray light, protecting the chips inside the housing.

[0042] After the cover plate 3 is reinstalled, the cover plate 3 protects the aluminum alloy sheet 4 and also improves the structural strength of the top surface of the box.

[0043] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lightweight semiconductor laser housing, characterized in that: The device includes a detachable base plate (1) and a surrounding plate (2). A cover plate (3) is installed on the surrounding plate (2). The base plate (1) is made of copper, and the surrounding plate (2) is made of aluminum alloy. An installation panel (11) is integrally formed on the base plate (1). The outer side wall shape of the installation panel (11) matches the inner side wall shape of the surrounding plate (2). The base plate (1) has multiple installation holes (12). A fixing bolt (13) passes through the installation holes (12). The fixing bolt (13) is threaded to the bottom surface of the surrounding plate (2). An annular groove (14) is formed on the base plate (1). The annular groove (14) is filled with glue, and the glue contacts the bottom surface of the surrounding plate (2).

2. The lightweight semiconductor laser housing according to claim 1, characterized in that: The cover plate (3) has multiple mounting holes (31), and a fixing bolt (32) is inserted into the mounting hole (31). The fixing bolt (32) is threaded to the top surface of the enclosure plate (2).

3. The lightweight semiconductor laser housing according to claim 2, characterized in that: The enclosure (2) includes multiple integrally formed protrusions (22), and the fixing bolts one (13) and two (32) are threaded to the enclosure (2) at the protrusions (22).

4. The lightweight semiconductor laser housing according to claim 3, characterized in that: The protrusions (22) are located at the four corners of the inner wall of the enclosure (2) and at the middle of its length.

5. A lightweight semiconductor laser housing according to claim 2, characterized in that: The top surface of the enclosure (2) is provided with a positioning groove (21), the shape of which corresponds to that of the cover plate (3).

6. The lightweight semiconductor laser housing according to claim 1, characterized in that: The base plate (1) is integrally fixed with multiple ear plates (15), and the ear plates (15) are provided with fixing holes (16).

7. A lightweight semiconductor laser housing according to claim 2, characterized in that: An aluminum alloy sheet (4) is placed between the cover plate (3) and the enclosure plate (2). The second fixing bolt (32) passes through the aluminum alloy sheet (4), and the second mounting hole (31) extends into the side wall of the enclosure plate (2) to the nearest side wall of the enclosure plate (2).

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