An NFC double-sided wiring parallel connection structure

By adopting a double-sided parallel connection structure in NFC devices, the problems of signal attenuation and increased power consumption caused by high DCR are solved, achieving more stable and efficient NFC communication and longer device battery life, while reducing production costs and processing difficulty.

CN224289793UActive Publication Date: 2026-05-26HOLYPAO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HOLYPAO
Filing Date
2025-03-12
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

High DC resistance (DCR) in existing NFC devices leads to signal attenuation, shortened transmission distance, and increased power consumption. Furthermore, high-conductivity materials are expensive, while low-resistivity materials are difficult to process.

Method used

The NFC double-sided parallel connection structure is adopted. By setting up a symmetrical parallel antenna trace layout on the A-side and B-side circuit boards, the parallel trace entry and exit are connected by conduction, and the signal transmission is optimized by reasonably designing the via size and position.

Benefits of technology

It effectively reduces the overall antenna DCR, reduces signal energy loss, extends device battery life, improves communication stability and data transmission speed, enhances sensing capabilities and compatibility, and reduces manufacturing difficulty and cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application discloses an NFC double-sided trace parallel connection structure, belonging to the field of near-field communication applications. The NFC double-sided trace parallel connection structure effectively reduces the overall antenna DCR, thereby reducing energy loss during signal transmission. The NFC module consumes less power during operation, helping to extend the device's battery life and making communication between the NFC device and external reading / writing devices more stable and efficient, improving data transmission speed and accuracy. The lower resistance enhances the antenna's sensing capability, increasing the effective sensing distance between the NFC device and other devices, making operation more convenient and flexible for users. Furthermore, the improved signal transmission enhances the compatibility of the NFC device with various types and brands of reading / writing devices, ensuring normal operation in more scenarios. In addition, the antenna thickness under this structure is not significantly different from that of conventional double-sided boards, thus requiring no special antenna space and exhibiting good applicability in practical applications.
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Description

Technical Field

[0001] This application relates to the field of near-field communication applications, and in particular to an NFC double-sided wiring parallel connection structure. Background Technology

[0002] Near Field Communication (NFC), also known as short-range wireless communication, is a short-range wireless communication technology that allows contactless point-to-point data transfer (within 10cm) between electronic devices. It evolved from contactless RFID and interconnection technologies, integrating inductive card readers, inductive cards, and point-to-point communication functions onto a single chip. This enables applications such as mobile payments, electronic ticketing, access control, mobile identity verification, and anti-counterfeiting using mobile terminals. Due to its inherent security, NFC technology has great potential for application in areas such as mobile payments.

[0003] Furthermore, DC resistance (DCR) is a very important parameter affecting the performance of NFC antennas. It has a certain impact on the strength of communication signals, transmission distance, and power consumption. For example, it can attenuate the signal, leading to a decrease in signal quality, shorten the transmission distance, and increase the power consumption of the device.

[0004] To address the aforementioned issues, related technologies utilize materials with high conductivity, such as silver and copper, to reduce the resistance of wires and antennas. However, these materials are relatively expensive. Furthermore, while some novel low-resistance materials offer advantages in conductivity, they may present challenges in processing, potentially requiring specialized processing techniques and equipment. Utility Model Content

[0005] This application provides an NFC double-sided trace parallel connection structure. The technical solution is as follows:

[0006] According to one aspect of this application, an NFC double-sided trace parallel connection structure is provided, the structure including an A-side circuit board and a B-side circuit board;

[0007] The A-side circuit board has an A-side antenna trace layout, and the B-side circuit board has a B-side antenna trace layout.

[0008] The traces of the A-side antenna trace layout are connected in parallel with the traces of the B-side antenna trace layout, and the trace entry position of the A-side circuit board is electrically connected to the trace entry position of the B-side circuit board.

[0009] Optionally, the wiring layout of the A-side antenna and the wiring layout of the B-side antenna are in a double-sided symmetrical structure.

[0010] Optionally, the A-side antenna trace and the B-side antenna trace layout have at least N traces, where N is a positive integer ≥ 1;

[0011] The first trace in the antenna routing layout on side A is jumpered at the first trace in the antenna routing layout on side B.

[0012] Optionally, the Nth trace in the A-side antenna routing layout is jumpered at the Mth trace in the B-side antenna routing layout.

[0013] Optionally, in the antenna routing layouts of surface A and surface B, the N-path routing is sequentially connected to the M-path routing at symmetrical positions.

[0014] Optionally, a via is provided at the connection point between the trace exit position and the trace entry position of the A-side circuit board and the trace entry position of the B-side circuit board.

[0015] Optionally, the size of the via is between 0.2 and 0.5 mm.

[0016] In this embodiment, the parallel connection structure of the NFC double-sided traces effectively reduces the overall antenna DCR, thereby reducing energy loss during signal transmission. The NFC module consumes less power during operation, which helps extend the device's battery life and makes communication between the NFC device and external reading / writing devices more stable and efficient, improving the speed and accuracy of data transmission. The lower resistance helps enhance the antenna's sensing capability, thereby increasing the effective sensing distance between the NFC device and other devices, making operation more convenient and flexible for users. Furthermore, the good signal transmission improves the compatibility of the NFC device with various types and brands of reading / writing devices, ensuring normal operation in more scenarios. In addition, the antenna thickness under this structure is not significantly different from that of conventional double-sided boards, thus requiring no special antenna space and having good applicability in practical applications. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the NFC double-sided trace parallel connection structure provided in an illustrative embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0019] In this article, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0020] First, before each embodiment, the specific impact of DCR on NFC performance mentioned in the background art will be explained in detail, from the perspectives of its influence on signal strength, transmission distance, and power consumption. Furthermore, the limitations of existing technologies or methods in reducing DCR will also be further explained.

[0021] First, the impact on signal strength.

[0022] This manifests in increased signal attenuation. A higher DCR leads to increased energy loss in the NFC antenna and related circuitry. During signal transmission, some energy is converted into heat due to resistance, weakening the actual transmitted electromagnetic signal strength. For example, when the DCR is too high, the electromagnetic field strength emitted by the NFC device decreases, and the signal strength sensed by the receiving device also decreases accordingly, thus affecting normal communication between devices. This is similar to transmitting current in a resistive wire; the greater the resistance, the greater the current loss during transmission, and the smaller the current strength reaching the terminal.

[0023] This also manifests in signal quality degradation. DCR (Distributed Resistivity) can cause signal distortion. Due to the presence of resistance, changes in current and voltage may no longer be an ideal linear relationship, leading to waveform distortion. For NFC communication, this signal distortion can affect the accurate transmission of data, potentially causing the receiver to be unable to correctly interpret the information sent by the transmitter, thus reducing signal quality and reliability.

[0024] Secondly, there's the impact on transmission distance. This manifests in the shortened transmission distance. NFC is a near-field communication technology, which inherently has a short transmission distance, and a high DCR (Distribution Limiting Rate) further limits this distance. Because of the energy loss caused by DCR, the signal attenuates rapidly during transmission. When the signal strength weakens to a certain level, the receiver cannot receive a valid signal, thus making the actual transmission distance shorter than theoretically possible.

[0025] Thirdly, there's the impact on power consumption. DCR (Distribution Ratio) causes NFC devices to consume more power during operation. To maintain normal communication, the device needs to provide enough energy to overcome energy loss due to resistance. This means the device's battery needs to output more current, leading to increased power consumption. For example, an NFC device with a low DCR might consume 10 milliwatts during operation, while a higher DCR could increase its power consumption to 15 milliwatts or even higher. This significantly shortens battery life for battery-powered mobile devices.

[0026] To address the aforementioned issues, certain measures have been taken in related technologies to reduce limitations in DCR (Displacement Resistance). On one hand, the use of highly conductive materials, such as silver and copper, can reduce the resistance of wires and antennas, but these materials are relatively expensive. Material cost is a significant consideration in the mass production of NFC devices. Using only highly conductive materials would substantially increase manufacturing costs and reduce the product's market competitiveness. In cost-sensitive NFC applications, such as low-cost smart tags and access cards, it is difficult to widely use highly conductive materials. On the other hand, special materials, such as some new low-resistance materials, while offering advantages in conductivity, may present challenges in processing. These materials may require specialized processing techniques and equipment. For example, some nanomaterials possess excellent conductivity, but their application in NFC device manufacturing requires complex fabrication processes and precise control technologies; otherwise, it is difficult to guarantee material performance and product quality.

[0027] Therefore, based on the above background analysis, this application provides an NFC double-sided wiring parallel connection structure, such as... Figure 1 As shown, this method is used to solve the above problems, reduce costs, and lower processing difficulty.

[0028] like Figure 1 As shown, the NFC double-sided trace parallel connection structure includes an A-side circuit board and a B-side circuit board.

[0029] The A-side circuit board has an A-side antenna trace layout, and the B-side circuit board has a B-side antenna trace layout. The A-side antenna trace layout and the B-side antenna trace layout are in a double-sided symmetrical structure.

[0030] The traces of the A-side antenna trace layout are connected in parallel with the traces of the B-side antenna trace layout, and the trace entry position of the A-side circuit board is electrically connected to the trace entry position of the B-side circuit board.

[0031] For the location of the exit, that is Figure 1 The entry location formed by markers a and b in the antenna routing layout on plane A, and, Figure 1 The entry point formed by markers a' and b in the wiring layout of the B-plane antenna.

[0032] Optionally, the A-side antenna traces and the B-side antenna traces are arranged with at least N traces, where N is a positive integer ≥ 1. For example... Figure 1 As shown in the diagram, with N equal to 2, both panels have two loops of traces. It should be noted that the antenna trace layout for both sides A and B requires the number of traces to be the same, N, but a completely identical design is not required. There can be differences in the design of the area other than the vias, and modifications can be made based on design and development details.

[0033] exist Figure 1 In the diagram, A represents the A-side circuit board, B represents the B-side circuit board, a and b are the trace entry points on the A-side circuit board, and a' and b' are the trace entry points on the B-side circuit board. Conductive connections are established at a and a', and b and b', to connect parallel front and rear antennas.

[0034] Furthermore, the first trace in the A-side antenna routing layout is jumpered at the first trace in the B-side antenna routing layout, and the Nth trace in the A-side antenna routing layout is jumpered at the Mth trace in the B-side antenna routing layout. Continuing as... Figure 1 As shown, A' is an enlarged schematic of the traces of A, and B' is an enlarged schematic of the traces of B. Each trace is numbered in the diagram. In the diagram shown in A', traces 1 and 8 are jumpered at the positions of traces 1' and 8' in the diagram shown in B'. For other positions, traces 2 and 2', trace 3 and 3', and so on, are connected on surfaces A and B respectively.

[0035] This diagram is for illustrative purposes only. The position of the vias can be changed according to the actual situation, and the number of vias can also be increased.

[0036] Optionally, in the antenna routing layouts of surface A and surface B, the N-path routing is sequentially connected to the M-path routing at symmetrical positions.

[0037] Optionally, a via is provided at the connection point between the trace exit position and the trace entry position of the A-side circuit board and the trace entry position of the B-side circuit board. To ensure good electrical performance and avoid signal interference, the width and spacing of the traces need to be considered during the design. Double-sided trace designs require special attention to the inter-layer connections and via design of the circuit boards to ensure signal continuity and stability.

[0038] Regarding via size design, the appropriate via diameter is typically selected based on the trace width and current required. Generally, the via diameter should not be too large or too small. Overly large vias may cause signal leakage and interference, while overly small vias may increase the impedance of the trace, affecting signal transmission quality. Therefore, it is recommended to choose a moderate via size, typically between 0.2 mm and 0.5 mm, with the specific size adjustable according to actual design requirements. For example, the distance between the via and the trace edge should be no less than 0.2 mm to ensure trace integrity and reliability.

[0039] The number of vias should be rationally configured based on the number of coils and current requirements. For applications with high current or stringent signal transmission requirements, the number of vias can be appropriately increased to reduce line impedance and improve signal transmission reliability. Especially in symmetrical areas of jumpers, vias can be added to ensure smooth signal transmission. However, excessive vias may increase the difficulty and cost of circuit board manufacturing; therefore, a balance must be struck between performance and cost.

[0040] Furthermore, jumpers and vias should be placed away from corners in the trace layout to minimize adverse effects from discontinuous current paths or signal interference. By rationally designing the size, number, and location of vias, the performance of the NFC antenna can be effectively optimized, ensuring stability and efficiency in various operating environments.

[0041] In summary, this application effectively reduces the overall antenna DCR through the parallel connection structure of NFC double-sided traces, thereby reducing energy loss during signal transmission. The NFC module consumes less power during operation, which helps extend the device's battery life and makes communication between the NFC device and external reading / writing devices more stable and efficient, improving the speed and accuracy of data transmission. The lower resistance helps enhance the antenna's sensing capability, thereby increasing the effective sensing distance between the NFC device and other devices, making operation more convenient and flexible for users. Furthermore, the good signal transmission improves the compatibility of the NFC device with various types and brands of reading / writing devices, ensuring normal operation in more scenarios. In addition, the antenna thickness under this structure is not significantly different from that of conventional double-sided boards, thus requiring no special antenna space and having good applicability in practical applications.

[0042] This application also provides a computer-readable medium storing at least one instruction, which is loaded and executed by the processor to implement the NFC double-sided trace parallel connection structure method as described in the above embodiments.

[0043] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An NFC double-sided trace parallel connection structure, characterized in that, The structure includes a circuit board on side A and a circuit board on side B; The A-side circuit board has an A-side antenna trace layout, and the B-side circuit board has a B-side antenna trace layout. The traces of the A-side antenna trace layout are connected in parallel with the traces of the B-side antenna trace layout, and the trace entry position of the A-side circuit board is electrically connected to the trace entry position of the B-side circuit board.

2. The structure according to claim 1, characterized in that, The wiring layout of the A-side antenna and the wiring layout of the B-side antenna are symmetrical on both sides.

3. The structure according to claim 1, characterized in that, The antenna traces on side A and side B have at least N traces, where N is a positive integer ≥ 1. The first trace in the antenna routing layout on side A is jumpered at the first trace in the antenna routing layout on side B.

4. The structure according to claim 3, characterized in that, The Nth trace in the A-side antenna routing layout is jumpered at the Mth trace in the B-side antenna routing layout.

5. The structure according to claim 4, characterized in that, At the trace exit location, in the antenna trace layout of side A and the antenna trace layout of side B, the N traces are sequentially connected to the M traces at symmetrical positions.

6. The structure according to claim 5, characterized in that, The trace exit position, the trace entry position of the A-side circuit board and the trace entry position of the B-side circuit board are provided with a via.

7. The structure according to claim 6, characterized in that, The size of the via is between 0.2 and 0.5 mm.