Circuit board and electronic equipment
By setting protruding target parts connected to the conductive layer and multiple heat dissipation structures on the circuit board substrate, the problems of increased circuit board thickness and poor thermal conductivity are solved, achieving efficient heat dissipation and improved mechanical strength, thus ensuring the stability and lifespan of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2026-05-26
AI Technical Summary
In the prior art, the combination of reinforcing steel sheet and thermosetting adhesive increases the thickness of the circuit board and results in poor thermal conductivity, leading to low heat dissipation efficiency and affecting the working stability and lifespan of electronic devices.
A first target portion is provided on the substrate of the circuit board. The first target portion is connected to the conductive layer and protrudes along the thickness direction of the substrate to increase the contact area with the external air and improve the heat dissipation efficiency through multiple heat dissipation structures, while providing additional mechanical support.
It improves heat dissipation efficiency, enhances the mechanical strength of the circuit board, prevents breakage or deformation, and ensures the stability and lifespan of electronic devices.
Smart Images
Figure CN224290148U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board technology, and more particularly to a circuit board and electronic device. Background Technology
[0002] In existing traditional solutions, reinforcing steel sheets are attached to the device area to enhance its mechanical strength and improve heat dissipation. However, this method has significant limitations: the combined thickness of the reinforcing steel sheet and the thermosetting adhesive used to attach it is relatively thick, increasing the overall thickness of the FPC. Furthermore, heat must pass through the thermosetting adhesive layer to transfer from the heat-generating element to the steel sheet. Since thermosetting adhesive has relatively poor thermal conductivity, this results in low heat dissipation efficiency, failing to effectively dissipate heat and consequently affecting the operational stability and lifespan of the electronic device. Utility Model Content
[0003] To address the aforementioned technical problems, this application provides the following technical solutions:
[0004] The first aspect of this application provides a circuit board, comprising: a substrate, the substrate including at least one conductive layer, protective layers being disposed on both sides of the conductive layer, a first target portion disposed on a first side of the substrate, the first target portion being connected to the conductive layer, and the first target portion protruding from the first side of the substrate along a first direction; wherein, the first direction is the thickness direction of the substrate.
[0005] In some embodiments, the substrate has a connection region on a second side opposite to the first side. The connection region is used to connect a target device and is disposed corresponding to the first target portion to dissipate heat from the target device.
[0006] In some embodiments, the orthographic projection area of the connecting region along the first direction at least partially overlaps with the orthographic projection area of the first target portion along the first direction.
[0007] In some embodiments, the thickness of the first target portion along the first direction is greater than the thickness of the protective layer along the first direction.
[0008] In some embodiments, the first target portion includes: a plurality of heat dissipation structures spaced apart along a second direction, the plurality of heat dissipation structures extending from one side of the conductive layer toward the side away from the conductive layer, the second direction being perpendicular to the first direction; the first target portion and the conductive layer being fixedly connected; or, the first target portion and the conductive layer being integrally formed.
[0009] In some embodiments, the substrate includes three conductive layers connected in sequence along a first direction, and a protective layer is provided on both sides of each conductive layer. The size of the conductive layer located on the first side of the substrate is larger than that of the protective layer located on the first side.
[0010] In some embodiments, a second target portion corresponding to the first target portion is provided between two adjacent conductive layers. The second target portion is connected to one of the conductive layers and is insulated from the other conductive layer.
[0011] In some embodiments, the heat dissipation surface of the first target portion exposed on the substrate is at least partially covered by a heat dissipation layer.
[0012] In some embodiments, at least one conductive layer has a third target portion at its end along a third direction, and the third target portion is connected to its corresponding conductive layer; the third direction is perpendicular to the first direction.
[0013] A second aspect of this application provides an electronic device, comprising: a circuit board, the circuit board comprising: a substrate, the substrate comprising at least one conductive layer, protective layers being disposed on both sides of the conductive layer, a first target portion, the first target portion being disposed on a first side of the substrate, the first target portion being connected to the conductive layer, the first target portion protruding from the first side of the substrate along a first direction; wherein, the first direction is the thickness direction of the substrate. Attached Figure Description
[0014] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:
[0015] Figure 1 A schematic cross-sectional view of a circuit board provided in this application is shown.
[0016] Figure 2 A schematic cross-sectional view of another circuit board provided in this application is shown.
[0017] Figure 3 A schematic cross-sectional view of another type of circuit board provided in this application is shown.
[0018] Figure 4 A schematic cross-sectional view of another type of circuit board provided in this application is shown.
[0019] Figure 5 A schematic cross-sectional view of yet another type of circuit board provided in this application is shown.
[0020] Figure 6 A schematic diagram of the structure of a first target part provided in this application is shown.
[0021] Explanation of icon numbers:
[0022] 1. Substrate; 11. Conductive layer; 12. Protective layer; 121. PI layer; 122. Adhesive layer; A. First side; B. Second side; 2. First target part; 21. Heat dissipation hole; 22. Fin; 3. Connection area; 4. Target device; 5. Second target part; 6. Third target part; X. First direction; Y. Second direction. Detailed Implementation
[0023] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0024] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.
[0025] The inventors discovered that using reinforcing steel sheets and fixing them to the corresponding areas of the device with thermosetting adhesive increases the total thickness by more than 0.25 mm, thus increasing the overall thickness of the flexible printed circuit board (FPC). Furthermore, due to the poor thermal conductivity of thermosetting adhesive, heat transfer from the heat-generating element to the reinforcing steel sheet is hindered, resulting in low heat dissipation efficiency. This inefficient heat dissipation mechanism cannot effectively dissipate heat, thereby affecting the operational stability and lifespan of electronic devices.
[0026] The first aspect of this application provides a circuit board, as shown in the attached drawing. Figure 1 - Appendix Figure 5 The substrate includes: a substrate 1, the substrate 1 including at least one conductive layer 11, protective layers 12 provided on both sides of the conductive layer 11, a first target portion 2, the first target portion 2 being disposed on a first side A of the substrate 1, the first target portion 2 being connected to the conductive layer 11, and the first target portion 2 protruding from the first side A of the substrate 1 along a first direction X; wherein, the first direction X is the thickness direction of the substrate 1.
[0027] In some possible cases, the circuit board in this application includes, but is not limited to, single-layer circuit boards, multi-layer circuit boards, flexible circuit boards, and rigid circuit boards. The substrate 1 is a basic material for carrying circuit elements, constituting the main structural part of the circuit board and providing mechanical support. The substrate 1 may be made of glass fiber reinforced epoxy resin, polyimide, or other high-performance polymers. The substrate 1 includes at least one conductive layer 11, such as one, three, or five conductive layers 11. The conductive layers 11 are used to form circuit paths, realizing the transmission and distribution of electrical signals. The conductive layers 11 may be made of copper. Protective layers 12 are provided on both sides of the conductive layers 11. The protective layers 12 are used to prevent the conductive layers 11 from being affected by mechanical damage, chemical corrosion, or moisture, and the protective layers 12 maintain electrical isolation between the conductive layers 11. The protective layers 12 may be made of a PI layer 121, where PI is polyimide. The PI layer 121 may be pre-coated with an adhesive layer 122 and attached to the conductive layers 11 by hot pressing. The protective layer 12 can also be an ink layer, which is printed onto the surface of the circuit board and then cured to form a robust protective film.
[0028] like Figure 1 As shown, the first target portion 2 is disposed on the first side A of the substrate 1. The first target portion 2 protrudes from the first side A of the substrate 1 along the first direction X, allowing the protective layer 12 of the substrate 1 corresponding to the first target portion 2 to be hollowed out. The first target portion 2 is then connected to the conductive layer 11 by welding. The first target portion 2 can be of any shape, such as rectangular, circular, or elliptical, and can be made of materials such as copper, aluminum, aluminum alloy, or graphene. Furthermore, the first target portion 2 can be integrally formed with the conductive layer 11 to ensure rapid heat conduction, or the first target portion 2 can be a protrusion extending from a portion of the conductive layer 11 along the first direction X, or the first target portion 2 can be a copper layer electroplated onto the conductive layer 11. The height of the first target portion 2 protruding from the first side A of the substrate 1 can be 0.1mm, 0.15mm, 0.2mm, etc., and can be set according to actual needs.
[0029] In the circuit board provided in this application, the first target portion 2 is directly connected to the conductive layer 11, allowing heat to be quickly transferred from the conductive layer 11 to the first target portion 2. The first target portion 2 protrudes along the thickness direction of the substrate 1, increasing its contact area with external air and thus improving heat dissipation efficiency. Simultaneously, the first target portion 2 protruding from the substrate 1 provides additional support to the substrate 1, preventing the flexible circuit board from breaking or deforming when bent or subjected to force, thus playing a reinforcing role.
[0030] In some embodiments, the substrate 1 has a second side B opposite to the first side A, which has a connection region 3. The connection region 3 is used to connect the target device 4. The connection region 3 is provided corresponding to the first target part 2 to dissipate heat from the target device 4.
[0031] In some possible cases, such as Figures 1-5 As shown, a connection area 3 is provided on the second side B of the substrate 1, opposite to the first side A. This connection area 3 is used to connect the target device 4 (such as a heat-generating element, chip, or other electronic component). The protective layer 12 on this side can be hollowed out to directly solder the target device 4 onto the conductive layer 11, or it can directly contact a heat dissipation medium such as thermal paste. The position of the connection area 3 corresponds to the first target part 2, so that heat can be transferred from the target device 4 to the first target part 2 through the conductive layer 11, thereby achieving efficient heat dissipation of the target device 4.
[0032] In some embodiments, the orthographic projection area of the connecting region 3 along the first direction X at least partially overlaps with the orthographic projection area of the first target portion 2 along the first direction X.
[0033] In some possible cases, the projected area of the connecting region 3 along the first direction X may partially overlap with the projected area of the first target part 2 along the first direction X, or they may completely overlap. For example, the area corresponding to the first target part 2 is 20mm x 10mm and is located on the first side A of the circuit board. On the second side B of the circuit board, the connecting region 3 is also a 20mm x 10mm area, but its position can be slightly offset so that its projected area only partially overlaps with the projected area of the first target part 2, so that the left half of the connecting region 3 corresponds exactly to the right half of the first target part 2. Both the first target part 2 and the connecting region 3 can be rectangular areas of 20mm x 10mm, and their positions are aligned along the first direction X, such as... Figures 1-5 As shown, their projected areas along the first direction X are completely overlapping. In this embodiment, all the heat from the target device 4 can be transferred from the connecting region 3 to the first target part 2 via the shortest path, i.e., the shortest straight-line distance from the connecting region to the first target part. Heat can be transferred from the target device 4 to the external environment via the shortest path, reducing heat loss and improving heat dissipation efficiency.
[0034] In some embodiments, the thickness of the first target portion 2 along the first direction X is greater than the thickness of the protective layer 12 along the first direction X.
[0035] In some possible cases, such as Figures 1-5As shown, the thickness of the first target portion 2 along the first direction X is greater than the thickness of the protective layer 12 along the first direction X. That is, the first target portion 2 protrudes from the substrate 1 along the first direction X, and the side of the first target portion 2 facing away from the conductive layer 11 is higher than the side of the protective layer 12 facing away from the conductive layer 11, which increases the exposed area of the first target portion 2. This additional exposed surface can directly contact the air in the surrounding environment, allowing more heat from the target device 4 to be transferred to the surrounding air through the first target portion 2 in the form of convection and radiation, thereby improving the overall heat dissipation efficiency.
[0036] In some embodiments, the first target portion 2 includes: a plurality of heat dissipation structures spaced apart along a second direction Y, the plurality of heat dissipation structures extending from one side of the conductive layer 11 toward the side opposite to the conductive layer 11, the second direction Y being perpendicular to the first direction X; the first target portion 2 and the conductive layer 11 being fixedly connected; or, the first target portion 2 and the conductive layer 11 being integrally formed. The second direction Y is the length direction of the substrate 1, and the first direction X is the thickness direction of the substrate 1. The first target portion 2 and the conductive layer 11 can be fixedly connected, for example: in a single-layer FPC, after the PI layer and adhesive layer 122 on its surface are removed, copper can be electroplated on the removed area, and the copper plating position can be higher than the surface of the conductive layer 11, which can play a reinforcing role and also dissipate heat to the target device 4 on the opposite side. Alternatively, the first target portion 2 and the conductive layer 11 can be integrally formed, for example: a portion of the conductive layer 11 is extended along its thickness direction until its extended thickness protrudes from its surface, so that the height of its protrusion is higher than its protective layer 12, which can play a reinforcing role and also dissipate heat to the target device 4 on the opposite side.
[0037] In some possible cases, such as Figure 5 , Figure 6 As shown, the first target part 2 may include multiple heat dissipation structures spaced apart along the second direction Y. These heat dissipation structures may be fin-like structures 22, heat dissipation holes 21, etc. The heat dissipation structures extend from one side of the conductive layer 11 to the side opposite to the conductive layer 11. For example, if the heat dissipation structure is a fin-like structure 22, the fin-like structure extends from one side of the conductive layer 11 to the other side. Multiple fin-like structures 22 can be integrally formed with the conductive layer 11 or can be welded to the conductive layer 11. If the heat dissipation structure is a heat dissipation hole 21, the heat dissipation hole 21 can penetrate from one side of the conductive layer to the other side. By extending the heat dissipation structure from one side of the conductive layer 11 to the other side, the overall surface area of the heat dissipation structure is significantly increased, allowing more heat to be transferred to the surrounding air through convection and radiation, thereby improving the overall heat dissipation efficiency.
[0038] In some embodiments, the substrate 1 includes three conductive layers 11 connected in sequence along the first direction X. Each conductive layer 11 has a protective layer 12 on both sides. The conductive layer 11 located on the first side A of the substrate 1 has a larger size than the protective layer 12 located on the first side A.
[0039] In some possible cases, such as Figures 1-5 As shown, the substrate 1 includes three conductive layers 11 along the first direction X. Each conductive layer 11 has a protective layer 12 on both sides. The protective layer 12 can be made of materials such as polyimide or solder resist ink to protect the conductive layer 11 from physical damage, corrosion, and environmental factors. The conductive layer 11 is used for the transmission and distribution of electrical signals and can be made of copper or other highly conductive materials. The size of the conductive layer 11 located on the first side A of the substrate 1 is larger than the size of the protective layer 12 located on the first side A. That is, a hollowed-out portion of the protective layer 12 is made in the protective layer 12, exposing part of the conductive layer 11 for heat dissipation. A first target portion 2 can be provided in the hollowed-out area. The first target portion 2 can be connected to the exposed area of the conductive layer 11 by welding or integrally formed with the conductive layer 11. In this embodiment, the size of the conductive layer 11 located on the first side A is larger than the size of the protective layer 12 on the first side A, allowing more of the conductive layer 11 surface to be directly exposed, enabling more effective contact with external heat dissipation structures or air, and significantly improving heat dissipation efficiency.
[0040] In some embodiments, a second target portion 5 corresponding to the first target portion 2 is provided between two adjacent conductive layers 11. The second target portion 5 is connected to one of the conductive layers 11 and is insulated from the other conductive layer 11.
[0041] In some possible cases, such as Figure 2 , Figure 4 As shown, a second target portion 5 is provided between two adjacent target layers (such as between the top layer and the middle layer, or between the middle layer and the bottom layer). The second target portion 5 serves to provide a heat dissipation channel and reinforcement for the conductive layer 11. The second target portion 5 can be of any shape, such as rectangular, circular, or elliptical, and can be made of materials such as copper, aluminum, aluminum alloy, or graphene. Furthermore, the second target portion 5 can be integrally formed with the conductive layer 11 to ensure rapid heat conduction. Alternatively, the second target portion 5 can be a protrusion extending from a portion of the conductive layer 11 along the first direction X, or the second target portion 5 can be a copper layer electroplated onto the conductive layer 11. The second target portion 5 is directly connected to one of the conductive layers 11 and electrically isolated from the other conductive layer 11 through a protective layer 12. The second target portion 5 can protrude from the conductive layer 11 it is connected to along the first direction X, and its protrusion height from the conductive layer 11 is lower than the height of the corresponding protective layer 12, i.e., the second target is completely covered by the protective layer 12.
[0042] To enhance heat dissipation, a second target portion 5 corresponding to the target device 4 can be provided on each pair of adjacent conductive layers 11. The coverage areas of the multiple second target portions 5 can be the same or different, and the heights at which the multiple second target portions 5 protrude from their corresponding conductive layers 11 can also be the same or different. To further enhance the heat dissipation effect, the orthographic projection of each second target portion 5 along the first direction X towards the target device 4 can completely cover the target device 4, so that the heat generated from the target device 4 can be transferred to the first target portion 2 as quickly as possible through the multiple second target portions 5, reducing the thermal resistance in the heat transfer path. In this embodiment, the first target portion 2 and the second target portion 5 together constitute a multi-level heat dissipation network. Starting from the target device 4, heat is conducted layer by layer to the first target portion 2 through the second target portions 5, and finally dissipated into the external environment. Furthermore, the second target portions 5 help to disperse stress and prevent delamination or damage caused by bending or external forces.
[0043] In some embodiments, the heat dissipation surface of the first target portion 2 exposed on the substrate 1 is at least partially covered by a heat dissipation layer.
[0044] In some possible cases, a heat dissipation layer is at least partially covered on the heat dissipation surface of the first target portion 2 exposed on the substrate 1. The heat dissipation layer may cover a portion of the first target portion 2 or completely cover the exposed area of the first target portion 2. The heat dissipation layer may be a high thermal conductivity material, such as graphene, copper foil, aluminum foil, or a special heat dissipation coating, to promote heat dissipation. The heat dissipation coating may be uniformly applied to the surface of the first target portion 2 by brushing, spraying, or dipping. Alternatively, the heat dissipation layer, such as aluminum foil, may be pre-cut and then adhered to the surface of the first target portion 2 with thermally conductive adhesive. Or, the heat dissipation layer may be directly integrated into the first target portion 2 through an integrated molding process, reducing manufacturing steps and improving reliability.
[0045] In addition, a heat sink is provided on one side of the substrate 1 to further dissipate heat from the heat dissipation surface of the first target portion 2 exposed on the substrate 1. The heat sink can be a radiator, cooling fan, etc. The heat sink can be directly mounted on the first target portion 2 to ensure close contact between the two and reduce thermal resistance. Thermally conductive adhesive or thermally conductive pads can be used to fill the tiny gaps between the contact surfaces to improve heat conduction efficiency. The heat sink can also transfer heat from the first target portion 2 to the heat sink through heat pipes or other heat conduction devices.
[0046] In some embodiments, at least one conductive layer 11 is provided with a third target portion 6 at its end along a third direction, and the third target portion 6 is connected to its corresponding conductive layer 11; the third direction satisfies the perpendicular condition to the first direction X.
[0047] In some possible cases, such as Figure 3 , Figure 4As shown, to further enhance heat dissipation, at least one conductive layer 11 is provided with a third target portion 6 at its end along a third direction. The third target portion 6 can be provided at one end of the conductive layer 11 along the third direction, or at both ends of the conductive layer 11. The third target portion 6 can be part of the conductive layer 11 or a separate structure, connected to the end of the conductive layer 11 by welding or integral molding. The shape of the third target portion 6 can be rectangular, circular, strip-shaped, etc., serving as an additional heat dissipation channel to conduct heat away from the end of the conductive layer 11. The third target portion 6 can be made of a high thermal conductivity material (such as copper, aluminum, or graphene), enabling rapid heat conduction from the conductive layer 11 to the external environment. The third direction can be perpendicular to the first direction X. For example, the second direction Y is the length direction of the substrate 1, and the third direction is the width direction of the substrate 1; or, for example, the third direction is the length direction of the substrate 1, and the second direction Y is the width direction of the substrate 1. The third direction can be in the same direction as the second direction Y, or it can have an angle with the second direction Y. Furthermore, the third target section 6 enhances heat dissipation while also strengthening the mechanical support at the end of the conductive layer 11, especially in applications requiring frequent insertion and removal or subject to significant stress. Additionally, the third target section 6 is positioned along a third direction, thus not increasing the overall thickness of the circuit board.
[0048] A second aspect of this application provides an electronic device, including: a circuit board, the circuit board including: a substrate 1, the substrate 1 including at least one conductive layer 11, protective layers 12 disposed on both sides of the conductive layer 11, a first target portion 2, the first target portion 2 disposed on a first side A of the substrate 1, the first target portion 2 being connected to the conductive layer 11, and the first target portion 2 protruding from the first side A of the substrate 1 along a first direction X; wherein, the first direction X is the thickness direction of the substrate 1.
[0049] The second aspect of this application provides an electronic device, including but not limited to mobile phones, tablets, laptops, game consoles, servers, and other electronic devices. This electronic device may include one or more circuit boards, which can be used to connect a built-in battery and a motherboard, or to connect the motherboard to a USB interface, etc. In the circuit board of this electronic device, the first target portion 2 is directly connected to the conductive layer 11, allowing heat to be quickly transferred from the conductive layer 11 to the first target portion 2. The first target portion 2 protrudes along the thickness direction of the substrate 1, increasing its contact area with external air or other heat dissipation media, thereby improving heat dissipation efficiency. Simultaneously, the first target portion 2 protruding from the substrate 1 provides additional support to the substrate 1, preventing the flexible circuit board from breaking or deforming when bent or subjected to force. Furthermore, the target device 4 is disposed on the substrate 1, and the conductive layer 11 is thickened through an electroplating process. The thickened conductive layer 11 not only enhances the structural support strength but also allows direct contact with heat dissipation media such as thermal paste, thereby transferring heat more efficiently.
[0050] It should be noted that in the description of this specification, the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure; the terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.
[0051] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0052] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. A circuit board, characterized in that, include: A substrate, the substrate including at least one conductive layer, and protective layers are provided on both sides of the conductive layer; A first target portion is disposed on a first side of the substrate, the first target portion is connected to the conductive layer, and the first target portion protrudes from the first side of the substrate along a first direction; Wherein, the first direction is the thickness direction of the substrate.
2. The circuit board according to claim 1, characterized in that, The substrate has a connection area on a second side opposite to the first side. The connection area is used to connect a target device. The connection area is provided corresponding to the first target part to dissipate heat from the target device.
3. The circuit board according to claim 2, characterized in that, The orthographic projection area of the connecting region along the first direction at least partially overlaps with the orthographic projection area of the first target portion along the first direction.
4. The circuit board according to claim 1, characterized in that, The thickness of the first target portion along the first direction is greater than the thickness of the protective layer along the first direction.
5. The circuit board according to claim 1, characterized in that, The first target unit includes: Multiple heat dissipation structures are spaced apart along a second direction, and the multiple heat dissipation structures extend from one side of the conductive layer to the side away from the conductive layer, wherein the second direction is perpendicular to the first direction. The first target portion and the conductive layer are fixedly connected; or, the first target portion and the conductive layer are integrally formed.
6. The circuit board according to claim 1, characterized in that, The substrate includes three conductive layers connected in sequence along the first direction. Each conductive layer has a protective layer on both sides. The conductive layer on the first side of the substrate is larger than the protective layer on the first side.
7. The circuit board according to claim 6, characterized in that, A second target portion corresponding to the first target portion is provided between two adjacent conductive layers. The second target portion is connected to one of the conductive layers and is insulated from the other conductive layer.
8. The circuit board according to claim 1, characterized in that, The first target portion exposed on the heat dissipation surface of the substrate is at least partially covered by a heat dissipation layer.
9. The circuit board according to claim 1, characterized in that, At least one conductive layer has a third target portion at its end along a third direction, and the third target portion is connected to the conductive layer corresponding to it; the third direction is perpendicular to the first direction.
10. An electronic device, characterized in that, include: Circuit board, the circuit board comprising: A substrate, the substrate including at least one conductive layer, and protective layers are provided on both sides of the conductive layer; A first target portion is disposed on a first side of the substrate, the first target portion is connected to the conductive layer, and the first target portion protrudes from the first side of the substrate along a first direction; Wherein, the first direction is the thickness direction of the substrate.