Splicing type heat dissipation circuit board structure

Abstract

The utility model provides a spliced heat dissipation circuit board structure, which comprises a plurality of module units, a heat dissipation structure and a dustproof structure, an inserting part is arranged on one side of the substrate body, and a clamping part is arranged on the other side of the substrate body; inserting guide columns are fixedly welded to the two opposite sides of the side, provided with the inserting part, of the base plate body, and stepped limiting rings are arranged at the tail ends of the inserting guide columns; nickel-titanium shape memory alloy sheet layers are embedded in the two opposite sides of the upper surface and the lower surface of the inserting part in the length direction, and conical silver-nickel alloy locking heads are fixedly connected to the upper surfaces of the nickel-titanium shape memory alloy sheet layers; a stepped groove is formed in a groove, matched with the inserting part, of the clamping part; a neodymium iron boron magnetic layer is arranged on the inner wall of the stepped groove; the dustproof structure is arranged at the joint between the clamping part and the inserting part in a covering manner; the dustproof structure comprises an elastic dustproof net; the heat dissipation structure comprises a tree-shaped fractal micro-channel penetrating through the substrate body, and sharkskin bionic textures are arranged on the inner wall of the micro-channel. And collaborative optimization of dust prevention, heat dissipation and mechanical stability is realized.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a spliced ​​heat dissipation circuit board structure. Background Technology

[0002] Chinese Patent Publication No. CN222884861U, published on May 16, 2025, discloses a spliced ​​printed circuit board, relating to the field of circuit board technology. The board includes multiple sets of circuit board module units connected in a spliced ​​manner. Except for the last set of circuit board module units, all other circuit board module units have a connecting plate fixed to their bottom ends. Except for the first set of circuit board module units, all other circuit board module units have a locking plate fixed to their bottom ends. An insert plate is fixedly connected to the inner end face of the connecting plate, and the locking plate has a locking groove inside that fits with the insert plate. The insert plate is slidably connected to the inner wall of the locking groove. This invention, by setting up circuit board module units, enables modular connection of the circuit board, thereby adapting to different usage requirements, significantly reducing circuit board waste and improving circuit board utilization. In practical use, the existing technology has the following drawbacks: it only solves the modular splicing problem, and the sliding connection between the insert plate and the locking groove relies on manual bolt locking, resulting in low insertion and removal efficiency; it lacks a dedicated dustproof structure, relying solely on the gap between the insert plate and the locking groove for sealing. Furthermore, the return spring in the existing technology fails to maintain its elasticity at -40℃, affecting normal use; therefore, improvements are urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a spliced ​​heat dissipation circuit board structure to achieve synergistic optimization of dust prevention, heat dissipation, and mechanical stability.

[0004] This utility model provides a spliced ​​heat dissipation circuit board structure, including multiple module units, a heat dissipation structure, and a dustproof structure; each module unit is composed of four layers of high thermal conductivity substrates; electronic components are arranged on the front side of the substrate body of each high thermal conductivity substrate, and the back side is a component-free area; one side of the substrate body is provided with an insertion part, and the other side is provided with a locking part that mates with the insertion part; the length of the insertion part is less than the length of the substrate body; insertion guide posts are welded and fixedly arranged on opposite sides of the side of the substrate body with the insertion part, and a stepped limiting ring is provided at the end of the insertion guide post; nickel-titanium shape memory alloy sheets are embedded on opposite sides of the upper and lower surfaces along the length direction of the insertion part. A conical silver-nickel alloy locking head is fixedly connected to the upper surface of the gold sheet layer; a stepped groove that mates with the conical silver-nickel alloy locking head is provided in the groove where the engaging part and the insert part cooperate; a neodymium iron boron magnetic layer is provided on the inner wall of the stepped groove; a dustproof structure is provided at the joint between the engaging part and the insert part; the dustproof structure includes an elastic dustproof mesh, one edge of which is slidably connected to the side wall of the module unit through a dovetail groove guide rail, and the inner side of the other side of the elastic dustproof mesh is provided with a magnetic adsorption layer that magnetically cooperates with the neodymium iron boron magnetic layer; the heat dissipation structure includes a tree-shaped fractal microchannel penetrating the substrate body, and the inner wall of the microchannel is provided with a sharkskin biomimetic texture.

[0005] Preferably, a phase change heat dissipation layer is embedded inside the substrate body.

[0006] Preferably, the magnetic induction intensity of the neodymium iron boron magnetic layer is set to 0.1-0.3T; the neodymium iron boron magnetic layer is a composite functional layer made of neodymium iron boron magnetic powder and silicone rubber, and the elastic dustproof net forms a magnetically sealed interface with the neodymium iron boron magnetic layer.

[0007] Preferably, the mesh density of the elastic dustproof net is set in a gradient distribution of 200-500 mesh.

[0008] Preferably, the substrate body has stepped limiting bosses on opposite sides of the side with the engaging portion and at positions corresponding to the insertion guide post for the engaging portion to be inserted, and the stepped limiting ring is interference-fitted with the limiting boss.

[0009] The beneficial effects of this utility model are as follows: the insertion part and the locking part are symmetrically distributed, and the interference fit is automatically triggered by the nickel-titanium shape memory alloy sheet and the conical silver-nickel alloy locking head, realizing intelligent locking without manual intervention and improving insertion and extraction efficiency; the stepped limiting ring and the limiting boss form a mechanical interlock, reducing the fluctuation of locking force under vibration; through the above two locking methods, the insertion and extraction force of the circuit board is stable in the range of -40℃ to 150℃, meeting the requirements of extreme environments; the heat dissipation structure includes a tree-shaped fractal microchannel that runs through the substrate body, and the inner wall of the microchannel is provided with a sharkskin biomimetic texture. The heat is spread out through the tree-shaped fractal microchannel, and the sharkskin biomimetic texture further improves the heat dissipation efficiency; by setting a dustproof structure, the joint between the locking part and the insertion part has a dustproof function. Attached Figure Description

[0010] Figure 1 This is a three-dimensional view of the module unit.

[0011] Figure 2 This is a side view of the module unit.

[0012] Figure 3 This is a partial view of the spliced ​​state of the two module units.

[0013] The attached figures are labeled as follows: substrate body 10, engaging part 11, insertion part 12, stepped groove 14, neodymium iron boron magnetic layer 16, insertion guide post 15, nickel-titanium shape memory alloy sheet layer 17, elastic dustproof mesh 19, tapered silver-nickel alloy locking head 18, magnetic adsorption layer 21, and dovetail groove guide rail 20. Detailed Implementation

[0014] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0015] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0016] Please refer to Figure 1-3As shown, this utility model provides a spliced ​​heat dissipation circuit board structure, including multiple module units, a heat dissipation structure, and a dustproof structure; each module unit is composed of four layers of high thermal conductivity substrates; electronic components are arranged on the front side of the substrate body 10 of each high thermal conductivity substrate, and the back side is a component-free area; a plug-in part 12 is provided on one side of the substrate body 10, and a locking part 11 that cooperates with the plug-in part 12 is provided on the other side; the length of the plug-in part 12 is less than the length of the substrate body 10; plug-in guide posts 15 are welded and fixed on both opposite sides of the side of the substrate body 10 with the plug-in part 12, and a stepped limiting ring is provided at the end of the plug-in guide post 15; nickel-titanium shape memory alloy sheets 17 are embedded on both opposite sides of the upper and lower surfaces along the length direction of the plug-in part 12. A tapered silver-nickel alloy locking head 18 is fixedly connected to the upper surface of the shape memory alloy sheet 17; a stepped groove 14 that mates with the tapered silver-nickel alloy locking head 18 is provided in the groove where the engaging part 11 and the plug-in part 12 mate; a neodymium iron boron magnetic layer 16 is provided on the inner wall of the stepped groove 14; a dustproof structure is provided at the joint between the engaging part 11 and the plug-in part 12; the dustproof structure includes an elastic dustproof mesh 19, one edge of which is slidably connected to the side wall of the module unit through a dovetail groove guide rail 20, and the inner side of the other side of the elastic dustproof mesh 19 is provided with a magnetic adsorption layer 21 that magnetically mates with the neodymium iron boron magnetic layer 16; the heat dissipation structure includes a tree-shaped fractal microchannel penetrating the substrate body 10, and the inner wall of the microchannel is provided with a sharkskin biomimetic texture. The heat is spread out through the tree-shaped fractal microchannel, and the sharkskin biomimetic texture further improves the heat dissipation efficiency.

[0017] In this embodiment, a phase change heat dissipation layer is embedded inside the substrate body 10. The phase change heat dissipation layer is composed of paraffin wax and graphene. In actual operation, a high-precision laser is used to etch small holes inside the circuit board, a layer of graphene foam is coated on the inner wall of the small holes, molten paraffin wax and graphene fragments are mixed, vacuumed and poured into the small holes, and then sealed and reinforced.

[0018] The magnetic induction intensity of the neodymium iron boron magnetic layer 16 is set to 0.1-0.3T. The neodymium iron boron magnetic layer 16 is a composite functional layer made of neodymium iron boron magnetic powder and silicone rubber. The elastic dustproof net 19 and the neodymium iron boron magnetic layer 16 form a magnetically sealed interface. The neodymium iron boron magnetic layer 16 at the engaging part generates an adsorption force with the magnetic adsorption layer 21 of the elastic dustproof net 19.

[0019] The mesh density of the elastic dustproof net 19 is set in a gradient distribution of 200-500 mesh.

[0020] On the opposite sides of the side with the engaging part 11 on the substrate body 10, and at positions corresponding to the insertion guide post 15, there are stepped limiting bosses 13 for the engaging part 11 to be inserted. The stepped limiting rings are interference-fitted with the limiting bosses 13.

[0021] The plug-in part of the adjacent module unit is inserted into the locking part. The stepped limiting ring of the plug-in guide post and the limiting boss of the locking part form a mechanical interlock. When the temperature is ≥45℃, the conical silver-nickel alloy locking head 18 triggers the deformation of the nickel-titanium shape memory alloy sheet 17 and inserts it into the stepped groove to form an interference fit. When the temperature is <45℃, the limiting boss of the stepped groove and the stepped limiting ring of the plug-in guide post form a double mechanical lock to ensure the connection is stable.

[0022] In this embodiment, the insertion part and the locking part are symmetrically distributed. The interference fit is automatically triggered by the nickel-titanium shape memory alloy sheet and the conical silver-nickel alloy locking head, realizing intelligent locking without manual intervention and improving insertion and extraction efficiency. The stepped limiting ring and the limiting boss form a mechanical interlock, reducing the fluctuation of locking force under vibration. Through the above two locking methods, the insertion and extraction force of the circuit board is stable in the range of -40℃ to 150℃, meeting the requirements of extreme environments. The heat dissipation structure includes a tree-shaped fractal microchannel that runs through the substrate body. The inner wall of the microchannel is provided with a sharkskin biomimetic texture. The heat is spread out through the tree-shaped fractal microchannel, and the sharkskin biomimetic texture further improves the heat dissipation efficiency. By setting a dustproof structure, the joint between the locking part and the insertion part has a dustproof function.

[0023] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A split heat dissipating circuit board structure, characterized by comprising: It includes multiple module units, heat dissipation structure, and dustproof structure; each module unit is composed of four high thermal conductivity substrates; electronic components are arranged on the front side of the substrate body (10) of each high thermal conductivity substrate, and the back side is a device-free area; a plug-in part (12) is provided on one side of the substrate body (10), and a locking part (11) that cooperates with the plug-in part (12) is provided on the other side; the length of the plug-in part (12) is less than the length of the substrate body (10); plug-in guide posts (15) are welded and fixed on both opposite sides of the side of the substrate body (10) with the plug-in part (12), and a stepped limiting ring is provided at the end of the plug-in guide post (15); nickel-titanium shape memory alloy sheets (17) are embedded on both opposite sides of the upper and lower surfaces of the plug-in part (12) in the length direction, and a conical shape memory alloy sheet (17) is fixedly connected to the upper surface of the nickel-titanium shape memory alloy sheet (17). Silver-nickel alloy locking head (18); a stepped groove (14) that mates with the conical silver-nickel alloy locking head (18) is provided in the groove where the engaging part (11) and the plug-in part (12) are fitted; a neodymium iron boron magnetic layer (16) is provided on the inner wall of the stepped groove (14); the dustproof structure covers the joint between the engaging part (11) and the plug-in part (12); the dustproof structure includes an elastic dustproof net (19), one edge of the elastic dustproof net (19) is slidably connected to the side wall of the module unit through a dovetail groove guide rail (20), and the inner side of the other side of the elastic dustproof net (19) is provided with a magnetic adsorption layer (21) that magnetically mates with the neodymium iron boron magnetic layer (16); the heat dissipation structure includes a tree-shaped fractal microchannel penetrating the substrate body (10), and the inner wall of the microchannel is provided with a sharkskin biomimetic texture.

2. The spliced ​​heat dissipation circuit board structure according to claim 1, characterized in that: A phase change heat dissipation layer is embedded inside the substrate body (10).

3. The spliced ​​heat dissipation circuit board structure according to claim 1, characterized in that: The magnetic induction intensity of the neodymium iron boron magnetic layer (16) is set to 0.1-0.3T; the neodymium iron boron magnetic layer (16) is a composite functional layer made of neodymium iron boron magnetic powder and silicone rubber, and the elastic dustproof net (19) and the neodymium iron boron magnetic layer (16) form a magnetically sealed interface.

4. The spliced ​​heat dissipation circuit board structure according to claim 1, characterized in that: The mesh density of the elastic dustproof net (19) is set in a gradient distribution of 200-500 mesh.

5. The spliced ​​heat dissipation circuit board structure according to claim 1, characterized in that: The substrate body (10) has stepped limiting bosses (13) on opposite sides of the side with the engaging part (11) and at positions corresponding to the insertion guide post (15) for the engaging part (11) to be inserted. The stepped limiting ring is interference-fitted with the limiting boss (13).

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