A multilayer integrated printed circuit board

Abstract

This utility model discloses a multilayer integrated printed circuit board, belonging to the field of circuit boards. The device includes a positioning spring detachably disposed inside an extrusion block and a substrate. The substrate can be positioned by the contact and compression between the extrusion block and the positioning block. During the pressing process, the extrusion block moves, causing the positioning spring to contract and drive a release rod to slide. The release rod causes a fixing block to slide inside a fixing groove. When it slides to the horizontal area of ​​the fixing groove, the positioning spring is in a contracted state, and the horizontal area of ​​the fixing groove and the through groove are connected. Compared to the distance between the two fixing grooves at this time, the length of the through groove is greater, so the positioning spring will move into the through groove and unfold. The fixing block of the positioning spring disengages from the extrusion block and slides out of the substrate through the through groove. At this time, the positioning block slides into the extrusion groove. Continued pressing makes it difficult to change the position of the positioning block and the extrusion groove, and the positioning spring disengages from the substrate, so the positioning spring does not affect the positioning effect between the two substrates.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to a multilayer integrated printed circuit board. Background Technology

[0002] Multilayer integrated printed circuit boards are an indispensable core component in modern electronic devices. They are formed by stacking and laminating multiple conductive and insulating layers alternately to achieve high-density wiring and complex circuit functions.

[0003] Multilayer integrated printed circuit boards (PCBs) are typically manufactured by laminating multiple substrates together. During this lamination process, there are generally three methods for substrate positioning: optical alignment with mechanical fixtures, substrate positioning elements, and manual methods. Optical alignment with mechanical fixtures and manual methods are difficult to maintain effective positioning during lamination, and the resulting errors are hard to control. Some substrates are positioned using springs or elastic pins for interlayer positioning. However, during lamination, the environment is under high temperature and pressure, which alters the performance of these positioning elements. For example, the spring constant may change, and the elastic pin may deform, thus reducing positioning accuracy.

[0004] In summary, in the process of stacking adjacent substrates, the performance of positioning elements such as springs in existing multilayer integrated printed circuit boards can easily affect the positioning accuracy. Utility Model Content

[0005] This invention provides a multilayer integrated printed circuit board, which can solve the problem that in the prior art, when adjacent substrates are stacked, the performance of the positioning elements such as springs can easily affect the positioning accuracy.

[0006] A multilayer integrated printed circuit board includes several substrates. A positioning mechanism is disposed on the surface of each substrate. The positioning mechanism is slidably disposed within a copper-free area of ​​the substrate. The positioning mechanism includes:

[0007] A plurality of extrusion blocks are slidably disposed inside a substrate. A plurality of extrusion grooves are formed on the surface of the substrate. Two extrusion blocks are slidably disposed inside a single extrusion groove. A positioning spring is detachably connected between the extrusion blocks and the substrate through a fixing component. A positioning block is fixedly connected to the side of the substrate away from the extrusion groove. The positioning block is adapted to the extrusion groove.

[0008] The fixing component includes:

[0009] The fixing blocks are fixedly installed at both ends of the positioning spring. The base plate and the extrusion block are both provided with fixing grooves. The fixing grooves are adapted to the fixing blocks. The cross-section of the fixing grooves is L-shaped.

[0010] A release rod is attached to a fixing block and a positioning block. A through groove is provided on the surface of the substrate, and the through groove is connected to the horizontal area of ​​the fixing groove.

[0011] Optionally, a protruding post is fixedly connected to the surface of the fixing block, and an inner groove is formed on the surface of the substrate and the extrusion block, with the protruding post being adapted to the inner groove.

[0012] Optionally, the release rod includes a vertical rod and a horizontal rod, the vertical rod being in contact with the compression block, and the horizontal rod being slidably connected to the vertical rod.

[0013] Optionally, the horizontal bar has triangular ends in its cross-section, and the fixing block fits against the hypotenuse of the horizontal bar.

[0014] Optionally, the extrusion block has a sliding groove inside, which is adapted to the horizontal bar.

[0015] Optionally, a vertical groove is formed inside the substrate, and the vertical rod is adapted to the vertical groove.

[0016] Optionally, the vertical groove is a semi-open groove, and a connecting groove is provided on the side of the substrate away from the extrusion block, the connecting groove being adapted to the vertical rod.

[0017] Optionally, a movable shaft is fixedly connected to the surface of the vertical rod, and a movable groove is formed on the surface of the horizontal rod, with the movable shaft and the movable groove being adapted to each other.

[0018] Optionally, a plurality of limiting rods are fixedly disposed on the surface of the substrate, the edges of the limiting rods are attached to the edges of the substrate, and limiting grooves are formed on the surface of the limiting rods.

[0019] Optionally, the cross-section of the through groove is Z-shaped, and the through groove is a semi-open groove.

[0020] This invention provides a multilayer integrated printed circuit board, including a positioning spring detachably disposed inside an extrusion block and a substrate. The substrate can be positioned by the contact and extrusion of the extrusion block and the positioning block. During the pressing process, the extrusion block moves, causing the positioning spring to contract and drive the release rod to slide. During the contraction of the positioning spring, the sliding of the release rod can drive the fixing block to slide inside the fixing groove. When it slides to the horizontal area of ​​the fixing groove, the positioning spring is in a contracted state and tends to return to its natural state. The horizontal area of ​​the fixing groove and the through groove are connected. Compared with the distance between the two fixing grooves at this time, the length of the through groove is larger. Therefore, the positioning spring will move into the through groove and unfold. The fixing block of the positioning spring disengages from the extrusion block and slides out of the substrate through the through groove. At this time, the positioning block slides into the extrusion groove. Continuous pressing is unlikely to change the position of the positioning block and the extrusion groove, and the positioning spring disengages from the substrate. The positioning spring will not affect the positioning effect between the two substrates. Attached Figure Description

[0021] Figure 1 A schematic diagram of the substrate structure provided by this utility model;

[0022] Figure 2 A three-dimensional structural cross-sectional view of the positioning mechanism provided by this utility model;

[0023] Figure 3 Provided by this utility model Figure 2 Enlarged view of the local structure at point A;

[0024] Figure 4 This is a schematic diagram of the structure of the two substrates stacked together according to the present invention;

[0025] Figure 5 A three-dimensional cross-sectional view of the positioning mechanism provided by this utility model after two substrates are stacked.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Base plate; 2. Extrusion block; 3. Extrusion groove; 4. Positioning spring; 5. Positioning block; 6. Fixing block; 7. Fixing groove; 8. Through groove; 9. Protruding post; 10. Recessed groove; 11. Vertical rod; 12. Horizontal rod; 13. Sliding groove; 14. Vertical groove; 15. Connecting groove; 16. Moving shaft; 17. Moving groove; 18. Limiting rod; 19. Limiting groove. Detailed Implementation

[0028] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0029] like Figures 1 to 5 As shown in the figure, an embodiment of the present invention provides a multilayer integrated printed circuit board, comprising a plurality of substrates 1, wherein a positioning mechanism is disposed on the surface of the substrate 1, the positioning mechanism being slidably disposed within a copper-free area of ​​the substrate 1, and the positioning mechanism comprising:

[0030] A plurality of extrusion blocks 2 are slidably disposed inside a substrate 1. A plurality of extrusion grooves 3 are provided on the surface of the substrate 1. Two extrusion blocks 2 are slidably disposed inside a single extrusion groove 3. A positioning spring 4 is detachably connected between the extrusion blocks 2 and the substrate 1 through a fixing component. A positioning block 5 is fixedly connected to the side of the substrate 1 away from the extrusion groove 3. The positioning block 5 is adapted to the extrusion groove 3.

[0031] The fixing component includes:

[0032] Fixing blocks 6 are fixedly installed at both ends of the positioning spring 4. Fixing grooves 7 are opened on the surfaces of the base plate 1 and the extrusion block 2. The fixing grooves 7 are adapted to the fixing blocks 6. The cross-section of the fixing grooves 7 is L-shaped.

[0033] Release rod, the surface of the release rod is in contact with the fixing block 6 and the positioning block 5, and the surface of the base plate 1 is provided with a through groove 8, which is connected to the horizontal area of ​​the fixing groove 7;

[0034] In summary, the multilayer integrated printed circuit board provided by this utility model embodiment includes a positioning spring 4 detachably disposed inside the extrusion block 2 and the substrate 1. The positioning of the substrate 1 can be achieved by the contact extrusion block 2 and the positioning block 5. During the pressing process, the extrusion block 2 moves, causing the positioning spring 4 to contract and drive the release rod to slide. During the contraction of the positioning spring 4, the sliding of the release rod can drive the fixing block 6 to slide inside the fixing groove 7. When it slides to the horizontal area of ​​the fixing groove 7, the positioning spring 4 is in a contracted state and tends to return to its natural state. The horizontal area of ​​the fixing groove 7 and the through groove 8 are connected. Compared with the distance between the two fixing grooves 7 at this time, the length of the through groove 8 is larger. Therefore, the positioning spring 4 will move into the through groove 8 and unfold. The fixing block 6 of the positioning spring 4 is separated from the extrusion block 2 and slides out of the substrate 1 through the through groove 8. At this time, the positioning block 5 slides into the extrusion groove 3. Continuous pressing is difficult to change the position of the positioning block 5 and the extrusion groove 3, and the positioning spring 4 is separated from the substrate 1. The positioning spring 4 will not affect the positioning effect between the two substrates 1.

[0035] In some specific implementations, a protruding post 9 is fixedly connected to the surface of the fixing block 6, and an inner groove 10 is formed on the surface of the base plate 1 and the extrusion block 2. The protruding post 9 is adapted to the inner groove 10. The single-sized protruding post 9 and the inner groove 10 adapted to the protruding post 9 make it easier to control the sliding path of the fixing block 6.

[0036] In some specific embodiments, the release rod includes a vertical rod 11 and a horizontal rod 12. The vertical rod 11 is attached to the extrusion block 2, and the horizontal rod 12 is attached to the fixing block 6. The horizontal rod 12 has triangular ends in its cross-section, and the fixing block 6 is attached to the hypotenuse of the horizontal rod 12. The horizontal rod 12 is slidably connected to the vertical rod 11. Through the vertical rod 11 and the horizontal rod 12, the two structures can be driven to slide in opposite directions when the extrusion block 2 moves, thereby causing the fixing block 6 to slide obliquely.

[0037] In a further embodiment, the extrusion block 2 has a sliding groove 13 inside, and the sliding groove 13 is adapted to the horizontal rod 12;

[0038] In a further embodiment, a vertical groove 14 is formed inside the substrate 1, and the vertical rod 11 is adapted to the vertical groove 14; the vertical groove 14 restricts the sliding path of the vertical rod 11 and prevents the vertical rod 11 from moving obliquely.

[0039] In a further embodiment, the vertical groove 14 is a semi-open groove, and a connecting groove 15 is provided on the side of the substrate 1 away from the extrusion block 2. The connecting groove 15 is adapted to the vertical rod 11. By providing the connecting groove 15, when the two substrates 1 are pressed together, the vertical rod 11 can contact the connecting groove 15 for further positioning.

[0040] In a further embodiment, a movable shaft 16 is fixedly connected to the surface of the vertical rod 11, and a movable groove 17 is formed on the surface of the horizontal rod 12. The movable shaft 16 is adapted to the movable groove 17. The movable shaft 16 and the movable groove 17 are provided to prevent the vertical rod 11 from separating from the horizontal rod 12.

[0041] In some specific implementations, a plurality of limiting rods 18 are fixedly provided on the surface of the substrate 1, the edges of the limiting rods 18 are attached to the edges of the substrate 1, and the surface of the limiting rods 18 is provided with limiting grooves 19; through the limiting rods 18, a certain degree of limiting and positioning can be provided when the substrates 1 are stacked, which facilitates rapid basic positioning.

[0042] In some specific implementations, the cross-section of the through groove 8 is Z-shaped, and the through groove 8 is a semi-open groove; through the Z-shaped through groove 8, one end of the through groove 8 can be located on the side of the substrate 1, so that when the two substrates 1 are pressed together, the positioning spring 4 can be disengaged from the substrate 1 at a specified position.

[0043] The working principle of this utility model:

[0044] When the substrate 1 is stacked, the limiting rod 18 on the surface of the substrate 1 is placed, and the positioning block 5 is in contact with the two extrusion blocks 2. During pressing, the positioning block 5 moves, causing the two extrusion blocks 2 to slide towards each other. The sliding of the extrusion blocks 2 causes the vertical rod 11 to slide, and at the same time, the positioning spring 4 is compressed. The sliding of the vertical rod 11 causes the horizontal rod 12 to move, causing the fixed block 6 to change its position inside the extrusion blocks 2 and the substrate 1. When the fixed block 6 slides to the position of the through groove 8, under the action of the positioning spring 4, the fixed block 6 slides into the through groove 8 and slides out from one side of the through groove 8. Pressing continues, causing the positioning block 5 to slide completely into the extrusion groove 3.

[0045] The above-disclosed embodiments are only a few specific examples of the present utility model. However, the embodiments of the present utility model are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.

Claims

1. A multilayer integrated printed circuit board, comprising a plurality of substrates (1), characterized in that, A positioning mechanism is provided on the surface of the substrate (1), and the positioning mechanism is slidably disposed inside the copper-free area of ​​the substrate (1). The positioning mechanism includes: A plurality of extrusion blocks (2) are slidably disposed inside a substrate (1). A plurality of extrusion grooves (3) are provided on the surface of the substrate (1). Two extrusion blocks (2) are slidably disposed inside a single extrusion groove (3). A positioning spring (4) is detachably connected between the extrusion block (2) and the substrate (1) through a fixing component. A positioning block (5) is fixedly connected to the side of the substrate (1) away from the extrusion groove (3). The positioning block (5) is adapted to the extrusion groove (3). The fixing component includes: Fixed blocks (6) are fixedly installed at both ends of the positioning spring (4). Fixed grooves (7) are opened on the surfaces of the base plate (1) and the extrusion block (2). The fixed grooves (7) are adapted to the fixed blocks (6). The cross-section of the fixed grooves (7) is L-shaped. The release rod is attached to the fixing block (6) and the positioning block (5). The substrate (1) has a through groove (8) on its surface, which is connected to the horizontal area of ​​the fixing groove (7).

2. The multilayer integrated printed circuit board as described in claim 1, characterized in that, The surface of the fixing block (6) is fixedly connected with a protruding post (9), and the surfaces of the substrate (1) and the extrusion block (2) are provided with recessed grooves (10), and the protruding post (9) is adapted to the recessed groove (10).

3. A multilayer integrated printed circuit board as described in claim 1, characterized in that, The release rod includes a vertical rod (11) and a horizontal rod (12), the vertical rod (11) is in contact with the extrusion block (2), and the horizontal rod (12) is slidably connected to the vertical rod (11).

4. A multilayer integrated printed circuit board as described in claim 3, characterized in that, The horizontal rod (12) has triangular ends in its cross-section, and the fixing block (6) fits against the hypotenuse of the horizontal rod (12).

5. A multilayer integrated printed circuit board as described in claim 3, characterized in that, The extrusion block (2) has a sliding groove (13) inside, which is adapted to the horizontal rod (12).

6. A multilayer integrated printed circuit board as described in claim 3, characterized in that, The substrate (1) has a vertical groove (14) inside, and the vertical rod (11) is adapted to the vertical groove (14).

7. A multilayer integrated printed circuit board as described in claim 6, characterized in that, The vertical groove (14) is a semi-open groove. A connecting groove (15) is provided on the side of the substrate (1) away from the extrusion block (2). The connecting groove (15) is adapted to the vertical rod (11).

8. A multilayer integrated printed circuit board as described in claim 3, characterized in that, The vertical rod (11) has a movable shaft (16) fixedly connected to its surface, and the horizontal rod (12) has a movable groove (17) on its surface. The movable shaft (16) is adapted to the movable groove (17).

9. A multilayer integrated printed circuit board as described in claim 1, characterized in that, A plurality of limiting rods (18) are fixedly provided on the surface of the substrate (1), the edge of the limiting rod (18) is attached to the edge of the substrate (1), and a limiting groove (19) is formed on the surface of the limiting rod (18).

10. A multilayer integrated printed circuit board as described in claim 1, characterized in that, The cross-section of the through groove (8) is Z-shaped, and the through groove (8) is a semi-open groove.

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