Two-step type step-shaped golden finger plate

Abstract

The utility model discloses a two-step type step-shaped golden finger plate. The second-order stepped golden finger plate comprises a first stack structure, a second stack structure, a pressing layer and a first golden finger layer. The first stack structure has a first top surface and a first bottom surface. The second stack structure has a second top surface and a second bottom surface. The second stack structure is provided with two diagonal planes which are respectively connected with the second top surface and the second bottom surface. The pressing layer is arranged between the first stack structure and the second stack structure. The first golden finger layer is formed on the second top surface of the second stack structure. The first top surface and the side edge of the first stack structure, the side edge of the pressing layer and the second top surface of the second stack structure jointly form a stepped structure. The two-step type step-shaped golden finger plate can solve the problem that the existing golden finger plate cannot meet the plate thickness requirement.

Description

Technical Field

[0001] This utility model relates to a gold finger plate, and more particularly to a two-tiered stepped gold finger plate. Background Technology

[0002] With technological advancements, the overall thickness requirements for gold finger boards have increased to improve signal transmission performance, but there is no need to increase the thickness of the gold finger board's plug-in terminals. Existing gold finger boards cannot meet these thickness requirements, therefore improvements are necessary. Utility Model Content

[0003] This utility model discloses a two-stage stepped gold finger plate, which is mainly used to improve the problem that the existing gold finger plates cannot meet the plate thickness requirements.

[0004] One embodiment of this utility model discloses a two-tiered stepped gold finger plate, comprising: a first stack structure having a first top surface and a first bottom surface; a second stack structure having a second top surface and a second bottom surface; wherein the second stack structure has two oblique cut surfaces respectively connected to the second top surface and the second bottom surface; a pressing layer disposed between the first stack structure and the second stack structure; and a first gold finger layer formed on the second top surface of the second stack structure at a position where the first stack structure is not disposed; wherein the first top surface and side edge of the first stack structure, the side edge of the pressing layer, and the second top surface of the second stack structure together form a stepped structure.

[0005] Preferably, the dimension of the first stack structure in the lateral direction is smaller than the dimension of the second stack structure in the lateral direction.

[0006] Preferably, the lamination layer is a polypropylene adhesive layer.

[0007] Preferably, the first thickness of the first stack structure is between 0.05 mm and 5.2 mm.

[0008] Preferably, the second thickness of the second stack structure is between 0.8 mm and 3.2 mm.

[0009] Preferably, the sum of the first thickness of the first stack structure and the second thickness of the second stack structure is less than 6 mm.

[0010] Preferably, the ratio between the first thickness of the first stack structure and the second thickness of the second stack structure is between 0.016 and 6.5.

[0011] Preferably, the two-tiered stepped gold finger plate further includes a second gold finger layer, which is located on the second bottom surface of the second stack structure and is positioned corresponding to the first gold finger layer.

[0012] Preferably, in the second stack structure, one of the beveled surfaces is connected to the second top surface and side edge of the second stack structure, and the other beveled surface is connected to the second bottom surface and side edge of the second stack structure.

[0013] Preferably, the first stack structure includes a plurality of first insulating layers and a plurality of first circuit layers formed on the plurality of first insulating layers, and the second stack structure includes a plurality of second insulating layers and a plurality of second circuit layers formed on the plurality of second insulating layers.

[0014] In summary, one of the beneficial effects of this utility model is that the two-tiered stepped gold finger plate provided by this utility model can improve the problem that existing gold finger plates cannot meet the plate thickness requirements by using the technical solution of "the first top surface and side edge of the first stacked structure, the side edge of the lamination layer and the second top surface of the second stacked structure together forming a stepped structure".

[0015] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating the manufacturing method of a two-tiered stepped gold finger plate according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the first groove forming step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the first ink printing step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the first gold plating step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0021] Figure 6This is a schematic diagram of the second ink printing step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the pressing steps in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the second gold plating step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram of the second groove forming step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention.

[0025] Figure 10 This is a schematic diagram of the windowing step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention.

[0026] Figure 11 This is a schematic diagram of the oblique cutting step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of the "two-tiered stepped gold finger plate" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0028] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used in this document should, depending on the context, include any combination of one or more related listed items.

[0029] Manufacturing method of two-stage stepped gold finger plate

[0030] Please see Figure 1 As shown, Figure 1This is a flowchart illustrating a method for manufacturing a two-tiered stepped gold finger plate according to an embodiment of the present invention. The present invention provides a method for manufacturing a two-tiered stepped gold finger plate. The method includes a pre-processing step S110, a first groove forming step S120, a first gold plating step S130, a pressing step S140, a second groove forming step S150, a windowing step S160, and a beveling step S170. Of course, the method for manufacturing the two-tiered stepped gold finger plate may include other steps as needed, and the present invention does not limit this.

[0031] Please see Figure 2 As shown, Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the two-tiered stepped gold finger board according to an embodiment of the present invention. In the preliminary step S110, a first stack structure 1 and a second stack structure 2 are provided. The first stack structure 1 has a first top surface 1a and a first bottom surface 1b, and the second stack structure 2 has a second top surface 2a and a second bottom surface 2b. The first stack structure 1 includes a plurality of first insulating layers 11 and a plurality of first circuit layers 12 formed on the plurality of first insulating layers 11, and the second stack structure 2 includes a plurality of second insulating layers 21 and a plurality of second circuit layers 22 formed on the plurality of second insulating layers 21.

[0032] Preferably, the first thickness T1 of the first stack structure 1 is between 0.05 mm and 5.2 mm, the second thickness T2 of the second stack structure 2 is between 0.8 mm and 3.2 mm, and the sum of the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure 2 is less than 6 mm.

[0033] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the first groove forming step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. In the first groove forming step S120, a first groove 13 is formed on the first bottom surface 1b of the first stack structure 1, and the first stack structure 1 defines a sacrificial portion 14 located on one side of the first groove 13 (e.g., Figure 3 The first stack structure 1 is located on the right side of the first groove 13) and the pressing part 15 is located on the other side of the first groove 13 (such as...). Figure 3 The first stack structure 1 is located on the left side of the first groove 13. In other words, the sacrificial portion 14 and the pressing portion 15 of the first stack structure 1 are respectively formed on... Figure 3 The right and left sides of the first groove 13.

[0034] In the first groove forming step S120, the first groove 13 can be formed, for example, by laser, but the present invention is not limited thereto. Furthermore, the depth of the first groove 13 can be, for example, between 0.034 mm and 3.47 mm, or the depth of the first groove 13 can be slightly greater than two-thirds of the first thickness T1 of the first stack structure 1, but the present invention is not limited thereto. In addition, the first groove 13 does not penetrate to the first top surface 1a of the first stack structure 1.

[0035] Please see Figure 4 As shown, Figure 4 This is a schematic diagram of the first ink printing step in the manufacturing method of a two-tiered stepped gold finger plate according to an embodiment of the present invention. In one embodiment, after the first groove forming step S120, the manufacturing method of the two-tiered stepped gold finger plate may further include a first ink printing step S121, forming a first ink layer 3 on the bottom surface of the sacrificial portion 14 of the first stack structure 1.

[0036] Please see Figure 5 As shown, Figure 5 This is a schematic diagram of the first gold plating step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. In the first gold plating step S130, a first gold finger layer 4 is plated on the second top surface 2a of the second stack structure 2. The position of the first gold finger layer 4 on the second stack structure 2 may correspond to the sacrificial portion 14 of the first stack structure 1.

[0037] Please see Figure 6 As shown, Figure 6 This is a schematic diagram of the second ink printing step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. In one embodiment, after the first gold plating step S130, the manufacturing method of the two-tiered stepped gold finger plate may further include a second ink printing step S131 to form a second ink layer 5 covering the first gold finger layer 4. However, it is worth noting that the two-tiered stepped gold finger plate is not limited to including either the first ink printing step S121 or the second ink printing step S131.

[0038] Please see Figure 7 As shown, Figure 7 This is a schematic diagram of the pressing step in the manufacturing method of the two-stage stepped gold finger plate according to an embodiment of the present invention. In the pressing step S140, the pressing layer 6 is pressed between the first stack structure 1 and the second stack structure 2. In one embodiment, the pressing layer 6 can be a polypropylene adhesive layer.

[0039] Please see Figure 8 As shown, Figure 8 This is a schematic diagram of the second gold plating step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. Furthermore, after the pressing step S140, the manufacturing method of the two-tiered stepped gold finger plate may further include a second gold plating step S141, in which a second gold finger layer 7 is plated on the second bottom surface 2b of the second stack structure 2.

[0040] Please see Figure 9 As shown, Figure 9 This is a schematic diagram of the second groove forming step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. In the second groove forming step S150, a second groove 16 communicating with the first groove 13 is formed on the first top surface 1a of the first stack structure 1. The first groove 13 formed in the first groove forming step S120 makes the second groove forming step S150 easier to perform.

[0041] Specifically, since the first bottom surface 1b of the first stack structure 1 has the first groove 13, the second groove 16 can be formed more precisely, and the depth of the second groove 16 can be relatively small. Furthermore, in the second groove forming step S150, the second groove can be formed, for example, by mechanical drilling, but this invention is not limited to this method.

[0042] Please see Figure 10 As shown, Figure 10 This is a schematic diagram of the windowing step in the manufacturing method of the two-tiered stepped gold finger plate according to an embodiment of the present invention. In the windowing step S160, the sacrificial portion 14 of the first stack structure 1 and the pressing layer 6 located on the sacrificial portion 14 are removed, so that the pressing portion 15 of the first stack structure 1, the pressing layer 6, and the second stack structure 2 together form a stepped structure S. Through the design of the stepped structure S, the overall thickness (such as the sum of the first thickness T1 and the second thickness T2) can be increased without increasing the second thickness T2 of the second stack structure 2, thereby enabling the final product to have better signal transmission.

[0043] Furthermore, after the windowing step S160, the first gold finger layer 4 is exposed from the first stack structure 1 (that is, it is not covered by the first stack structure 1). Specifically, in the windowing step S160, the sacrificial portion 14 of the first stack structure 1 and the bonding layer 6 located on the sacrificial portion 14 may be removed along the second groove 16.

[0044] In another embodiment, the two-stage stepped gold finger plate 100 includes the first ink printing step S121 and the second ink printing step S131, and in the windowing step S160, the portion of the sacrificial part 14, the first ink layer 3, the second ink layer 5 and the bonding layer 6 located between the sacrificial part 14 and the second stack structure 2 may be removed from the first stack structure 1.

[0045] More specifically, in the windowing step S160, the sacrificial portion 14 of the first stack structure 1 and the portion of the bonding layer 6 located between the sacrificial portion 14 and the second stack structure 2 can be removed first, and then the first ink layer 3 and the second ink layer 5 can be removed with a chemical solution. Through the first ink layer 3 and the second ink layer 5, the sacrificial portion 14 of the first stack structure 1 can be removed more easily, thus bringing process convenience.

[0046] Please see Figure 11 As shown, Figure 11 This is a schematic diagram of the beveling step in the manufacturing method of the two-tier stepped gold finger plate according to an embodiment of the present invention. In the beveling step S170, a beveling operation is performed on the second stack structure 2 to remove a portion of the second stack structure 2 and form two beveling surfaces 2c respectively connected to the second top surface 2a and the second bottom surface 2b, thereby forming the two-tier stepped gold finger plate 100. More specifically, in the beveling step S170, the corner portions where the second top surface 2a intersects with the side edge and the corner portions where the second bottom surface 2b intersects with the side edge of the second stack structure 2 may be removed to form the two beveling surfaces 2c.

[0047] Two-tiered stepped gold finger plate

[0048] Please see Figure 11 As shown, Figure 11 This is also a schematic diagram of a two-tiered stepped gold finger plate according to an embodiment of the present invention. The present invention also provides a two-tiered stepped gold finger plate 100. The two-tiered stepped gold finger plate 100 can be obtained by performing the aforementioned manufacturing method for a two-tiered stepped gold finger plate, but the present invention is not limited thereto. Furthermore, the two-tiered stepped gold finger plate 100 can, for example, be a two-tiered five-pressure stepped gold finger plate.

[0049] The two-tiered stepped gold finger plate 100 includes a first stack structure 1, a second stack structure 2, a pressing layer 6, and a first gold finger layer 4. Of course, the two-tiered stepped gold finger plate 100 may include other components as needed, and this utility model does not impose any limitations thereon.

[0050] The first stack structure 1 has a first top surface 1a and a first bottom surface 1b. The second stack structure 2 has a second top surface 2a and a second bottom surface 2b, and the second stack structure 2 has two beveled surfaces 2c respectively connected to the second top surface 2a and the second bottom surface 2b. More specifically, one of the beveled surfaces 2c is connected to the second top surface 2a and the side edge of the second stack structure 2, and the other beveled surface 2c is connected to the second bottom surface 2b and the side edge of the second stack structure 2. Accordingly, the second stack structure 2 forms a plug-in end 23 adjacent to the first gold finger layer 4.

[0051] The bonding layer 6 is disposed between the first stack structure 1 and the second stack structure 2. The bonding layer 6 can be, for example, a polypropylene adhesive layer, thereby enabling better bonding between the first stack structure 1 and the second stack structure 2, but the present invention is not limited thereto.

[0052] The first gold finger layer 4 is disposed on the second top surface 2a of the second stack structure 2. Specifically, the first gold finger layer 4 is formed on the second top surface 2a of the second stack structure 2 at a position where the first stack structure 1 is not disposed, and the first gold finger layer 4 is disposed adjacent to one of the beveled surfaces 2c.

[0053] In this embodiment, the first thickness T1 of the first stack structure 1 is between 0.05 mm and 5.2 mm, and the second thickness T2 of the second stack structure 2 is between 0.8 mm and 3.2 mm. The sum of the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure 2 is less than 6 mm, but this invention is not limited thereto. Furthermore, the ratio between the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure 2 can be between 0.016 and 6.5, but this invention is not limited thereto.

[0054] The dimension of the first stack structure 1 in the lateral direction W can be smaller than the dimension of the second stack structure 2 in the lateral direction W. The lateral direction W is defined as the direction parallel to the connection between the two ends of the second stack structure 2 (such as the end with the beveled surface 2c and the end without the beveled surface 2c). Accordingly, the first top surface 1a and side edge of the first stack structure 1, the side edge of the laminating layer 6, and the second top surface 2a of the second stack structure 2 together form a stepped structure S.

[0055] Furthermore, the two-tiered stepped gold finger plate 100 may further include a second gold finger layer 7, which is located on the second bottom surface 2b of the second stack structure 2 and is positioned corresponding to the first gold finger layer 4.

[0056] Beneficial effects of the embodiments

[0057] In summary, one of the beneficial effects of this utility model is that the two-tiered stepped gold finger plate provided by this utility model can improve the problem that existing gold finger plates cannot meet the plate thickness requirements by using the technical solution of "the first top surface and side edge of the first stacked structure, the side edge of the lamination layer and the second top surface of the second stacked structure together forming a stepped structure".

[0058] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the protection scope of the present utility model.

[0059] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the patent scope of the present utility model.

Claims

1. A two-tiered stepped gold finger plate, characterized in that, The two-tiered stepped gold finger plate includes: The first stack structure has a first top surface and a first bottom surface; The second stack structure has a second top surface and a second bottom surface; wherein the second stack structure has two oblique cut surfaces respectively connected to the second top surface and the second bottom surface; and a laminating layer is disposed between the first stack structure and the second stack structure. The first gold finger layer is formed on the second top surface of the second stack structure at a position where the first stack structure is not provided; The first top surface and side edge of the first stack structure, the side edge of the lamination layer, and the second top surface of the second stack structure together form a stepped structure.

2. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The first stack structure has a smaller lateral dimension than the second stack structure.

3. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The bonding layer is a polypropylene adhesive layer.

4. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The first thickness of the first stack structure is between 0.05 mm and 5.2 mm.

5. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The second thickness of the second stack structure is between 0.8 mm and 3.2 mm.

6. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The sum of the first thickness of the first stack structure and the second thickness of the second stack structure is less than 6 mm.

7. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The ratio between the first thickness of the first stack structure and the second thickness of the second stack structure is between 0.016 and 6.

5.

8. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The two-tiered stepped gold finger plate further includes a second gold finger layer, which is located on the second bottom surface of the second stack structure and is positioned corresponding to the first gold finger layer.

9. The two-tiered stepped gold finger plate according to claim 1, characterized in that, In the second stack structure, one of the beveled surfaces is connected to the second top surface and side edge of the second stack structure, and the other beveled surface is connected to the second bottom surface and side edge of the second stack structure.

10. The two-tiered stepped gold finger plate according to claim 1, characterized in that, The first stack structure includes a plurality of first insulating layers and a plurality of first circuit layers formed on the plurality of first insulating layers, and the second stack structure includes a plurality of second insulating layers and a plurality of second circuit layers formed on the plurality of second insulating layers.

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